CN217591213U - Communication module and communication terminal - Google Patents
Communication module and communication terminal Download PDFInfo
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- CN217591213U CN217591213U CN202220911745.3U CN202220911745U CN217591213U CN 217591213 U CN217591213 U CN 217591213U CN 202220911745 U CN202220911745 U CN 202220911745U CN 217591213 U CN217591213 U CN 217591213U
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- communication module
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Abstract
The application discloses communication module and communication terminal. The communication module comprises a first circuit board main body and a second circuit board main body which are stacked, the second circuit board main body is stacked on the first circuit board main body and comprises a third surface and a fourth surface which are arranged in a back-to-back mode, electronic components are arranged on the third surface and the fourth surface, the fourth surface faces the first surface of the first circuit board main body, and the electronic components on the fourth surface extend to and are located in the recessed area. This application can realize piling up electronic components and laying at the two-sided of a circuit board in the circuit board, and the electronic components of this circuit board one side can utilize at least partly thickness space of another circuit board main part to be favorable to communication module's miniaturized design.
Description
Technical Field
The application relates to the field of communication, in particular to a communication module and a communication terminal.
Background
Currently, with the great heat of 5G communication technology, the M2 interface (also referred to as m.2 interface) can be compatible with multiple communication protocols, and thus has become a new host interface solution accepted by the market. The communication module based on the M2 interface generally has at least two circuit boards, wherein one circuit board main body is stacked on the other circuit board main body, so that electronic components can only be arranged on one side surface of each circuit board main body, which results in a larger thickness and a larger volume of the communication module and is difficult to realize a miniaturized design.
SUMMERY OF THE UTILITY MODEL
In view of this, the present application provides a communication module and a communication terminal, so as to solve the problem that the communication module is difficult to realize a miniaturized design due to the stacked arrangement of the circuit board main bodies.
The application provides a communication module in the first aspect, including first circuit board main part, second circuit board main part and electronic components. The electronic components are arranged on the first circuit board main body and the second circuit board main body. The first circuit board main part comprises a first surface and a second surface which are arranged in a back-to-back mode, the first circuit board is provided with a depressed area, and an opening is formed in one side, facing the first surface, of the depressed area. The second circuit board main part is stacked on the first circuit board main part, and the second circuit board main part comprises a third surface and a fourth surface which are arranged back to back, wherein electronic components are arranged on the third surface and the fourth surface, the fourth surface faces the first surface, and the electronic components on the fourth surface extend to be positioned in the depressed area.
Optionally, the communication module further comprises a first shielding element covering the electronic component on the fourth surface, the first shielding element extending to be located in the recessed area.
Optionally, the first shielding element does not protrude from the second surface of the first circuit board body.
Optionally, a distance between the first shield and the second circuit board body in the stacking direction is less than or equal to a thickness of the first circuit board body.
Optionally, the first shield is disposed on the fourth surface.
Optionally, the first shield is disposed on the first circuit board body.
Optionally, the communication module further includes a second shielding element disposed on the first surface and covering the electronic component and the second circuit board main body on the first surface.
Optionally, the second shield is at a distance H from the first surface in the stacking direction 1 ', the thickness of the second circuit board main body is T 1 The maximum height of the electronic component on the third surface is H 3 And T is 1 +H 3 ＜H 1 ’。
Optionally, the first surface of the first circuit board main body is provided with a first pad, the fourth surface of the second circuit board main body is provided with a second pad, and the first pad and the second pad are opposite and welded.
A second aspect of the application provides a communication terminal comprising a communication module according to any of the above.
As described above, in the communication module and the communication terminal of the present application, the first circuit board main body and the second circuit board main body are stacked, two surfaces of the second circuit board main body that are opposite to each other are provided with electronic components, and for only a single surface, the size of the second circuit board main body may be smaller, and the area reserved for the second circuit board main body by the first circuit board main body is smaller, which is beneficial to miniaturization design.
Drawings
Fig. 1 to fig. 3 are schematic structural diagrams of a communication module according to an embodiment of the present application from three perspectives;
fig. 4 is an exploded view of the communication module shown in fig. 1 to 3;
fig. 5 is a schematic structural diagram of a first circuit board main body on a first surface according to an embodiment of the present application;
fig. 6 is an exploded view of the second circuit board main body, the electronic component and the first shielding member according to the embodiment of the present application;
fig. 7 isbase:Sub>A schematic cross-sectional view of the communication module shown in fig. 1 alongbase:Sub>A directionbase:Sub>A-base:Sub>A'.
Detailed Description
In the scene is piled up to the circuit board at traditional communication module, only one side surface of each circuit board main part can set up electronic components, leads to communication module's thickness great, is difficult to realize miniaturized design. And there are the two-sided laying of circuit board (namely two surfaces of circuit board all can set up electronic components) in the pile up circuit board scene of this application, and the electronic components of this circuit board one side can utilize at least partly thickness space of another circuit board main part to this reduces the gross thickness that piles up the circuit board, does benefit to miniaturized design.
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described below with reference to specific embodiments and accompanying drawings. It should be apparent that the embodiments described below are only a part of the embodiments of the present application, and not all embodiments. In the following embodiments and technical features thereof, all of which are described below may be combined with each other without conflict, and also belong to the technical solutions of the present application.
It should be understood that in the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only used for convenience of describing technical solutions and simplifying the description of the respective embodiments of the present application, but do not indicate or imply that a device or an element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Referring to fig. 1 to 7, a communication module 1 according to an embodiment of the present disclosure includes a first circuit board main body 10, a second circuit board main body 20, and an electronic component 30.
The second circuit board main body 20 is stacked on the first circuit board main body 10. For convenience of description, the stacking direction is hereinafter referred to as a second direction y in some places of the present application, and as shown in fig. 1 to 7, the second direction y may also be referred to as a thickness direction of any one of the communication module 1, the first circuit board main body 10, and the second circuit board main body 20. The length direction of the communication module 1 is a first direction x, the width direction of the communication module 1 may be a third direction z, and the first direction x, the second direction y and the third direction z are perpendicular to each other. It should be noted that, limited by the actual processing or measurement error (also called tolerance), the term perpendicular as used throughout this application does not require that the angle between the two must be 90 °, but allows a deviation of ± 10 °, i.e. perpendicular is understood to mean that the angle between any two directions is 80 ° to 100 °.
The first circuit board body 10 includes a first surface 11 and a second surface 12 which are oppositely disposed, and the first circuit board 10 is provided with a recessed area Z 1 Depressed region Z 1 The side facing the first surface 11 is provided with an opening. So-called depressed zone Z 1 It can be understood that: the thickness of the first circuit board body 10 in this region is smaller than that in other regions. In the scenario shown in FIG. 4, the depressed zone Z 1 Is a keep-out area that penetrates the first circuit board body 10, i.e., the side facing the second surface 12 is also provided with an opening. In other scenarios, the depressed zone Z 1 A groove bottom may be provided for the groove, i.e. the side facing the second surface 12.
The second circuit board body 20 includes a third surface 21 and a fourth surface 22 disposed oppositely. The third surface 212 and the fourth surface 22 are both provided with the electronic components 30, that is, the two opposite surfaces of the second circuit board main body 20 are both provided with the electronic components 30, and for the design that only a single surface is provided with the electronic components 30, the second circuit board main body 20 can adopt a smaller size to arrange the preset number of electronic components 30, and for the first circuit board main body 10, the area reserved for the second circuit board main body 20 by the first circuit board main body 10 is smaller, thereby being beneficial to the miniaturization design of the communication module 1.
The fourth surface 22 of the second circuit board main body 20 faces the first surface 11 of the first circuit board main body 10, and the electronic component 30 on the fourth surface 22 extends to be located in the recessed area Z 1 And (4) the following steps. In the stacking direction y, at the firstThe electronic components 30 on the four surfaces 22 utilize at least a portion of the thickness space of the first circuit board body 10, thereby further facilitating the miniaturized design of the communication module 1.
The first circuit board body 10 and the second circuit board body 20 may be represented differently according to the specific implementation type of the communication module 1, for example, the first circuit board body 10 and the second circuit board body 20 may be both PCBs (printed circuit boards). In some scenarios, two circuit board bodies may be soldered, for example, the first surface 11 of the first circuit board body 10 is provided with a first solder pad, the fourth surface 22 of the second circuit board body 20 is provided with a second solder pad, and the first solder pad and the second solder pad are oppositely disposed and soldered.
The type of the electronic component 30 may be adapted according to the function of the communication module 1, for example, the electronic component 30 includes but is not limited to at least one of a resistor, a capacitor, a transistor, a chip, a radio frequency component, and the like. The electronic components 30 are disposed on the first and second circuit board bodies 10 and 20, and specifically, on the first surface 11 of the first circuit board body 10, the third surface 21 and the fourth surface 22 of the second circuit board body 20. The electronic component 30 may be disposed on the Surface of the corresponding circuit board main body using, for example, SMT (Surface mount Technology).
As shown in fig. 1 to fig. 4 and fig. 7, the communication module 1 may further include a first shielding element 41, and the first shielding element 41 covers the fourth surface 22 of the second circuit board main body 20, so as to cover the electronic component 30 on the fourth surface 22, thereby reducing or preventing the electronic component 30 on the fourth surface 22 from being interfered by external electromagnetic interference. In one scenario, such as shown in fig. 7, the first shielding member 41 may be disposed on the fourth surface 22 of the second circuit board body 20 through a sidewall. In other scenarios, the first shielding element 41 may be disposed on the first circuit board body 10, for example, in the recessed area Z 1 On the side wall of the container.
The first shield 41 extends to a recess region Z of the first circuit board body 10 1 In addition, the first shielding member 41 may utilize at least a portion of the thickness space of the first circuit board body 10, further facilitating the communication moduleMiniaturized design of group 1. In a preferred implementation, the first shielding member 41 does not protrude from the second surface 12 of the first circuit board body 10, for example, the first shielding member 41 is spaced apart from the second circuit board body 20 by a distance H along the stacking direction y 2 The thickness of the first circuit board body 10 is T 0 And H is 2 ≤T 0 。
As shown in fig. 1 to fig. 4 and fig. 7, the communication module 1 may further include a second shielding element 42, where the second shielding element 42 is disposed on the first surface 11 of the first circuit board main body 10, and covers the electronic component 30 on the first surface 11 and the second circuit board main body 20, and certainly also covers the electronic component 30 on the third surface 21 of the second circuit board main body 20, so as to reduce or prevent the electronic component 30 in the area covered by the second shielding element 42 from being interfered by external electromagnetic interference.
In some scenarios, the second shielding member 42 may include a shielding frame 421 and a shielding cover 422, the shielding frame 421 defines an overall shape of the second shielding member 42 and ensures a structural strength thereof, and the shielding cover 422 covers the shielding frame 421 for electromagnetically shielding a covered area.
Optionally, the distance between the second shielding member 42 and the first surface 11 of the first circuit board body 10 along the stacking direction y is H 1 ', the thickness of the second circuit board body 20 is T 1 The maximum height of the electronic component 30 on the third surface 21 of the second circuit board body 20 is H 3 And T is 1 +H 3 ＜H 1 '. Here, the electronic component 30 on the third surface 21 and the top wall of the second shielding member 42 are oppositely disposed, so that electromagnetic interference is prevented, and meanwhile, contact or collision between the electronic component 30 on the third surface 21 and the second shielding member 42 can be avoided, so as to protect the electronic component 30 on the third surface 21.
The communication module 1 may be actually represented as a communication module based on an M2 interface, but is not limited thereto. As shown in fig. 1 to 4, a plug including a plurality of terminals 13 is disposed at one end of the first circuit board body 10 for plugging other devices; the fourth surface 22 of the second circuit board body 20 may be provided with a connection region Z 2 The connection ofZone Z 2 At least a portion of the second circuit board body 20 is exposed, for example, a copper exposed area of the second circuit board body 20, for electrically connecting the second circuit board body 20 with other external devices. The communication module 1 may further include other necessary structural components, and the height and other dimensional relationships of the structural components may be determined according to the actual required adaptability, for example, please refer to fig. 7, the total height H of the communication module 1 0 Is the height T of the first circuit board body 10 0 Height H from the second shield 42 1 In the scene, the communication module 1 is compact in structure, high in overall structure layout utilization rate and small in size.
The embodiment of the present application further provides a communication terminal, which includes the communication module 1 according to any of the above embodiments, so that the communication module 1 according to the embodiment can have the beneficial effects.
The communication terminal may be embodied in various specific forms. For example, the communication terminal described in the embodiments of the present application may include, but is not limited to, a mobile terminal such as a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and the like, and a fixed terminal such as a Digital TV, a radio, a desktop computer, and the like.
It should be understood that the above-mentioned embodiments are only some examples of the present application, and not intended to limit the scope of the present application, and all structural equivalents made by those skilled in the art using the contents of the present specification and the accompanying drawings are also included in the scope of the present application.
Although the terms "first, second, etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. In addition, the singular forms "a", "an" and "the" are intended to include the plural forms as well. The terms "or" and/or "are to be construed as inclusive or meaning any one or any combination. An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.
Claims (10)
1. A communication module, comprising: the circuit board comprises a first circuit board main body, a second circuit board main body and electronic components arranged on the first circuit board main body and the second circuit board main body;
the first circuit board main body comprises a first surface and a second surface which are arranged in a back-to-back mode, the first circuit board is provided with a recessed area, and one side, facing the first surface, of the recessed area is provided with an opening;
the second circuit board main part pile up set up in on the first circuit board main part, second circuit board main part is including third surface and the fourth surface that sets up dorsad, the third surface with all be provided with electronic components on the fourth surface, the fourth surface orientation the first surface, just electronic components on the fourth surface extends to and is located in the depressed area.
2. The communication module of claim 1, further comprising a first shield covering the electronic component on the fourth surface, the first shield extending to be within the recessed region.
3. The communication module of claim 2, wherein the first shield does not protrude from the second surface of the first circuit board body.
4. The communication module of claim 3, wherein a distance of the first shield from the second circuit board body in the stacking direction is less than or equal to a thickness of the first circuit board body.
5. The communication module of any of claims 2 to 4, wherein the first shield is disposed on the fourth surface.
6. The communication module of any of claims 2-4, wherein the first shield is disposed on the first circuit board body.
7. The communication module of claim 1, further comprising a second shield disposed on the first surface and covering the electronic components on the first surface and the second circuit board body.
8. The communication module of claim 7, wherein the second shield is at a distance H from the first surface along the stacking direction 1 ', the thickness of the second circuit board main body is T 1 The maximum height of the electronic component on the third surface is H 3 And T is 1 +H 3 ＜H 1 ’。
9. The communication module of claim 1, wherein the first surface of the first circuit board body is provided with a first pad, and the fourth surface of the second circuit board body is provided with a second pad, the first pad and the second pad being opposed and soldered.
10. A communication terminal, characterized in that it comprises a communication module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220911745.3U CN217591213U (en) | 2022-04-19 | 2022-04-19 | Communication module and communication terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220911745.3U CN217591213U (en) | 2022-04-19 | 2022-04-19 | Communication module and communication terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217591213U true CN217591213U (en) | 2022-10-14 |
Family
ID=83543039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220911745.3U Active CN217591213U (en) | 2022-04-19 | 2022-04-19 | Communication module and communication terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217591213U (en) |
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2022
- 2022-04-19 CN CN202220911745.3U patent/CN217591213U/en active Active
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