CN217606848U - Device connecting device, package and electronic device - Google Patents
Device connecting device, package and electronic device Download PDFInfo
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- CN217606848U CN217606848U CN202220432366.6U CN202220432366U CN217606848U CN 217606848 U CN217606848 U CN 217606848U CN 202220432366 U CN202220432366 U CN 202220432366U CN 217606848 U CN217606848 U CN 217606848U
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Abstract
The application discloses device connecting device, packaging body and electron device, this device connecting device includes: the circuit board is provided with a covering film, wherein an opening in a preset shape is formed in the covering film; the shape of the bonding pad is a preset shape corresponding to the opening, wherein the bonding pad is fixed in the opening; and the light-emitting diode comprises a pin with a preset shape corresponding to the bonding pad, and the light-emitting diode is welded with the bonding pad through the pin with the preset shape. The pin and the pad of the light-emitting diode of the device connecting device are in corresponding preset shapes, and the pins and the pad are easily controlled to be attached to the required position when being mutually embedded and attached, so that the inclination angle of the light-emitting diode can be reduced.
Description
Technical Field
The utility model relates to a technical field that the device is connected especially relates to a device connecting device, packaging body and electron device.
Background
In recent years, products such as mobile phones and televisions tend to be light and thin, and the thickness of light emitting diodes serving as packaged devices of screen light sources is becoming thinner and thinner. A side-Emitting small-sized Light Emitting Diode is becoming a mainstream trend at present except for an OLED (Organic Light-Emitting Diode).
The luminous angle of the side-emitting light-emitting diode is smaller than that of the top-emitting light-emitting diode, and a plurality of light-emitting diodes are usually arranged on the same line, so that the requirement for the inclination angle of the side-emitting light-emitting diode after welding is higher for ensuring the uniformity of screen light emission.
How to improve the pad design to control the tilt angle of the side-emitting led within an acceptable range becomes a problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem who mainly solves provides a device connecting device, packaging body and electron device, can effectively reduce the luminous emitting diode's of side inclination.
In order to solve the above technical problem, a first technical solution adopted by the present application is to provide a device connecting apparatus, including: the circuit board is provided with a covering film, wherein an opening in a preset shape is formed in the covering film; the shape of the bonding pad is a preset shape corresponding to the opening, wherein the bonding pad is fixed in the opening; and the light-emitting diode comprises a pin with a preset shape corresponding to the bonding pad, and the light-emitting diode is welded with the bonding pad through the pin with the preset shape.
Wherein the preset shape is L-shaped.
The circuit board comprises a conducting layer, and the covering film is fixed on the conducting layer through glue.
Wherein the pad is electrically connected with the conductive layer of the circuit board through the opening.
The light emitting diode comprises two pins in preset shapes, two corresponding openings and two bonding pads located in the openings are formed in the covering film, and the two pins in the preset shapes are respectively welded with the two bonding pads.
And the bonding pad and the pin with the preset shape are welded together through solder paste.
Wherein, the bonding pad is an electroplated nickel-palladium-gold bonding pad.
In order to solve the above technical problem, a second technical solution adopted by the present application is to provide a package body, wherein the package body is attached with a light emitting diode through the device connecting apparatus.
Wherein, a plurality of light emitting diodes are collinearly attached on the packaging body.
In order to solve the above technical problem, a third technical solution adopted by the present application is to provide an electronic device, which includes a frame and the package body described above located in the frame.
The beneficial effect of this application is: in contrast to the prior art, the present application provides a device connecting apparatus, a package and an electronic apparatus. The device connecting device circuit board is provided with an upper covering film window to form an opening with a preset shape, and the shape of the opening corresponds to that of the bonding pad. And then the bonding pad corresponding to the preset shape and the opening corresponding to the covering film are pressed and fixed, so that the matching refinement degree of the bonding pad and the opening of the covering film is higher. Meanwhile, the pins on the light-emitting diodes are in the preset shapes corresponding to the bonding pads, when the pins in the preset shapes of the light-emitting diodes are attached to the bonding pads in the preset shapes, the attachment of the light-emitting diodes at required positions can be controlled more easily, the inclination angle of the light-emitting diodes can be controlled within 1 degree, and finally the collinear effect of the light-emitting diodes is better.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
FIG. 1 is a schematic diagram of an embodiment of a device attachment apparatus of the present application;
FIG. 2 is a schematic top view of a portion of the structure of the device attachment apparatus of FIG. 1;
FIG. 3 is a schematic structural diagram of an embodiment of the package of the present application;
fig. 4 is a schematic structural diagram of an embodiment of an electronic device of the present application.
Reference numerals: 100. a device connecting means; 101/201, opening; 102/202, bonding pad; 103/203, pins; 104/204, light emitting diodes; 105. covering the film; 106. gluing; 107. a conductive layer; 200/400, packaging body; 300. an electronic device.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" typically includes at least two, but does not exclude the presence of at least one.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
Electronic products gradually tend to be light and thin, and small light emitting diodes emitting light from the side become the mainstream trend. The side-emitting leds need to be fixed with high precision, and the requirements on the tilt angle and the collinearity of the leds are high.
Based on the problem, the utility model provides a device connecting device, packaging body and electron device forms the pad of predetermineeing the shape on the conducting layer, later on cover the opening that the membrane was opened window and is formed the same shape of predetermineeing, will have the opening of predetermineeing the shape equally and the pad pressfitting is fixed, will have again to correspond the emitting diode and the pad welded fastening who predetermine the shape pin, can effectively solve above-mentioned problem.
The device connecting apparatus, the package and the electronic apparatus provided in the present application are described in detail below with reference to the accompanying drawings and embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a device connection apparatus according to the present application, and as shown in fig. 1, in the embodiment, the device connection apparatus 100 at least includes a circuit board (not labeled), a pad 102, and a light emitting diode 104.
The circuit board is provided with a cover film 105, wherein the cover film 105 is formed with an opening 101 having a predetermined shape. The pad 102 has a predetermined shape corresponding to the opening 101, wherein the pad 102 is fixed in the opening 101. Specifically, in this embodiment, the pad 102 with a predetermined shape is formed by pattern plating on the circuit board, then the cover film 105 is windowed to form the opening 101 with the same shape, and then the opening 101 of the cover film 105 and the pad 102 are pressed on the conductive layer correspondingly. In other embodiments, the cover film 105 may be pressed on the circuit board, the opening 101 is formed on the cover film 105, and then the pad 102 with a predetermined shape is formed in the opening 101 by electroplating or the pad 102 with a predetermined shape is directly pressed. The advantages of forming the opening 101 by film-pasting and then forming the bonding pad 102 by electroplating are that the dimensional accuracy of the opening 101 is high, and the fitting degree between the opening 101 and the bonding pad 102 is better. The advantage of pressing the coverlay 105 onto the plated pad 102 after forming the opening 101 is that the coverlay 105 is not plated in the opening 101, and the coverlay 105 does not expand or contract due to thermal expansion or contraction during the plating process. The specific manner of forming the structure of the opening 101 and the pad 102 is not limited, and may be selected according to circumstances, and is not limited herein. Wherein the opening 101 is formed by a windowing process. In this embodiment, the cover film 105 is windowed by a laser windowing tool to form the opening 101 having a predetermined shape, and in other embodiments, windowing may be performed by other processes such as slow-running wire.
In the conventional bonding pad 102 connection method, the bonding pad 102 is fixed in the opening 101 of the cover film 105, the shape of the opening 101 is not preset, the opening 101 is generally rectangular, when the bonding pad 102 is fixed in the rectangular opening 101, the fixing position accuracy is not high, and the cover film 105 near the opening 101 may be damaged when the cover film 105 is pressed on the bonding pad 102 because the opening 101 and the bonding pad 102 are not matched in size. In the application, the opening 101 is in a preset shape corresponding to the pad 102, the position of the pad 102 fixed in the opening 101 is only fixed, the fine degree of the pad 102 attached to the cover film is improved, and the inclination angle of subsequent device mounting is reduced.
The led 104 includes a lead 103 having a predetermined shape corresponding to the pad 102, and the led 104 is soldered to the pad 102 through the lead 103 having the predetermined shape. Specifically, in the present embodiment, the size of the predetermined shape of the opening 101 is the same as the size of the predetermined shape of the pad 102, and the size of the lead 103 of the predetermined shape is slightly smaller than the size of the pad 102. The height of the bonding pad 102 is larger than the thickness of the cover film 105, the bonding pad 102 is partially embedded in the opening 101, and the portion of the bonding pad 102 higher than the cover film 105 is welded with the lead 103 of the light emitting diode 104. The shape of the bonding pad 102 corresponds to that of the pin 103, and when the light emitting diode 104 is welded, the pin 103 and the bonding pad 102 are inverted to each other, and under the action of the mutually embedded bonding pad 102 and the pin 103, the pin 103 of the light emitting diode 104 can be accurately welded at a preset position, so that the welding refinement degree is higher, and an overlarge inclination angle generated in the welding process is avoided.
Through the mode, the upper opening window of the covering film on the circuit board forms the opening with the preset shape, and the shape of the opening corresponds to the pad. And then the bonding pad corresponding to the preset shape and the opening corresponding to the covering film are pressed and fixed, so that the matching refinement degree of the bonding pad and the opening of the covering film is higher. When the light emitting diode is welded, the mutually inverted and mutually embedded bonding pads and the pins interact, the pins can be accurately welded at preset positions, and the phenomenon that the welding process generates an overlarge inclination angle is avoided.
With continued reference to fig. 1, other technical features of the device connecting apparatus 100 of the present embodiment will be described.
In this embodiment, the predetermined shape is an L-shape, the light emitting diode 104 includes two leads 103 with predetermined shapes, two openings 101 and two pads 102 located in the openings 101 are formed on the cover film 105, and the two leads 103 with predetermined shapes are respectively soldered to the two pads 102. Specifically, the distance between the two pads 102 is equal to the distance between the two leads 103 on the led 104. In other embodiments, the predetermined shape may also be an arc shape or a fan shape, which is not limited in this application.
In this embodiment, the pad 102 is an electroplated nickel-palladium-gold pad. Specifically, a nickel layer, a palladium layer and a gold layer may be deposited on the pad 102 by chemical deposition to form an electroplated nickel-palladium-gold pad, and the nickel-palladium-gold plated on the surface of the pad 102 can form a large metal surface, thereby enhancing the heat dissipation effect of the light emitting diode 104. In other embodiments, other pads may be used.
Wherein, the pad 102 and the lead 103 with a predetermined shape are soldered together by solder paste (not shown). Specifically, solder paste is a conductive adhesive by which the leads 103 of the light emitting diode 104 and the pad 102 are conductively bonded together. In other embodiments, the leads 103 and the pads 102 may be bonded by using other conductive adhesives such as silver paste.
Further, in order to enhance the bonding effect between the leads 103 of the light emitting diode 104 and the bonding pad 102, in other embodiments, a plurality of blind holes may be formed on the bonding pad 102, and it can be understood that when the leads 103 are bonded to the bonding pad 102, a conductive adhesive such as solder paste may fill the blind holes on the bonding pad 102, so that the bonding manner between the conductive adhesive and the bonding pad 102 is changed from surface bonding to surface bonding, and by increasing the contact area between the conductive adhesive and the bonding pad 102, the connection bonding force between the leads 103 of the light emitting diode 104 and the bonding pad 102 is greatly improved.
Referring to fig. 2, fig. 2 is a schematic top view of a portion of the device connecting apparatus 100 of fig. 1.
As shown in fig. 2, the circuit board (not labeled) includes a conductive layer 107, and the cover film 105 is fixed on the conductive layer 107 by the adhesive 106. The pads 102 are electrically connected to the conductive layer 107 of the circuit board through openings (not labeled). Specifically, the cap film 105 is an insulating film that protects the conductive layer 107 from exposure to air and prevents oxidation of the conductive layer 107, the pad 102 is electrically connected to the conductive layer 107 through the opening, and power is supplied to the device through the conductive layer 107 after the device is subsequently mounted on the pad 102.
Different from the prior art, the device connecting device has the advantages that the opening window in the covering film forms the opening with the preset shape, and the shape of the opening corresponds to that of the bonding pad. And then the bonding pad corresponding to the preset shape and the opening corresponding to the covering film are pressed and fixed, so that the degree of fineness of the bonding pad and the opening of the covering film is higher. When the luminous secondary light is welded, the mutually inverted and mutually embedded bonding pads and the pins (not marked) interact, the pins can be accurately welded at preset positions, and the phenomenon that the welding process generates an overlarge inclination angle is avoided.
Correspondingly, the application provides a package body.
Specifically, please refer to fig. 3, wherein fig. 3 is a schematic structural diagram of an embodiment of a package 200 according to the present application. The light emitting diode is mounted on the package body 200 through the device connecting apparatus 100 described above.
A cover film 205 is disposed on the circuit board (not labeled), wherein an opening 201 with a predetermined shape is formed on the cover film 205. The pad 202 has a predetermined shape corresponding to the opening 201, wherein the pad 202 is fixed in the opening 201. Specifically, in this embodiment, the pad 202 with a predetermined shape is formed by pattern plating on the circuit board, then the cover film 205 is windowed to form the opening 201 with the same shape, and then the opening 201 of the cover film 205 and the pad 202 are correspondingly pressed on the conductive layer. In other embodiments, the cover film 205 may be pressed on the circuit board, the opening 201 is formed on the cover film 205, and then the pad 202 with a predetermined shape is formed in the opening 201 by electroplating or the pad 202 with a predetermined shape is directly pressed. The advantage of forming the opening 201 by film-coating and then forming the pad 202 by electroplating is that the opening 201 has high dimensional accuracy and the opening 201 and the pad 202 have better fitting degree. The advantage of pressing the coverlay 205 on the plated pad 202 after forming the opening 201 is that the coverlay 205 is not plated in the opening 201, and the problem of expansion and contraction of the coverlay 205 caused by thermal expansion and contraction of the plating process is avoided. The specific manner of forming the structure of the opening 201 and the pad 202 is not limited, and may be selected according to the circumstances, and is not limited herein. Wherein the opening 201 is formed by a windowing process. In this embodiment, the cover film 205 is windowed by a laser windowing tool to form the opening 201 in a predetermined shape, and in other embodiments, windowing may be performed by other processes such as slow-moving wire.
In the conventional bonding pad 202 connection manner, the bonding pad 202 is fixed to the opening 201 of the cover film 205, the shape of the opening 201 is not preset, the opening 201 is generally rectangular, when the bonding pad 202 is fixed in the rectangular opening 201, the fixing position accuracy is not high, and the cover film 205 near the opening 201 may be damaged when the bonding pad 202 is fixed due to the mismatch between the sizes of the opening 201 and the bonding pad 202 when the cover film 205 is pressed on the bonding pad 202. In the application, the opening 201 is a preset shape corresponding to the pad 202, the position of the pad 202 fixed in the opening 201 is only fixed, the fine degree of the bonding between the pad 202 and the cover film 205 is improved, and the inclination angle of the subsequent device mounting is also reduced.
The led 204 includes a pin 203 with a predetermined L shape corresponding to the pad 202, and the led 204 is soldered to the pad 202 through the pin 203 with the predetermined L shape. Specifically, the shape of the pad 202 corresponds to the shape of the pin 203, and when the led 204 is welded, the pin 203 and the pad 202 are inverted, and under the action of the mutually embedded pad 202 and pin 203, the pin 203 of the led 204 can be accurately welded at a preset position, so that the degree of weld refinement is higher, and an excessive inclination angle generated in the welding process is avoided.
Wherein a plurality of light emitting diodes 204 are mounted on the package 200 in a collinear manner. In order to simplify the drawing, only two light emitting diodes 204 are shown in fig. 3, and it is understood that a plurality of more light emitting diodes 204 and corresponding pads 202 may be disposed in the lateral or longitudinal direction of the package body 200.
Through the structure, when the light emitting diode is pasted on the packaging body, the upper opening window of the covering film on the circuit board forms the opening with the preset shape, and the shape of the opening corresponds to the bonding pad. And then the bonding pad corresponding to the preset shape and the opening corresponding to the covering film are pressed and fixed, so that the matching refinement degree of the bonding pad and the opening of the covering film is higher. When the light emitting diode is welded, the mutually inverted and mutually embedded bonding pads and the pins interact, the pins can be accurately welded at preset positions, and the phenomenon that the welding process generates an overlarge inclination angle is avoided. Meanwhile, when the cover film is windowed and pressed to fix the bonding pad, a plurality of openings in shapes are windowed at the same time, and a plurality of light-emitting diodes can be correspondingly mounted, the openings in the preset shapes are controlled to be in a collinear state when the windows are formed, the bonding pads in the corresponding shapes are also in a collinear state after being pressed in an opening area, and then the plurality of light-emitting diodes are welded at the preset positions through interaction of the bonding pads which are mutually inverted and mutually embedded and the pins, so that the collinear effect of the plurality of light-emitting diodes is better.
Correspondingly, the application provides an electronic device.
As shown in fig. 4, the electronic device 300 of the present application includes a frame (not shown) and the package 400 described above and located in the frame.
Different from the prior art, the electronic device has the advantages that the opening in the preset shape is formed by opening the window on the covering film on the circuit board, and the shape of the opening corresponds to that of the bonding pad. And then, the bonding pad corresponding to the preset shape and the opening corresponding to the covering film are pressed and fixed, and the matching degree of the bonding pad and the opening of the covering film is higher. When the light emitting diode is welded, the mutually inverted and mutually embedded bonding pads and the pins interact, the pins can be accurately welded at preset positions, and the phenomenon that the welding process generates an overlarge inclination angle is avoided. Meanwhile, when the cover film is windowed and pressed to fix the bonding pad, a plurality of openings in shapes are windowed at the same time, and a plurality of light-emitting diodes can be correspondingly mounted, the openings in the preset shapes are controlled to be in a collinear state when the windows are formed, the bonding pads in the corresponding shapes are also in a collinear state after being pressed in an opening area, and then the plurality of light-emitting diodes are welded at the preset positions through interaction of the bonding pads which are mutually inverted and mutually embedded and the pins, so that the collinear effect of the plurality of light-emitting diodes is better. Especially for the side-emitting electronic device, the arrangement of the light-emitting diodes on the thinner side edge can ensure that the inclination angle is not higher than 1 degree, and the collinear effect of all the light-emitting diodes is good.
The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications that can be made by using equivalent structures or equivalent principles in the contents of the specification and the drawings or directly or indirectly applied to other related technical fields are also included in the scope of the present application.
Claims (10)
1. A device connecting apparatus, comprising:
the circuit board is provided with a covering film, wherein an opening in a preset shape is formed in the covering film;
the shape of the bonding pad is a preset shape corresponding to the opening, and the bonding pad is fixed in the opening;
and the light-emitting diode comprises a pin with a preset shape corresponding to the pad, and the light-emitting diode is welded with the pad through the pin with the preset shape.
2. The device connecting apparatus according to claim 1,
the preset shape is L-shaped.
3. The device connecting apparatus according to claim 1,
the circuit board comprises a conducting layer, and the covering film is fixed on the conducting layer through glue.
4. The device connecting apparatus according to claim 3,
the pad is electrically connected to the conductive layer of the circuit board through the opening.
5. The device connecting apparatus according to claim 1,
the light emitting diode comprises two pins in the preset shapes, two corresponding openings and two bonding pads located in the openings are formed in the cover film, and the two pins in the preset shapes are respectively welded with the two bonding pads.
6. The device connecting apparatus according to claim 1,
and the bonding pad and the pin with the preset shape are welded together through solder paste.
7. The device connecting apparatus according to claim 1,
the bonding pad is an electroplated nickel-palladium-gold bonding pad.
8. A package having a light emitting diode mounted thereon by the device connecting apparatus as claimed in any one of claims 1 to 7.
9. The package of claim 8,
and the plurality of light-emitting diodes are attached to the packaging body in a collinear manner.
10. An electronic device, comprising a frame and the package according to any one of claims 8 to 9 located in the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220432366.6U CN217606848U (en) | 2022-02-28 | 2022-02-28 | Device connecting device, package and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220432366.6U CN217606848U (en) | 2022-02-28 | 2022-02-28 | Device connecting device, package and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217606848U true CN217606848U (en) | 2022-10-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220432366.6U Active CN217606848U (en) | 2022-02-28 | 2022-02-28 | Device connecting device, package and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217606848U (en) |
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- 2022-02-28 CN CN202220432366.6U patent/CN217606848U/en active Active
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