CN217465013U - Refrigerator with a door - Google Patents

Abstract

The utility model provides a refrigerator. Wherein this refrigerator includes: a box body, wherein a storage space is limited in the box body; the heating pipeline is arranged on the inner side of the top surface of the box body, and water is stored in the heating pipeline; and the semiconductor heating sheet is arranged below the heating pipeline and is configured to controllably heat water in the heating pipeline so as to heat food placed above the top surface of the box body. The refrigerator of the utility model can heat the food placed on the top surface of the box body, effectively expands the use function of the refrigerator, and not only can the refrigerator refrigerate and freeze food materials, but also can realize the heating function of the food; the semiconductor heating sheet is directly converted into energy by electric energy, so that noise is effectively avoided, and the use experience of a user is improved.

Description

Refrigerator with a door

Technical Field

The utility model relates to a household electrical appliances field especially relates to a refrigerator.

Background

With the increasing development of society and the continuous improvement of living standard of people, the pace of life of people is faster and faster, and a lot of food can be purchased and stored at one time. In order to ensure the storage effect of food, a refrigerator has become one of household appliances indispensable to people's daily life.

However, the existing refrigerator generally only can realize the functions of refrigerating and freezing food materials, and the frozen food materials taken out of the freezing space of the refrigerator by a user are usually thawed by other household appliances, such as a microwave oven, so that the thawing process is complicated, or the frozen food materials are placed at normal temperature for thawing, the thawing effect is not good when the thawing time is long, and the next cooking of the user is influenced. In addition, after the user cooks the food material, the prepared food often becomes cool due to being placed in the environment, which affects the eating experience of the user.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a can heat the refrigerator of placing the food on the box top surface.

The utility model discloses a further purpose is that the realization is thawed and is kept warm to the food that the culinary art is good to freezing edible material, promotes the use of user's culinary art process and experiences.

Particularly, the utility model provides a refrigerator, include: a box body, wherein a storage space is limited in the box body; the heating pipeline is arranged on the inner side of the top surface of the box body, and water is stored in the heating pipeline; and the semiconductor heating sheet is arranged below the heating pipeline and is configured to controllably heat water in the heating pipeline so as to heat food placed above the top surface of the box body.

Optionally, the heating line covers the entire top surface of the tank.

Optionally, the heating lines are evenly distributed on the top surface of the tank.

Optionally, the refrigerator further comprises: and the water pump is connected with the heating pipeline and is configured to be controlled to be started so as to enable the water in the heating pipeline to circularly flow.

Optionally, the refrigerator further comprises: and the temperature sensor is arranged at the top surface of the box body and is configured to detect the temperature of the top surface of the box body.

Optionally, the water pump and the semiconductor heating sheet are configured to be turned on when the temperature of the top surface is equal to or lower than a first preset temperature.

Optionally, the water pump and the semiconductor heating sheet are further configured to be turned off when the temperature of the top surface is greater than or equal to a second preset temperature, wherein the second preset temperature is greater than the first preset temperature.

Alternatively, the semiconductor heat sink is composed of two semiconductor elements of different materials and is configured such that when a current flows therethrough, heat is moved from one end to the other end, thereby forming the two ends as a cold end and a hot end, respectively.

Optionally, the hot end is proximate to the heating line and the cold end is configured to provide cooling to the storage space.

Optionally, the top surface of the tank is a thermally conductive material.

The utility model discloses a refrigerator, include: a box body, wherein a storage space is limited in the box body; the heating pipeline is arranged on the inner side of the top surface of the box body, and water is stored in the heating pipeline; the semiconductor heating sheet is arranged below the heating pipeline and is configured to controllably heat water in the heating pipeline so as to heat food placed above the top surface of the box body, and the use function of the refrigerator is effectively expanded by providing the refrigerator capable of heating the food placed on the top surface of the box body, so that the refrigerator not only can refrigerate and freeze food materials, but also can realize the heating function of the food; the semiconductor heating sheet is directly converted into energy by electric energy, so that noise is effectively avoided, and the use experience of a user is improved.

Further, the utility model discloses a refrigerator, heating pipeline cover the whole top surface of box, and heating pipeline evenly distributed is in the top surface of box, and the refrigerator still includes: the water pump is connected with the heating pipeline and is configured to be controlled to be started so as to enable the water in the heating pipeline to circularly flow; the temperature sensor is arranged at the top surface of the box body and is configured to detect the temperature of the top surface of the box body, and the water pump and the semiconductor heating sheet are configured to be started when the temperature of the top surface is less than or equal to a first preset temperature; close when top surface temperature more than or equal to second preset temperature, drive water through the water pump and circulate in the heating pipeline and flow for whole water all can be effectively heated repeatedly by semiconductor heating plate, and the specific mode that sets up of heating pipeline also makes the food heating to placing in the box top surface more even, can realize thawing frozen food material and keep warm to the food that cooks, promotes the use of user's culinary art process and experiences.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

fig. 1 is a schematic structural view of a refrigerator according to an embodiment of the present invention;

fig. 2 is a rear perspective view of a refrigerator according to an embodiment of the present invention; and

fig. 3 is a schematic structural view of a semiconductor heating sheet in a refrigerator according to an embodiment of the present invention.

Detailed Description

The embodiment provides a refrigerator, which can heat food placed on the top surface of a refrigerator body, effectively expands the use function of the refrigerator, and enables the refrigerator to refrigerate and freeze food materials and also realize the heating function of the food; the semiconductor heating sheet is directly converted into energy by electric energy, so that noise is effectively avoided, and the use experience of a user is improved. Fig. 1 is a schematic structural view of a refrigerator 100 according to an embodiment of the present invention, and fig. 2 is a rear perspective view of the refrigerator 100 according to an embodiment of the present invention. As shown in fig. 1 and 2, the refrigerator 100 of the present embodiment may generally include: a box 110, a heating pipe 130 and a semiconductor heating sheet 140.

Wherein, the case 110 may define a storage space 111 therein. The heating line 130 may be disposed inside the top surface of the case 110, and water is stored therein. The semiconductor heating sheet 140 may be disposed below the heating pipe 130 and configured to controllably heat water inside the heating pipe 130, thereby heating food placed above the top surface of the case 110. That is to say, the refrigerator 100 of the embodiment can heat the food placed on the top surface of the box body 110 through the semiconductor heating sheet 140, so as to effectively expand the use function of the refrigerator 100, so that the refrigerator 100 can not only refrigerate and freeze food materials, but also can heat the food; the semiconductor heating sheet 140 directly converts energy from electric energy, so that noise is effectively avoided, and the use experience of a user is improved.

It should be noted that the height of the conventional vertical refrigerator is often high, so that a longitudinal storage space is realized. The refrigerator 100 of the present embodiment may have a short height, and the width and length may be increased to form the transverse storage space 111. The refrigerator 100 of the present embodiment is set to have a short height, so that a user can conveniently pick and place objects on the top surface of the cabinet 110. In fact, the refrigerator 100 of the present embodiment may have a size and layout design similar to a sideboard cabinet shape in daily life, and a height suitable for placing articles on the top of the refrigerator body 110. That is, to a certain extent, the refrigerator 100 of the present embodiment can be used instead of a sideboard, and placed beside a dining table.

In a specific embodiment, the number and structure of the storage spaces 111 can be configured as required. The storage space 111 may be configured as a refrigerating space, a freezing space, a temperature changing space, or a refreshing space according to the purpose. Each storage space 111 may be divided into a plurality of storage regions by a partition plate, and the storage regions may store articles by racks or drawers. For example, in the refrigerator 100 shown in fig. 1, a storage space 111 may be provided inside a cabinet 110, and the cabinet may be divided into three storage regions by a rack from top to bottom. The storage space 111 may be provided as a refrigerating space or a freezing space to refrigerate or freeze the food material. In other embodiments, a plurality of storage spaces 111 may be disposed inside the box body 110 to respectively implement different functions.

The refrigerator 100 of the present embodiment may further include: the door 120 is pivotally disposed on a front surface of the cabinet 110, and allows a user to open and close the storage space 111. The door bodies 120 may be disposed corresponding to the storage spaces 111, that is, one or more door bodies 120 may be disposed corresponding to each storage space 111. The door 120 may be pivotally opened or may be opened in a drawer type, and in the case where the drawer is opened, a slide rail may be provided at the bottom of the drawer to increase the smoothness of pulling out and reduce noise.

In a preferred embodiment, the heating line 130 covers the entire top surface of the tank 110. That is, in the case that the semiconductor heating sheets 140 heat the water in the heating pipe 130, the temperature of the entire top surface of the cabinet 110 is increased, and food can be heated by placing it at any position of the top surface of the cabinet 110. Due to the arrangement, the heating area of the top surface of the box body 110 can be increased, so that a large number of foods can be heated at the same time, and the situation that after one food is heated, another food is heated again, and the heated food is cooled again is avoided. Also, the heating lines 130 may be uniformly distributed on the top surface of the case 110. The heating pipelines 130 are uniformly distributed on the top surface of the box body 110, so that the top surface of the box body 110 is uniformly heated, food above the box body can be uniformly heated, and the heating effect is effectively improved.

In addition, in other embodiments, a heating area may be disposed on the top surface of the box body 110, and the heating pipeline 130 is disposed only below the heating area, so that when the semiconductor heating sheet 140 heats water in the heating pipeline 130, only the temperature of the top surface of the heating area is increased, and only food placed in the heating area is heated. This reduces the heating area, but separates a portion of the unheated area for placement of items that do not require heating.

It should be emphasized that the semiconductor heating sheet 140 is used to heat the water in the heating pipeline 130 in the present embodiment, so as to raise the temperature of the top surface of the box body 110, and indirectly heat the food placed on the top surface of the box body 110. Instead of directly heating food by arranging a heater at the top of the box body 110, the mode of the embodiment not only can enable the refrigerator 100 to realize the multifunctional integration of refrigeration, freezing and heating, but also can slowly heat food, can not heat food rapidly, or enable food to be cooked directly at high temperature, but only realizes mild heating, so that the cooked food can be kept warm, or the food to be thawed can be thawed.

As shown in fig. 2, the refrigerator 100 of the present embodiment may further include a water pump 150 and a temperature sensor 160. Wherein the water pump 150 may be connected to the heating line 130 and configured to be controlled to be turned on to circulate the water in the heating line 130. The temperature sensor 160 may be disposed at the top surface of the tank body 110, and configured to detect the temperature of the top surface of the tank body 110. The water pump 150 drives the water in the heating pipeline 130 to circularly flow, so that the water can be effectively heated when flowing to the upper part of the semiconductor heating sheet 140, and the water continuously and circularly flows, so that the water can be effectively and repeatedly heated by the semiconductor heating sheet 140, and the heating effect is further improved.

The temperature sensor 160 may be an infrared sensor or a thermistor sensor, or may be provided in other types. The temperature sensor 160 in this embodiment can ensure a distance from the top surface of the box 110 and can also accurately measure the top surface temperature of the top surface. In a specific embodiment, the water pump 150 and the semiconductor heating sheet 140 may be configured to be turned on when the temperature of the top surface is equal to or lower than a first preset temperature. The water pump 150 and the semiconductor heating fins 140 may also be configured to turn off when the temperature of the top surface is greater than or equal to a second preset temperature, wherein the second preset temperature is greater than the first preset temperature.

That is, when the temperature sensor 160 detects that the temperature of the top surface is less than or equal to the first preset temperature, the water pump 150 and the semiconductor heating fins 140 may be controlled to be turned on, so that the semiconductor heating fins 140 can repeatedly heat the water circulating in the heating pipeline 130. When the temperature sensor 160 detects that the temperature of the top surface is greater than or equal to the second preset temperature, the water pump 150 and the semiconductor heating sheet 140 can be controlled to be turned off, so that the semiconductor heating sheet 140 stops heating water in the heating pipeline 130, the water pump 150 does not drive the water to flow circularly, and energy is effectively saved.

In a preferred embodiment, a switch (not shown) may be disposed on the top surface of the box 110, and a heating command may be obtained through the switch, so as to control the open/close states of the water pump 150 and the semiconductor heating sheets 140 according to the preset conditions described above. The switch may be a touch button or a touch screen, and the user may operate the touch button or the touch screen to reach a heating instruction for heating food placed on the top surface of the box body 110. Preferably, the switch may be a touch screen, and the user may set the first preset temperature and the second preset temperature through the touch screen to meet heating requirements of different foods.

For example, if only the cooked food needs to be kept warm, the first preset temperature and the second preset temperature can be set to be lower, so that the heating time is shorter and the total heating amount is smaller. If the frozen food material taken out from the freezing space needs to be unfrozen, the first preset temperature and the second preset temperature can be set to be higher, so that the heating time is longer, and the heating total amount is larger. In either case, however, the condition that the second preset temperature is greater than the first preset temperature needs to be satisfied.

Fig. 3 is a schematic structural view of the semiconductor heating sheet 140 in the refrigerator 100 according to an embodiment of the present invention. The semiconductor heat generating sheet 140 is composed of semiconductor elements of two different materials, and may be configured such that heat moves from one end to the other when a current flows therein, thereby forming both ends as a cold end 142 and a hot end 141, respectively. In one embodiment, the semiconductor heat sink 140 may be formed by a combination of an N-type semiconductor material and a P-type semiconductor material, wherein when an electric current is passed through the heat sink, heat is transferred from one end to the other end, thereby creating a temperature differential between the cold side 142 and the hot side 141.

It should be noted that hot end 141 is close to heating pipe 130, so that water in heating pipe 130 can be heated by hot end 141. The cold end 142 may be configured to provide cooling to the storage space 111. That is, in the case that the semiconductor heating sheet 140 is turned on, the cold end 142 thereof may provide cooling, and the hot end 141 thereof may heat water in the heating pipe 130, and one component performs both cooling and heating functions.

Overall, the semiconductor heat sink 140 has the following advantages and features in technical applications: the device does not need any refrigerant, can continuously work, has no pollution source, no rotating part, no rotation effect and no sliding part, is a solid piece, has no vibration and noise during working, has long service life and is easy to install. The semiconductor heating sheet 140 has two functions, namely cooling and heating, and the heating efficiency is very high and is always greater than 1, so that the semiconductor heating sheet 140 can replace a heating system and a cooling system which are separated from each other.

The semiconductor heating sheet 140 is a current transduction type sheet member, and can realize high-precision temperature control by controlling input current, and can easily realize remote control, program control and computer control by temperature detection and control means, thereby being convenient for forming an automatic control system. The semiconductor heating sheet 140 has very small thermal inertia, the cooling and heating time is very short, and the semiconductor heating sheet 140 can reach the maximum temperature difference when the cold end 142 is in no load with good heat dissipation of the hot end 141 and the power is supplied for less than one minute.

The heating power of the single semiconductor heating sheet 140 is small, but the heating power is very large when the electric piles are combined, and the heating system is formed by combining the electric piles of the same type in series and parallel, so that the heating power can be in the range of several milliwatts to over ten thousand watts. The temperature difference range of the semiconductor heating sheet 140 can be realized from a positive temperature of 90 ℃ to a negative temperature of 130 ℃, so that the hot end 141 can heat the heating pipeline 130 at different temperatures to meet different heating requirements of food placed on the top surface.

As shown in fig. 2, the cabinet 110 may further define a heating compartment 112 therein, which is disposed above the storage space 111. Wherein the heating pipeline 130, the semiconductor heating sheet 140, the water pump 150 and the temperature sensor 160 can be disposed in the heating chamber 112. In fact, the box body 110 comprises an outer shell, an inner container and a heat preservation layer, the inner container defines the storage space 111, and the heat preservation layer is arranged between the outer shell and the inner container and used for isolating external heat and avoiding leakage of cold energy of the storage space 111. The above-mentioned top surface of the case 110 is actually referred to as a top surface of the housing.

The heating pipeline 130 can be arranged between the outer shell and the inner container, and the heat insulating layer can insulate the heat of the hot end 141 from influencing the temperature of the storage space 111 and insulate the cold of the storage space 111 from influencing the heating effect. In a preferred embodiment, the top surface of the box body 110 may be made of a heat conductive material, so that when the semiconductor heating sheets 140 heat the water in the heating pipeline 130, the temperature of the top surface can be raised faster, and then the food placed on the top surface of the box body 110 can be heated faster, thereby effectively improving the heating efficiency and improving the user experience.

The refrigerator 100 may further include a compression refrigeration system (not shown) configured to provide refrigeration to the storage space 111. That is, when the semiconductor heating sheet 140 operates, the storage space 111 may be simultaneously supplied with cooling energy by the compression refrigeration system and the cold end 142 of the semiconductor heating sheet 140. In addition, the semiconductor heating sheet 140 has low refrigeration efficiency, so that the original refrigeration process of the compression refrigeration system is not affected, and unnecessary energy waste is avoided. When the semiconductor heating sheet 140 works, the heating function is realized by mainly utilizing the hot end 141, and meanwhile, in order to avoid the waste of cold energy generated by the cold end 142, the cold energy is timely provided to the storage space 111, so that the cold energy generated by the cold end 142 can be effectively utilized. When the semiconductor heating sheet 140 is closed, the storage space 111 may be supplied with cooling energy only by the compression refrigeration system. The semiconductor heating sheet 140 is turned off, which may mean that the semiconductor heating sheet 140 is not actually energized; the semiconductor heat sink 140 is turned on or operated, and may actually direct the semiconductor heat sink 140 to be energized.

It should be noted that the compression refrigeration system 140 provides different amounts of cooling to the various types of storage spaces 111, so that the temperatures in the various types of storage spaces 111 are different. Wherein the temperature in the refrigerated space is generally between 2 ℃ and 10 ℃, preferably between 4 ℃ and 7 ℃. The temperature in the refrigerated space is typically in the range of-22 ℃ to-14 ℃. The optimum storage temperatures for different types of articles are not the same, and thus the storage spaces 111 suitable for storage are not the same. For example, fruits and vegetables are suitable for storage in a refrigerated space or a fresh-keeping space, while meat is suitable for storage in a refrigerated space. Specifically, the compression refrigeration system may include: a compressor, a condenser, a capillary tube, and an evaporator. The case 110 may further define a compressor compartment 113 therein, disposed below the storage space 111, and the compressor may be disposed in the compressor compartment 113.

The refrigerator 100 may further include a fan 143 disposed in the air duct of the storage space 111 and configured to transfer cold energy generated from the cold end 142 of the semiconductor heating sheet 140 to the storage space 111. It should be noted that the cold end 142 is disposed at a side close to the storage space 111 so as to lower the temperature of the storage space 111. Specifically, the air duct may be provided with an air supply outlet at a position corresponding to the fan 143 to supply cold energy to the storage space 111; the storage space 111 may also be provided with a return air inlet to return the air with the increased temperature to the cold end 142 of the semiconductor heating sheet 140, thus forming an air circulation.

In summary, the refrigerator 100 of the present embodiment includes: a case 110 having a storage space 111 defined therein; a heating pipe 130 disposed inside the top surface of the case 110 and having water stored therein; the semiconductor heating sheet 140 is arranged below the heating pipeline 130 and is configured to controllably heat water in the heating pipeline 130 so as to heat food placed above the top surface of the box body 110, and by providing the refrigerator 100 capable of heating food placed on the top surface of the box body 110, the use function of the refrigerator 100 is effectively expanded, so that the refrigerator 100 not only can refrigerate and freeze food materials, but also can realize the heating function of the food; the semiconductor heating sheet 140 directly converts energy from electric energy, so that noise is effectively avoided, and the use experience of a user is improved.

Further, in the refrigerator 100 of the embodiment, the heating pipeline 130 covers the entire top surface of the box body 110, and the heating pipeline 130 is uniformly distributed on the top surface of the box body 110, and the refrigerator 100 further includes: a water pump 150 connected to the heating line 130 and configured to be controlled to be turned on to circulate water in the heating line 130; a temperature sensor 160 disposed at the top surface of the tank 110 and configured to detect a temperature of the top surface of the tank 110, the water pump 150 and the semiconductor heating sheet 140 being configured to be turned on when the temperature of the top surface is equal to or lower than a first preset temperature; close when top surface temperature more than or equal to second preset temperature, drive water circulation flow in heating pipeline 130 through water pump 150 for whole water all can be effectively heated repeatedly by semiconductor heating plate 140, and the specific setting mode of heating pipeline 130 also makes the food heating of placing in the box 110 top surface more even, can realize that it keeps warm to unfreeze and food to cooking to the freezing food material, promotes the use experience of the whole culinary art process of user.

It should be understood by those skilled in the art that, without specific description, terms used to represent orientations or positional relationships in the embodiments of the present invention such as "upper," "lower," "left," "right," "front," "rear," and the like are used with reference to the actual usage state of the refrigerator 100, and these terms are only used for convenience of description and understanding of the technical solutions of the present invention, and do not indicate or imply that the devices or components referred to must have a specific orientation, and therefore, should not be construed as limiting the present invention.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are intended to be inclusive and mean that, for example, they may be fixedly connected or detachably connected or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. Those skilled in the art should understand the specific meaning of the above terms in the present invention according to specific situations.

In the description of the present embodiments, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described in detail herein, many other variations and modifications can be made, consistent with the principles of the invention, which are directly determined or derived from the disclosure herein, without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and interpreted to cover all such other variations or modifications.

Claims (10)

1. A refrigerator, characterized by comprising:

a box body, wherein a storage space is limited in the box body;

the heating pipeline is arranged on the inner side of the top surface of the box body, and water is stored in the heating pipeline; and

the semiconductor heating sheet is arranged below the heating pipeline and is configured to controllably heat water in the heating pipeline so as to heat food placed above the top surface of the box body.

2. The refrigerator according to claim 1,

the heating pipeline covers the whole top surface of the box body.

3. The refrigerator according to claim 2,

the heating pipelines are uniformly distributed on the top surface of the box body.

4. The refrigerator according to claim 1, further comprising:

a water pump connected to the heating line and configured to be controlled to be turned on to circulate water in the heating line.

5. The refrigerator of claim 4, further comprising:

a temperature sensor disposed at a top surface of the tank body, configured to detect a top surface temperature of the tank body.

6. The refrigerator according to claim 5,

the water pump and the semiconductor heating sheet are configured to be started when the temperature of the top surface is less than or equal to a first preset temperature.

7. The refrigerator according to claim 6,

the water pump and the semiconductor heating sheet are further configured to be closed when the temperature of the top surface is greater than or equal to a second preset temperature, wherein the second preset temperature is greater than the first preset temperature.

8. The refrigerator according to claim 1,

the semiconductor heat generating sheet is composed of semiconductor elements of two different materials and is configured such that heat moves from one end to the other end when a current flows therein, thereby forming both ends as a cold end and a hot end, respectively.

9. The refrigerator according to claim 8,

the hot end is close to the heating pipeline, and the cold end is configured to provide cold energy for the storage space.

10. The refrigerator according to claim 1,

the top surface of the box body is made of heat conducting materials.

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