CN217693843U - 3D three-dimensional flexible circuit board structure - Google Patents
3D three-dimensional flexible circuit board structure Download PDFInfo
- Publication number
- CN217693843U CN217693843U CN202221335769.5U CN202221335769U CN217693843U CN 217693843 U CN217693843 U CN 217693843U CN 202221335769 U CN202221335769 U CN 202221335769U CN 217693843 U CN217693843 U CN 217693843U
- Authority
- CN
- China
- Prior art keywords
- insulating
- flexible substrate
- copper layer
- flexible
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a 3D three-dimensional flexible folded circuit board structure in the circuit board field, including the flexible substrate, the upper surface of flexible substrate is pasted and is covered with the insulating protection layer, bond through the insulating cement between insulating protection layer and the flexible substrate, set up the interval between insulating protection layer and the flexible substrate upper surface and be provided with the copper layer, the last copper layer is gone up and is etched graphical circuit, sets up the last mounting hole that is used for exposing graphical circuit on the insulating protection layer and the position that last copper layer corresponds, flexible substrate, insulating protection layer and insulating cement are the flexible material of same low resilience; go up the mounting hole and be used for the graphical line connection installation on LED lamp pearl and the last copper layer, insulating inoxidizing coating and flexible substrate adopt the flexible material of same kind of no elasticity for the circuit board does not have the problem of resilience after buckling, need not to reserve length, and assembly process is simple, the utility model is suitable for an abnormal shape structure's LED lamp illumination installation.
Description
Technical Field
The utility model relates to a flexible folded circuit board structure in the flexible circuit board field.
Background
On traditional car light, use PCB (FR 4) or MCPCB (aluminium base board), it is difficult to reach the three-dimensional effect of buckling. In the traditional method, a hard plate is used, the three-dimensional car lamp effect cannot be achieved (the hard plate cannot be bent), a connecting wire or a connector needs to be additionally arranged, the assembly process is complex, and the reliability is low. If the rigid-flex board is used, although the reliability is high, the cost is too high. If the flexible circuit board is bent to have a three-dimensional shape, the flexible circuit board will have a wavy shape due to the bending radian (R angle), and a certain length needs to be reserved to avoid the difficulty of the assembly process due to the problems of the expansion and contraction of the size and the resilience (reverse) of the flexible circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a 3D three-dimensional flexible circuit board structure need not adopt the design of soft board + hardboard, uses same kind of material, more saves expense and yield.
In order to realize the above-mentioned purpose, the utility model provides a three-dimensional flexible folded circuit board structure of 3D, including the flexible substrate, the upper surface subsides of flexible substrate have the insulating protection layer, bond through the insulating cement between insulating protection layer and the flexible substrate, it is provided with the copper layer to set up the interval between insulating protection layer and the flexible substrate upper surface, and it has the graphical circuit to etch on the copper layer, offers the last mounting hole that is used for exposing the graphical circuit on the position that insulating protection layer and last copper layer correspond, flexible substrate, insulating protection layer and insulating cement are the flexible material of same kind of low resilience.
Compared with the prior art, the beneficial effects of the utility model reside in that, going up the mounting hole and being used for the graphical line connection installation on LED lamp pearl and the last copper layer, insulating protection layer and flexible substrate adopt the flexible material of same kind of no elasticity for the circuit board does not have the problem of resilience after buckling, need not to reserve length, and assembly process is simple, the utility model is suitable for a LED lamp illumination installation of abnormal shape structure.
As a further improvement of the utility model, the flexible substrate, the insulating protective layer and the insulating glue are made of silica gel; the LED lamp adopts the silica gel material, can resist the temperature of-40-230 ℃, can resist the temperature instantly to 260 ℃, has good ductility, can be bent into a required special-shaped structure well, has good light transmittance, can be matched with a reflector plate, better reflects LED lamp light, and improves the illumination brightness.
As the utility model discloses a further improvement, the lower surface of flexible base plate has insulating inoxidizing coating through insulating adhesive bonding equally, sets up the interval between insulating inoxidizing coating and the flexible base plate lower surface and is provided with down the copper layer, and it has graphical circuit to etch down on the copper layer, offers the lower mounting hole that is used for exposing graphical circuit on the position that insulating layer and lower copper layer correspond.
LED lamp pearl can be installed to the upper and lower two sides homoenergetic of flexible substrate like this for the circuit board is after being buckled into heterotypic structure, and tow sides just can give out light, with the cooperation actual demand.
As a further improvement of the utility model, the upper copper layer and the lower copper layer are communicated with each other by arranging a connecting hole on the flexible substrate; therefore, the upper copper layer and the lower copper layer are mutually conducted, and no additional copper wire is needed to be connected, so that the wiring cost is reduced.
Drawings
Fig. 1 is a schematic view of a single-sided structure of the present invention.
Fig. 2 is a schematic view of the double-sided structure of the present invention.
The flexible printed circuit board comprises a flexible substrate 1, an insulating protective layer 2, an upper mounting hole 3, an upper copper layer 4, an insulating glue 5, a lower copper layer 6, a connecting hole 7 and a lower mounting hole 8.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings:
as shown in fig. 1-2, a 3D three-dimensional flexible circuit board structure that rolls over, including flexible substrate 1, the upper surface subsides of flexible substrate 1 cover has insulating inoxidizing coating 2, bond through insulating cement 5 between insulating inoxidizing coating 2 and the flexible substrate 1, set up the interval between insulating inoxidizing coating 2 and the flexible substrate 1 upper surface and be provided with copper layer 4, it has the graphical circuit to etch on the copper layer 4, offers the last mounting hole 3 that is used for exposing the graphical circuit on the position that insulating inoxidizing coating 2 and last copper layer 4 correspond, flexible substrate 1, insulating inoxidizing coating 2 and insulating cement 5 are the flexible material of same low resilience.
The flexible substrate 1, the insulating protective layer 2 and the insulating glue 5 are made of silica gel; the lower surface of the flexible substrate 1 is bonded with an insulating protective layer 2 through an insulating adhesive 5, a lower copper layer 6 is arranged between the insulating protective layer 2 and the lower surface of the flexible substrate 1 at intervals, a graphical circuit is etched on the lower copper layer 6, and a lower mounting hole 8 for exposing the graphical circuit is formed in the part of the insulating layer corresponding to the lower copper layer 6; the upper copper layer 4 and the lower copper layer 6 are communicated with each other through a connecting hole 7 formed in the flexible substrate 1.
The utility model discloses flexible substrate 1, insulating cement 5 and insulating inoxidizing coating 2 are the adoption silica gel material, utilize the good ductility of silica gel for the circuit board is whole can buckle into heterotypic structure in succession, and the resilience force is low, makes the equipment of circuit board more simple and convenient. The silica gel can resist the temperature of-40-230 ℃ and the instant temperature resistance of 260 ℃, can adapt to a wider temperature range, and has long service life. Because the light transmissivity of silica gel is fine, the light that makes LED lamp pearl send can pierce through the circuit board, reflects light through the reflection bottom plate, promotes the reflectivity effectively, and the light color is more fidelity.
The utility model uses silica gel as the substrate, the substrate is soft and has low resilience, and a copper layer is pasted or sputtered on the silica gel substrate, and then a graphical circuit is carried out; the outer layer is an insulating protective layer 2, silica gel is also synchronously used for insulation, the same material is used, the cost and the yield are saved, the production efficiency is improved, and the assembly process is simpler.
The present invention is not limited to the above embodiments, and based on the technical solutions of the present disclosure, those skilled in the art can make some substitutions and transformations to some technical features without creative labor according to the disclosed technical contents, and these substitutions and transformations are all within the protection scope of the present invention.
Claims (4)
1. The utility model provides a three-dimensional flexible folded circuit board structure of 3D which characterized in that: including the flexible substrate, the upper surface subsides of flexible substrate have insulating inoxidizing coating, bond through insulating cement between insulating inoxidizing coating and the flexible substrate, it is provided with the copper layer to set up the interval between insulating inoxidizing coating and the flexible substrate upper surface, goes up the copper layer and goes up the etching and have the graphical circuit, offers the last mounting hole that is used for exposing the graphical circuit on the position that insulating inoxidizing coating and last copper layer correspond, flexible substrate, insulating inoxidizing coating and insulating cement are the flexible material of same kind of low resilience force.
2. The 3D stereoscopic flexible circuit board structure according to claim 1, wherein: the flexible substrate, the insulating protective layer and the insulating glue are made of silica gel.
3. The 3D stereoscopic flexible circuit board structure according to claim 2, wherein: the lower surface of the flexible substrate is also connected with an insulating protective layer through an insulating adhesive, a lower copper layer is arranged between the insulating protective layer and the lower surface of the flexible substrate at intervals, a graphical circuit is etched on the lower copper layer, and a lower mounting hole used for exposing the graphical circuit is formed in the position, corresponding to the lower copper layer, of the insulating layer.
4. The 3D stereoscopic flexible circuit board structure according to claim 3, wherein: the upper copper layer and the lower copper layer are communicated with each other by arranging a connecting hole on the flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221335769.5U CN217693843U (en) | 2022-05-31 | 2022-05-31 | 3D three-dimensional flexible circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221335769.5U CN217693843U (en) | 2022-05-31 | 2022-05-31 | 3D three-dimensional flexible circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217693843U true CN217693843U (en) | 2022-10-28 |
Family
ID=83703865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221335769.5U Active CN217693843U (en) | 2022-05-31 | 2022-05-31 | 3D three-dimensional flexible circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217693843U (en) |
-
2022
- 2022-05-31 CN CN202221335769.5U patent/CN217693843U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7422918B2 (en) | Method of making a support for light emitting diodes which are interconnected in a three-dimensional environment | |
| CN205542866U (en) | A bendable filament for illuminator | |
| CN102859271A (en) | Lighting device | |
| CN204879551U (en) | LED bulb and flexible LED filament thereof | |
| CN202652681U (en) | LED three-dimensional circuit board | |
| CN217693843U (en) | 3D three-dimensional flexible circuit board structure | |
| CN105430904A (en) | Flexible lamp filament for light emitting device and fabrication method of flexible lamp filament | |
| CN205716629U (en) | A kind of anti-tampering light bar of double-faced flexible | |
| CN105813380B (en) | A kind of LED pcb boards connection method | |
| CN206743658U (en) | A kind of encapsulated light bar of double-faced flexible | |
| CN102032540A (en) | Substrate group connected by flexible connecting bridges | |
| CN213660406U (en) | Integrated LED lamp bead | |
| CN1474462A (en) | Package structure of surface adhesive light -emitting diode and its producing method | |
| CN202144992U (en) | FPC (flexible printed circuit board) illuminating device capable of being multi-directionally bent | |
| CN210601153U (en) | Lamp strip FFC | |
| CN102769992A (en) | Three-dimensional LED circuit board | |
| CN206743673U (en) | A kind of heat-resisting encapsulated light bar of double-faced flexible | |
| CN102227156A (en) | High reflection mirror MCPCB (printed circuit board) and preparation method thereof | |
| CN206743674U (en) | A kind of double-faced flexible wiring board | |
| CN207122793U (en) | A kind of heat-resisting light bar of double-faced flexible | |
| CN2588539Y (en) | Adhesive stick type LED | |
| CN206093582U (en) | High radiating LED circuit board bulb module | |
| CN204741612U (en) | Circuit connection structure | |
| CN205726664U (en) | A kind of anti-tampering encapsulated light bar of double-faced flexible | |
| CN201063960Y (en) | LED unit and the composed LED module group thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |