CN217509158U - Chip mounter that electronic components equipment system used - Google Patents

Chip mounter that electronic components equipment system used Download PDF

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Publication number
CN217509158U
CN217509158U CN202220541631.4U CN202220541631U CN217509158U CN 217509158 U CN217509158 U CN 217509158U CN 202220541631 U CN202220541631 U CN 202220541631U CN 217509158 U CN217509158 U CN 217509158U
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Prior art keywords
frame
splint
convex
screw rods
motor
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CN202220541631.4U
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Chinese (zh)
Inventor
刘荣平
刘海民
刘祖任
廖朝晖
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Weihai Antunni Intelligent Electronic Technology Co ltd
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Weihai Antunni Intelligent Electronic Technology Co ltd
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Priority to CN202220541631.4U priority Critical patent/CN217509158U/en
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Abstract

The utility model relates to the technical field of chip mounters, in particular to a chip mounter for an electronic component assembly system, which comprises a frame, wherein a material ejecting mechanism is installed on the frame, the left side and the right side of the top end of the frame are both provided with first convex grooves, the interiors of the two first convex grooves are respectively provided with a first convex block in a sliding manner, the interiors of the two first convex blocks are respectively connected with a first screw rod in a threaded manner, the two first screw rods are respectively connected with the frame in a rotating manner, the middle of the two first screw rods is connected with a first connecting rod, the first connecting rod is connected with the frame in a rotating manner, the top ends of the two first convex blocks are respectively fixedly connected with a first clamping plate, the right end of the frame is provided with a first motor, the output end of the first motor is fixedly connected with the right end of the first screw rod on the right side, and the front side and the rear side of the top end of the frame are respectively provided with a second convex groove; it is convenient for carry on spacing fixedly to the PCB pad, avoids the PCB pad to remove during the paster, improves the effect of paster, and the people of being convenient for take the PCB pad.

Description

Chip mounter that electronic components equipment system used
Technical Field
The utility model relates to a chip mounter technical field specifically is a chip mounter that electronic components equipment system used.
Background
As is well known, the chip mounter has the advantages of high mounting speed, high precision and stable and reliable quality as a support column type device in the field of electronic mounting, thoroughly changes the characteristics of labor-intensive enterprises in the field of mounting, greatly improves the production efficiency, liberates labor force and is essential equipment in the modern mounting industry.
Through the retrieval, the prior patent discloses a chip mounter that electronic components equipment system used, including the chip mounter frame, the mounting groove has been seted up on the surface of its characterized in that chip mounter frame, the surface of mounting groove is provided with the fixed plate, the surface of fixed plate is provided with the collection tuber pipe, the surface of collection tuber pipe is provided with the blowing head, the surface of chip mounter frame is provided with the mounting bracket, the inside of mounting bracket is provided with the fan, peg graft on the surface of chip mounter frame has the butt joint frame, the surface at the storage case is fixed to the butt joint frame, the surface of storage case is provided with the gusset, it is when using, put the PCB pad in the frame usually, when carrying out the paster, be not convenient for fix the PCB pad, the PCB pad removes easily, reduce the quality of paster.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a chip mounter that electronic components equipment system used to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a chip mounter for an electronic component assembly system comprises a frame, wherein a material ejecting mechanism is installed on the frame, first convex grooves are formed in the left side of the top end and the right side of the top end of the frame, first convex blocks are arranged inside the two first convex grooves in a sliding mode, first screw rods are connected to the insides of the two first convex blocks in a threaded mode, the two first screw rods are connected with the frame in a rotating mode, a first connecting rod is connected between the two first screw rods and is connected with the frame in a rotating mode, first clamping plates are fixedly connected to the tops of the two first convex blocks, a first motor is installed at the right end of the frame, the output end of the first motor is fixedly connected with the right end of the first screw rod on the right side, second convex grooves are formed in the front side of the top end of the frame and in the rear side of the top end of the frame, second convex blocks are arranged inside the two second convex grooves in a sliding mode, and second screw rods are connected to the insides of the two second convex blocks in a threaded mode, two second screw rods all rotate with the frame to be connected, and the centre fixedly connected with second connecting rod of two second screw rods, the second connecting rod rotates with the frame to be connected, and the equal fixedly connected with second splint in top of two protruding type pieces of second, the second motor is installed to the rear end of frame, the output of second motor and the rear end fixed connection who is located the second screw rod of rear side, and the PCB pad has been placed to the centre of two first splint and two second splint.
For taking out the PCB pad for being convenient for, it is preferred, liftout mechanism includes roof and electronic jar, the top of frame is provided with the recess, the roof is located the inside of recess, the bottom of recess is provided with four logical grooves, four inside that lead to the groove all slide and be provided with the slide bar, the top of four slide bars all with the bottom fixed connection of roof, the bottom fixed connection of four slide bars has the plectane, the top of electronic jar and the bottom fixed connection of frame, the bottom of electronic jar and the top fixed connection of plectane.
For being convenient for blow away the dust on the PCB pad, preferred, the inside of two first splint all is provided with the cavity, and the one end that two first splint are relative all is provided with a plurality of through-holes with the inside intercommunication of cavity, and the left end of frame is connected with the hair-dryer through the fixed plate, and the output of air-out machine passes through the hose and is located the inside intercommunication of left cavity.
For the dust with on the PCB pad is siphoned away, preferred, the right-hand member of frame is connected with the dust catcher through the fixed plate, and the input of dust catcher passes through the hose and communicates with the cavity that is located the right side.
In order to blow off and suck away dust on the PCB pads, it is preferable that the plurality of through holes are located at an upper side of the PCB pads.
In order to facilitate the placement of the PCB pad between the two first clamping plates and the two second clamping plates, preferably, the top ends of the two first clamping plates and the two second clamping plates are provided with bevel edges.
Compared with the prior art, the utility model provides a chip mounter that electronic components equipment system used possesses following beneficial effect:
1. this chip mounter that electronic components equipment system used drives two first screw rods and head rod through first motor and rotates, makes two first protruding type pieces and two first splint remove to the centre, drives two second screw rods and second connecting rod through the second motor and rotates, makes two second fixed blocks and two second splint remove to the centre, is convenient for carry out spacing fixed to the PCB pad, avoids the PCB pad to remove during the paster, improves the effect of paster.
2. This chip mounter that electronic components equipment system used is convenient for ejecting PCB pad from the centre of two first splint and two second splint through liftout mechanism, is convenient for people to take the PCB pad.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic cross-sectional view taken along line A-A of FIG. 2 according to the present invention;
FIG. 4 is a schematic cross-sectional view taken along line B-B of FIG. 2 according to the present invention;
fig. 5 is a schematic cross-sectional view taken along line C-C of fig. 2 according to the present invention.
The symbols in the figures indicate:
1. a frame; 2. a first male block; 3. a first screw; 4. a first connecting rod; 5. a first splint; 6. a first motor; 7. a second male block; 8. a second screw; 9. a second connecting rod; 10. a second splint; 11. a second motor; 12. a PCB pad; 13. a top plate; 14. an electric cylinder; 15. a slide bar; 16. a circular plate; 17. a fixing plate; 18. a blower; 19. a hose; 20. a dust collector.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Example (b):
referring to fig. 1-5, the present invention provides a chip mounter for an electronic component assembly system, including a frame 1, wherein a material ejecting mechanism is installed on the frame 1, and the material ejecting mechanism is used to eject a PCB pad 12 from the middle of two first clamping plates 5 and two second clamping plates 10, so as to facilitate people to take the PCB pad 12; the top left side and the top right side of frame 1 all are provided with first protruding type groove, and the inside in two first protruding type grooves all slides and is provided with first protruding type piece 2, and the equal threaded connection in inside of two first protruding type pieces 2 has first screw rod 3, and the screw thread spiral opposite direction of two first screw rods 3, two first screw rods 3 all rotate with frame 1 and are connected, and the intermediate junction of two first screw rods 3 has head rod 4, and head rod 4 rotates with frame 1 to be connected.
In the embodiment, the top ends of the two first convex blocks 2 are fixedly connected with the first clamping plates 5, cavities are formed in the two first clamping plates 5, a plurality of through holes communicated with the interiors of the cavities are formed in the opposite ends of the two first clamping plates 5, and the through holes are located on the upper sides of the PCB bonding pads 12, so that dust on the PCB bonding pads 12 can be blown off and sucked away conveniently, the dust is prevented from falling on the PCB bonding pads 12, and the effect of surface mounting is ensured;
the left end of the rack 1 is connected with a blower 18 through a fixing plate 17, and the output end of the air outlet machine is communicated with the inside of the cavity on the left side through a hose 19, so that dust on the PCB bonding pad 12 can be blown away conveniently; the right-hand member of frame 1 is connected with dust catcher 20 through fixed plate 17, and the input of dust catcher 20 passes through hose 19 and is located the cavity intercommunication on right side, is convenient for suck away the dust on PCB pad 12 to inhale the inside to external connection's purifier with the dust, avoid the dust to scatter to in the air on every side.
A first motor 6 is installed at the right end of the rack 1, the output end of the first motor 6 is fixedly connected with the right end of a first screw rod 3 positioned on the right side, second convex grooves are formed in the front side of the top end and the rear side of the top end of the rack 1, second convex blocks 7 are arranged in the two second convex grooves in a sliding mode, second screw rods 8 are connected to the insides of the two second convex blocks 7 in a threaded mode, the thread spiral directions of the two second screw rods 8 are opposite, the two second screw rods 8 are rotatably connected with the rack 1, a second connecting rod 9 is fixedly connected to the middle of each of the two second screw rods 8, and the second connecting rod 9 is rotatably connected with the rack 1; the equal fixedly connected with second splint 10 in top of two second protruding type pieces 7, the top of two first splint 5 and two second splint 10 all is provided with the hypotenuse, is convenient for place the centre of two first splint 5 and two second splint 10 with PCB pad 12, the blowing of being convenient for.
Second motor 11 is installed to the rear end of frame 1, second motor 11's output and the rear end fixed connection who is located the second screw rod 8 of rear side, PCB pad 12 has been placed to the centre of two first splint 5 and two second splint 10, drive two first screw rods 3 and the rotation of head rod 4 through first motor 6, make two first protruding type piece 2 and two first splint 5 remove to the centre, drive two second screw rods 8 and the rotation of second connecting rod 9 through second motor 11, make two second fixed blocks and two second splint 10 remove to the centre, be convenient for carry out spacing fixed to PCB pad 12, avoid PCB pad 12 to remove during the paster, improve the effect of paster.
It should be further noted that, in this embodiment, the liftout mechanism includes top plate 13 and electronic jar 14, the top of frame 1 is provided with the recess, top plate 13 is located the inside of recess, the bottom of recess is provided with four through grooves, four through grooves's inside all slides and is provided with slide bar 15, four slide bar 15's top all is connected with the bottom fixed connection of top plate 13, four slide bar 15's bottom fixed connection has the plectane 16, electronic jar 14's top and frame 1's bottom fixed connection, electronic jar 14's bottom and plectane 16's top fixed connection, through electronic jar 14 pulling plectane 16, four slide bar 15 and top plate 13 upward movement, push away PCB pad 12 to the upside of two first splint 5 and two second splint 10, be convenient for take PCB pad 12 after the paster.
The utility model discloses when using, at first drive two first screw rods 3 and the head rod 4 through first motor 6 and rotate, make two first protruding type pieces 2 and two first splint 5 remove to the centre, drive two second screw rods 8 and the rotation of second connecting rod 9 through second motor 11, make two second fixed blocks and two second splint 10 remove to the centre, carry out spacing fixed to PCB pad 12, start hair-dryer 18 and dust catcher 20 simultaneously, blow away the dust on PCB pad 12 through hair-dryer 18, suck away the dust on PCB pad 12 through dust catcher 20, then carry out paster work, after the paster is accomplished, stimulate plectane 16 through electronic jar 14, four slide bars 15 and roof 13 rebound, push away PCB pad 12 to the upside of two first splint 5 and two second splint 10, then take out PCB pad 12, then promote plectane 16 through electronic jar 14, The four sliding bars 15 and the top plate 13 move downward, so that the top plate 13 moves to the inside of the groove, and then the PCB pads 12 are placed between the two first clamping plates 5 and the two second clamping plates 10, and the pasting work is continued.
In the description of the present invention, it is to be understood that the directions or positional relationships indicated by the terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular direction, and therefore, should not be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (6)

1. The utility model provides a chip mounter that electronic components equipment system used, includes frame (1), its characterized in that: the ejection mechanism is installed on the rack (1), first convex grooves are formed in the left side of the top end and the right side of the top end of the rack (1), first convex blocks (2) are arranged inside the two first convex grooves in a sliding mode, first screw rods (3) are connected to the inside of the two first convex blocks (2) in a threaded mode, the two first screw rods (3) are connected with the rack (1) in a rotating mode, a first connecting rod (4) is connected between the two first screw rods (3), the first connecting rod (4) is connected with the rack (1) in a rotating mode, first clamping plates (5) are fixedly connected to the top ends of the two first convex blocks (2), a first motor (6) is installed at the right end of the rack (1), the output end of the first motor (6) is fixedly connected with the right end of the first screw rod (3) on the right side, second convex grooves are formed in the front side of the top end and the back side of the top end of the rack (1), the inside in two convex type grooves of second all slides and is provided with second protruding type piece (7), the equal threaded connection in inside of two second protruding type pieces (7) has second screw rod (8), two second screw rods (8) all rotate with frame (1) and are connected, middle fixedly connected with second connecting rod (9) of two second screw rods (8), second connecting rod (9) rotate with frame (1) and are connected, the equal fixedly connected with second splint (10) in top of two second protruding type pieces (7), second motor (11) are installed to the rear end of frame (1), the output of second motor (11) and the rear end fixed connection who is located the second screw rod (8) of rear side, PCB pad (12) have been placed to the centre of two first splint (5) and two second splint (10).
2. The mounter for an electronic component assembling system according to claim 1, wherein: the liftout mechanism includes roof (13) and electronic jar (14), the top of frame (1) is provided with the recess, roof (13) are located the inside of recess, and the bottom of recess is provided with four logical grooves, and the inside in four logical grooves all slides and is provided with slide bar (15), the top of four slide bar (15) all with the bottom fixed connection of roof (13), the bottom fixed connection of four slide bar (15) has plectane (16), the bottom fixed connection of the top of electronic jar (14) and frame (1), the bottom of electronic jar (14) and the top fixed connection of plectane (16).
3. The mounter for an electronic component assembling system according to claim 2, wherein: two the inside of first splint (5) all is provided with the cavity, and the one end that two first splint (5) are relative all is provided with a plurality of through-holes with the inside intercommunication of cavity, and the left end of frame (1) is connected with hair-dryer (18) through fixed plate (17), and the output that goes out the fan passes through hose (19) and is located the inside intercommunication of left cavity.
4. A mounter for an electronic component assembling system according to claim 3, characterized in that: the right-hand member of frame (1) is connected with dust catcher (20) through fixed plate (17), and the input of dust catcher (20) passes through hose (19) and is located the cavity intercommunication on right side.
5. The mounter for an electronic component assembling system according to claim 4, wherein: the through holes are all located on the upper side of the PCB pad (12).
6. The mounter for an electronic component assembling system according to claim 5, wherein: the top ends of the two first clamping plates (5) and the two second clamping plates (10) are provided with bevel edges.
CN202220541631.4U 2022-03-13 2022-03-13 Chip mounter that electronic components equipment system used Active CN217509158U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220541631.4U CN217509158U (en) 2022-03-13 2022-03-13 Chip mounter that electronic components equipment system used

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220541631.4U CN217509158U (en) 2022-03-13 2022-03-13 Chip mounter that electronic components equipment system used

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CN217509158U true CN217509158U (en) 2022-09-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116209153A (en) * 2023-05-06 2023-06-02 中创领科(西安)智能科技发展有限公司 Low-power consumption semiconductor device convenient for circuit board installation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116209153A (en) * 2023-05-06 2023-06-02 中创领科(西安)智能科技发展有限公司 Low-power consumption semiconductor device convenient for circuit board installation

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