CN217561384U

CN217561384U - Non-contact semiconductor ingot and wafer integrated analysis and measurement equipment

Info

Publication number: CN217561384U
Application number: CN202220081240.9U
Authority: CN
Inventors: 党小锋; 刘全义; 张月兰; 翁端佳
Original assignee: Jiuyu Semiconductor Technology Suzhou Co ltd
Current assignee: Jiuyu Semiconductor Technology Suzhou Co ltd
Priority date: 2022-06-23
Filing date: 2022-06-23
Publication date: 2022-10-11
Anticipated expiration: 2032-06-23

Abstract

The utility model relates to a non-contact semiconductor ingot and wafer integrated analysis and measurement device, which comprises a device support, a linear slide rail arranged on the device support, a bearing platform connected on the linear slide rail in a sliding way, and a driving device for driving the bearing platform to slide on the linear slide rail; the photoelectric analyzer is arranged on the equipment support; the resistivity detector is arranged on the equipment support; according to the technical scheme, the wafer and the semiconductor ingot can be automatically distinguished, the data can be automatically analyzed and recorded, the surface coordinate of the wafer or the semiconductor ingot to be detected can be accurately adjusted to be a fulcrum through the jacking rotary vacuumizing module, and therefore the resistivity of all parts of the substance can be analyzed and measured; the equipment can automatically find a position, establish a coordinate point, have more comprehensive and more accurate measurement, distinguish and judge the object to be detected, and automatically detect the existence of the object to be detected, the size and the thickness of the object to be detected and the thickness information of the object to be detected.

Description

Non-contact semiconductor ingot and wafer integrated analysis and measurement equipment

Technical Field

The utility model relates to an analytical measurement device, in particular to non-contact semiconductor ingot and wafer integral type analytical measurement equipment.

Background

The photoelectric tester is a common device used for measuring resistivity in the market, but the common photoelectric tester in the market can only measure a single wafer or semiconductor ingot, does not automatically distinguish the wafer from the semiconductor ingot, and cannot accurately and automatically find the position, so that a plurality of devices are required to be combined for measurement, the device and labor cost is high, and the operation is complex.

Therefore, the non-contact semiconductor ingot and wafer integrated analysis and measurement equipment is provided, which can test wafers with different sizes, can test semiconductor ingots, can automatically find positions, can set any coordinate and can comprehensively measure data information of the substance.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a non-contact semiconductor ingot and wafer integral type analytical measurement equipment.

The above technical purpose of the present invention can be achieved by the following technical solutions: a non-contact semiconductor ingot and wafer integrated analysis and measurement device comprises a device support, a linear slide rail arranged on the device support, a bearing table connected to the linear slide rail in a sliding manner, and a driving device for driving the bearing table to slide on the linear slide rail; the photoelectric analyzer is arranged on the equipment support; the device also comprises a resistivity detector arranged on the equipment support.

By adopting the technical scheme, the wafer and the semiconductor ingot can be automatically distinguished, the recorded data can be automatically analyzed, and the surface coordinate of the wafer or the semiconductor ingot to be detected can be accurately adjusted to be a fulcrum through the jacking rotary vacuumizing module, so that the resistivity of all parts of the substance can be analyzed and measured; the equipment can automatically find a position, establish a coordinate point, have more comprehensive and more accurate measurement, more specifically distinguish and judge the object to be detected, and automatically detect the existence of the object to be detected, the size and the thickness of the object to be detected.

Preferably, the driving device comprises a driving belt and a driven wheel set which are arranged in parallel to the linear slide rail, and further comprises a driving motor; the transmission belt clamping device further comprises a clamping clip connected to the receiving platform, and the transmission belt penetrates through the clamping clip.

Preferably, the vacuum machine further comprises a jacking rotary vacuum-pumping module arranged on the equipment support.

Preferably, the jacking rotary vacuumizing module comprises a support, a lifting motor arranged in the support, a screw nut screwed on a motor shaft in a threaded manner, and a push plate, wherein a motor shaft through hole which is sleeved on the motor shaft in a matched manner is formed in the push plate; still including connecting the connecting plate in the push pedal, still include the rotating electrical machines, the one end that the connecting plate deviates from the push pedal is connected on the rotating electrical machines, still including connecting the sucking disc at the rotating electrical machines epaxial.

Preferably, an optical coupler is arranged on the equipment support.

Preferably, a macro probe is arranged on the resistivity detector.

Preferably, the optical coupler is provided with a plurality of groups.

To sum up, the utility model discloses following beneficial effect has:

1. according to the technical scheme, the wafer and the semiconductor ingot can be automatically distinguished, the data can be automatically analyzed and recorded, the surface coordinate of the wafer or the semiconductor ingot to be detected can be accurately adjusted to be a fulcrum through the jacking rotary vacuumizing module, and therefore the resistivity of all parts of the substance can be analyzed and measured; the equipment can automatically find a position, establish a coordinate point, have more comprehensive and more accurate measurement, distinguish and judge the object to be detected, and automatically detect the existence of the object to be detected, the size and the thickness of the object to be detected and the thickness information of the object to be detected.

Drawings

FIG. 1 is an isometric view of an overall structure in an embodiment;

FIG. 2 is a schematic structural diagram of a jacking rotary vacuum-pumping module in an embodiment;

FIG. 3 is an exploded view of the jacking rotary vacuum module in the embodiment;

FIG. 4 is the top view of the structure of the jacking rotary vacuum-pumping module in the embodiment.

In the figure, 1, an equipment support; 11. an optical coupler; 2. a linear slide rail; 21. a receiving table; 22. a drive belt; 23. a driven wheel set; 3. a resistivity detector; 31. a macro probe; 4. jacking and rotating the vacuumizing module; 41. a motor support; 411. a linear slide rail; 42. a lifting motor; 43. a lead screw nut; 44. pushing a plate; 45. a motor shaft through hole; 46. a rotating electric machine; 47. a suction cup; 48. a connecting plate; 49. jacking optical couplers; 491. a contact piece; 5. a photoelectric analyzer; 6. semiconductor ingot detection module.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.

The embodiment is as follows:

a non-contact semiconductor ingot and wafer integrated analysis and measurement device comprises a device support 1, a linear slide rail 2 arranged on the device support 1, a receiving table 21 connected to the linear slide rail 2 in a sliding manner, and a driving device for driving the receiving table 21 to slide on the linear slide rail 2, wherein the device is shown in figure 1; the device also comprises a photoelectric analyzer 5 arranged on the device support 1; the resistivity detector 3 is arranged on the equipment support 1.

As shown in fig. 1, the driving device includes a driving belt 22 and a driven wheel set 23 arranged parallel to the linear guideway 2, and further includes a driving motor, the driving motor is connected with the driven wheel set 23, and the driving motor is connected with the driven wheel set to drive the driving belt, which is the prior art and is not shown in the figure; the device also comprises a clamp connected to the receiving platform 21, and a transmission belt 22 is arranged in the clamp in a penetrating way.

As shown in fig. 1, the vacuum-pumping device further comprises a jacking rotary vacuum-pumping module 4 arranged on the equipment support 1.

As shown in fig. 2 and 3, the jacking rotary vacuum-pumping module 4 includes a motor support 41, a lifting motor 42 disposed in the motor support 41, a lead screw nut 43 screwed on the motor shaft, and a push plate 44, wherein the push plate 44 is provided with a motor shaft through hole 45 fitted on the motor shaft; the device also comprises a connecting plate 48 connected on the push plate 44, a rotating motor 46, a sucker 47 connected on the motor shaft of the rotating motor 46 and a connecting plate 48, wherein one end of the connecting plate 48, which is far away from the push plate 44, is connected on the rotating motor 46.

The linear sliding rail device further comprises a linear sliding rail 411 arranged between the push plate 44 and the motor support 41, two sides of the linear sliding rail 411 are respectively connected to the push plate 44 and the motor support 41, the linear sliding rail 411 comprises a sliding seat and a sliding block, and the sliding block is connected with the sliding seat in a sliding mode.

As shown in fig. 3 and 4, the lifting-up device further comprises a lifting-up optical coupler 49 and a contact piece 491, wherein the lifting-up optical coupler 49 and the contact piece 491 are combined, namely, the crossing position of the lifting-up optical coupler 49 and the contact piece 491 is the lower limit height of the lifting-up structure, the height of the connecting plate is affected by the through groove on the bearing seat, and the upper limit height of the lifting-up device can be controlled.

As shown in fig. 1, the device holder 1 is provided with an optocoupler 11.

As shown in fig. 1, the resistivity tester 3 is provided with a macro probe 31.

As shown in fig. 1, the optocoupler is provided with a plurality of sets.

As shown in fig. 1, further comprises a semiconductor ingot detection module 6 disposed on the equipment support 1.

The working principle is as follows:

place the determinand on accepting the platform, along with accepting the platform and sliding on linear slide rail 2, driving motor rotates and drives the drive belt motion and then drive and accept the platform and follow linear slide rail 2 motion, and when the determinand passes through photoelectric analyzer, photoelectric analyzer 5 alright differentiate that the determinand is wafer or semiconductor ingot, still can set up the microspur sensor on semiconductor ingot detection module in addition, alright survey determinand thickness.

When the object is determined to be a wafer, the wafer is conveyed to the position below the resistivity detector, then the coordinate in the diameter direction of the wafer is automatically marked, the numerical value of each coordinate point is measured, then the wafer passes through the resistivity detector in a reciprocating mode through the matching of the jacking rotary vacuumizing module, the wafer rotates for a certain angle through the jacking rotary vacuumizing module, and the data of each coordinate point on the wafer can be measured one by one repeatedly.

When the object is determined to be a semiconductor ingot, the semiconductor ingot is conveyed to the lower part of the resistivity detector, then the coordinates of the semiconductor ingot in the diameter direction are automatically marked, the numerical value of each coordinate point is measured, and then the semiconductor ingot passes through the resistivity detector in a reciprocating mode through the matching of the jacking rotary vacuumizing module.

Claims

1. A non-contact semiconductor ingot and wafer integrated analysis and measurement equipment is characterized in that: the device comprises an equipment support (1), a linear slide rail (2) arranged on the equipment support (1), a bearing platform (21) connected to the linear slide rail (2) in a sliding manner, and a driving device for driving the bearing platform (21) to slide on the linear slide rail (2); the device also comprises a photoelectric analyzer (5) arranged on the device support (1); the device also comprises a resistivity detector (3) arranged on the device support (1).

2. A non-contact type semiconductor ingot and wafer integrated analysis and measurement apparatus according to claim 1, wherein: the driving device comprises a driving belt (22) and a driven wheel set (23) which are arranged in parallel to the linear slide rail (2), and further comprises a driving motor; the device also comprises a clamp connected to the receiving platform (21), and the transmission belt (22) penetrates through the clamp.

3. The non-contact type semiconductor ingot and wafer integrated analysis and measurement device according to claim 2, wherein: the vacuum machine also comprises a jacking rotary vacuumizing module (4) arranged on the equipment support (1).

4. A non-contact type semiconductor ingot and wafer integrated analysis and measurement apparatus according to claim 3, wherein: the jacking rotary vacuumizing module (4) comprises a motor support (41), a lifting motor (42) arranged in the motor support (41), a lead screw nut (43) screwed on a motor shaft in a threaded manner, and a push plate (44), wherein a motor shaft through hole (45) which is sleeved on the motor shaft in a matched manner is formed in the push plate (44); still including connecting plate (48) on push pedal (44), still include rotating electrical machines (46), connecting plate (48) deviate from the one end of push pedal (44) and connect on rotating electrical machines (46), still including connecting sucking disc (47) on rotating electrical machines (46) motor shaft.

5. The non-contact type semiconductor ingot and wafer integrated analysis and measurement device according to claim 4, wherein: an optical coupler (11) is arranged on the equipment support (1).

6. A non-contact type semiconductor ingot and wafer integrated analysis and measurement device according to claim 5, wherein: and a microspur probe (31) is arranged on the resistivity detector (3).

7. A non-contact type semiconductor ingot and wafer integrated analysis and measurement apparatus according to claim 6, wherein: the optical coupler is provided with a plurality of groups.

8. The non-contact type semiconductor ingot and wafer integrated analysis and measurement device according to claim 7, wherein: the device also comprises a semiconductor ingot detection module (6) arranged on the equipment support (1).

9. A non-contact integrated semiconductor ingot and wafer analysis and measurement apparatus as claimed in claim 8, wherein: also comprises a jacking optocoupler (49) and a contact piece (491).