CN217721769U - Multi-channel aluminum alloy efficient radiator - Google Patents
Multi-channel aluminum alloy efficient radiator Download PDFInfo
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- CN217721769U CN217721769U CN202220791856.5U CN202220791856U CN217721769U CN 217721769 U CN217721769 U CN 217721769U CN 202220791856 U CN202220791856 U CN 202220791856U CN 217721769 U CN217721769 U CN 217721769U
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Abstract
The utility model discloses a high-efficient radiator of multichannel aluminum alloy, include: the heat-conducting plate comprises heat-conducting plates, fins, radiating fans, a heat-conducting layer, a storage box, a water-cooling pipe, a fixing seat and semiconductor refrigerating sheets, wherein the fins are arranged on one side of the heat-conducting plate, and the radiating fans are arranged at two ends of the fins; fixing seats are arranged at two ends of the heat conducting plate, and water-cooling pipes are arranged on the fixing seats; one side of the heat conducting plate close to the fins is provided with a semiconductor refrigerating sheet; a heat conduction layer is arranged on one side of the heat conduction plate, which is far away from the fins, and the heat conduction layer is connected with a storage box; adopt the fin to increase heat radiating area on the one hand, adopt air-cooled, liquid cooling and semiconductor cooling simultaneously, established a plurality of cooling channel, made the radiator can use arbitrary passageway or their combination according to the heat dissipation demand, realized the cascaded regulation of heat-sinking capability, on the other hand adopts the metal crate laminating heating element of variability to metal crate replaces heat-conducting plate direct contact, avoids forming the vacuole or the problem that the heat-conducting glue can't be filled completely.
Description
Technical Field
The utility model belongs to the cooling system field, in particular to high-efficient radiator of multichannel aluminum alloy.
Background
The finned radiator is one of the most common heat exchange devices in a heat exchanger, can solve the interference and damage of heat to the device, and is widely used from industrial production to household appliances. Along with the technological progress, the demand on the radiator is higher and higher, and a single air-cooled or liquid-cooled radiator cannot meet the heat dissipation demand, especially for equipment with constantly changing temperature, the heat dissipation cannot be well realized, so that how to realize the stepped heat dissipation function is pursued by the present research and development personnel.
The existing radiator still has many shortcomings, for example, most existing radiators have few heat dissipation paths and poor heat dissipation effects, and cannot provide heat dissipation capacity of corresponding proportion according to actual heating requirements, and meanwhile, most existing radiators have the problem of non-lamination with heating objects, and because the surface shapes of different heating objects are inconsistent, the radiators are not laminated with the heating objects, so that the heat dissipation efficiency is affected. Therefore, the present application has innovated and improved a heat sink with respect to the above problems.
The existing radiator mainly has the following problems:
1. most of the existing radiators have few heat dissipation ways and poor heat dissipation effect, and can not provide heat dissipation capacity with corresponding proportion according to actual heating requirements.
2. Most of the existing radiators have the problem of non-lamination with heating materials, the radiator and the heating materials are not laminated due to the fact that the surface shapes of the heating materials are different, when the heat conducting glue is used, the heat conducting glue is firstly smeared to easily generate vacuoles, a heat conducting plate which is firstly laminated easily generates a closed space, and the heat conducting glue cannot be filled when injected again, so that the heat radiating efficiency is affected.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome not enough above, the utility model aims at providing a high-efficient radiator of multichannel aluminum alloy, adopt the fin to increase heat radiating area on the one hand, adopt the forced air cooling simultaneously, liquid cooling and semiconductor cooling, a plurality of cooling channel have been established, make the radiator can use arbitrary passageway or their combination according to the heat dissipation demand, the cascaded regulation of heat-sinking capability has been realized, holistic heat-sinking capability has also been improved, on the other hand adopts the metal crate laminating of variability to generate heat the thing, can enough adapt to the heating thing surface, improve the contact surface, replace heat-conducting plate direct contact with metal crate again, avoid forming vacuole or the problem that the heat-conducting glue can't fill completely.
The technical scheme is as follows: in order to realize the above purpose, the utility model provides a high-efficient radiator of multichannel aluminum alloy, include: the heat-conducting plate comprises heat-conducting plates, fins, radiating fans, a heat-conducting layer, a storage box, a water-cooling pipe, a fixing seat and semiconductor refrigerating sheets, wherein the fins are arranged on one side of the heat-conducting plate, and the radiating fans are arranged at two ends of the fins; fixing seats are arranged at two ends of the heat-conducting plate, water-cooling tubes are arranged on the fixing seats, and the water-cooling tubes are uniformly distributed on one sides of the fins far away from the heat-conducting plate; a semiconductor refrigerating sheet is arranged on one side of the heat conducting plate close to the fins; one side that the fin was kept away from to the heat-conducting plate is provided with the heat-conducting layer, the heat-conducting layer is connected and is provided with the storage box, the storage box sets up in heat-conducting plate one end.
The utility model discloses in the setting of radiator adopts the fin board to increase heat radiating area, adopts forced air cooling, liquid cooling and semiconductor cooling simultaneously, has established a plurality of cooling channel, makes the radiator can use arbitrary passageway or their combination according to the heat dissipation demand, has realized heat-sinking capability's cascaded regulation, has also improved holistic heat-sinking capability.
The fins in the utility model are arranged in a queue, the fins are provided with grooves which are matched with the water-cooling tubes, and the water-cooling tubes are deep into the fins; the groove is matched with the semiconductor refrigerating sheet.
The utility model discloses in the area of contact of water-cooled tube with the fin has been increased in the setting of fin, has improved the heat-sinking capability.
The utility model discloses in the heat-conducting layer include the wire frame, take shape heat-conducting layer, filler space and filler opening, one side that the fin was kept away from to the heat-conducting plate is provided with the wire frame, wire frame outside cladding is provided with the heat-conducting layer that takes shape, the heat-conducting layer inboard that takes shape is provided with the filler space, the filler space sets up between the wire frame, be provided with the filler opening on the heat-conducting layer that takes shape, the storage box is connected to the filler opening.
The utility model discloses in the setting of heat-conducting layer adopts the metal crate laminating of variability to generate heat the thing, can enough adapt to the thing surface that generates heat, improves the contact surface, replaces heat-conducting plate direct contact with metal crate again, avoids forming vacuole or the heat-conducting glue problem that can't fill completely.
The utility model discloses in the storage box include heat-conducting layer magazine, coagulant magazine, discharging pipe, feeding spiral and pressure material piston, heat-conducting layer magazine is provided with to heat-conducting layer one end, heat-conducting layer magazine one side is provided with the coagulant magazine, heat-conducting layer magazine output is connected through the discharging pipe with coagulant magazine output, the discharging pipe passes the charge door, the discharging pipe extends to the inside of wire frame; a feeding screw is arranged in the discharging pipe, the feeding screw is hinged in the discharging pipe, and the feeding screw rotates along the axis; the heat-conducting layer material box is provided with a material pressing piston, the material pressing piston presses the heat-conducting layer material box, and the material pressing piston presses the coagulant material box.
The utility model discloses in the setting of storage box utilizes the mixed heat-conducting layer of feeding spiral and coagulant.
The utility model discloses in the discharging pipe on be provided with the discharge gate, the discharge gate is provided with a plurality ofly, the discharge gate is the array and arranges on the discharging pipe.
The utility model discloses in the setting of discharge gate for heat-conducting layer can evenly distributed in the wire frame.
The utility model discloses in the semiconductor refrigeration piece include backup pad, heat insulating board, refrigeration semiconductor and second radiator fan, the heat-conducting plate both ends are provided with the backup pad, the backup pad is provided with a plurality ofly, the articulated heat insulating board that is provided with in the backup pad, the heat insulating board center is provided with the through-hole, be provided with the refrigeration semiconductor in the through-hole, refrigeration semiconductor one side is provided with second radiator fan.
The utility model discloses in the setting of semiconductor refrigeration piece adopts adjustable structure, keeps away from the radiator fin when not opening, avoids semiconductor and circuit to be influenced by thermal fatigue.
The utility model discloses in one side that second radiator fan kept away from the refrigeration semiconductor be provided with the anticollision board, the anticollision board sets up in second radiator fan edge, be provided with the groove of stepping down in the backup pad, the groove of stepping down cooperates with second radiator fan.
The utility model discloses in the damage of refrigeration semiconductor and second radiator fan is avoided in the setting of anticollision board.
Above-mentioned technical scheme can find out, the utility model discloses following beneficial effect has:
1. the utility model discloses in a high-efficient radiator of multichannel aluminum alloy, adopt the fin to increase heat radiating area, adopt forced air cooling, liquid cooling and semiconductor cooling simultaneously, established a plurality of cooling channel, make the radiator can use arbitrary passageway or their combination according to the heat dissipation demand, realized heat-sinking capability's cascaded regulation, also improved holistic heat-sinking capability.
2. The utility model discloses in a high-efficient radiator of multichannel aluminum alloy, the metal crate laminating of adoption variability is heated the thing, can enough adapt to the surface of heating the thing, improves the contact surface, replaces heat-conducting plate direct contact with metal crate again, avoids forming the problem that vacuole or heat-conducting glue can't fill completely.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic top view of the present invention;
fig. 3 is a schematic structural view of the heat conduction layer and the material storage box of the present invention;
fig. 4 is a schematic structural view of the semiconductor refrigeration sheet of the present invention;
in the figure: the heat-conducting plate comprises a heat-conducting plate-1, fins-2, a heat-radiating fan-3, a heat-conducting layer-4, a metal wire frame-41, a formed heat-conducting layer-42, a filler space-43, a filler opening-44, a storage box-5, a heat-conducting layer material box-51, a coagulant material box-52, a discharge pipe-53, a feeding screw-54, a material pressing piston-55, a water-cooling pipe-6, a fixed seat-7, a semiconductor refrigerating sheet-8, a supporting plate-81, a heat-insulating plate-82, a refrigerating semiconductor-83 and a second heat-radiating fan-84.
Detailed Description
The invention will be further elucidated with reference to the drawings and the specific embodiments.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Example 1
A multi-channel aluminum alloy high efficiency heat sink as shown in fig. 1-4, comprising: the heat-conducting plate comprises a heat-conducting plate 1, fins 2, a heat-radiating fan 3, a heat-conducting layer 4, a storage box 5, a water-cooling pipe 6, a fixing seat 7 and semiconductor refrigerating sheets 8, wherein the fins 2 are arranged on one side of the heat-conducting plate 1, and the heat-radiating fans 3 are arranged at two ends of the fins 2; fixing seats 7 are arranged at two ends of the heat conducting plate 1, water-cooling tubes 6 are arranged on the fixing seats 7, and the water-cooling tubes 6 are uniformly arranged on one side, away from the heat conducting plate 1, of the fin 2; a semiconductor refrigerating sheet 8 is arranged on one side of the heat conducting plate 1 close to the fins 2; one side that fin 2 was kept away from to heat-conducting plate 1 is provided with heat-conducting layer 4, heat-conducting layer 4 connects and is provided with storage box 5, storage box 5 sets up in 1 one end of heat-conducting plate.
The fins 2 are arranged in a queue, grooves are formed in the fins 2, the grooves are matched with the water-cooling tubes 6, and the water-cooling tubes 6 penetrate into the fins 2; the groove is matched with the semiconductor refrigerating sheet 8.
The heat conducting layer 4 in this embodiment includes a wire frame 41, a forming heat conducting layer 42, a filler space 43 and a filler opening 44, the wire frame 41 is disposed on one side of the heat conducting plate 1 away from the fins 2, the forming heat conducting layer 42 is wrapped on the outer side of the wire frame 41, the filler space 43 is disposed on the inner side of the forming heat conducting layer 42, the filler space 43 is disposed between the wire frames 41, the filler opening 44 is disposed on the forming heat conducting layer 42, and the filler opening 44 is connected to the storage box 5.
The material storage box 5 in this embodiment includes a heat conducting layer material box 51, a coagulant material box 52, a material outlet pipe 53, a feeding screw 54 and a material pressing piston 55, wherein the heat conducting layer material box 51 is arranged at one end of the heat conducting layer 1, the coagulant material box 52 is arranged at one side of the heat conducting layer material box 51, the output end of the heat conducting layer material box 51 is connected with the output end of the coagulant material box 52 through the material outlet pipe 53, the material outlet pipe 53 passes through the filling opening 44, and the material outlet pipe 53 extends to the inside of the metal wire frame 41; a feeding screw 54 is arranged inside the discharging pipe 53, the feeding screw 54 is hinged in the discharging pipe 53, and the feeding screw 54 rotates along the axis; the heat conducting layer material box 51 is provided with a material pressing piston 55, the material pressing piston 55 presses the heat conducting layer material box 51, and the material pressing piston 55 presses the coagulator material box 52.
The discharging pipe 53 described in this embodiment is provided with a plurality of discharging ports, and the discharging ports are arranged on the discharging pipe 53 in an array.
In this embodiment, the semiconductor refrigeration sheet 8 includes a support plate 81, a heat insulation plate 82, a refrigeration semiconductor 83 and a second cooling fan 84, the support plates 81 are disposed at two ends of the heat conduction plate 1, the support plate 81 is provided with a plurality of heat insulation plates 82, the heat insulation plates 81 are hinged to each other, a through hole is formed in the center of each heat insulation plate 82, the refrigeration semiconductor 83 is disposed in the through hole, and the second cooling fan 84 is disposed on one side of each refrigeration semiconductor 83.
In this embodiment, an anti-collision plate is disposed on a side of the second heat dissipation fan 84 away from the refrigeration semiconductor 83, the anti-collision plate is disposed on an edge of the second heat dissipation fan 84, and a recess is disposed on the support plate 81, and the recess is matched with the second heat dissipation fan 84.
Example 2
A multi-channel aluminum alloy high efficiency heat sink as shown in fig. 1 and 2, comprising: the heat-conducting plate comprises a heat-conducting plate 1, fins 2, a heat-radiating fan 3, a heat-conducting layer 4, a storage box 5, a water-cooling pipe 6, a fixing seat 7 and semiconductor refrigerating sheets 8, wherein the fins 2 are arranged on one side of the heat-conducting plate 1, and the heat-radiating fans 3 are arranged at two ends of the fins 2; fixing seats 7 are arranged at two ends of the heat conducting plate 1, water-cooling tubes 6 are arranged on the fixing seats 7, and the water-cooling tubes 6 are uniformly arranged on one side, away from the heat conducting plate 1, of the fin 2; a semiconductor refrigerating sheet 8 is arranged on one side of the heat conducting plate 1 close to the fins 2; one side that fin 2 was kept away from to heat-conducting plate 1 is provided with heat-conducting layer 4, heat-conducting layer 4 connects and is provided with storage box 5, storage box 5 sets up in 1 one end of heat-conducting plate.
The fins 2 are arranged in a queue, grooves are formed in the fins 2, the grooves are matched with the water-cooling tubes 6, and the water-cooling tubes 6 penetrate into the fins 2; the groove is matched with the semiconductor refrigerating sheet 8.
Example 3
A multi-channel aluminum alloy high efficiency heat sink as shown in fig. 1-3, comprising: the heat-conducting plate comprises a heat-conducting plate 1, fins 2, a heat-radiating fan 3, a heat-conducting layer 4, a storage box 5, a water-cooling pipe 6, a fixed seat 7 and semiconductor refrigerating sheets 8, wherein the fins 2 are arranged on one side of the heat-conducting plate 1, and the heat-radiating fans 3 are arranged at two ends of the fins 2; fixing seats 7 are arranged at two ends of the heat conducting plate 1, water-cooling tubes 6 are arranged on the fixing seats 7, and the water-cooling tubes 6 are uniformly arranged on one side, away from the heat conducting plate 1, of the fin 2; a semiconductor refrigerating sheet 8 is arranged on one side of the heat conducting plate 1 close to the fins 2; one side that fin 2 was kept away from to heat-conducting plate 1 is provided with heat-conducting layer 4, heat-conducting layer 4 connects and is provided with storage box 5, storage box 5 sets up in 1 one end of heat-conducting plate.
The heat conducting layer 4 in this embodiment includes a wire frame 41, a forming heat conducting layer 42, a filler space 43 and a filler opening 44, the wire frame 41 is disposed on one side of the heat conducting plate 1 away from the fins 2, the forming heat conducting layer 42 is wrapped on the outer side of the wire frame 41, the filler space 43 is disposed on the inner side of the forming heat conducting layer 42, the filler space 43 is disposed between the wire frames 41, the filler opening 44 is disposed on the forming heat conducting layer 42, and the filler opening 44 is connected to the storage box 5.
The material storage box 5 in this embodiment includes a heat conducting layer material box 51, a coagulant material box 52, a material outlet pipe 53, a feeding screw 54 and a material pressing piston 55, wherein the heat conducting layer material box 51 is arranged at one end of the heat conducting layer 1, the coagulant material box 52 is arranged at one side of the heat conducting layer material box 51, the output end of the heat conducting layer material box 51 is connected with the output end of the coagulant material box 52 through the material outlet pipe 53, the material outlet pipe 53 passes through the filling opening 44, and the material outlet pipe 53 extends to the inside of the metal wire frame 41; a feeding screw 54 is arranged inside the discharging pipe 53, the feeding screw 54 is hinged in the discharging pipe 53, and the feeding screw 54 rotates along the axis; the heat conducting layer material box 51 is provided with a material pressing piston 55, the material pressing piston 55 presses the heat conducting layer material box 51, and the material pressing piston 55 presses the coagulator material box 52.
The discharging pipe 53 described in this embodiment is provided with a plurality of discharging ports, and the discharging ports are arranged on the discharging pipe 53 in an array.
Example 4
A multi-channel aluminum alloy high efficiency heat sink as shown in fig. 1, 2 and 4, comprising: the heat-conducting plate comprises a heat-conducting plate 1, fins 2, a heat-radiating fan 3, a heat-conducting layer 4, a storage box 5, a water-cooling pipe 6, a fixed seat 7 and semiconductor refrigerating sheets 8, wherein the fins 2 are arranged on one side of the heat-conducting plate 1, and the heat-radiating fans 3 are arranged at two ends of the fins 2; fixing seats 7 are arranged at two ends of the heat conducting plate 1, water-cooling tubes 6 are arranged on the fixing seats 7, and the water-cooling tubes 6 are uniformly arranged on one side, away from the heat conducting plate 1, of the fin 2; one side of the heat conducting plate 1 close to the fins 2 is provided with a semiconductor refrigerating sheet 8; one side that fin 2 was kept away from to heat-conducting plate 1 is provided with heat-conducting layer 4, heat-conducting layer 4 connects and is provided with storage box 5, storage box 5 sets up in 1 one end of heat-conducting plate.
In this embodiment, the semiconductor refrigeration sheet 8 includes a support plate 81, a heat insulation plate 82, a refrigeration semiconductor 83 and a second cooling fan 84, the support plates 81 are disposed at two ends of the heat conduction plate 1, the support plate 81 is provided with a plurality of heat insulation plates 82, the heat insulation plates 81 are hinged to each other, a through hole is formed in the center of each heat insulation plate 82, the refrigeration semiconductor 83 is disposed in the through hole, and the second cooling fan 84 is disposed on one side of each refrigeration semiconductor 83.
In this embodiment, an anti-collision plate is disposed on a side of the second heat dissipation fan 84 away from the refrigeration semiconductor 83, the anti-collision plate is disposed on an edge of the second heat dissipation fan 84, and a recess is disposed on the support plate 81, and the recess is matched with the second heat dissipation fan 84.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications can be made without departing from the principle of the present invention, and these modifications should also be regarded as the protection scope of the present invention.
Claims (7)
1. The utility model provides a high-efficient radiator of multichannel aluminum alloy which characterized in that: the method comprises the following steps: the heat-conducting plate comprises a heat-conducting plate (1), fins (2), a heat-radiating fan (3), a heat-conducting layer (4), a storage box (5), a water-cooling pipe (6), a fixed seat (7) and semiconductor refrigerating pieces (8), wherein the fins (2) are arranged on one side of the heat-conducting plate (1), and the heat-radiating fan (3) is arranged at two ends of each fin (2); fixing seats (7) are arranged at two ends of the heat conducting plate (1), water-cooling pipes (6) are arranged on the fixing seats (7), and the water-cooling pipes (6) are uniformly arranged on one side, away from the heat conducting plate (1), of the fin (2); a semiconductor refrigerating sheet (8) is arranged on one side of the heat conducting plate (1) close to the fins (2); one side of the heat-conducting plate (1) far away from the fins (2) is provided with a heat-conducting layer (4), the heat-conducting layer (4) is connected with a storage box (5), and the storage box (5) is arranged at one end of the heat-conducting plate (1).
2. The multi-channel aluminum alloy high-efficiency radiator as recited in claim 1, wherein: the fins (2) are arranged in a queue, grooves are formed in the fins (2), the grooves are matched with the water-cooling tubes (6), and the water-cooling tubes (6) penetrate into the fins (2); the groove is matched with the semiconductor refrigeration sheet (8).
3. The multi-channel aluminum alloy high-efficiency radiator as recited in claim 1, wherein: the heat conducting layer (4) comprises a metal wire frame (41), a forming heat conducting layer (42), a filling space (43) and a filling opening (44), wherein the metal wire frame (41) is arranged on one side, away from the fins (2), of the heat conducting plate (1), the forming heat conducting layer (42) is arranged on the outer side of the metal wire frame (41) in a wrapping mode, the filling space (43) is arranged on the inner side of the forming heat conducting layer (42), the filling space (43) is arranged between the metal wire frame (41), the filling opening (44) is arranged on the forming heat conducting layer (42), and the filling opening (44) is connected with the storage box (5).
4. The multi-channel aluminum alloy high-efficiency radiator as recited in claim 3, wherein: the material storage box (5) comprises a heat conduction layer material box (51), a coagulator material box (52), a discharge pipe (53), a feeding screw (54) and a pressing piston (55), wherein the heat conduction layer material box (51) is arranged at one end of the heat conduction layer (1), the coagulator material box (52) is arranged on one side of the heat conduction layer material box (51), the output end of the heat conduction layer material box (51) is connected with the output end of the coagulator material box (52) through the discharge pipe (53), the discharge pipe (53) penetrates through a filling opening (44), and the discharge pipe (53) extends to the inside of the metal wire frame (41); a feeding screw (54) is arranged in the discharging pipe (53), the feeding screw (54) is hinged in the discharging pipe (53), and the feeding screw (54) rotates along the axis; the heat-conducting layer material box (51) is provided with a material pressing piston (55), the material pressing piston (55) presses the heat-conducting layer material box (51), and the material pressing piston (55) presses the coagulator material box (52).
5. The multi-channel aluminum alloy high-efficiency radiator as recited in claim 4, wherein: discharging pipe (53) on be provided with the discharge gate, the discharge gate is provided with a plurality ofly, the discharge gate is the array and arranges on discharging pipe (53).
6. The multi-channel aluminum alloy high-efficiency radiator as recited in claim 2, wherein: semiconductor refrigeration piece (8) including backup pad (81), heat insulating board (82), refrigeration semiconductor (83) and second radiator fan (84), heat-conducting plate (1) both ends are provided with backup pad (81), backup pad (81) are provided with a plurality ofly, articulated on backup pad (81) are provided with heat insulating board (82), heat insulating board (82) center is provided with the through-hole, be provided with refrigeration semiconductor (83) in the through-hole, refrigeration semiconductor (83) one side is provided with second radiator fan (84).
7. The multi-channel aluminum alloy high-efficiency radiator as recited in claim 6, wherein: one side of the second cooling fan (84) far away from the refrigeration semiconductor (83) is provided with an anti-collision plate, the anti-collision plate is arranged on the edge of the second cooling fan (84), a yielding groove is formed in the supporting plate (81), and the yielding groove is matched with the second cooling fan (84).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220791856.5U CN217721769U (en) | 2022-04-07 | 2022-04-07 | Multi-channel aluminum alloy efficient radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220791856.5U CN217721769U (en) | 2022-04-07 | 2022-04-07 | Multi-channel aluminum alloy efficient radiator |
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| Publication Number | Publication Date |
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| CN217721769U true CN217721769U (en) | 2022-11-01 |
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| CN202220791856.5U Active CN217721769U (en) | 2022-04-07 | 2022-04-07 | Multi-channel aluminum alloy efficient radiator |
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- 2022-04-07 CN CN202220791856.5U patent/CN217721769U/en active Active
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