CN217656818U

CN217656818U - Novel nickel plating terminal paster structure

Info

Publication number: CN217656818U
Application number: CN202220306496.5U
Authority: CN
Inventors: 樊文豪; 彭观强; 唐波; 彭康; 廖健; 曾国强; 刘聪
Original assignee: Guangdong Greenway Technology Co Ltd
Current assignee: Guangdong Greenway Technology Co Ltd
Priority date: 2022-02-15
Filing date: 2022-02-15
Publication date: 2022-10-25
Anticipated expiration: 2032-02-15

Abstract

The utility model provides a novel nickel plating terminal paster structure, which comprises a nickel plating terminal used as an over-power current carrier for ensuring continuous output of large current, wherein the nickel plating terminal comprises a PCB copper strip and a U-shaped copper strip; the protection shield for cooperation installation nickel plating terminal, PCB copper bar and U-shaped copper sheet all are connected with the protection shield, the utility model discloses compare with the prior art, reduced the quantity of copper bar when the paster, draw the interval of wide copper bar, reduce reflow soldering's stress concentration problem, under the prerequisite of guaranteeing circuit stability, can let the protection shield need not to use the tool when SMT reflow soldering nickel plating terminal, no deformation or deflection less than or equal to 0.5% behind the stove.

Description

Novel nickel plating terminal paster structure

Technical Field

The utility model relates to a PCB paster technical field, concretely relates to novel nickel plating terminal paster structure.

Background

The nickel plating terminal is the carrier of too big power current on the energy storage type lithium cell BMS protection shield, is the important safety spare that the guarantee protection shield can continuously output heavy current, and the nickel plating terminal that uses on the BMS protection shield at present is rectangular paster material, closely pastes dress welding to the BMS protection shield through the form at SMT paster with the nickel plating terminal on.

And this kind of mode leads to the protection shield to appear serious deformation after reflow soldering, produces stress simultaneously and influences the welding and the equipment effect of rear end, finally influences the life cycle of product.

In order to reduce the deformation of the protection plate, a corresponding furnace-passing jig is needed during SMT reflow soldering. Limited by the number of jigs, cooling waiting and other factors, the input cost of the jigs is high, and the production efficiency of products is low

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provide a novel nickel plating terminal patch structure.

The technical scheme of the utility model as follows:

a novel nickel plated terminal patch structure, comprising:

the nickel plating terminal is used as an over-power current carrier and used for guaranteeing continuous output of large current and comprises a PCB copper strip and a U-shaped copper sheet;

the protection shield is used for being matched with and installing the nickel plating terminal, and the PCB copper strip and the U-shaped copper sheet are connected with the protection shield.

The utility model discloses in, be equipped with the copper region that covers that is P +, P-, B +, B-respectively on the protection shield, just lie in on the protection shield P +, P cover copper region department still be equipped with the jack.

Furthermore, the PCB copper bar is welded on the copper-clad area of the P +, P-, B + and B-of the protection board through flat pasting.

The utility model discloses in, U-shaped copper sheet bottom is equipped with the pin.

Furthermore, the pins correspond to the jacks, and the U-shaped copper sheets are welded and mounted on the P + and P-copper-clad areas of the protection plate through the pins matching with the jacks.

The utility model discloses in, PCB copper bar is two liang of left and right sides parallel subsides dress, and the interval is 4.5mm, the U-shaped copper sheet is located PCB copper bar top, the U-shaped copper sheet with one-to-one about the PCB copper bar, and the interval is 0.5mm.

The utility model discloses in, the PCB copper bar size adopts 20x1.3x9mmT.

In the utility model, the U-shaped copper sheet adopts 12x24x5.5mmT in size.

Furthermore, the thickness of the jack is 1.5mm, the thickness of the pin is 1mm, and the pin and the jack are filled with soldering tin to ensure normal over-current.

The utility model discloses in, the PCB copper bar and the U-shaped copper sheet all adopts red copper nickel plating mode to make.

Compared with the prior art, the beneficial effects of the utility model reside in that:

compared with the prior art, the utility model, reduced the quantity of copper bar when the paster, the interval of widening the copper bar reduces reflow soldering's stress concentration problem, under the prerequisite of guaranteeing circuit stability, can let the protection shield need not to use the tool when SMT reflow soldering nickel plating terminal, and the stove is back to have not warp or deflection less than or equal to 0.5%.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following descriptions are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of a novel nickel plating terminal patch structure provided by the present invention;

FIG. 2 is a schematic structural view of the protection plate;

fig. 3 is a schematic structural view of the U-shaped copper sheet.

The reference numerals are explained below:

1. PCB copper bar; 2. a U-shaped copper sheet; 21. a pin; 3. a protection plate; 31. a copper-clad region; 32. and (7) inserting the jack.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to explain the technical solution of the present invention, the following description is made by using specific examples.

Example 1

Referring to fig. 1 to fig. 3, the present embodiment provides a novel nickel-plated terminal patch structure, including:

the nickel plating terminal is used as an over-power current carrier and used for guaranteeing continuous output of large current and comprises a PCB copper strip 1 and a U-shaped copper sheet 2;

and the protection plate 3 is used for installing a nickel plating terminal in a matching way, and the PCB copper strip 1 and the U-shaped copper sheet 2 are connected with the protection plate 3.

In this embodiment, the protection board 3 is provided with copper-clad regions 31 of P +, P-, B +, and B-, respectively, and the protection board 3 is further provided with insertion holes 32 at the copper-clad regions 31 of P +, P-.

Further, the PCB copper bar 1 is welded on the P +, P-, B +, B-copper-coated area 31 of the protection board 3 by flat pasting.

In this embodiment, the bottom of the U-shaped copper sheet 2 is provided with a pin 21.

Furthermore, the pins 21 correspond to the insertion holes 32, and the U-shaped copper sheets 2 are welded and mounted on the P + and P-copper-clad areas 31 of the protection board 3 through the pins 21 matching with the insertion holes 32.

In the embodiment, the PCB copper strips 1 are pasted on the left side and the right side in parallel at intervals of 4.5mm, the U-shaped copper sheets 2 are arranged above the PCB copper strips 1, the U-shaped copper sheets 2 correspond to the PCB copper strips 1 one by one from top to bottom, and the intervals are 0.5mm.

In this embodiment, the PCB copper bar 1 size is 20x1.3x9mmt.

In this example, the size of the U-shaped copper sheet 2 is 12x24x5.5mmT.

Furthermore, the thickness of the insertion hole 32 is 1.5mm, the thickness of the pin 21 is 1mm, and the space between the pin 21 and the insertion hole 32 is filled with soldering tin, so that normal over-current is ensured.

In this embodiment, the PCB copper bar 1 and the U-shaped copper sheet 2 are made of red copper by nickel plating.

Example 2

The novel nickel plating terminal paster structure that this embodiment provided includes:

Further, the PCB copper bar 1 is welded on the P +, P-, B +, B-copper-covered region 31 of the protection board 3 by flat pasting.

In the embodiment, the PCB copper strips 1 are pasted on the left side and the right side in parallel in pairs, the distance is 4.5mm, the U-shaped copper sheets 2 are arranged above the PCB copper strips 1, the U-shaped copper sheets 2 correspond to the PCB copper strips 1 one by one from top to bottom, and the distance is 0.5mm.

In this embodiment, the PCB copper bar 1 size is 20x1.3x9mmt.

In the present embodiment, the size of the U-shaped copper sheet 2 is 12x24x5.5mmt.

Furthermore, the thickness of the insertion hole 32 is 1mm, the thickness of the pin 21 is 0.8mm, and the space between the pin 21 and the insertion hole 32 is filled with soldering tin, so that normal over-current is ensured.

In this embodiment, the PCB copper bar 1 and the U-shaped copper sheet 2 are made of red copper by nickel plating. While the present invention has been described with reference to several exemplary embodiments, it is understood that the terms used are words of description and illustration, rather than words of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims

1. A novel nickel plating terminal patch structure is characterized by comprising:

the protection plate is used for being matched with and installing the nickel plating terminal, and the PCB copper strip and the U-shaped copper sheet are connected with the protection plate.

2. A novel nickel plating terminal patch structure as claimed in claim 1, wherein the protection plate is provided with copper-clad regions P +, P-, B +, B-, respectively, and the protection plate is further provided with a jack at the copper-clad region P +, P-.

3. A novel nickel plated terminal patch structure as claimed in claim 2, wherein the PCB copper strip is soldered to the P +, P-, B +, B-copper clad region of the protection plate by flat soldering.

4. A novel nickel plated terminal patch structure according to claim 2, wherein the bottom of the U-shaped copper sheet is provided with pins.

5. A novel nickel plated terminal patch structure as claimed in claim 4, wherein said pins correspond to said receptacles, and said U-shaped copper sheet is solder-mounted on said P +, P-copper-clad area of said protection board by said pins engaging said receptacles.

6. A novel nickel plating terminal patch structure as claimed in claim 1, wherein the PCB copper bars are mounted in parallel two by two with a space of 4.5mm, the U-shaped copper sheets are arranged above the PCB copper bars, the U-shaped copper sheets and the PCB copper bars are in one-to-one correspondence from top to bottom, and the space is 0.5mm.

7. A novel nickel plated terminal patch structure as claimed in claim 1, wherein the PCB copper bar size is 20x1.3x9mmt.

8. A novel nickel plated terminal patch structure according to claim 1, wherein the U-shaped copper sheet size is 12x24x5.5mmt.

9. A novel nickel plating terminal patch structure as claimed in claim 4, characterized in that the thickness of the jack is 1.5mm, the thickness of the pin is 1mm, and the pin and the jack are filled up by soldering tin to ensure normal over-current.

10. A novel nickel plated terminal patch structure according to claim 1, wherein the PCB copper strip and the U-shaped copper sheet are made of red copper plated with nickel.