CN217504454U

CN217504454U - Counter-gravity temperature-equalizing plate and electronic element

Info

Publication number: CN217504454U
Application number: CN202220956432.XU
Authority: CN
Inventors: 杨洪武
Original assignee: Dalian Bonded Area Jinbaozhi Electronics Co ltd
Current assignee: Dalian Bonded Area Jinbaozhi Electronics Co ltd
Priority date: 2022-04-24
Filing date: 2022-04-24
Publication date: 2022-09-27
Anticipated expiration: 2032-04-24

Abstract

An antigravity temperature-uniforming plate and an electronic component, the antigravity temperature-uniforming plate is suitable for a heating element with a vertical radiating surface, the antigravity temperature-uniforming plate comprises a plurality of panels which are arranged in a stacked mode, and the panels are all parallel to the vertical radiating surface; a condensate pool, a steam cavity and a liquid conveying channel are arranged among the panels, the condensate pool is positioned at the bottom of the antigravity temperature-equalizing plate along the vertical direction, and the steam cavity and the liquid conveying channel are positioned at the top of the antigravity temperature-equalizing plate along the vertical direction; the extension plane of the condensate tank is vertical to the vertical radiating surface, the steam cavity and the infusion channel are arranged at intervals, and the extension directions of the steam cavity and the infusion channel are both vertical to the extension plane of the condensate tank; the top ends of the steam cavity and the infusion channel in the vertical direction are communicated with each other, and the bottom ends of the steam cavity and the infusion channel in the vertical direction are communicated with the condensate tank. The application is particularly suitable for radiating the low-power heating part with the large-area vertical radiating surface.

Description

Counter-gravity temperature-equalizing plate and electronic element

Technical Field

The application relates to the technical field of electronic elements, in particular to an antigravity temperature-equalizing plate and an electronic element.

Background

The heat pipe is an element for improving the heat transfer capacity of a heat dissipation system by utilizing latent heat of vaporization carried by a liquid phase change process, and is widely applied by the electronic engineering industry.

In the related art, a Vapor Chamber (also called Vapor Chamber or Vapor Chamber, VC for short) is a heat pipe structure for performing liquid phase change heat transfer in a planar Chamber. The temperature equalizing plate comprises a lower shell, a wire mesh plate, a sintering plate and an upper shell which are arranged in sequence. The lower shell is provided with a steam cavity, and the wire mesh plate and the sintering plate are embedded in the steam cavity. The edge of the lower shell is buckled and welded with the edge of the upper shell, so that the steam cavity forms a closed cavity. When the cold source heat dissipation device is used, the lower shell is used as an evaporation end and is arranged adjacent to a heat dissipation surface of the heating piece, and the upper shell is used as a condensation end and is in contact with a cold source.

However, the above technical solution is not suitable for dissipating heat from a low-power heat generating component having a large-area vertical heat dissipating surface.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present application provides an antigravity temperature equalization plate and an electronic device, which are particularly suitable for dissipating heat from a low-power heating element having a large-area vertical heat dissipation surface.

In order to achieve the above object, the present application provides the following technical solutions:

a first aspect of an embodiment of the present application provides an antigravity temperature-uniforming plate, which is suitable for a heating element having a vertical heat dissipation surface, and includes a plurality of stacked panels, and the plurality of panels are parallel to the vertical heat dissipation surface;

a condensate pool, a steam cavity and a liquid conveying channel are arranged among the panels, the condensate pool is positioned at the bottom of the antigravity temperature-equalizing plate along the vertical direction, and the steam cavity and the liquid conveying channel are positioned at the top of the antigravity temperature-equalizing plate along the vertical direction;

the extending plane of the condensate liquid pool is perpendicular to the vertical radiating surface, the steam cavity and the liquid conveying channel are arranged at intervals, and the extending directions of the steam cavity and the liquid conveying channel are perpendicular to the extending plane of the condensate liquid pool;

the top ends of the steam cavity and the infusion channel in the vertical direction are communicated with each other, and the bottom ends of the steam cavity and the infusion channel in the vertical direction are communicated with the condensate tank.

In an implementation mode, the infusion channel and the steam cavity are provided with a plurality of channels, the number of the infusion channels is larger than that of the steam cavities, and the steam cavities are communicated with at least one infusion channel.

In an implementation mode, a plurality of steam cavity micro-channels are further arranged among the panels, and are all positioned on the wall of the steam cavity;

each steam cavity micro-channel extends along the extending direction of the steam cavity, the bottom end of each steam cavity micro-channel along the vertical direction is communicated with the condensate liquid pool, and the top end of each steam cavity micro-channel along the vertical direction is communicated with at least one liquid conveying channel.

In an implementation mode, a steam channel is further arranged among the panels and is positioned at the top end of each infusion channel in the vertical direction;

the extension plane of the steam channel is parallel to the extension plane of the condensate liquid pool, the steam channel and the infusion channels are arranged at intervals, and the steam channel is communicated with the top ends of the steam cavities in the vertical direction.

In one possible embodiment, the cross-sectional area of the infusion channel is smaller than the cross-sectional area of the vapor chamber;

and/or the cross-sectional area of the bottom end of the infusion channel in the vertical direction is smaller than that of the top end of the infusion channel in the vertical direction;

and/or the distance between the top end of the liquid conveying channel in the vertical direction and the condensate pool is larger than the distance between the top end of the steam cavity in the vertical direction and the condensate pool.

In one implementation mode, a heat radiation fin is further arranged and connected to at least one of the two panels positioned on the outer side of the antigravity temperature equalizing plate, and the heat radiation fin is positioned at the top or the bottom of the panel along the vertical direction;

the heat dissipation fins are arranged in a plurality and are perpendicular to the panel.

In one possible embodiment, the plurality of panels comprises a first end panel, a second end panel and a plurality of intermediate panels;

the first end panel is positioned on one side of the plurality of panels closest to the vertical heat dissipation surface, the second end panel is positioned on one side of the plurality of panels farthest from the vertical heat dissipation surface, and the plurality of intermediate panels are stacked and arranged between the first end panel and the second end panel;

at least part of the infusion channel is arranged on the first end panel and/or the second end panel.

In an implementation manner, at least part of the condensate pool is located between a plurality of intermediate panels, a bottom of each intermediate panel in the vertical direction is provided with a first through hole, the first through holes of adjacent intermediate panels are communicated with each other, and the condensate pool located between the intermediate panels is formed;

and/or the presence of a gas in the gas,

at least part of the steam cavity is positioned among the plurality of middle panels, each middle panel is provided with a second through hole, the second through holes of the adjacent middle panels are communicated with each other, and the steam cavity positioned among the plurality of middle panels is formed.

In one possible embodiment, the infusion channel is located between any two adjacent panels,

one of two adjacent panels is provided with a micro-channel, and the other panel of two adjacent panels is butted with the panel provided with the micro-channel and blocks a notch of the micro-channel to form the transfusion channel;

or the surfaces, close to each other, of the two adjacent panels are provided with micro channels, the two adjacent panels are in butt joint, and the micro channels positioned on the two adjacent panels are in butt joint to form the infusion channel.

A second aspect of the embodiments of the present application provides an electronic component, including generating heat and foretell antigravity temperature-uniforming plate, generate heat and have perpendicular cooling surface, antigravity temperature-uniforming plate set up in it is close to generate heat one side of perpendicular cooling surface.

The embodiment of the application provides an antigravity temperature-uniforming plate and an electronic component, and the antigravity temperature-uniforming plate is suitable for a low-power heating part with a large-area vertical radiating surface. The countergravity temperature-uniforming plate is provided with the plurality of panels parallel to the vertical radiating surfaces, so that the panels can be arranged adjacent to the vertical radiating surfaces, the contact area between the panels and the vertical radiating surfaces is increased, the plurality of panels form a layered structure, heat of the heating part flows along the layers of two sides of each panel, the flow resistance is smaller, the heat can be rapidly diffused along the extension plane parallel to the vertical radiating surfaces, the radiating efficiency is higher, and the radiating effect is better; through setting up infusion passageway and steam chamber, make the condensate can climb to the top along infusion passageway under the effect of capillary, with condensate gravity upwards promote and carry to the steam chamber in the condensate pool, the temperature of the relative infusion passageway of temperature in steam chamber is higher, make the condensate take place the phase transition after getting into the steam chamber and turn into steam, steam flows to the bottom along the steam chamber, and take place the phase transition and turn into the condensate in the position that is close to the condensate pool, the condensate after the phase transition flows back to the condensate pool once more. The condensate flows in a circulating way among the liquid conveying channel, the steam cavity and the condensate pool in such a reciprocating way, and the vertical radiating surface of the heating part is radiated. The electronic element comprises the antigravity temperature-uniforming plate and has the same beneficial effects.

The construction and other objects and advantages of the present application will be more apparent from the description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural view of an anti-gravity temperature equalization plate according to an embodiment of the present disclosure;

fig. 2 is another schematic structural diagram of an anti-gravity temperature equalization plate according to an embodiment of the present disclosure;

fig. 3 is a top view internal structure diagram of an inverse gravity temperature-uniforming plate according to an embodiment of the present application;

FIG. 4 is an enlarged view of a portion of FIG. 3;

fig. 5 is a schematic view of a first panel of an anti-gravity temperature equalization plate according to an embodiment of the present disclosure;

FIG. 6 is a partial enlarged view of FIG. 5 at B;

FIG. 7 is a schematic view of a second panel of the antigravity temperature equalization plate according to an embodiment of the present disclosure;

FIG. 8 is an enlarged view of a portion of FIG. 7 at C;

FIG. 9 is an enlarged view of a portion of FIG. 7 at D;

FIG. 10 is a schematic view of a third panel of the antigravity temperature equalization plate according to the present disclosure;

FIG. 11 is an enlarged view of a portion of FIG. 10 at E;

FIG. 12 is a schematic view of a fourth panel of an anti-gravity thermal equalizer according to an embodiment of the present disclosure;

fig. 13 is a partially enlarged view of fig. 12 at F.

Description of reference numerals:

100-antigravity temperature-uniforming plate;

101-a first panel; 102-a second panel; 103-a third panel; 104-a fourth panel;

210-condensate tank; 211-a first via;

220-a steam chamber; 221-vapor chamber microchannels; 222-a steam channel; 223-a second via;

230-an infusion channel; 231-microchannels;

310-heat dissipation fins;

q-heat; an L-refrigerant; y-condensate; z-steam.

Detailed Description

In the related art, the temperature equalization plate comprises a lower shell, a wire mesh plate, a sintering plate and an upper shell which are arranged in sequence. The casing is provided with the steam chamber down, a plurality of support columns of steam intracavity array distribution, and a plurality of support columns all sink in the border of casing down. The wire mesh plate is erected and welded on the support column, the sintering plate is erected on the wire mesh plate, and the wire mesh plate and the sintering plate are both embedded in the steam cavity. The edge of the lower shell is buckled with the edge of the upper shell and welded, so that the steam cavity forms a closed cavity.

When the cold source heat dissipation device is used, the lower shell is used as an evaporation end and is arranged adjacent to a heat dissipation surface of the heating piece, and the upper shell is used as a condensation end and is in contact with a cold source. And injecting condensate into the evaporation cavity of the lower shell, so that the condensate is distributed at the bottom of the steam cavity and is filled in the pores of the wire mesh plate. After the condensed fluid in the pores of the wire mesh plate absorbs the heat of the radiating surface, the condensed fluid is quickly subjected to phase change vaporization to form steam. The steam flows to the condensation cavity under the action of diffusion force, contacts the cold source in the condensation cavity to release heat, and is subjected to phase change to be converted into condensate. The condensate in the condensation cavity flows through the cavity wall of the condensation cavity, the pores of the sintering plate and the pores of the wire mesh plate and then flows back to the evaporation cavity again. The process is repeated until the temperatures of the evaporation end and the condensation end are equal.

However, the above technical solution is not suitable for dissipating heat from a low-power heat generating component having a large-area vertical heat dissipating surface. The condensate can only be remained in the evaporation cavity or the pores of the wire mesh plate and cannot climb along the vertical direction along the extending direction of the vertical radiating surface, namely, the condensate can only radiate the local surface of the vertical radiating surface and cannot radiate the whole surface of the vertical radiating surface.

In view of the above technical problems, an embodiment of the present application provides an antigravity temperature-uniforming plate and an electronic component, and the antigravity temperature-uniforming plate is suitable for a low-power heating element with a large-area vertical heat dissipation surface. The antigravity temperature-uniforming plate is provided with the plurality of panels parallel to the vertical radiating surface, so that the panels can be arranged adjacent to the vertical radiating surface, the contact area between the panels and the vertical radiating surface is increased, the plurality of panels form a layered structure, heat of the heating part flows in a layered mode along two sides of each panel, the flow resistance is smaller, the heat can be rapidly diffused along an extending plane parallel to the vertical radiating surface, the radiating efficiency is higher, and the radiating effect is better; through setting up infusion passageway and steam chamber, make the condensate can climb to the top along infusion passageway under the effect of capillary, with condensate gravity upwards promote and carry to the steam chamber in the condensate pool, the temperature of the relative infusion passageway of temperature in steam chamber is higher, make the condensate take place the phase transition after getting into the steam chamber and turn into steam, steam flows to the bottom along the steam chamber, and take place the phase transition and turn into the condensate in the position that is close to the condensate pool, the condensate after the phase transition flows back to the condensate pool once more. The condensate flows in a circulating manner among the infusion channel, the steam cavity and the condensate pool in such a reciprocating manner, and the vertical radiating surface of the heating part is radiated. The electronic element comprises the antigravity temperature-uniforming plate and has the same beneficial effect.

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described are some, but not all embodiments of the disclosure. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The electronic components provided in the embodiments of the present application will be described below.

The embodiment of the application provides an electronic component, including generating heat and foretell antigravity temperature-uniforming plate, generate heat and have perpendicular cooling surface, antigravity temperature-uniforming plate sets up in the one side that generates heat and be close to perpendicular cooling surface.

The heating part can comprise a large-space heating part with low power and low heat flux density, and the heating part can provide a vertical radiating surface with a larger area. For example, the electronic component may include a battery, and the heat generating member may include a cell in the battery. In some embodiments, the electronic component may further include a circuit board, and the heat generating member may include a chip in the circuit board.

It will be appreciated that as the position and attitude of the electronic component changes during use, the position and attitude of the vertical heat-dissipating surfaces changes, i.e., the vertical heat-dissipating surfaces may have an inclined or horizontal state. The embodiment of the present application does not strictly limit that the vertical heat dissipation surface is kept vertical at any time, but means that the vertical heat dissipation surface may have a vertical state in a normal condition.

The antigravity temperature equalization plate 100 provided in the embodiment of the present application will be described below with reference to fig. 1 to 13.

The embodiment of the application provides an antigravity temperature-uniforming plate 100, is applicable to the piece that generates heat that has perpendicular cooling surface, and antigravity temperature-uniforming plate 100 is all on a parallel with perpendicular cooling surface including a plurality of panels of range upon range of setting, a plurality of panels.

A condensate pool 210, a steam cavity 220 and a liquid conveying channel 230 are arranged among the panels, the condensate pool 210 is positioned at the bottom of the antigravity temperature-uniforming plate 100 along the vertical direction, and the steam cavity 220 and the liquid conveying channel 230 are positioned at the top of the antigravity temperature-uniforming plate 100 along the vertical direction.

The extension plane of the condensate liquid pool 210 is perpendicular to the vertical heat dissipation surface, the steam cavity 220 and the liquid feeding channel 230 are arranged at intervals, and the extension directions of the steam cavity 220 and the liquid feeding channel 230 are perpendicular to the extension plane of the condensate liquid pool 210.

The top ends of the vapor cavity 220 and the liquid feeding channel 230 in the vertical direction are communicated with each other, and the bottom ends of the vapor cavity 220 and the liquid feeding channel 230 in the vertical direction are communicated with the condensate pool 210.

The panel may comprise a ceramic, metal or composite material piece, among others. Illustratively, the panel may be a copper alloy sheet or a stainless steel sheet. The plurality of panels may have the same shape and size, so that orthographic projections of the plurality of panels on each other are all overlapped with each other, and the plurality of panels may be welded and fixed.

The plurality of panels are all parallel to the vertical radiating surface, so that the panels can be arranged adjacent to the vertical radiating surface, and the contact area between the panels and the vertical radiating surface is increased. A plurality of panels form a layered structure, and the heat Q of the piece that generates heat flows along the layering of each panel both sides, and flow resistance is littleer, and heat Q can be followed the extension plane rapid diffusion that is on a parallel with perpendicular radiating surface, and the radiating efficiency is higher, and the radiating effect is better.

In one possible implementation, as shown in fig. 3 and 4 in conjunction with fig. 5-13, the cross-sectional area of the infusion channel 230 is less than the cross-sectional area of the vapor chamber 220.

It will be appreciated that the smaller the cross-sectional area of the feed passage 230, the smaller the effective diameter of the feed passage 230, the greater the capillary force of the feed passage 230 on the condensate Y, and the greater the elevation of the condensate Y within the feed passage 230. The infusion channel 230 has a cross-sectional area of micrometer-scale dimensions.

In the embodiment of the present application, the capillary force of the liquid delivery channel 230 to the condensate Y is much larger than that of the vapor cavity 220 to the condensate Y, so that the condensate Y can be lifted through the liquid delivery channel 230 and delivered to the vapor cavity 220 at the top, and the lifting height of the condensate Y in the vapor cavity 220 can be almost ignored. Illustratively, the effective diameter of the feed channel 230 may be less than 100 μm, and its elevation height for the condensate Y may be greater than 30 mm. The effective diameter of the vapor chamber 220 may be greater than 3mm with a lift height of less than 300 μm for the condensate Y.

It will be appreciated that the feed passage 230 is filled with condensate Y and that the condensate Y in the vapor chamber 220 is replenished from the feed passage 230, the difference in cross-sectional area and the flow rate of the condensate Y being such that the temperature in the vapor chamber 220 is higher than the temperature in the feed passage 230. Also, since the bottom of the vapor chamber 220 in the vertical direction communicates with the condensate pool 210, the temperature of the top of the vapor chamber 220 is higher than that of the bottom thereof. When the condensate Y enters the steam cavity 220 from the top of the liquid conveying channel 230, the condensate Y in the steam cavity 220 can be subjected to phase change and converted into steam Z under the action of high temperature; the steam Z flows from the top to the bottom along the steam cavity 220, contacts the low-temperature cavity wall at a position close to the condensate pool 210, and is subjected to phase change to be converted into condensate Y; the phase-changed condensate Y is returned to the condensate pool 210. In this way, the condensate Y circulates among the liquid feeding channel 230, the steam cavity 220 and the condensate pool 210, and the vertical heat dissipation surface of the heat generating member is cooled.

In one possible implementation, as shown in fig. 5-13, the distance between the top end of the infusion channel 230 in the vertical direction and the condensate pool 210 is greater than the distance between the top end of the vapor chamber 220 in the vertical direction and the condensate pool 210.

Thus, the infusion channel 230 can enter the steam cavity 220 in a backflow mode at the top, wherein the infusion channel 230 can be communicated to the steam cavity 220 through an inverted U-shaped structure as shown in fig. 8, so that the severe change of the cross-sectional area of the infusion channel 230 can be avoided, the smooth connection between the infusion channel 230 and the steam cavity 220 can be ensured, and the continuous integrity of the flowing of the condensate Y is promoted.

In one possible implementation, as shown in fig. 5 and 6, the cross-sectional area of the bottom end of the infusion channel 230 in the vertical direction is smaller than the cross-sectional area of the top end of the infusion channel 230 in the vertical direction.

Thus, the capillary force of the bottom of the liquid conveying channel 230 to the condensate Y is larger than that of the top of the liquid conveying channel to the condensate Y, so that the antigravity temperature equalizing plate 100 can assist the condensate Y in the condensate pool 210 to flow to the liquid conveying channel 230 in the initial stage of heat dissipation of the heating element, and has a one-way rejection function.

Wherein the cross-sectional area of the infusion channel 230 can be increased in a stepwise manner or continuously. The embodiment of the present application does not limit this.

In one possible implementation, as shown in fig. 2, 3 and 7, the infusion channel 230 and the steam cavity 220 are provided in a plurality, the number of the infusion channels 230 is greater than that of the steam cavity 220, and the steam cavity 220 is communicated with at least one infusion channel 230.

It can be understood that the cross-sectional area of the liquid feeding channel 230 is much smaller than that of the vapor cavity 220, and the liquid feeding channel 230 is provided more, so that the vapor cavity 220 can be supplemented with enough flow of the condensate Y, so as to take away more heat Q and improve the heat dissipation efficiency.

When the steam chamber 220 is communicated with the plurality of the feeding channels 230, the plurality of the feeding channels 230 may be respectively communicated with the steam chamber 220, or the plurality of the feeding channels 230 may be communicated with each other at the top through a connecting channel and then communicated with the steam chamber 220.

In one implementation, as shown in fig. 2 and 3 and fig. 7-13, a plurality of vapor chamber microchannels 221 are further disposed between the plurality of panels, and the plurality of vapor chamber microchannels 221 are located on the wall of the vapor chamber 220.

Each vapor cavity micro channel 221 extends along the extending direction of the vapor cavity 220, the bottom end of each vapor cavity micro channel 221 along the vertical direction is communicated with the condensate liquid pool 210, and the top end of each vapor cavity micro channel 221 along the vertical direction is communicated with at least one liquid conveying channel 230.

Thus, vapor chamber microchannels 221 may form a group of vapor chamber 220 channels within vapor chamber 220, where condensate Y contacts heat Q in vapor chamber 220 and absorbs heat Q to convert to vapor Z. The arrangement of the micro-channel 221 of the steam cavity can expand the contact area of the condensate Y and the heat Q in the steam cavity 220, and the heat dissipation efficiency is improved.

In one possible implementation, as shown in fig. 7, 10 and 12, a steam channel 222 is further provided among the panels, and the steam channel 222 is located at the top end of each infusion channel 230 in the vertical direction.

The extension plane of the steam channel 222 is parallel to the extension plane of the condensate pool 210, the steam channel 222 and each liquid feeding channel 230 are arranged at intervals, and the steam channel 222 is communicated with the top end of each steam cavity 220 along the vertical direction.

In this way, the vapor Z vaporized in the vapor chamber 220 may flow into the other vapor chambers 220 through the vapor passage 222, so that the heat Q in the vapor chamber 220 in which the temperature is high may be dispersed into the other vapor chambers 220.

In one implementation that may be realized, as shown in fig. 1-4, the plurality of panels includes a first end panel, a second end panel, and a plurality of intermediate panels.

The first end panel is positioned on one side of the plurality of panels closest to the vertical heat dissipation surface, the second end panel is positioned on one side of the plurality of panels farthest from the vertical heat dissipation surface, and the plurality of intermediate panels are stacked and arranged between the first end panel and the second end panel.

At least part of the infusion channel 230 is provided on the first end panel and/or the second end panel.

As shown in fig. 3, the inverse gravity temperature-uniforming plate 100 is arranged in a symmetrical structure, and may be formed by sequentially stacking a first panel 101, a second panel 102, a third panel 103, a fourth panel 104, a third panel 103, a second panel 102, and the first panel 101, wherein the first panels 101 located at both sides may form a first end panel and a second end panel, and the remaining panels form a middle panel.

In the embodiment of the present application, both sides of the antigravity temperature-uniforming plate 100 may have heat generating members, so that the first end panel closest to the vertical heat dissipating surface is only the second end panel relative to the heat generating member on one side and the second end panel relative to the heat generating member on the other side.

It is understood that the cross-sectional area of the vapor chamber 220 is greater than the cross-sectional area of the infusion channel 230, the vapor chamber 220 may be located on a plurality of intermediate panels, and the infusion channel 230 may be located between two adjacent panels. The steam chamber 220 occupies most of the area of the middle panel, so that the area in which the infusion path 230 can be disposed is greatly reduced, and the panel located at the side can provide more area for disposing the infusion path 230. Therefore, by providing the introduction passage 230 on the panel located at the side, the number of the introduction passages 230 formed can be increased to deliver more condensate Y.

In one possible implementation, the infusion channel 230 is located between any two adjacent panels, as shown in fig. 3-13.

One of the two adjacent panels is provided with a micro-channel 231, and the other of the two adjacent panels is butted with the panel provided with the micro-channel 231 and blocks the notch of the micro-channel 231 to form the transfusion channel 230.

Or, the surfaces of two adjacent panels close to each other are provided with micro-channels 231, the two adjacent panels are butted, and the micro-channels 231 on the two adjacent panels are butted to form the transfusion channel 230.

In this way, the feeding passages 230 can be formed between any adjacent panels, so that more feeding passages 230 can be conveniently arranged to feed the condensate Y to the steam cavity 220 and continuously take away the heat Q of the heat generating member.

In one possible implementation, as shown in fig. 7, 10 and 12, at least a part of the condensate pool 210 is located between a plurality of intermediate panels, a bottom of each intermediate panel in the vertical direction is provided with a first through hole 211, and the first through holes 211 of adjacent intermediate panels are communicated with each other to form the condensate pool 210 located between the plurality of intermediate panels.

Thus, the condensate tank 210 can have a large liquid storage amount, so as to provide enough condensate Y for the antigravity temperature-uniforming plate 100, and improve the heat dissipation effect.

In some embodiments, as shown in fig. 5, a partial condensate pool 210 may also be located on the first end panel and/or the second end panel.

Taking the example that a part of the condensate tank 210 is located on the first end panel, the position of the first end panel corresponding to the condensate tank 210 may be half engraved to form a channel, and the channel is communicated with the first through holes 211 of the plurality of middle panels to form the condensate tank 210 located between the first end panel and the plurality of middle panels. Wherein the top of the channel can also communicate with the feeding channel 230 on the first end panel, thereby realizing the communication between the condensate pool 210 and the feeding channel 230.

Similarly, the second end panel may be similarly positioned to form a reservoir 210 of partially condensed liquid and communicate with the feed passage 230.

Thus, the condensate pool 210 can provide condensate Y for the liquid conveying channels 230 on the first end plate and the second end plate, and the condensate pool 210 can have a larger liquid storage amount, so that the heat dissipation effect is improved.

In one possible implementation, as shown in fig. 3, 7, 10 and 12, at least a part of the steam cavity 220 is located between a plurality of intermediate panels, each of which is provided with a second through hole 223, the second through holes 223 of adjacent intermediate panels are communicated with each other and form the steam cavity 220 located between the plurality of intermediate panels.

Thus, the vapor chamber 220 may have a sufficient evaporation space, and the introduction passage 230 may be formed according to the area of the solid portion between the plurality of intermediate panels where the second through hole 223 is not provided, to introduce more condensate Y.

In the embodiment of the present application, the second through holes 223 have different diameters, so that the cross-sectional shape of the steam chamber 220 is similar to an ellipse.

It can be understood that the micro channel 221 of the steam chamber is located on the wall of the steam chamber 220, and it can refer to the formation of the micro channel 231, and the micro channel 231 is opened at the edge of the wall of the second through hole 223, and the side wall of the second through hole 223 adjacent to the micro channel is communicated with the second through hole 223.

It should be noted that, when a plurality of steam chambers 220 are provided, since the top of the steam chamber 220 in the vertical direction is communicated with the steam channel 222, and the bottom of the steam chamber 220 in the vertical direction is communicated with the condensate pool 210, the solid part between the adjacent steam chambers 220 on the same panel needs to be positioned and supported by the adjacent panels. Therefore, the micro-channels 231 of the feeding channels 230 may be formed on each panel, and then the first end panel and the plurality of middle panels may be stacked on each other (it is also possible to consider stacking the second end panel), and finally the steam chamber 220 may be formed by removing the material.

In one possible implementation, the antigravity vapor chamber 100 further includes a liquid injection port (not shown) with a sealing cover, and the liquid injection port is communicated with the top end of the steam chamber 220 in the vertical direction.

Thus, make-up condensate Y can be injected into the condensate pool 210 through the injection port.

In one implementation, as shown in fig. 1 and 2, the antigravity temperature-uniforming plate 100 is further provided with heat dissipation fins 310, the heat dissipation fins 310 are connected to at least one of the two panels located at the outer side of the antigravity temperature-uniforming plate 100, and the heat dissipation fins 310 are located at the top or bottom of the panel in the vertical direction.

There are a plurality of heat dissipation fins 310, and the plurality of heat dissipation fins 310 are all disposed perpendicular to the panel.

Thus, the cooling medium L (e.g., cooling air) can flow between the heat dissipating fins 310, and the heat Q transferred from the heat dissipating fins 310 is taken away, thereby improving the heat dissipating efficiency of the antigravity temperature equalizing plate 100.

It should be noted that in the embodiments of the present application, "micro" in "micro channel" means that the structural size of the channel is in the micrometer scale, and for a structure not explicitly shown, such as "through hole", the structural size may be in the millimeter scale or in the micrometer scale, which is not limited herein.

It should be noted that, unless otherwise specifically stated or limited in the description of the embodiments of the present application, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixed or indirectly connected through intervening media, or may be connected through two elements or in the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the embodiments of the present application, the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Further, the term "plurality" means two or more unless specifically stated otherwise.

In the description of the embodiments of the present application, the terms "first," "second," "third," "fourth," and the like (if any) are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. The antigravity temperature-uniforming plate is characterized by being suitable for a heating part with a vertical radiating surface, and comprising a plurality of panels which are arranged in a stacked manner and are parallel to the vertical radiating surface;

the extending plane of the condensate pool is perpendicular to the vertical radiating surface, the steam cavity and the liquid conveying channel are arranged at intervals, and the extending directions of the steam cavity and the liquid conveying channel are perpendicular to the extending plane of the condensate pool;

2. The antigravity temperature equalization plate of claim 1, wherein a plurality of liquid delivery channels and a plurality of vapor cavities are provided, the number of liquid delivery channels is greater than the number of vapor cavities, and the vapor cavities are in communication with at least one liquid delivery channel.

3. The antigravity temperature equalization plate of claim 2 further comprising a plurality of steam chamber microchannels disposed between said plurality of panels, each of said plurality of steam chamber microchannels being located on a wall of said steam chamber;

4. The antigravity temperature equalization plate of claim 2, wherein a steam channel is further provided between a plurality of said panels, said steam channel being located at the top end of each said infusion channel in the vertical direction;

5. The antigravity temperature equalization plate of any one of claims 1-4, wherein a cross-sectional area of said infusion channel is less than a cross-sectional area of said vapor chamber;

and/or the cross-sectional area of the bottom end of the transfusion channel along the vertical direction is smaller than that of the top end of the transfusion channel along the vertical direction;

6. The antigravity temperature equalization plate of any one of claims 1-4, further comprising heat dissipation fins attached to at least one of the two panels located outside the antigravity temperature equalization plate, wherein the heat dissipation fins are located at the top or bottom of the panels in the vertical direction;

7. The antigravity thermal equalizer plate of any one of claims 1-4, wherein the plurality of panels comprises a first end panel, a second end panel, and a plurality of intermediate panels;

8. The antigravity temperature equalization plate of claim 7, wherein at least a portion of said condensate pool is located between a plurality of said intermediate panels, a bottom of each of said intermediate panels in a vertical direction is provided with a first through hole, said first through holes of adjacent intermediate panels are communicated with each other and form said condensate pool between said plurality of intermediate panels;

and/or the presence of a gas in the gas,

9. The antigravity temperature equalization plate of any one of claims 1-4, wherein said fluid infusion channel is located between any two adjacent panels,

10. An electronic component, comprising a heat generating member and the antigravity temperature equalizing plate according to any one of claims 1 to 9, wherein the heat generating member has a vertical heat dissipating surface, and the antigravity temperature equalizing plate is disposed on a side of the heat generating member close to the vertical heat dissipating surface.