CN217522017U - Infrared detection chip packaging structure - Google Patents

Abstract

The application discloses an infrared detection chip packaging structure which comprises a window, a cover plate, a chip, a getter and a shell; the window is fixed on the cover plate through a first solder ring; the cover plate is fixed on the shell through a second solder ring; the chip and the getter are both arranged on the shell; the pins of the chip are connected with a first bonding pad arranged on the shell through metal leads; the bottom surface of the shell is provided with a second bonding pad, the second bonding pad is connected to the first bonding pad through a lead embedded into the shell, and the welding surface of the second bonding pad is flush with the bottom surface of the shell; the side face of the shell is provided with a groove, a third bonding pad is arranged in the groove, the third bonding pad is connected to the first bonding pad through a lead embedded into the shell, and the welding face of the third bonding pad is concave relative to the side face of the shell. The structure has small volume, difficult damage and low cost.

Description

Infrared detection chip packaging structure

Technical Field

The application relates to the field of infrared detectors, in particular to an infrared detection chip packaging structure.

Background

The current common infrared detection chip packaging technology can be divided into three types, namely metal, ceramic and wafer level packaging, wherein the wafer level packaging difficulty is higher. The metal or ceramic package is to seal the detection chip in the tube shell by adopting a metal or ceramic tube shell, and the tube shell usually adopts a pin as an I/O port to be connected with a circuit board. Therefore, a package structure with small volume, less damage and low cost is a problem to be solved by those skilled in the art.

Disclosure of Invention

In view of this, the present application provides an infrared detection chip package structure.

In order to solve the technical problem, the following technical scheme is adopted in the application:

the utility model provides an infrared detection chip packaging structure which characterized in that, infrared detection chip packaging structure includes: the device comprises a window, a cover plate, a chip, a getter and a shell;

the window is fixed on the cover plate through a first solder ring;

the cover plate is fixed on the shell through a second solder ring, and a cavity is formed between the cover plate and the shell;

the chip and the getter are arranged on the shell, and the getter is used for maintaining the vacuum degree of the cavity;

the pins of the chip are connected with a first bonding pad arranged on the shell through metal leads;

the bottom surface of the shell is provided with a second bonding pad, the second bonding pad is connected to the first bonding pad through a lead embedded into the shell, and the welding surface of the second bonding pad is flush with the bottom surface of the shell;

the side face of the shell is provided with a groove, a third bonding pad is arranged in the groove, the third bonding pad is connected to the first bonding pad through a lead embedded into the shell, and the welding face of the third bonding pad is concave relative to the side face of the shell.

Compared with the prior art, the method has the following beneficial effects:

based on above technical scheme can know, the application provides an infrared detection chip packaging structure, should have a plurality of welding position including setting up in the second pad of casing bottom surface and setting up in the third pad of casing side, can nimble multiple circuit board structure of adaptation, according to circuit board structure reasonable selection welding second pad 62 or third pad. Second pad 62 and third pad 63 are no contact pin form for infrared detector encapsulates smallly, avoided the condition that contact pin is buckled or is broken, and is not fragile, it is more firm to be connected with the circuit board, because this structure does not use the contact pin, consequently, the encapsulation is with low costs, and can accomplish the surface mounting on the circuit board through the machine according to the detector that the packaging structure who provides forms in this application, high efficiency, be fit for large-scale production, the problem of the inefficiency that contact pin detector assembly needs manual operation to the circuit board has been solved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic view of an infrared detection chip package structure provided in an embodiment of the present application.

Fig. 2 is a schematic bottom view of a housing according to an embodiment of the present disclosure.

Wherein: 1. a window; 2. a first solder ring; 3. a cover plate; 31. a light-passing part; 4. a second solder ring; 5. a chip; 51. an infrared-sensitive portion; 52. a pin; 6. a housing; 61. a first pad; 62. a second pad; 63. a third pad; 64. an air intake part; 65. a metal contact; 66. a getter electrode; 67. a housing bottom surface; 68. a housing side; 7. a cavity.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device in which the element is included.

Fig. 1 is a schematic view of an infrared detection chip package structure provided in an embodiment of the present application.

Referring to fig. 1, an infrared detection chip package structure provided in an embodiment of the present application includes a window 1, a first solder ring 2, a connection layer 3, a second solder ring 4, a chip 5, a housing 6, and a cavity 7.

The window 1 is fixed on the cover plate 3 by the first solder ring 2, specifically, the cover plate 3 has a light passing portion 31, the light passing portion 31 includes a through hole and an edge portion provided on the outline of the through hole, the window 1 is fixed on the edge portion by the first solder ring 2, and the through hole corresponds to the position of the window 1. The cover plate 3 is fixed to the housing 6 by means of a second solder ring 4, a cavity 7 being formed between the cover plate 3 and the housing 6.

The bottom surface of the chip 5 and the top surface of the case 6 may be connected by an adhesive (not shown), and the chip 5 is placed in the cavity 7 to fix the position of the chip 5 on the case 6 so as not to easily fall off.

The chip 5 comprises an infrared sensitive part 51, the infrared sensitive part 51 corresponds to the position of the window 1, and the area of the window 1 is larger than that of the infrared sensitive part 51, so that the infrared sensitive part 51 is completely covered by the projection of the window 1 on the plane of the chip 5, and an incident infrared signal can be received by the infrared sensitive part 51 through the window 1.

The chip 5 further includes a plurality of leads 52, the leads 52 are disposed in the cavity 7, the leads 52 are connected to the first pads 61 by metal wires, and the plurality of first pads 61 are disposed in the cavity 7 and connected to the housing 6.

The housing 6 further includes a getter portion 64 and a metal contact portion 65, the getter portion 64 being used for placing a getter (not shown in the drawings), and the getter being connected to the metal contact portion 65 by a wire. After the encapsulation is finished, the infrared detector maintains the cavity 7 in a high vacuum state by means of the getter.

The chip 5, the metal leads and the first bonding pads 61 are all arranged in the cavity 7, so that physical protection is formed on the chip 5, and the chip 5 and the pins 52 thereof are prevented from being collided or scratched by the external environment in the transportation process.

The shell 6 can be made of ceramic, metal, plastic or other materials, the metal shell and the ceramic shell are high in strength, corrosion resistant, long in service life and high in resistance to thermal expansion, the plastic shell is simple to process and low in cost, and can be selected according to actual needs without specific limitation in the application.

Fig. 2 is a schematic bottom view of the housing according to an embodiment of the present disclosure.

Referring to fig. 2, the bottom surface 67 surface of the case 6 is provided with a plurality of second pads 62 connected to the first pads 61 by wires embedded in the case 6, that is, the second pads 62 are connected to the first pads 61 to form a conductive path. The bonding surface of the second pad 62 is disposed flush with the case bottom surface 67. The number of the second pads 62 is not less than the number of the first pads 61, and the shape of the second pads 62 may be circular.

The housing 6 is in the shape of a cuboid, and includes four side surfaces 68, at least one side surface 68 includes a plurality of grooves, in some embodiments, each side surface 68 includes a plurality of grooves, each groove surface is provided with a metal contact, the metal contact is connected to the first pad 61 through a lead embedded in the housing 6, the plurality of grooves include metal fillings, the metal fillings are firmly connected and contacted with the metal contact, the metal fillings do not exceed the groove space, the plurality of grooves including the metal fillings form a plurality of third pads 63, that is, the third pads 63 are connected with the first pads 61 to form a conductive path, the third pads 63 are disposed in the grooves, and the welding surface of the third pads 63 is recessed relative to the housing side surfaces 68. The number of the third pads 63 is not less than the number of the first pads 61.

The bottom surface 60 of the housing 6 is further provided with a getter electrode 66, the getter electrode 66 is connected to the metal contact 65 through a lead embedded in the housing 6, the getter electrode 66 and the metal contact 65 form a conductive path, and the getter electrode 66 is used for activating the getter.

According to the infrared detection chip packaging structure provided by the embodiment of the application, the second bonding pad 62 arranged on the bottom surface of the shell can be welded to an external circuit board, or the third bonding pad 63 arranged on the side surface of the shell can be welded to the external circuit board.

If the second pad 62 disposed on the bottom surface of the case is soldered to an external circuit board, the pin 52, the first pad 61, and the second pad 62 constitute a conductive path through which a signal of the chip 5 can be input or output.

If the third pad 63 disposed on the side of the housing is soldered to an external circuit board, the pin 52, the first pad 61, and the third pad 63 constitute a conductive path through which a signal of the chip 5 can be input or output.

The infrared detection chip packaging structure provided by the embodiment of the application comprises a second bonding pad 62 arranged on the bottom surface of a shell and a third bonding pad 63 arranged on the side surface of the shell, a plurality of welding positions are provided, the infrared detection chip packaging structure can be flexibly adapted to various circuit board structures, and the second bonding pad 62 or the third bonding pad 63 can be welded according to reasonable selection of the circuit board structures.

The second pad 62 and the third pad 63 that the infrared detection chip package structure that this application embodiment provided includes are no contact pin form, make infrared detector encapsulation small, the condition of contact pin bending or rupture has been avoided, it is not fragile, it is more firm to be connected with the circuit board, because this structure does not use the contact pin, consequently, the encapsulation cost is low, and the detector that the package structure that provides according to this application formed can accomplish the surface mounting on the circuit board through the machine, high efficiency, be fit for large-scale production, the problem of contact pin detector assembly need manual operation's inefficiency to the circuit board is solved.

Under the condition that must use contact pin cooperation circuit board, can also install contact pin on second pad 62 to guarantee infrared detector normal use, the packaging structure that this application embodiment provided can provide the connected mode of multiple and circuit board, satisfies diversified demand.

The foregoing is merely a preferred embodiment of the present application and, although the present application discloses the foregoing preferred embodiments, the present invention is not limited thereto. Those skilled in the art can now make numerous possible variations and modifications to the disclosed embodiments, or modify equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the claimed embodiments. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application still fall within the protection scope of the technical solution of the present application without departing from the content of the technical solution of the present application.

Claims (1)

1. The utility model provides an infrared detection chip package structure which characterized in that, infrared detection chip package structure includes: the device comprises a window, a cover plate, a chip, a getter and a shell;

the window is fixed on the cover plate through a first solder ring;

the cover plate is fixed on the shell through a second solder ring, and a cavity is formed between the cover plate and the shell;

the chip and the getter are arranged on the shell, and the getter is used for maintaining the vacuum degree of the cavity;

the pins of the chip are connected with a first bonding pad arranged on the shell through metal leads;

the bottom surface of the shell is provided with a second bonding pad, the second bonding pad is connected to the first bonding pad through a lead embedded into the shell, and the welding surface of the second bonding pad is flush with the bottom surface of the shell;

the side face of the shell is provided with a groove, a third bonding pad is arranged in the groove, the third bonding pad is connected to the first bonding pad through a lead embedded into the shell, and the welding face of the third bonding pad is concave relative to the side face of the shell.

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