CN217606780U - Heat dissipation cooling device of quartz furnace tube vacuum furnace - Google Patents
Heat dissipation cooling device of quartz furnace tube vacuum furnace Download PDFInfo
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- CN217606780U CN217606780U CN202221231287.5U CN202221231287U CN217606780U CN 217606780 U CN217606780 U CN 217606780U CN 202221231287 U CN202221231287 U CN 202221231287U CN 217606780 U CN217606780 U CN 217606780U
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Abstract
The utility model provides a heat dissipation cooling device of a quartz furnace tube vacuum furnace, which comprises a vacuum furnace body and a cold air conveyor; an air inlet through hole and an air outlet through hole are formed in the vacuum furnace body, and the cold air conveyor is communicated with the air inlet through hole; the air outlet through hole is connected with an air outlet pipeline. The utility model has the advantages that: the condition that the silicon wafer or the quartz furnace tube is cracked due to overlarge temperature difference can be avoided; meanwhile, the temperature of the silicon wafer and the quartz furnace tube is reduced firstly, and then the silicon wafer and the quartz furnace tube are taken out from the vacuum furnace body, so that the taking-out operation is very convenient, and the scalding of operators can be avoided.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a silicon chip production facility technical field, in particular to heat dissipation cooling device of quartzy boiler tube vacuum furnace.
[ background of the invention ]
The silicon chip is a raw material for manufacturing transistors and integrated circuits and is also a main component in photovoltaic products. The silicon wafer is typically a slice of monocrystalline silicon. Various semiconductor devices can be manufactured by means of photoetching, ion implantation and the like on a silicon wafer; chips made from silicon wafers have a surprising computing power.
In the process of producing the silicon wafer, the silicon wafer is required to be placed in a quartz furnace tube, and the silicon wafer and the quartz furnace tube are placed in a quartz furnace tube vacuum furnace together for heating. In the past, after heating is finished, the heated silicon wafer and the quartz furnace tube are taken out of the quartz furnace tube vacuum furnace together for cooling, but the conventional method has the following defects: because the temperature difference between the inside and the outside of the quartz furnace tube vacuum furnace is large, the silicon wafer or the quartz furnace tube is easily broken when the silicon wafer or the quartz furnace tube is directly taken out of the quartz furnace tube vacuum furnace; meanwhile, the temperature of the heated silicon wafer and the quartz furnace tube is higher, and the silicon wafer and the quartz furnace tube are very inconvenient to take and place.
[ Utility model ] content
The to-be-solved technical problem of the utility model lies in providing a heat dissipation cooling device of quartzy boiler tube vacuum furnace, solve among the prior art with silicon chip and quartzy boiler tube directly take out from quartzy boiler tube vacuum furnace and cause silicon chip or quartzy boiler tube to appear cracked problem easily.
The utility model discloses a realize like this: a heat dissipation cooling device of a quartz furnace tube vacuum furnace comprises a vacuum furnace body and a cold air conveyor; an air inlet through hole and an air outlet through hole are formed in the vacuum furnace body, and the cold air conveyor is communicated with the air inlet through hole; the air outlet through hole is connected with an air outlet pipeline.
Furthermore, a first pipe joint is fixedly arranged in the air inlet through hole, an air inlet control valve is fixedly arranged at the outer end of the first pipe joint, and the cold air conveyor is connected with the air inlet control valve through an air inlet pipeline; and a second pipe joint is fixedly arranged in the air outlet through hole, an air outlet control valve is fixedly arranged at the outer end of the second pipe joint, and the air outlet pipeline is connected with the air outlet control valve.
Furthermore, the air inlet through hole is formed in the lower portion of the vacuum furnace body, and the air outlet through hole is formed in the upper portion of the vacuum furnace body; or the air inlet through hole is arranged at the upper part of the vacuum furnace body, and the air outlet through hole is arranged at the lower part of the vacuum furnace body.
The device further comprises a temperature sensor fixedly arranged in the vacuum furnace body, a control box fixedly arranged outside the vacuum furnace body and a temperature display fixedly arranged outside the vacuum furnace body; the temperature sensor and the temperature display are electrically connected with the control box.
Furthermore, the vacuum furnace further comprises a supporting platform fixedly arranged on one side of the vacuum furnace body, and the control box and the cold air conveyor are fixedly arranged on the supporting platform.
Further, the air inlet control valve and the air outlet control valve are both solenoid valves.
Further, the air inlet pipeline and the air outlet pipeline are hoses.
Furthermore, a sealing door is arranged on the vacuum furnace body.
An air inlet through hole and an air outlet through hole are formed in a vacuum furnace body, the air inlet through hole is connected with a cold air conveyor, and the air outlet through hole is connected with an air outlet pipeline; when the vacuum furnace is used specifically, cold air can be conveyed into the vacuum furnace body by using the cold air conveyor, and meanwhile, hot air in the vacuum furnace body can be discharged by the air outlet pipeline; therefore, compared with the existing mode of directly taking out the heated silicon wafer and the quartz furnace tube, the method has the following beneficial effects:
1. after entering the vacuum furnace body, the cold air conveyed by the cold air conveyor can slowly diffuse in the vacuum furnace body and exchange heat, and the hot air after heat exchange is discharged through the air outlet pipeline; in the process, the temperature of the silicon wafer and the quartz furnace tube can be slowly reduced without suddenly reducing, so that the situation that the silicon wafer or the quartz furnace tube is broken due to overlarge temperature difference can be avoided.
2. The temperature of the silicon wafer and the quartz furnace tube is reduced firstly, and then the silicon wafer and the quartz furnace tube are taken out from the vacuum furnace body, so that the taking-out operation is very convenient, and the scalding of operators can be avoided.
[ description of the drawings ]
The invention will be further described with reference to the following examples with reference to the accompanying drawings.
FIG. 1 is an overall structure diagram of the heat dissipation cooling device of the present invention;
FIG. 2 is a structural diagram of the hollow furnace body of the present invention;
fig. 3 is a schematic block diagram of a circuit according to the present invention.
Description of reference numerals:
1-an empty furnace body, 11-an air inlet through hole, 12-an air outlet through hole, 13-a sealing door, 2-a cold air conveyer, 3-an air outlet pipeline, 41-a first pipe joint, 42-a second pipe joint, 51-an air inlet control valve, 52-an air outlet control valve, 6-an air inlet pipeline, 7-a temperature sensor, 8-a control box, 9-a temperature display and 10-a supporting platform.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present invention, the technical solutions of the present invention will be described in detail below with reference to the drawings and specific embodiments.
It should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are only for convenience in describing the embodiments and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be configured and operated in a specific orientation. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature.
Referring to fig. 1 to 3, the heat dissipation and cooling device of a quartz furnace tube vacuum furnace of the present invention includes a vacuum furnace body 1 and a cold air conveyor 2; an air inlet through hole 11 and an air outlet through hole 12 are formed in the vacuum furnace body 1, and the cold air conveyor 2 is communicated with the air inlet through hole 11; the air outlet through hole 12 is connected with an air outlet pipeline 3. When the vacuum furnace is used, after the silicon wafer and the quartz furnace tube are heated, cold air can be conveyed into the vacuum furnace body 1 by the cold air conveyor 2, and meanwhile, hot air in the vacuum furnace body 1 can be discharged outwards by the air outlet pipeline 3, so that the temperatures of the silicon wafer and the quartz furnace tube in the vacuum furnace body 1 are slowly reduced.
The vacuum furnace is characterized in that the vacuum furnace body 1 is provided with an air inlet through hole 11 and an air outlet through hole 12, the air inlet through hole 11 is connected with a cold air conveyor 2, and the air outlet through hole 12 is connected with an air outlet pipeline 3; when the vacuum furnace is used specifically, cold air can be conveyed into the vacuum furnace body 1 by the cold air conveyor 2, and meanwhile, hot air in the vacuum furnace body 1 can be discharged by the air outlet pipeline 3; therefore, compared with the existing mode of directly taking out the heated silicon wafer and the quartz furnace tube, the method has the following beneficial effects:
1. after entering the vacuum furnace body 1, the cold air conveyed by the cold air conveyor 2 can slowly diffuse in the vacuum furnace body 1 and exchange heat, and the hot air after heat exchange is discharged through the air outlet pipeline 3; in the process, the temperature of the silicon wafer and the quartz furnace tube can be slowly reduced without suddenly reducing, so that the situation that the silicon wafer or the quartz furnace tube is broken due to overlarge temperature difference can be avoided.
2. The temperature of the silicon wafer and the quartz furnace tube is firstly reduced, and then the silicon wafer and the quartz furnace tube are taken out from the vacuum furnace body 1, so that the taking-out operation is very convenient, and the scalding of operators can be avoided.
In the embodiment of the present invention, a first pipe joint 41 is fixedly arranged in the air inlet through hole 11, an air inlet control valve 51 is fixedly arranged at the outer end of the first pipe joint 41, and the cold air conveyer 2 is connected with the air inlet control valve 51 through an air inlet pipeline 6; the first pipe joint 41 is fixed in the air inlet through hole 11 by welding, and the first pipe joint 41 can be made of stainless steel, so that the first pipe joint 41 can resist high temperature, and the sealing performance between the outer wall of the first pipe joint 41 and the hole wall of the air inlet through hole 11 can be ensured. The air inlet control valve 51 is used for controlling whether cold air is conveyed into the vacuum furnace body 1, for example, when the heated silicon wafer and the quartz furnace tube need to be cooled, the air inlet control valve 51 is opened; and when the silicon wafer and the quartz furnace tube are not required to be cooled, the air inlet control valve 51 is closed.
A second pipe joint 42 is fixedly arranged in the air outlet through hole 12, an air outlet control valve 52 is fixedly arranged at the outer end of the second pipe joint 42, and the air outlet pipeline 3 is connected with the air outlet control valve 52. The second pipe joint 42 is fixed in the vent hole 12 by welding, and the second pipe joint 42 can be made of stainless steel, so that the second pipe joint 42 can resist high temperature, and the sealing performance between the outer wall of the second pipe joint 42 and the wall of the vent hole 12 can be ensured. The air outlet control valve 52 is used for controlling whether hot air in the vacuum furnace body 1 is exhausted, for example, when the heated silicon wafer and the quartz furnace tube need to be cooled, the air outlet control valve 52 is opened; and when the temperature of the silicon wafer and the quartz furnace tube is not required to be reduced, the air outlet control valve 52 is closed.
In the embodiment of the present invention, the air inlet hole 11 is disposed at the lower part of the vacuum furnace body 1, and the air outlet hole 12 is disposed at the upper part of the vacuum furnace body 1; or the air inlet through hole 11 is arranged at the upper part of the vacuum furnace body 1, and the air outlet through hole 12 is arranged at the lower part of the vacuum furnace body 1. Through setting up arbitrary one in inlet hole 11 and the outlet hole 12 in the upper portion of vacuum furnace body 1, another sets up the lower part at vacuum furnace body 1 for when specifically using, the cold air of cold air conveyer 2 input can be better diffused in vacuum furnace body 1, thereby realizes better cooling effect.
In the embodiment of the present invention, the heat dissipation and cooling device further comprises a temperature sensor 7 fixed inside the vacuum furnace body 1, a control box 8 fixed outside the vacuum furnace body 1, and a temperature display 9 fixed outside the vacuum furnace body 1; the temperature sensor 7 and the temperature display 9 are both electrically connected with the control box 8. When the temperature display device is used specifically, the temperature in the vacuum furnace body 1 can be detected in real time through the temperature sensor 7, and the temperature in the vacuum furnace body 1 is displayed in real time through the temperature display 9, so that when the silicon wafer and the quartz furnace tube are cooled, an operator can judge whether the cooling is finished according to the temperature displayed by the temperature display 9.
The utility model discloses when specifically implementing, advance air control valve 51, go out air control valve 52 and cold air conveyer 2 also all with control box 8 to utilize control box 8 to control advancing air control valve 51, going out air control valve 52 and cold air conveyer 2.
The utility model discloses an in the embodiment, heat dissipation cooling device still including set firmly in supporting platform 10 of 1 one side of vacuum furnace body, control box 8 and cold air conveyer 2 all set firmly in on the supporting platform 10 to the realization supports control box 8 and cold air conveyer 2.
In the embodiment of the present invention, in order to facilitate the realization of automatic control, the air inlet control valve 51 and the air outlet control valve 52 are both solenoid valves.
The embodiment of the utility model provides an in, inlet channel 11 and outlet channel 12 are the hose to the in-process inlet channel 11 that conveniently uses and outlet channel 12 can buckle.
The embodiment of the utility model provides an in, be provided with sealing door 13 on the vacuum furnace body 1, both can guarantee sealed effect like this, make again can open sealing door 13 when getting to put silicon chip and quartzy boiler tube.
Although specific embodiments of the invention have been described herein, it will be understood by those skilled in the art that the specific embodiments described are illustrative only and are not limiting upon the scope of the invention, as equivalent modifications and variations within the spirit of the invention are intended to be covered by the appended claims.
Claims (8)
1. The utility model provides a heat dissipation cooling device of quartz furnace tube vacuum furnace, includes the vacuum furnace body, its characterized in that: the cold air conveyor is also included; an air inlet through hole and an air outlet through hole are formed in the vacuum furnace body, and the cold air conveyor is communicated with the air inlet through hole; the air outlet through hole is connected with an air outlet pipeline.
2. A heat sink cooling apparatus as recited in claim 1, wherein: a first pipe joint is fixedly arranged in the air inlet through hole, an air inlet control valve is fixedly arranged at the outer end of the first pipe joint, and the cold air conveyor is connected with the air inlet control valve through an air inlet pipeline; and a second pipe joint is fixedly arranged in the air outlet through hole, an air outlet control valve is fixedly arranged at the outer end of the second pipe joint, and the air outlet pipeline is connected with the air outlet control valve.
3. A heat sink cooling apparatus as recited in claim 1, wherein: the air inlet through hole is arranged at the lower part of the vacuum furnace body, and the air outlet through hole is arranged at the upper part of the vacuum furnace body; or the air inlet through hole is formed in the upper portion of the vacuum furnace body, and the air outlet through hole is formed in the lower portion of the vacuum furnace body.
4. A heat sink cooling apparatus as recited in claim 1, wherein: the vacuum furnace also comprises a temperature sensor fixedly arranged in the vacuum furnace body, a control box fixedly arranged outside the vacuum furnace body and a temperature display fixedly arranged outside the vacuum furnace body; the temperature sensor and the temperature display are electrically connected with the control box.
5. A heat sink cooling apparatus as recited in claim 4, wherein: the vacuum furnace further comprises a supporting platform fixedly arranged on one side of the vacuum furnace body, and the control box and the cold air conveyor are fixedly arranged on the supporting platform.
6. A heat sink cooling device as recited in claim 2, wherein: and the air inlet control valve and the air outlet control valve are both electromagnetic valves.
7. A heat sink cooling apparatus as recited in claim 2, wherein: and the air inlet pipeline and the air outlet pipeline are hoses.
8. A heat sink cooling apparatus as recited in claim 1, wherein: and a sealing door is arranged on the vacuum furnace body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221231287.5U CN217606780U (en) | 2022-05-18 | 2022-05-18 | Heat dissipation cooling device of quartz furnace tube vacuum furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221231287.5U CN217606780U (en) | 2022-05-18 | 2022-05-18 | Heat dissipation cooling device of quartz furnace tube vacuum furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217606780U true CN217606780U (en) | 2022-10-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221231287.5U Active CN217606780U (en) | 2022-05-18 | 2022-05-18 | Heat dissipation cooling device of quartz furnace tube vacuum furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217606780U (en) |
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2022
- 2022-05-18 CN CN202221231287.5U patent/CN217606780U/en active Active
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