CN217452607U

CN217452607U - Cutting machine for processing wafer

Info

Publication number: CN217452607U
Application number: CN202220772122.2U
Authority: CN
Inventors: 李辉; 王均涛; 陈荣国
Original assignee: Sichuan Timemaker Technology Co ltd
Current assignee: Sichuan Timemaker Technology Co ltd
Priority date: 2022-04-06
Filing date: 2022-04-06
Publication date: 2022-09-20
Anticipated expiration: 2032-04-06

Abstract

The utility model discloses a processing is cutting machine for wafer relates to wafer cutting technical field. The utility model comprises a cutting table and fixing frames, wherein the two fixing frames are respectively arranged on the front surface and the rear surface of the cutting table, a first chute is arranged on the upper surface of the cutting table, a first screw rod is arranged in the first chute, a first slider is arranged on the first screw rod, a third motor is arranged on the first slider, the output end of the third motor is connected with a slide holder, the upper surface of the slide holder is provided with a plurality of suckers for adsorbing and fixing a wafer to be cut, a second chute is arranged on the surface of the fixing frame, a second slider is arranged in the second chute, the lower surface of the second slider is provided with an electric push rod, the telescopic end of the electric push rod is connected with an installation block, the lower surface of the installation block is provided with a laser cutting head for cutting, the wafer is driven to rotate by the third motor, and the laser cutting heads on the front side and the rear side are combined to adapt to cutting at different positions, the cutting efficiency is improved.

Description

Cutting machine for processing wafer

Technical Field

The utility model belongs to the technical field of the wafer cutting, especially, relate to a processing cutting machine for wafer.

Background

The wafer is composed of group III and group V compound semiconductor materials. A cutting device is often used to cut the wafer during the wafer processing. At present, current cutting device can only carry out the unilateral cutting when cutting, and cutting efficiency is lower, treats simultaneously that the cutting wafer fixes the back, the angle of the regulation wafer of being not convenient for carries out diversified cutting, and the cutting effect is not good, and the cutting process produces waste gas easily, directly discharges, not only pollutes the operation place, causes the influence to staff's health simultaneously, and the practicality is not good. To this end, a dicing machine for processing a wafer is proposed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a processing cutting machine for wafer to prior art's defect and not enough.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a cutting machine for processing wafers, which comprises a cutting table and fixing frames, wherein the two fixing frames are respectively arranged on the front surface and the rear surface of the cutting table, a first chute is arranged on the upper surface of the cutting table, a first lead screw is arranged in the first chute, a first slide block is arranged on the first lead screw and is in sliding fit with the first chute, a third motor is arranged on the upper surface of the first slide block, the output end of the third motor is connected with a wafer carrier, an air pump is arranged in the wafer carrier, a plurality of suckers are arranged on the upper surface of the wafer carrier, the lower ends of the suckers penetrate through the wafer carrier and are connected with the air pump, a second chute is arranged on the surface of the fixing frame, a second lead screw is arranged in the second chute, a second slide block is arranged on the second lead screw, an electric push rod is arranged on the lower surface of the second slide block, and the telescopic end of the electric push rod is connected with a mounting block, surface mounting has the laser cutting head under the installation piece, mount medial surface is provided with the filter cartridge, just the inside active carbon adsorption package that is provided with of filter cartridge, filter cartridge surface is connected with bellows, just the bellows lower extreme passes the installation piece and is connected with the suction nozzle.

Through air pump and sucking disc mutually support, it is fixed to be convenient for adsorb the wafer of treating the cutting, combine first lead screw and first slider to mutually support, be convenient for drive the slide holder and remove, make things convenient for getting of wafer and put, second lead screw and second slider mutually support simultaneously, be convenient for drive electric putter's back-and-forth movement, combine electric putter's flexible, make things convenient for the laser cutting head to reciprocate, implement the cutting, the laser cutting head through both sides is convenient for cut the wafer both sides simultaneously around, it rotates to be convenient for drive slide holder to combine the third motor, and then adjust the angle of wafer, carry out diversified cutting, cutting efficiency and cutting effect have been improved, the rose box cooperatees with the suction nozzle, be convenient for adsorb the waste gas that the cutting process produced, filter, avoid causing operational environment's pollution, the practicality of device has been improved.

Preferably, the surface of the outer side of the fixing frame is provided with a fan body, the upper surface of the fan body is connected with an air inlet pipe, the upper end of the air inlet pipe penetrates through the fixing frame and is connected with the filter box, the surface of the outer side of the fan body is connected with an air outlet pipe, the fan body is convenient for absorbing waste gas, and the waste gas is filtered by an activated carbon bag in the filter box and then is discharged from the air outlet pipe at the rear side.

Preferably, an annular limiting groove is formed in the upper surface of the first sliding block, a plurality of limiting blocks are connected to the lower surface of the slide glass rack and are in sliding fit with the limiting groove, and the stability of the rotation of the slide glass rack is ensured through the sliding fit of the limiting blocks and the limiting groove.

Preferably, the left end of the first screw rod penetrates through the cutting table and is connected with a first motor.

Preferably, one end of the second screw rod penetrates through the fixing frame and is connected with a second motor.

Preferably, the blanking groove has all been seted up to both sides around the cutting bed upper surface, the cutting bed downside is provided with collects the box, mutually supports with the blanking groove, through the blanking groove is mutually supported with the collection box, is convenient for collect the waste material under the cutting, and the unified processing of being convenient for.

The utility model discloses following beneficial effect has:

the utility model discloses an air pump and sucking disc mutually support, it is fixed to be convenient for adsorb the wafer of treating the cutting, combine first lead screw and first slider to mutually support, be convenient for drive the slide holder and remove, make things convenient for getting of wafer to remove, the second lead screw mutually supports with the second slider simultaneously, be convenient for drive electric putter's back-and-forth movement, combine electric putter's flexible, make things convenient for the laser cutting head to reciprocate, implement the cutting, the laser cutting head through both sides is convenient for cut the wafer both sides simultaneously around, it rotates to be convenient for drive the slide holder to combine the third motor, and then adjust the angle of wafer, carry out diversified cutting, cutting efficiency and cutting effect have been improved, the filter box cooperatees with the suction nozzle, be convenient for adsorb the waste gas that the cutting process produced, filter, avoid causing operational environment's pollution, the practicality of device has been improved.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a right side view of the present invention;

FIG. 3 is a schematic structural view of the present invention;

FIG. 4 is an enlarged schematic view of the structure at A in FIG. 2;

fig. 5 is an enlarged schematic view of the structure at B in fig. 3.

In the drawings, the components represented by the respective reference numerals are listed below:

1. cutting table; 2. a fixed mount; 3. a first chute; 4. a first lead screw; 5. a first slider; 6. a third motor; 7. a slide rack; 8. an air pump; 9. a suction cup; 10. a second chute; 11. a second lead screw; 12. a second slider; 13. an electric push rod; 14. mounting blocks; 15. a laser cutting head; 16. a filter cartridge; 17. a flexible hose; 18. a suction nozzle; 19. a fan body; 20. an air inlet pipe; 21. a limiting groove; 22. a limiting block; 23. a first motor; 24. a second motor; 25. a charging chute; 26. and (4) collecting the box.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate positional or positional relationships, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-5, the present invention relates to a cutting machine for processing a wafer, comprising a cutting table 1 and two fixing frames 2, wherein the two fixing frames 2 are respectively disposed on the front and rear surfaces of the cutting table 1, a first sliding groove 3 is disposed on the upper surface of the cutting table 1, a first screw rod 4 is disposed inside the first sliding groove 3, a first slider 5 is disposed on the first screw rod 4 and is in sliding fit with the first sliding groove 3, a third motor 6 is disposed on the upper surface of the first slider 5, an output end of the third motor 6 is connected to a wafer carrier 7, an air pump 8 is disposed inside the wafer carrier 7, a plurality of suckers 9 are disposed on the upper surface of the wafer carrier 7, the lower ends of the plurality of suckers 9 penetrate through the wafer carrier 7 and are connected to the air pump 8, a second sliding groove 10 is disposed on the surface of the fixing frame 2, a second screw rod 11 is disposed inside the second sliding groove 10, a second slider 12 is disposed on the second screw rod 11, and an electric push rod 13 is disposed on the lower surface of the second slider 12, the telescopic end of the electric push rod 13 is connected with an installation block 14, the lower surface of the installation block 14 is provided with a laser cutting head 15, the inner side surface of the fixing frame 2 is provided with a filter box 16, an activated carbon adsorption bag is arranged inside the filter box 16, the surface of the filter box 16 is connected with a telescopic hose 17, and the lower end of the telescopic hose 17 penetrates through the installation block 14 to be connected with a suction nozzle 18.

The air pump 8 is matched with the sucker 9 to facilitate the absorption and fixation of the wafer to be cut, the first lead screw 4 is matched with the first slide block 5 to facilitate the left and right movement of the wafer carrier 7, the taking and placing of the wafer are facilitated, meanwhile, the second screw rod 11 is matched with the second slide block 12, so that the electric push rod 13 can be driven to move back and forth conveniently, the laser cutting head 15 can move up and down conveniently to perform cutting by combining the extension and retraction of the electric push rod 13, the laser cutting heads 15 at the front side and the rear side are convenient for simultaneously cutting the two sides of the wafer, the third motor 6 is combined to be convenient for driving the wafer carrier 7 to rotate, and then adjust the angle of wafer, carry out diversified cutting, improved cutting efficiency and cutting effect, filter cartridge 16 and suction nozzle 18 cooperate, are convenient for adsorb, filter the waste gas that the cutting process produced, avoid causing operational environment's pollution, have improved the practicality of device.

The charging conduit 25 has all been seted up to both sides around cutting bed 1 upper surface, and 1 downside of cutting bed is provided with collects box 26, mutually supports with charging conduit 25, mutually supports through charging conduit 25 and collection box 26, is convenient for collect the waste material under the cutting, the unified processing of being convenient for.

2 outside surfaces of mount are provided with

fan body

19, and 19 upper surfaces of the fan body are connected with air-supply line 20, and pass mount 2 on the air-supply line 20, are connected with

filter cartridge

16, and 19 outside surfaces of the fan body are connected with out the tuber pipe, are convenient for adsorb waste gas through fan body 19, and after the filtration of 16 inside activated carbon bags of filter cartridge, from the discharge of rear side air-out pipe.

Annular spacing groove 21 has been seted up to 5 upper surfaces of first slider, and slide glass frame 7 lower surfaces is connected with a plurality of stopper 22, with spacing groove 21 sliding fit, through stopper 22 and spacing groove 21's sliding fit, has ensured slide glass frame 7 pivoted stability.

The left end of the first screw rod 4 penetrates through the cutting table 1 and is connected with a first motor 23, one end of the second screw rod 11 penetrates through the fixing frame 2 and is connected with a second motor 24, and through the first motor 23 and the second motor 24, the movement of the wafer and the laser cutting head 15 can be conveniently adjusted in a movable mode, and the cutting operation can be conveniently implemented.

The working principle is as follows: when the utility model is used, the wafer to be cut is placed on the slide rack 7, under the action of the air pump 8, the wafer is absorbed and fixed by the sucking disc 9, and the first motor 23 operates to drive the first screw rod 4 to rotate, the fixed wafer is driven by the first slide block 5 to move to the right side to the lower part of the fixed frame 2, then the second motors 24 on the front side and the rear side are driven to drive the second screw rod 11 to rotate, driven by the second slide block 12, the electric push rods 13 on the two sides are further driven to approach each other until the laser cutting head 15 is aligned with the cutting position on the surface of the wafer, the electric push rods 13 stretch and retract to drive the laser cutting head 15 to move up and down, simultaneously cutting two sides of the wafer, and simultaneously adjusting the left and right movement of the first slide block 5 through the first screw rod 4 so as to drive the wafer to move left and right to complete cutting;

when the angle of the wafer is adjusted, the third motor 6 is driven to operate, under the sliding fit of the limiting block 22 and the limiting groove 21, the wafer carrier 7 is driven to rotate through the third motor 6, the wafer which is fixedly adsorbed is further driven to rotate to a proper angle, and the cutting operation is continued, so that the cutting efficiency and the cutting effect are greatly improved, and after the cutting is finished, the cut wafer is driven to move to the rightmost side through the first lead screw 4 and the first sliding block 5, so that a worker can conveniently take the wafer;

waste material under the cutting falls to collecting box 26 inside through charging conduit 25, the unified processing of being convenient for, the cutting process, and fan body 19 operation is through under suction nozzle 18 and the effect of bellows 17, inhales filter cartridge 16 with the abandonment inside, carries out filtration treatment through the inside active carbon package of filter cartridge 16, under fan body 19's effect, through the play tuber pipe discharge of rear side, prevents that waste gas from polluting the workplace, influences staff's healthy.

It should be further explained that the model of the middle air pump 8 of the present invention is: D23L-23.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a processing cutting machine for wafer, includes cutting bed (1) and mount (2), its characterized in that: the two fixing frames (2) are respectively arranged on the front surface and the rear surface of the cutting table (1), a first sliding groove (3) is formed in the upper surface of the cutting table (1), a first screw rod (4) is arranged in the first sliding groove (3), a first sliding block (5) is arranged on the first screw rod (4) and is in sliding fit with the first sliding groove (3), a third motor (6) is arranged on the upper surface of the first sliding block (5), the output end of the third motor (6) is connected with a slide rack (7), an air pump (8) is arranged in the slide rack (7), a plurality of suckers (9) are arranged on the upper surface of the slide rack (7), the lower ends of the suckers (9) penetrate through the slide rack (7) and are connected with the air pump (8), a second sliding groove (10) is formed in the surface of the fixing frame (2), a second screw rod (11) is arranged in the second sliding groove (10), be provided with second slider (12) on second lead screw (11), second slider (12) lower surface is provided with electric putter (13), electric putter (13) flexible end is connected with installation piece (14), installation piece (14) lower surface mounting has laser cutting head (15), mount (2) inboard surface is provided with filter cartridge (16), just filter cartridge (16) inside is provided with the active carbon adsorption package, filter cartridge (16) surface connection has flexible hose (17), just flexible hose (17) lower extreme passes installation piece (14) and is connected with suction nozzle (18).

2. The cutting machine for processing the wafer as claimed in claim 1, wherein a blower body (19) is disposed on the outer side surface of the fixing frame (2), an air inlet pipe (20) is connected to the upper surface of the blower body (19), the upper end of the air inlet pipe (20) penetrates through the fixing frame (2) and is connected to the filter box (16), and an air outlet pipe is connected to the outer side surface of the blower body (19).

3. The cutting machine for processing the wafer according to claim 2, wherein the first sliding block (5) is provided with an annular limiting groove (21) on the upper surface, and the carrier (7) is connected with a plurality of limiting blocks (22) on the lower surface, and the limiting blocks are in sliding fit with the limiting groove (21).

4. A cutting machine for processing wafers as claimed in claim 3, characterized in that the first screw (4) is passed through the cutting table (1) at its left end, to which a first motor (23) is connected.

5. The cutting machine for processing wafers as set forth in claim 4, characterized in that one end of the second lead screw (11) passes through the fixing frame (2) and is connected with a second motor (24).

6. The cutting machine for processing the wafer as claimed in claim 5, wherein the cutting table (1) is provided with a material receiving groove (25) on both the front and rear sides of the upper surface, and a collecting box (26) is arranged on the lower side of the cutting table (1) and is matched with the material receiving groove (25).