CN217588935U

CN217588935U - Vehicle-mounted camera packaging module

Info

Publication number: CN217588935U
Application number: CN202221069273.8U
Authority: CN
Inventors: 韦会儿
Original assignee: Hunan Yuemo Advanced Semiconductor Co ltd
Current assignee: Hunan Yuemo Advanced Semiconductor Co ltd
Priority date: 2022-05-06
Filing date: 2022-05-06
Publication date: 2022-10-14
Anticipated expiration: 2032-05-06

Abstract

The utility model belongs to the technical field of vehicle-mounted camera and chip packaging, and discloses a vehicle-mounted camera packaging module, which comprises a substrate, a chip, lens glass and a backing plate, wherein the backing plate is provided with a central through hole, the backing plate is arranged between the chip and the lens glass, and the central through hole is arranged right opposite to a camera sensing area of the chip; the peripheries of the substrate, the chip, the lens glass and the base plate are filled with plastic packaging bodies. The utility model discloses an on-vehicle camera encapsulation module through set up the backing plate between chip and lens glass, can the distance between accurate control lens glass and chip, guarantees the imaging parameters such as focus between lens glass and the chip induction area, promotes the formation of image effect of on-vehicle camera.

Description

Vehicle-mounted camera packaging module

Technical Field

The utility model relates to an on-vehicle camera and chip package technical field especially relate to an on-vehicle camera encapsulation module.

Background

As shown in fig. 1, the camera module generally includes a substrate 1', a chip 2', and a lens glass 3', first attaching the bottom surface of the chip 2' (CMOS chip) to the substrate 1 'and bonding a metal lead 21'; then, glue is coated on the surface of the chip 2' to form an adhesive layer 4' with a certain height, the adhesive layer 4' surrounds and blocks the periphery of a camera sensing area on the surface of the chip 2', the lens glass 3' is adhered on the surface of the adhesive layer 4' and a cavity is formed above the camera sensing area on the surface of the chip 2' to adjust the distance between the lens glass 3' and the chip 2 '; and finally, protecting the metal lead 21' in a plastic package mode.

According to the camera module adopting the mode, the height of the cavity is formed by the glue, so that the using amount of the glue is large, the risk that the glue overflows to the camera sensing area on the surface of the chip 2' exists, and the imaging effect is influenced; in addition, the glue is gelatinous and soft before being cured, so that the distance between the lens glass 3 'and the chip 2' cannot be accurately controlled, imaging parameters such as focal length and the like are influenced, and the imaging effect is influenced; the metal leads 21' are easily damaged during the encapsulation process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an on-vehicle camera encapsulation module to the difficult control of interval of solving lens glass and chip influences the problem of formation of image effect.

To achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a vehicle-mounted camera encapsulation module, includes base plate, chip and lens glass, vehicle-mounted camera encapsulation module still includes:

the base plate is provided with a central through hole, the base plate is arranged between the chip and the lens glass, and the central through hole is over against a camera sensing area of the chip; and plastic packaging bodies are filled around the substrate, the chip, the lens glass and the base plate.

Optionally, the vehicle-mounted camera packaging module further includes an adhesive layer, and the bottom surface of the pad and the surface of the chip are bonded and fixed through the adhesive layer.

Optionally, the adhesive layer is arranged around the circumference of the camera sensing area, and the inner diameter of the adhesive layer is larger than the outer diameter of the camera sensing area.

Optionally, the leads between the chip and the substrate are located below the pad and fixed by the plastic package body.

Optionally, the thickness of the adhesive layer is greater than the height of the leads on the surface of the chip.

Optionally, the circumferential direction of the backing plate is aligned with the circumferential direction of the base plate.

Optionally, the top surface of backing plate is equipped with the recess, central through-hole is located the diapire of recess and with the coaxial setting of recess, lens glass is located in the recess.

Optionally, the lens glass is adhesively fixed in the groove.

Optionally, the outer edge of the lens glass abuts against the inner side wall of the groove.

Optionally, the bottom surface of the chip is bonded to the substrate.

The utility model has the advantages that:

the utility model discloses an on-vehicle camera encapsulation module through set up the backing plate between chip and lens glass, can the distance between accurate control lens glass and chip, guarantees the imaging parameters such as focus between lens glass and the chip induction area, promotes the formation of image effect of on-vehicle camera.

Drawings

Fig. 1 is a schematic view of a package structure of a conventional vehicle-mounted camera module in the prior art;

fig. 2 is a schematic structural diagram of a vehicle-mounted camera packaging module according to an embodiment of the present invention;

FIG. 3 is a schematic structural view of a central through hole in a base plate according to an embodiment of the present invention;

fig. 4 is a schematic view illustrating the mounting of a chip on a substrate according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of the vehicle-mounted camera encapsulation module in the embodiment of the present invention before encapsulation.

In the figure:

1'. A substrate; 2' chip; a metal lead wire; lens glass; 4' bonding layer;

1. a substrate; 2. a chip; 21. a lead; 3. a lens glass; 4. an adhesive layer; 5. a backing plate; 51. a central through hole; 6. and (7) molding the body.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1, a conventional packaging structure of a vehicle-mounted camera module in the prior art includes a substrate 1', a chip 2' and lens glass 3', wherein a bottom surface of the chip 2' is bonded to a surface of the substrate 1', and glue is applied around a camera sensing area on the surface of the chip 2' to form a bonding layer 4' with a certain height for bonding the lens glass 3', and the bonding layer 4' is glue and has volume change before and after curing, so that a distance between the lens glass 3' and the surface of the chip 2' is uncontrollable, imaging parameters are unstable, and imaging effects are affected.

In order to solve the above technical problem, the present invention provides a vehicle-mounted camera encapsulation module, as shown in fig. 2 and 3, comprising a substrate 1, a chip 2, a lens glass 3 and a backing plate 5, wherein the backing plate 5 is provided with a central through hole 51, the backing plate 5 is arranged between the chip 2 and the lens glass 3, and the central through hole 51 is over against the camera sensing area of the chip 2; the peripheries of the substrate 1, the chip 2, the lens glass 3 and the backing plate 5 are filled with a plastic package body 6.

The utility model discloses an on-vehicle camera encapsulation module, through set up backing plate 5 between chip 2 and lens glass 3, can the distance between accurate control lens glass 3 and chip 2, guarantee imaging parameters such as focus between the camera induction area of lens glass 3 and chip 2, promote the imaging effect of on-vehicle camera. Compared with the structure that glue is adopted to form the bonding layer 4' in the prior art, the backing plate 5 is made of non-glue materials, such as glass, rigid plastic or metal and the like, and has stable structural strength, so that the backing plate is arranged in front of the chip 2 and the lens glass 3, the reliable distance between the chip 2 and the lens glass 3 is ensured, and the improvement of phase stability and reliability is facilitated.

Optionally, the utility model discloses a vehicle-mounted camera encapsulation module still includes adhesive linkage 4, and the bottom surface of backing plate 5 is fixed with 2 surfaces of chip through adhesive linkage 4 bonding.

It should be noted that, compared with the adhesive layer 4 'in the prior art, the adhesive layer 4 in the present embodiment is also a layered structure formed by solidifying glue and having a certain height, and the difference is that the thickness of the adhesive layer 4' in the prior art is equal to the distance between the chip 2 and the lens glass 3, that is, the lens glass 3 is directly adhered to the adhesive layer 4', and the central hole area of the adhesive layer 4' is consistent with the camera sensing area of the chip 2 so as to define the installation position of the lens glass 3, so that the thickness variation of the adhesive layer 4 'is easily caused during the adhesion process, and there is a problem that the adhesive layer 4' overflows into the camera sensing area, which affects the imaging effect. In this embodiment, the lens glass 3 is adhered to the adhesive layer 4 through the backing plate 5, and the adhesive layer 4 only has an adhesive surface provided with the backing plate 5 and has a certain height, so that the problem that the adhesive layer 4 overflows to a camera sensing area on the surface of the chip 2 does not exist, and a reliable imaging effect is ensured.

Optionally, the adhesive layer 4 is disposed around the circumference of the camera sensing area, and the inner diameter of the adhesive layer 4 is larger than the outer diameter of the camera sensing area.

As shown in fig. 2, the adhesive layer 4 is disposed on the surface of the chip 2, and has a central hole region around the camera sensing region, the central hole region in the prior art and the camera sensing region have the same size so as to position and mount the lens glass 3', in this embodiment, the aperture of the central hole of the adhesive layer 4 is larger than the outer diameter of the camera sensing region and larger than the aperture of the central through hole 51 on the backing plate 5, and complete imaging is performed through the consistency between the central through hole 51 on the backing plate 5 and the camera sensing region, even if the adhesive layer 4 overflows, the imaging effect of the camera sensing region is not affected, and the adhesive layer 4 plays a role of fixing the backing plate 5, so that compared with the adhesive layer 4' in the prior art, the thickness of the adhesive layer 4 in this embodiment is significantly reduced, and the stability is improved.

Optionally, the leads 21 between the chip 2 and the substrate 1 are located below the pad 5 and fixed by the plastic package 6.

As shown in fig. 2, a metal lead 21 is disposed between the chip 2 and the substrate 1, and the lead 21 is connected to the substrate 1 through the surface of the chip 2, so that the lower surface of the pad 5 cannot be directly bonded to the surface of the chip 2 but a certain space is left to protect the lead 21, in this embodiment, the pad 5 is bonded to the adhesive layer 4 by setting the thickness of the adhesive layer 4 to be greater than the height of the lead 21 on the surface of the chip 2, and since the pad 5 can be placed above the lead 21 without interfering with the lead 21, the periphery of the lead 21, that is, the cavity formed by the pad 5, the chip 2 and the substrate 1 is filled with the plastic package 6, thereby further protecting the lead 21 and ensuring the mounting stability of the pad 5. It can be understood that the lens glass 3 is adhered to the surface of the backing plate 5, and therefore the plastic package body 6 is filled between the edge of the lens glass 3 and the surface of the backing plate 5, so that the whole vehicle-mounted camera module forms a whole package, is regular in appearance and easy to mount and image.

Alternatively, the shim plate 5 is arranged with its circumferential direction aligned with the circumferential direction of the base plate 1.

As shown in fig. 3, when the whole backing plate 5 is rectangular, the substrate 1 is also rectangular with the same size, and after the bottom surface of the chip 2 is bonded to the central position of the substrate 1, the backing plate 5 is bonded to the substrate 1 after being aligned, so that the correspondence between the central through hole 51 on the backing plate 5 and the sensing area of the camera on the chip 2 can be realized, and the improvement of the mounting and positioning efficiency is facilitated, the alignment precision is high, and the imaging effect is good.

The specific process of mounting or plastic packaging of the vehicle-mounted camera packaging module provided by the embodiment is as follows:

firstly, a chip 2 (a CMOS chip in the embodiment) is adhered on the surface of a substrate 1, and a metal lead 21 is punched, as shown in fig. 4; then coating glue on the surface of the chip 2 around the sensing area of the camera to form a bonding layer 4, wherein the glue has enough distance with the edge of the sensing area of the camera to prevent the glue from overflowing into the sensing area of the camera as shown in fig. 5; aligning the base plate 5 with the central through hole 51 with the substrate 1 and bonding the base plate to the surface of the bonding layer 4, wherein the central through hole 5 is just corresponding to the sensing area of the camera, and bonding the lens glass 3 to the surface of the base plate 5; finally, the periphery is protected by the plastic package body 6, and the vehicle-mounted camera packaging module shown in fig. 2 is formed.

In some embodiments, the top surface of the pad 5 is provided with a groove (not shown), the central through hole 51 is provided at the bottom wall of the groove and is arranged coaxially with the groove, and the lens glass 3 is located in the groove. Through setting up the recess, do benefit to and set up recess and central through-hole 51 with the axle center when processing the design, reduce the location step during the installation, improve the installation effectiveness. And in the groove for installing the lens glass 3, quick positioning and installation are realized.

Optionally, the lens glass 3 is bonded and fixed in the groove, the outer edge of the lens glass 3 is abutted to the inner side wall of the groove, the positioning precision is high, the pouring of the plastic package body 6 is reduced, and the packaging efficiency is improved. It should be noted that, when the groove is formed in the backing plate 5, the distance between the lens glass 3 and the chip 2 is obtained through the thickness of the bottom wall of the groove and the thickness of the bonding layer 4, therefore, after the lens glass 3 is installed, the transparent glass 3 needs to be ensured to be in full contact with and connected with the bottom wall of the groove, the bonding is performed through glue with negligible thickness, the imaging effect is not affected, the depth of the lens glass 3 and the depth of the groove can be the same through setting, and the installation precision is improved in the mode that the surface of the lens glass 3 is flush with the surface of the backing plate 5 through the press-fitting glue during installation.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The utility model provides a vehicle-mounted camera encapsulation module, includes base plate (1), chip (2) and lens glass (3), its characterized in that, vehicle-mounted camera encapsulation module still includes:

the base plate (5), the base plate (5) is provided with a central through hole (51), the base plate (5) is arranged between the chip (2) and the lens glass (3), and the central through hole (51) is arranged right opposite to a camera sensing area of the chip (2); the periphery of the substrate (1), the chip (2), the lens glass (3) and the base plate (5) is filled with a plastic package body (6).

2. The vehicle-mounted camera packaging module according to claim 1, further comprising an adhesive layer (4), wherein the bottom surface of the pad (5) and the surface of the chip (2) are fixedly adhered through the adhesive layer (4).

3. The vehicle-mounted camera encapsulation module according to claim 2, wherein the adhesive layer (4) is arranged around the circumference of the camera sensing area, and the inner diameter of the adhesive layer (4) is larger than the outer diameter of the camera sensing area.

4. The vehicle camera package module according to claim 2, wherein the leads (21) between the chip (2) and the substrate (1) are located below the pad (5) and fixed by the plastic package body (6).

5. The vehicle camera packaging module according to claim 4, wherein the thickness of the adhesive layer (4) is larger than the height of the leads (21) on the surface of the chip (2).

6. The in-vehicle camera package module according to claim 1, wherein a circumferential direction of the shim plate (5) is aligned with a circumferential direction of the base plate (1).

7. The vehicle-mounted camera encapsulation module according to claim 1, wherein the top surface of the pad (5) is provided with a groove, the central through hole (51) is arranged at the bottom wall of the groove and is coaxial with the groove, and the lens glass (3) is positioned in the groove.

8. The vehicle camera packaging module according to claim 7, wherein the lens glass (3) is adhesively fixed in the groove.

9. The vehicle camera packaging module according to claim 8, wherein an outer edge of the lens glass (3) abuts against an inner side wall of the groove.

10. The vehicle camera packaging module according to claim 1, wherein the bottom surface of the chip (2) is bonded to the substrate (1).