CN217591361U - Power supply heat dissipation device - Google Patents

Power supply heat dissipation device Download PDF

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CN217591361U
CN217591361U CN202221692524.8U CN202221692524U CN217591361U CN 217591361 U CN217591361 U CN 217591361U CN 202221692524 U CN202221692524 U CN 202221692524U CN 217591361 U CN217591361 U CN 217591361U
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heat dissipation
cavity
heat
fan
quick
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袁博
冯涛
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Dongguan Mentech Optical and Magnetic Co Ltd
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Dongguan Mentech Optical and Magnetic Co Ltd
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Abstract

The application discloses power heat abstractor relates to power technical field. The embodiment of the application provides a power heat abstractor, the load simulator comprises a case, the rectifier module of setting at quick-witted incasement, and the door plant of being connected with quick-witted case rotation, the quick-witted incasement is provided with the division board, the division board separates quick-witted case for first cavity and the second cavity of intercommunication each other, the door plant lid is established on first cavity and second cavity, the rectifier module sets up in first cavity, be connected with first heat radiation structure on the outer wall that quick-witted case and door plant correspond, be connected with first fan on the rectifier module, first fan is bloied to first heat radiation structure, one side that the division board deviates from first cavity is provided with second heat radiation structure, second heat radiation structure sets up in the second cavity, be provided with the vent on the second cavity. The heat dissipation efficiency of the power supply heat dissipation device can be improved on the basis of ensuring the airtightness of the cavity where the rectifier module is located.

Description

Power supply heat dissipation device
Technical Field
The application relates to the technical field of power supplies, in particular to a power supply heat dissipation device.
Background
With the gradual and intensive point distribution construction of 5G base stations for network coverage, the adaptability requirement of a site selection environment on equipment is gradually improved, and the requirements of the characteristics of high network speed, low time delay, high reliability, low power and mass connection of 5G on power supply equipment are gradually improved, so that the power supply equipment has special attention in the aspects of capacity, energy consumption, heating, heat dissipation, sealing and the like while meeting the functions, and in addition, the power supply equipment requires miniaturization and multi-mode installation in the aspects of installation modes and space adaptability.
Among the prior art, power supply unit generally blows the cooling heat dissipation through front end axial fan, or terminal rearmounted fan takes out the hot mode and dispels the heat, and this all adopts the mode of accelerating the air flow so that in time take away the heat, but will accelerate the air flow, can reduce main equipment cabin sealing performance that is difficult to avoid, and the protection level such as waterproof dustproof of equipment also can descend thereupon simultaneously, can't satisfy outdoor adverse circumstances demand.
SUMMERY OF THE UTILITY MODEL
An object of this application is to provide a power heat abstractor, it can improve power radiating efficiency on the basis of guaranteeing the main equipment cabin leakproofness.
To achieve the purpose, the following technical scheme is adopted in the application:
the utility model provides a power heat abstractor, includes quick-witted case, set up rectifier module in quick-witted incasement, and with quick-witted case rotates the door plant of connecting, quick-witted incasement is provided with the division board, the division board will quick-witted case is separated for first cavity and the second cavity of intercommunication each other, the door plant lid is established first cavity with on the second cavity, rectifier module sets up in the first cavity, quick-witted case with be connected with first heat radiation structure on the outer wall that the door plant corresponds, be connected with first fan on the rectifier module, first fan to first heat radiation structure bloies, the division board deviates from one side of first cavity is provided with second heat radiation structure, second heat radiation structure sets up in the second cavity, be provided with the vent on the second cavity.
Optionally, as an implementable manner, the first heat dissipation structure includes a first heat dissipation plate and a plurality of first heat dissipation fins arranged on the first heat dissipation plate and parallel to each other, the first heat dissipation plate is connected to the chassis, and the first heat dissipation fins are located on a side of the first heat dissipation plate away from the chassis.
Optionally, as an implementable manner, a first air guide channel is formed between two adjacent first cooling fins, and one end of the first air guide channel is connected to a second fan.
Optionally, as an implementable manner, an air outlet is disposed on a side wall of the second chamber, and an air inlet corresponding to the air outlet is disposed on the door panel.
Optionally, as an implementable manner, the second heat dissipation structure includes a second heat dissipation plate and a plurality of second heat dissipation fins arranged on the second heat dissipation plate, the second heat dissipation fins are located on a side of the second heat dissipation plate away from the partition plate, a second air guiding channel is formed between two adjacent second heat dissipation fins, and the air inlet and the air outlet are respectively arranged at ends of the second air guiding channel.
Optionally, as an implementable manner, a third fan is disposed in the second chamber, and the third fan corresponds to the air inlet.
Optionally, as an implementable manner, a fourth fan is disposed in the second chamber, and the fourth fan corresponds to the air outlet.
Optionally, as an implementable manner, the door panel is provided with a sealing strip on the inner side, and the sealing strip is used for closing the first chamber.
Optionally, as an implementable manner, a reinforcing structure is disposed on the inner wall of the case.
Optionally, as an implementable manner, the case is made of an aluminum alloy material.
The beneficial effect of this application includes:
the utility model provides a power supply heat abstractor, the load simulator comprises a case, set up the rectifier module group at quick-witted incasement, and the door plant of being connected with quick-witted case rotation, the quick-witted incasement is provided with the division board, the division board separates quick-witted case for first cavity and the second cavity of intercommunication each other, the door plant lid is established on first cavity and second cavity, the rectifier module group sets up in first cavity, in order to guarantee the leakproofness of rectifier module group place cavity, be connected with first heat radiation structure on the outer wall that quick-witted case and door plant correspond, be connected with first fan on the rectifier module group, first fan is to first heat radiation structure bloies, in order to blow the hot gas flow that the rectifier module group produced to first heat radiation structure, and discharge the heat in the first cavity outside quick-witted case through first heat radiation structure, one side that the division board deviates from first cavity is provided with second heat radiation structure, second heat radiation structure sets up in the second cavity, be provided with the vent on the second cavity, in order to discharge the hot gas flow that the rectifier module group produced outside quick-witted case through second heat radiation structure, thereby improve power supply heat abstractor's heat dissipation efficiency.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a power heat dissipation device according to an embodiment of the present disclosure;
fig. 2 is a second schematic structural diagram of a power heat dissipation device according to an embodiment of the present disclosure;
fig. 3 is a third schematic structural diagram of a power heat dissipation device according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a second heat dissipation structure in the power heat dissipation device according to the embodiment of the present application;
fig. 5 is a schematic structural diagram of a chassis in a power heat dissipation device according to an embodiment of the present application.
Icon: 100-power heat sink; 110-a chassis; 111-a first chamber; 1111-a rectification module; 1112-a first fan; 112-a second chamber; 1121-air outlet; 113-a divider plate; 114-a reinforcing structure; 120-a door panel; 121-air inlet; 122-a sealing strip; 130-a first heat dissipation structure; 131-a first heat sink; 132-a first heat sink; 140-a second heat dissipation structure; 141-a second heat sink; 142-a second heat sink; 143-third fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Referring to fig. 1 and fig. 2, the present embodiment provides a power supply heat dissipation apparatus 100, including a chassis 110, a rectification module 1111 disposed in the chassis 110, and a door 120 rotatably connected to the chassis 110, a partition plate 113 is disposed in the chassis 110, the partition plate 113 partitions the chassis 110 into a first chamber 111 and a second chamber 112 which are mutually communicated, the door 120 covers the first chamber 111 and the second chamber 112, the rectification module 1111 is disposed in the first chamber 111, a first heat dissipation structure 130 is connected to an outer wall of the chassis 110 corresponding to the door 120, a first fan 1112 is connected to the rectification module 1111, the first fan 1112 blows air to the first heat dissipation structure 130, a second heat dissipation structure 140 is disposed on a side of the partition plate 113 away from the first chamber 111, the second heat dissipation structure 140 is disposed in the second chamber 112, and a vent is disposed on the second chamber 112.
Specifically, when the power setting is outdoor, in order to avoid debris such as dust to get into and cause rectifier module 1111 to damage in first cavity 111 in the first cavity 111, need guarantee the seal of first cavity 111 to guarantee rectifier module 1111 job stabilization nature of setting in first cavity 111, but when power supply unit during operation, rectifier module 1111 can send a large amount of heats at the course of the work, need lower the temperature in order to reach the purpose of reducing the temperature to rectifier module 1111 to first cavity 111 this moment. The first fan 1112 connected to the rectifier module 1111 works to blow heat generated by the rectifier module 1111 to the first heat dissipation structure 130, the blown hot air contacts the first heat dissipation structure 130 and heats the first heat dissipation structure 130, and the first heat dissipation structure 130 is cooled by external cold air, so that the temperature of the first heat dissipation structure 130 is always lower than the temperature in the first cavity 111, and at the moment, the first heat dissipation structure 130 continuously absorbs heat from the first cavity 111 to continuously transfer the heat in the first cavity 111 to the outside of the case 110; meanwhile, the heat generated in the first chamber 111 is also transferred to the partition plate 113, the heat on the partition plate 113 is transferred to the second heat dissipation structure 140, and the first heat dissipation structure 130 is cooled by the external cold air, so that the heat in the first chamber 111 is transferred to the outside of the case 110 through the second heat dissipation structure 140, thereby ensuring the stable operation of the power supply. The first heat dissipation structure 130 and the second heat dissipation structure 140 exchange hot and cold air flows of the first chamber 111, so as to cool heat in the first chamber 111. The second heat dissipation structure 140 is disposed in the second chamber 112, so as to prevent impurities such as dust from entering the first chamber 111 through a joint between the second heat dissipation structure 140 and the partition plate 113, which affects the working stability of the rectifier module 1111 in the first chamber 111.
It can be understood that a plurality of through holes are provided on the partition plate 113, and the first chamber 111 and the second chamber 112 communicate through the through holes on the partition plate 113, and directly transfer heat to the second heat dissipation structure 140 through the through holes, so as to improve the heat conduction efficiency between the second heat dissipation structure 140 and the first chamber 111.
For example, the first heat dissipation structure 130 and the second heat dissipation structure 140 may be made of aluminum to ensure thermal conductivity of the first heat dissipation structure 130 and the second heat dissipation structure 140, and when the first heat dissipation structure 130 and the second heat dissipation structure 140 need to absorb or dissipate heat in a large amount during use, a material with good thermal conductivity is used, the thermal conductivity is good for a substance to conduct heat, and the thermal conductivity of pure metal is good, wherein silver (about 418.6) is preferred, copper (about 393.5) and aluminum (about 211.9) are preferred, and aluminum is the most commonly used heat-conducting metal in terms of use cost. The first heat dissipation structure 130 and the second heat dissipation structure 140 are made of aluminum, so that the heat dissipation effects of the first heat dissipation structure 130 and the second heat dissipation structure 140 are ensured, and the working stability of the power supply is ensured.
The power supply heat dissipation device 100 provided by the application comprises a case 110, a rectifier module 1111 arranged in the case 110, and a door panel 120 rotatably connected with the case 110, a partition plate 113 is arranged in the case 110, the partition plate 113 partitions the case 110 into a first chamber 111 and a second chamber 112 which are mutually communicated, the door panel 120 covers the first chamber 111 and the second chamber 112, the rectifier module 1111 is arranged in the first chamber 111 to ensure the sealing property of the chamber where the rectifier module 1111 is located, the outer wall of the case 110 corresponding to the door panel 120 is connected with a first heat dissipation structure 130, the rectifier module 1111 is connected with a first fan 1112, the first fan 1112 blows air to the first heat dissipation structure 130 to blow hot air generated by the rectifier module 1111 to the first heat dissipation structure 130 and to discharge heat in the first chamber 111 to the outside of the case 110 through the first heat dissipation structure 130, one side of the partition plate 113, which deviates from the first chamber 111 is provided with a second heat dissipation structure 140, the second heat dissipation structure 140 is arranged in the second chamber 112, a vent is arranged on the second chamber 112 to discharge hot air generated by the rectifier module 1111 to the heat dissipation structure to discharge heat in the second chamber 111, thereby improving the heat dissipation efficiency of the case 100.
In one possible embodiment of the present disclosure, as shown in fig. 3, the first heat dissipation structure 130 includes a first heat dissipation plate 131 and a plurality of first heat dissipation fins 132 disposed on the first heat dissipation plate 131 and parallel to each other, the first heat dissipation plate 131 is connected to the chassis 110, and the first heat dissipation fins 132 are disposed on a side of the first heat dissipation plate 131 away from the chassis 110.
Specifically, heat is transferred to the first heat dissipation fins 132 through the first heat dissipation plate 131, the contact area between the first heat dissipation fins 132 and the outside cold air is increased, so that the heat dissipation efficiency of the first heat dissipation structure 130 is ensured, the first heat dissipation fins 132 are arranged in parallel at intervals, so that the heat can circulate between two adjacent first heat dissipation fins 132, the air circulation is accelerated, and the heat can be transferred out of the first heat dissipation structure 130 from the two adjacent first heat dissipation fins 132. The plurality of first heat dissipation fins 132 increase the contact area with the air, and the heat is transferred from the first heat dissipation fins 132 to the outside of the first heat dissipation structure 130, thereby increasing the heat dissipation efficiency of the first heat dissipation structure 130.
In one possible embodiment of the present application, as shown in fig. 3, a first air guiding channel is formed between two adjacent first cooling fins 132, and one end of the first air guiding channel is connected to a second fan.
Specifically, when the first heat dissipation structure 130 works, the second fan blows air to the first air guide channel to accelerate air circulation in the first air guide channel, so that heat generated by the first heat dissipation fins 132 can flow out of the first heat dissipation structure 130 through the first air guide channel quickly, so that the first heat dissipation fins 132 can be cooled quickly, heat exchange inside and outside the first cavity 111 is accelerated, and heat flows out quickly.
In one possible embodiment of the present disclosure, as shown in fig. 3, an air outlet 1121 is disposed on a sidewall of the second chamber 112, and an air inlet 121 corresponding to the air outlet 1121 is disposed on the door panel 120.
Specifically, the air outlet 1121 is formed in the second chamber 112, the air inlet 121 is formed in the door panel 120, the air inlet 121 and the air outlet 1121 are correspondingly formed, the ventilation efficiency of the second chamber 112 is improved through air convection between the air inlet 121 and the air outlet 1121, the heat dissipation efficiency of the second heat dissipation structure 140 is improved, and therefore the second heat dissipation structure 140 is cooled rapidly, heat exchange inside and outside the first chamber 111 is accelerated, and it is further guaranteed that heat in the first chamber 111 flows out rapidly. When the cold air enters the second chamber 112 from the air inlet 121, the heat generated by the second heat dissipation structure 140 is taken away, so that the heat flows out from the air outlet 1121, the heat of the second chamber 112 is taken out to the outside of the chassis 110 through the continuous circulation of the air, and the second heat dissipation structure 140 is cooled continuously, so as to accelerate the heat exchange between the first chamber 111 and the second heat dissipation structure 140, and further ensure that the heat in the first chamber 111 flows out quickly. It is understood that the cool air may also enter from the air outlet 1121 and exit from the air inlet 121.
In a possible embodiment of the present application, as shown in fig. 4, the second heat dissipation structure 140 includes a second heat dissipation plate 141 and a plurality of second heat dissipation plates 142 arranged on the second heat dissipation plate 141 and parallel to each other, the second heat dissipation plates 142 are located on a side of the second heat dissipation plate 141 away from the partition plate 113, a second air guiding channel is formed between two adjacent second heat dissipation plates 142, and the air inlet 121 and the air outlet 1121 are respectively arranged at ends of the second air guiding channel.
Specifically, the heat is transferred to the second heat dissipation fins 142 through the second heat dissipation plate 141, the contact area between the heat dissipation fins 142 and the external cold air is increased through the plurality of second heat dissipation fins 142, so that the heat dissipation efficiency of the second heat dissipation structure 140 is ensured, the plurality of second heat dissipation fins 142 are arranged in parallel at intervals, so that the heat can circulate between two adjacent second heat dissipation fins 142, the air circulation is accelerated, and the heat can be transferred out of the second heat dissipation structure 140 from between two adjacent second heat dissipation fins 142. The plurality of second heat dissipation fins 142 increase the contact area with the air, and the heat is transferred from the first heat dissipation fins 132 to the outside of the first heat dissipation structure 130, so as to increase the heat dissipation efficiency of the second heat dissipation structure 140, and after the cold air enters from the air inlet 121, the cold air takes away the heat in the second air guiding channel and sends the heat to the air outlet 1121, so as to increase the heat dissipation efficiency of the second heat dissipation structure 140.
In one possible embodiment of the present application, as shown in fig. 2 and 3, a third blower 143 is disposed in the second chamber 112, and the third blower 143 corresponds to the air inlet 121. So as to accelerate the speed of the cold air entering the second chamber 112, and improve the air circulation efficiency in the second chamber 112, thereby improving the heat dissipation efficiency of the second heat dissipation structure 140.
In a possible embodiment of the present application, as shown in fig. 3, a fourth fan is disposed in the second chamber 112, and the fourth fan corresponds to the air outlet 1121.
Specifically, when the third fan 143 and the fourth fan rotate forward, the cold air enters from the air inlet 121, and the hot air in the second chamber 112 is taken out from the air outlet 1121, so that the air circulation efficiency in the second chamber 112 is improved, and the second heat dissipation structure 140 can dissipate heat and cool quickly. When the third fan 143 and the fourth fan are rotated reversely, the cold air enters from the air outlet 1121, and the hot air in the second chamber 112 is taken out from the air inlet 121, so as to increase the air circulation efficiency in the second chamber 112, thereby enabling the second heat dissipation structure 140 to dissipate heat and cool down quickly.
It is understood that a filter screen may be disposed between the air inlet 121 and the third fan 143, and between the air outlet 1121 and the fourth fan, so as to prevent impurities such as dust from entering the second chamber 112 and entering the first chamber 111 from the second chamber 112.
In one possible embodiment of the present application, as shown in fig. 5, the door panel 120 is provided with a sealing strip 122 on the inner side, and the sealing strip 122 is used for closing the first chamber 111. When the door panel 120 is closed, the sealing strip 122 can improve the sealing performance between the first chamber 111 and the door panel 120, and prevent rainwater from entering the first chamber 111 through a gap between the door panel 120 and the first chamber 111 to damage the rectifier module 1111.
In a possible embodiment of the present application, as shown in fig. 5, a reinforcing structure 114 is disposed on an inner wall of the case 110 to ensure that when the case 110 is mounted on a wall or a frame, the structure inside the case 110 is stable, so as to ensure the stability of the power supply heat sink 100 in use.
In one possible embodiment of the present application, as shown in fig. 1, the case 110 is made of aluminum alloy material. The aluminum alloy has low density, high strength close to or higher than that of high-quality steel, good plasticity, excellent electrical conductivity, thermal conductivity and corrosion resistance, and improves the heat dissipation effect of the case 110 on the basis of ensuring the strength of the case 110.
The application provides a power heat abstractor 100, blow to first heat radiation structure 130 through first fan 1112, blow to first heat radiation structure 130 with the hot gas flow that rectifier module 1111 produced, and discharge the heat in the first cavity 111 outside quick-witted case 110 through first heat radiation structure 130, one side that division board 113 deviates from first cavity 111 is provided with second heat radiation structure 140, second heat radiation structure 140 sets up in second cavity 112, be provided with the vent on the second cavity 112, in order to discharge the hot gas flow that rectifier module 1111 produced outside quick-witted case 110 with the heat in the first cavity 111 through second heat radiation structure 140, thereby improve power heat abstractor 100's radiating efficiency.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. The utility model provides a power heat abstractor, its characterized in that, includes quick-witted case, sets up rectifier module in quick-witted incasement, and with the door plant that quick-witted case rotation is connected, the quick-witted incasement is provided with the division board, the division board will quick-witted case is separated for first cavity and the second cavity of intercommunication each other, the door plant lid is established first cavity with on the second cavity, rectifier module sets up in the first cavity, quick-witted case with be connected with first heat radiation structure on the outer wall that the door plant corresponds, be connected with first fan on the rectifier module, first fan to first heat radiation structure bloies, the division board deviates from one side of first cavity is provided with second heat radiation structure, second heat radiation structure sets up in the second cavity, be provided with the vent on the second cavity.
2. The power supply heat sink according to claim 1, wherein the first heat sink includes a first heat sink plate and a plurality of first heat dissipation fins disposed on the first heat sink plate, the first heat sink plate is connected to the chassis, and the first heat dissipation fins are disposed on a side of the first heat sink plate away from the chassis.
3. The power supply heat dissipation device according to claim 2, wherein a first air guiding channel is formed between two adjacent first heat dissipation fins, and one end of the first air guiding channel is connected to a second fan.
4. The power supply heat sink device according to claim 1, wherein an air outlet is disposed on a side wall of the second chamber, and an air inlet corresponding to the air outlet is disposed on the door panel.
5. The power supply heat dissipation device according to claim 4, wherein the second heat dissipation structure includes a second heat dissipation plate and a plurality of second heat dissipation fins arranged on the second heat dissipation plate, the second heat dissipation fins are located on a side of the second heat dissipation plate facing away from the partition plate, a second air guiding channel is formed between two adjacent second heat dissipation fins, and the air inlet and the air outlet are respectively arranged at ends of the second air guiding channel.
6. The power supply heat sink device of claim 5, wherein a third fan is disposed in the second chamber, the third fan corresponding to the air inlet.
7. The power supply heat sink device according to claim 6, wherein a fourth fan is disposed in the second chamber, and the fourth fan corresponds to the air outlet.
8. The power heat sink as claimed in claim 1, wherein the door panel is provided with a sealing strip on an inner side thereof, the sealing strip being used for sealing the first chamber.
9. The power supply heat sink of claim 1, wherein the inner wall of the housing is provided with a reinforcing structure.
10. The power supply heat sink of claim 1, wherein the case is made of aluminum alloy.
CN202221692524.8U 2022-06-30 2022-06-30 Power supply heat dissipation device Active CN217591361U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221692524.8U CN217591361U (en) 2022-06-30 2022-06-30 Power supply heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221692524.8U CN217591361U (en) 2022-06-30 2022-06-30 Power supply heat dissipation device

Publications (1)

Publication Number Publication Date
CN217591361U true CN217591361U (en) 2022-10-14

Family

ID=83534212

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221692524.8U Active CN217591361U (en) 2022-06-30 2022-06-30 Power supply heat dissipation device

Country Status (1)

Country Link
CN (1) CN217591361U (en)

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