CN217443816U - Memory fixed bolster, mainboard and computer - Google Patents

Abstract

The utility model discloses a memory fixed bolster, mainboard and computer relates to computer equipment's technical field, its support body passes through fixed part and printed circuit board or equipment body releasable connection, first spacing portion and the spacing portion of second are configured into the adjacent both sides portion that sets up at the memory respectively, first spacing portion is used for supporting the first side at the memory, in order to have in the restriction to extract and pull out ascending degree of freedom in the side, the spacing portion of second is used for supporting the second side at the memory, in order to have the ascending degree of freedom in first thickness side in the restriction. The fixed part and printed circuit board or equipment body releasable connection improve the reuse nature of memory fixed bolster, carry out spacing complex condition to the memory at the memory fixed bolster under, first spacing portion supports respectively in the both sides of memory with the spacing portion of second, improves the stability between memory and the mainboard, makes the installation of memory more firm, avoids the memory not hard up, drops and leads to the unable normal operating of computer or the condition of trouble.

Description

Memory fixed bolster, mainboard and computer

Technical Field

The utility model relates to a computer equipment's technical field especially relates to a memory fixed bolster, mainboard and computer.

Background

The communication connection between the extended memory (referring to the memory or the memory card) and the board card (i.e. the printed circuit board mentioned in the present invention) of the computer is realized by the extended slot on the board card, and the extended memory body is fixed on the board card through the extended slot.

The traditional expansion memory is generally installed and fixed with the board card through being directly inserted into the expansion slot, but if the expansion memory is fixed by only depending on the expansion slot, the expansion memory has a large risk of loosening or falling off, and particularly when the equipment is impacted by external force, the loosening or falling off of the expansion memory can cause the conditions of equipment crash, incapability of starting up and the like.

The existing extended memory reinforcing mode is dispensing or binding by a binding tape, the two modes cause difficulty in extended memory replacement, and the fixed structure cannot be recycled; in addition, there is also a fixing mode for expanding the memory by pressing the structural member, but this fixing mode usually affects the heat dissipation of the memory and the performance of the device.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides an aim at: the utility model provides a memory fixed bolster, mainboard and computer, solve memory fixed knot structure non-reuse, memory fixed insecure, heat dispersion subalternation problem.

In order to achieve the purpose, the utility model adopts the following technical proposal:

in a first aspect, a memory fixing bracket is provided, including:

a holder body provided with a fixing portion configured to be detachably connected with a printed circuit board or an apparatus body;

the bracket body is also provided with a first limiting part and a second limiting part, the fixing part is connected with the first limiting part and/or the second limiting part, and the first limiting part and the second limiting part are arranged in an angle manner to jointly define a memory mounting space;

the first limiting part and the second limiting part are respectively configured to be arranged at two adjacent side parts of the memory, the first limiting part is used for abutting against a first side of the memory to limit the freedom degree of the memory in the pulling-out direction, and the second limiting part is used for abutting against a second side of the memory to limit the freedom degree of the memory in the first thickness direction.

In an optional embodiment, the first limiting portion is provided with a first heat conduction member, and the first heat conduction member has a deformation capability;

one side of the first heat conduction piece is connected with the first limiting part, and the other side of the first heat conduction piece is configured to abut against the first side of the memory and apply acting force in the insertion direction to the memory.

As an alternative embodiment, the second limiting portion is provided with a second heat-conducting member, and the second heat-conducting member has a deformation capability;

one side of the second heat-conducting piece is connected with the second limiting part, and the other side of the second heat-conducting piece is configured to abut against the second side of the memory and apply acting force in the first thickness direction to the memory.

As an optional implementation manner, the bracket body is provided with heat dissipation holes, and the heat dissipation holes penetrate through two opposite sides of the bracket body, so that the heat dissipation holes communicate the internal memory installation space with the external environment of the bracket body.

As an optional implementation manner, the heat dissipation hole is opened in the second limiting portion.

In a second aspect, a motherboard is provided, which includes:

the main board body is provided with a memory socket, and the memory socket provides a memory plug-in space;

as described above, the memory fixing bracket is disposed at one side of the memory socket, and the memory mounting space is correspondingly communicated with the memory inserting space;

the first limiting part and the memory socket are arranged oppositely at intervals, and the first limiting part and the memory socket respectively limit the degree of freedom in the plugging direction;

the second limiting part and the mainboard body are oppositely arranged at intervals, and the second limiting part and the mainboard body respectively limit the freedom degrees in the first thickness direction and the second thickness direction.

As an optional embodiment, the memory socket includes a first socket and a second socket, where the first socket and the second socket are in the same orientation and both parallel to the main board body;

the first socket and the second socket are arranged on the mainboard body in a stepped mode, so that when memories are inserted into the first socket and the second socket, the two memories are arranged in a staggered mode, and the two memories are exposed in the Z-axis direction of the mainboard body;

the second limiting portion is provided with second pressing plate portions of first pressing plate portions at intervals along the plugging direction, the first pressing plate portions are configured to abut against a second side of the memory inserted into the first insertion opening, and the second pressing plate portions are configured to abut against a second side of the memory inserted into the second insertion opening.

As an optional embodiment, in an X-axis direction (a direction shown in fig. 1) of the main board body, a horizontal height of the first socket is greater than a horizontal height of the second socket, and in a Z-axis direction (a direction shown in fig. 1) of the main board body, the second socket is disposed on a side of the first socket close to the memory fixing frame, so that the memory inserted into the second socket can extend out from a lower side of the memory inserted into the first socket;

correspondingly, in the X-axis direction of the main board body, the horizontal height of the first pressing plate portion is greater than that of the second pressing plate portion, the first pressing plate portion is arranged on one side, close to the memory socket, of the second limiting portion, and the second pressing plate portion is arranged on one side, far away from the memory socket, of the second limiting portion.

In a third aspect, a computer is provided, the computer comprising:

an apparatus body provided with a mounting part providing a component mounting space;

the mainboard, the mainboard body and the memory fixed bolster all set up in part installation space, the memory fixed bolster with installation department releasable connection.

As an optional implementation mode, the mounting part and the fixing part are respectively provided with a fixing hole and a threaded hole;

the fixing part is provided with the fixing hole under the state that the mounting part is provided with the threaded hole;

the mounting part is provided with the fixing hole under the state that the fixing part is provided with the threaded hole;

and a hand screw is arranged between the threaded hole and the fixing hole, the thread section of the hand screw can be in threaded connection with the threaded hole, and the diameter of the screw head of the hand screw is larger than that of the fixing hole.

As an optional implementation manner, the mounting portion and the fixing portion are respectively provided with a positioning hole and a positioning column which are matched with each other, and the positioning column can be inserted into the positioning hole;

the fixing part is provided with the positioning hole under the condition that the mounting part is provided with the positioning column;

and the mounting part is provided with the positioning hole under the state that the fixing part is provided with the positioning column.

The utility model has the advantages that: this memory fixed bolster adopts releasable connection's mode and printed circuit board or equipment body releasable connection through set up the fixed part on the support body to carry out the memory fixed bolster again after the dismouting with the memory on the mainboard and install on printed circuit board or equipment body, improve memory fixed bolster's reuse nature.

The support body provides memory installation space on the mainboard and in the equipment body for the memory through setting up first spacing portion and the spacing portion of second. Therefore, under the condition that the memory fixing support is in limit fit with the memory, the first limit part and the second limit part are respectively abutted against two sides of the memory, so that after the memory is inserted into the memory socket, the freedom degree in the plugging direction and the thickness direction of the memory is limited, the relative displacement between the memory and the memory socket is avoided, the stability between the memory and a mainboard is improved, the memory is more firmly installed, and the condition that the computer cannot normally operate or break down due to looseness and falling of the memory is avoided.

Furthermore, under the state that the memory fixing support is matched with the memory, two sides of the memory are respectively abutted against the first limiting part and the second limiting part for limiting, so that the memory can transmit heat generated by the memory to the first limiting part and/or the second limiting part, the support body is further subjected to heat exchange with the external environment of the memory, the heat of the memory is dissipated, the heat dissipation efficiency of the memory is improved under the condition that the memory is ensured to be mounted in a limited and firm manner, and the probability of computer jam, computer crash and failure is reduced.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and examples.

Fig. 1 is a schematic view of an assembly structure of a memory fixing bracket, a motherboard and a computer according to an embodiment of the present invention;

fig. 2 is an explosion diagram of the memory fixing bracket, the motherboard and the computer according to the embodiment of the present invention;

FIG. 3 is an enlarged view of section A of FIG. 2;

fig. 4 is a schematic view of a memory fixing bracket according to an embodiment of the present invention;

fig. 5 is an exploded view of the memory fixing bracket according to the embodiment of the present invention.

In the figure: 10. a stent body; 11. a fixed part; 111. a fixing hole; 112. positioning holes; 12. a first limiting part; 13. a second limiting part; 131. a second heat-conducting member; 132. a first pressing plate portion; 133. a second pressing plate portion; 1331. a first pressing part; 1332. a second pressing part; 14. heat dissipation holes; 15. screwing the screw by hand; 20. a main board body; 21. a memory socket; 211. a first jack; 212. a second jack; 30. an apparatus body; 31. an installation part; 32. a threaded hole; 33. a positioning column; 40. a first memory; 50. and a second memory.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the embodiments of the present invention are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The embodiment provides a memory fixing support, which is specifically a reinforcement that can be used repeatedly, is applied to a memory mounting structure, and aims to improve the assembly stability between a memory and a memory socket 21 and improve the reusability of the memory reinforcing structure.

The computer according to the present embodiment is commonly referred to as a computer, and is an electronic computing machine for high-speed computation, which can perform numerical computation, logical computation, and memory function. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed. The memory fixing support can be specifically an industrial control computer (a PC bus industrial computer, a PLC programmable control system, a DCS decentralized control system, an FCS field bus system, a CNC numerical control system, etc.), an all-in-one computer (a computer all-in-one, a notebook computer, a tablet computer, etc.), a split computer (a computer host, etc.), a network computer (a server, a workstation, a hub, a switch, a router, etc.), etc., as long as the corresponding devices satisfy the above functional conditions, and a main board is correspondingly arranged in the device body 30 and a memory socket 21 is correspondingly arranged on the main board, the memory socket 21 provides a memory insertion space, which is regarded as the memory fixing support that can be applied in the embodiment.

As shown in fig. 1 to fig. 3, before describing the scheme in detail, it should be noted that, in the present invention, for each component in the device body 30 and the device body 30, such as the main board body 20, the memory, etc., the X-axis direction is the width direction of the chassis body and the above components, i.e., the direction of "X" indicated by an arrow in the drawing, the Y-axis direction is the length direction of the chassis body and the above components, i.e., the direction of "Y" indicated by an arrow in the drawing, and the Z-axis direction is the height direction of the chassis body and the above components, i.e., the direction of "Z" indicated by an arrow in the drawing. Of course, the above directions are only relative directions for easy understanding, and are not to be considered as specific limitations of the present invention.

The inserting direction, the pulling direction and the inserting and pulling direction in this embodiment are directions in which the memory is inserted into the memory socket 21 or pulled out of the memory socket 21 along a direction defined by the memory socket 21, and the directions are directions in which two opposite ends of the Y axis extend in this embodiment.

In some embodiments, a computer is provided, where an apparatus body 30 of the computer is used as an integral supporting mechanism of a computer apparatus, taking the apparatus body 30 as a chassis as an example, the chassis may be formed by splicing a plurality of plate-shaped structures or by a frame structure, the chassis is a hollow structure to form a component mounting space for accommodating each functional component of the computer, a mounting portion 31 for mounting each functional component may be formed at a bottom, a side wall, or the like of the chassis, a main board body 20 is disposed on the mounting portion 31 formed at one side of the interior of the chassis, and the main board body 20 and the chassis may be relatively fixed by a fastening connection, a screw connection, an adhesion connection, or the like.

It is immediately possible that the main board body 20 is provided with a CPU (central processing unit) mounting groove, a memory socket 21, and the like at a mounting position for mounting components forming the computer system on a side away from the mounting portion 31. In addition, a hardware connecting seat extending to the side wall of the device body 30 is further provided at the edge of the main board body 20, the hardware connecting seat of the main board body 20 extends out of a hardware connecting opening formed in the device body 30, and the hardware connecting seat group is a connecting seat group formed by connecting sockets such as a mouse, a keyboard, an audio output, an integrated mesh, a USB and the like.

The memory fixing bracket of the present embodiment is used to reinforce the stability of the insertion between the memory and the memory socket 21. The memory fixing support comprises a support body 10, a fixing portion 11 is arranged on the support body 10, the fixing portion 11 is configured to be detachably connected with a printed circuit board or an equipment body 30, in the application of a mainboard or a computer, the memory fixing support is arranged on one side of a memory socket 21, and the support body 10 is detachably connected with the printed circuit board or the equipment body 30 of a case serving as the mainboard through the fixing portion 11.

Specifically, the fixing portion 11 and the motherboard and/or the chassis can be connected by a snap connection manner in which a snap is engaged with a slot, a screw connection manner, a guide connection manner in which a guide block slides into a guide rail, and the like, and the objective is to simply detach the bracket body 10 from the motherboard and/or the chassis by a detachable connection structure when the memory (specifically, a memory bank or a memory card, which is not limited in this embodiment) is pulled out from the memory socket 21, to remove the position restriction on the memory, and to re-install the bracket body 10 on the motherboard and/or the chassis by the detachable connection structure after the memory is re-inserted into the memory socket 21, so as to re-reinforce the memory, thereby avoiding the situation that the reinforcing structure needs to be damaged when the memory needs to be detached, improving the reutilization rate and the control cost of the memory fixing bracket, the disassembly and assembly difficulty of the memory is reduced.

In the present embodiment, the fixing portion 11 is mounted in the housing, and the mounting portion 31 and the fixing portion 11 are provided with the fixing hole 111 and the screw hole 32, respectively.

The fixing portion 11 is provided with a fixing hole 111 in a state where the mounting portion 31 is provided with the screw hole 32; in a state where the fixing portion 11 is provided with the screw hole 32, the mounting portion 31 is provided with the fixing hole 111.

In the embodiment, the fixing portion 11 is provided with the fixing hole 111, the mounting portion 31 is provided with the threaded hole 32, the hand screw 15 is arranged between the threaded hole 32 and the fixing hole 111, the threaded section of the hand screw 15 can be in threaded connection with the threaded hole 32, the diameter of the screw head of the hand screw 15 is larger than that of the fixing hole 111, the threaded section of the hand screw 15 penetrates through the fixing hole 111 and then is in threaded connection with the threaded hole 32, and the fixing portion 11 is abutted to the mounting portion 31 by the screw head of the hand screw 15.

In order to further improve the stability between the memory fixing bracket and the mounting portion 31, the mounting portion 31 and the fixing portion 11 are respectively provided with a positioning hole 112 and a positioning post 33 which are matched with each other, and the positioning post 33 can be inserted into the positioning hole 112.

The fixing portion 11 is provided with a positioning hole 112 in a state where the mounting portion 31 is provided with the positioning column 33; the mounting portion 31 is provided with a positioning hole 112 in a state where the fixing portion 11 is provided with the positioning column 33.

In the embodiment, in a manner that the mounting portion 31 is provided with the positioning column 33, the fixing portion 11 is provided with the positioning hole 112, two positioning columns 33 and two positioning holes 112 are respectively provided, and the fixing hole 111 can be arranged just opposite to the threaded hole 32 in a state that the two positioning holes 112 are respectively sleeved on the two positioning columns 33, thereby reducing the mounting difficulty of the memory fixing bracket.

In order to reinforce the memory installation, the bracket body 10 is further provided with a first limiting part 12 and a second limiting part 13, and the fixing part 11 is connected with the first limiting part 12 and/or the second limiting part 13.

It is understood that, in the case that the first position-limiting portion 12 is connected to the second position-limiting portion 13, the number of the fixing portions 11 may be two, and the two fixing portions 11 are respectively connected to the first position-limiting portion 12 and the second position-limiting portion 13, so that the opposite ends of the bracket body 10 are respectively fixed by the fixing portions 11.

The fixing portion 11 may also be one, the fixing portion 11 is connected to the first limiting portion 12 or the second limiting portion 13, so that one end of the bracket body 10 is fixed to the motherboard or the chassis through the fixing portion 11, and the other end of the bracket body 10 extends in a direction close to the memory socket 21, so that the first limiting portion 12 and the second limiting portion 13 limit the memory inserted in the memory socket 21;

alternatively, the fixing portion 11 may be disposed between the first position-limiting portion 12 and the second position-limiting portion 13.

As shown in fig. 4-5, in the present embodiment, the first position-limiting portion 12 is connected to the second position-limiting portion 13, and the fixing portion 11 is disposed on the first position-limiting portion 12, and only one fixing portion 11 is adopted, since the auxiliary external force required to limit the memory in the stable insertion state is not very large when the memory is inserted into the memory socket 21, only one fixing portion 11 is disposed, so that the memory fixing bracket can limit the memory without changing the relative position with respect to the motherboard, and the production cost of the memory fixing bracket can be relatively saved.

As shown in fig. 1 to 5, in the case where the memory is inserted into the memory socket 21, it is necessary to limit the direction in which the memory is pulled out of the memory socket 21 and the thickness direction of the memory. The pulling-out direction of the memory is limited, so that the situation that the memory is loosened and separated from the memory socket 21 under the action of external force can be avoided. The thickness direction of the memory is perpendicular to the direction of the plate surface of the side surface with the largest memory area, and the memory is generally in a strip-shaped or rectangular plate structure and is thinner, so that one end of the memory, which is far away from the memory socket 21, is easier to shake along the thickness direction under the action of external force, the thickness direction of the memory is limited, the memory can be effectively prevented from shaking, and the situation that the memory is loosened and separated from the memory socket 21 under the condition that the memory shakes is avoided.

The first position-limiting part 12 and the second position-limiting part 13 are disposed at an angle to define a memory installation space. The first limiting portion 12 and the second limiting portion 13 are respectively configured to be disposed at two adjacent sides of the memory, the first limiting portion 12 is configured to abut against a first side of the memory to limit the existence of a degree of freedom in a pulling direction, and the second limiting portion 13 is configured to abut against a second side of the memory to limit the existence of a degree of freedom in a first thickness direction.

The holder body 10 of the present embodiment can be applied to the memory reinforcement inserted into the memory socket 21 in the direction perpendicular to the main board, and can also be applied to the memory reinforcement inserted into the memory socket 21 in the direction parallel to the main board.

Taking the memory applied to the memory inserted into the memory socket 21 along the direction perpendicular to the motherboard as an example, one end of the bracket body 10 is connected with the bottom of the motherboard or the device body 30 through the fixing part 11 to form a vertically installed memory structure, the memory fixing bracket is arranged at one side of the memory socket 21 to correspondingly communicate the memory installation space with the memory insertion space, it should be understood that the size of the memory installation space and the memory insertion space along the plugging direction is equal to or smaller than the size of the memory along the plugging direction, so that the memory end part can be attached to the first limiting part 12, or the memory end part can press the first heat-conducting member, the other end of the bracket body 10 extends upwards along the height direction towards one end of the memory far from the memory socket 21, the second limiting part 13 abuts against one side plate surface of the memory to limit the freedom degree of the memory in one thickness direction, and the second limiting part 13 abuts against the end of the memory far from the memory socket 21, the memory is restricted from coming off the memory socket 21 in the pull-out direction.

In order to form the installation space of the memory and other components, the plugging direction of the memory socket 21 is set to be parallel to the direction of the motherboard to form a horizontally installed memory structure, so that the memory is parallel to the motherboard in the state of being installed in the memory socket 21, and the space in the height direction is saved. In this state, the first position-limiting portion 12 and the memory socket 21 are disposed opposite to each other at an interval, the first position-limiting portion 12 and the memory socket 21 limit the degree of freedom in the insertion/extraction direction, the second position-limiting portion 13 and the motherboard body 20 are disposed opposite to each other at an interval, and the second position-limiting portion 13 and the motherboard body 20 limit the degree of freedom in the first thickness direction and the second thickness direction, respectively. The one side face of the memory faces the mainboard, the other side face of the memory forms one side of the second side face away from the mainboard, the second limiting part 13 abuts against one side face of the memory away from the mainboard, the first thickness direction and the second thickness direction of the memory can be limited by the mainboard respectively, the memory can be limited by the second limiting part 13 to shake upwards, and the memory can be limited by the mainboard to shake downwards.

Of course, the holder body 10 may be connected to the upper portion of the device body 30 or each side portion between the upper portion and the lower portion via the fixing portion 11, and the present embodiment is not particularly limited.

This embodiment makes support body 10 can adopt releasable connection's mode and printed circuit board or equipment body 30 releasable connection through setting up fixed part 11 to install memory fixed bolster on printed circuit board or equipment body 30 again after the memory on the mainboard carries out the dismouting, improve memory fixed bolster's reuse nature.

The first limiting part 12 and the second limiting part 13 can limit the freedom degree of the memory in the plugging direction and the thickness direction, avoid the relative displacement between the memory and the memory socket 21, improve the stability between the memory and the mainboard, ensure the memory to be more firmly installed, and avoid the situation that the computer cannot normally operate or fails due to the looseness and the falling of the memory. And the two sides of the memory respectively abut against the first limiting part 12 and the second limiting part 13 for limiting, so that the memory can transmit the heat generated by the memory to the first limiting part 12 and/or the second limiting part 13, and then the bracket body 10 exchanges heat with the external environment of the memory to dissipate the heat of the memory, thereby improving the heat dissipation efficiency of the memory and reducing the probability of computer jam, crash and failure under the condition of ensuring that the memory is firmly mounted and limited.

In order to save the production cost of the memory fixing bracket and simplify the structure of the memory fixing bracket, the memory fixing bracket in this embodiment is a sheet metal structure, and the first limiting portion 12, the second limiting portion 13 and the fixing portion 11 can be formed by bending, punching, stamping and other processing modes of the bracket body 10.

Taking the bracket body 10 as a plate structure as an example, the first limiting portion 12 and the second limiting portion 13 can be arranged in an angle by bending, so that the first limiting portion 12 and the second limiting portion 13 can be respectively arranged at the end portion of the memory forming the first side and the plate surface of the memory forming the second side to limit the same, and under the condition that the fixing portion 11 is arranged at the first limiting portion 12, the fixing portion 11 and the first limiting portion 12 can also be arranged by bending, and the fixing portion 11 and the first limiting portion 12, and the first limiting portion 12 and the second limiting portion 13 are preferably arranged in 90 degrees, so that the overall structure of the bracket body 10 is in a stepped structure similar to a zigzag shape. Fix on the bottom or the mainboard of quick-witted case through fixed part 11 to let first spacing portion 12 upwards extend along the direction of height and extend along the direction of parallel with the mainboard in spacing portion 13 department of second, be convenient for to the installation of support body 10 and the reinforcement of memory, also can let the memory fixed bolster more lightweight, save the installation space of quick-witted case.

In one embodiment, the first limiting portion 12 is provided with a first heat conducting member (not shown), and the first heat conducting member is preferably a heat conducting silicone sheet, and the first heat conducting member has a deformation capability. First heat-conducting piece one side is connected with first spacing portion 12, and is specific, and first heat-conducting piece is attached on first spacing portion 12, and the opposite side of first heat-conducting piece is configured as the first side of pasting the memory, makes first heat-conducting piece extrusion deformation to exert the reaction force in the direction of inserting to the memory.

Because the internal has the shake in the plugging direction and the displacement is less, and the first side of the internal memory is thinner and the heat productivity is less, the arrangement of the first heat conducting piece between the first side of the internal memory and the first limit part 12 can be cancelled, the internal limit in the plugging direction can be ensured, the heat generated by the internal memory can not be transmitted to the first limit part 12 through the first side too much, and the whole influence on the reinforced structure is not great.

In an alternative embodiment, the second limiting portion 13 is provided with a second heat conducting member 131, the second heat conducting member 131 is preferably a heat conducting silicone sheet, and the second heat conducting member 131 has a deformation capability. One side of the second heat conducting member 131 is connected to the second limiting portion 13, and the other side of the second heat conducting member 131 is configured to abut against the second side of the memory, so that the second heat conducting member 131 deforms under pressure, and applies a reaction force in the first thickness direction to the memory.

The heat-conducting silica gel sheet is produced by a special design scheme for transferring heat by utilizing gaps, can fill the gaps, get through a heat channel between a heating part and a radiating part, effectively improves the heat transfer efficiency, and simultaneously plays roles of insulation, shock absorption, sealing and the like. Thereby satisfying the requirements of heat transfer between the memory and the bracket body 10, reinforcement, shock absorption and the like.

In order to further improve the heat dissipation efficiency of the internal memory in the reinforced state, the bracket body 10 is provided with heat dissipation holes 14, and the heat dissipation holes 14 penetrate through two opposite sides of the bracket body 10, so that the heat dissipation holes 14 communicate the internal memory installation space with the external environment of the bracket body 10.

Because the board with a larger memory area is arranged over against the second limiting portion 13, and the heat generated by the board is also applied to the sole, the heat dissipation holes 14 are formed in the second limiting portion 13, so that part of the heat generated by the board can be transferred to the second limiting portion 13 through the second heat conducting member 131 for heat dissipation, and the other part of the heat generated by the board can be directly discharged out of the memory fixing bracket through the heat dissipation holes 14, and the heat in the heat dissipation holes 14 can be directly extracted by the heat dissipation fan arranged in the case, thereby ensuring the heat dissipation efficiency.

In order to enable more memories to be inserted into the memory socket 21 and connected to the motherboard, thereby adding or enhancing the characteristics and functions of the computer, the memory socket 21 includes a first socket 211 and a second socket 212 for inserting or extracting the memories, the first socket 211 and the second socket 212 can be respectively inserted into the memories to provide corresponding memory insertion spaces for the memories, in order to save the installation space, the first socket 211 and the second socket 212 are oriented in the same direction and are both parallel to the motherboard body 20, so that the memories are both arranged in parallel to the motherboard under the condition that the memories are inserted into the first socket 211 and the second socket 212.

For convenience of understanding, the memory inserted into the first socket 211 is defined as the first memory 40, and the memory inserted into the second socket 212 is defined as the second memory 50.

In order to enable the first memory 40 and the second memory 50 to be pressed and limited by the first limiting portion 12 and the second limiting portion 13, the first socket 211 and the second socket 212 are arranged on the main board body 20 in a stepped manner, the second socket 212 is arranged at the lower portion of the stepped structure and is arranged at the front side of the first socket 211 in the pulling direction, the first socket 211 is arranged at the upper portion of the stepped structure, the first memory 40 is correspondingly inserted into the first socket 211, and the second memory 50 is correspondingly inserted into the second socket 212, so that when the first memory 40 and the second memory 50 are respectively inserted into the first socket 211 and the second socket 212, the first memory 40 and the second memory 50 are arranged in a staggered manner, so that the second memory 50 at the lower side of the stepped structure can extend out from the lower side of the first memory 40 in the Z-axis direction of the main board body 20, so that the first memory 40 and the second memory 50 both have exposed plate surface portions, providing a space for the second position-limiting part 13 to limit.

Correspondingly, the second limiting portion 13 is provided with a plurality of second pressing plate portions 133 corresponding to the first pressing plate portions 132 at intervals along the plugging direction, the first pressing plate portions 132 are configured to abut against the second side of the first memory 40, the second pressing plate portions 133 are configured to abut against the second side of the second memory 50, and the second pressing plate portions 133 can also play a role in limiting the plugging direction of the first memory 40 and abut against the first side of the first memory 40.

The first pressure plate portion 132 and the second pressure plate portion 133 may be formed by a processing method such as punching or bending, and in the present embodiment, the second pressure plate portion 133 may be formed by punching the heat dissipation opening in the second stopper portion 13 and bending the punched portion, and the first pressure plate portion 132 may be a portion of the second stopper portion 13 which is not punched and bent.

One end of the second pressing plate 133 is connected to the bracket body 10, and the other end of the second pressing plate extends downward along the Z-axis direction for a distance to form a first pressing portion 1331 for pressing against a first side of the first memory 40, and then extends toward the direction close to the second socket 212 to form a second pressing portion 1332 for pressing against a second side of the second memory 50, it can be understood that the first pressing plate 132 and the second pressing portion 1332 are both attached with the second heat conducting member 131, so that the first memory 40 and the second memory 50 are both pressed against the two second heat conducting members 131 for limiting and transferring heat.

Further, in the X-axis direction of the main board body 20, the horizontal height of the first socket 211 is greater than the horizontal height of the second socket 212, and in the Z-axis direction of the main board body 20, the second socket 212 is disposed on a side of the first socket 211 close to the memory fixing frame, so that the second memory 50 can extend out from the lower side of the first memory 40 inserted into the first socket 211 when inserted into the second socket 212.

Correspondingly, in the X-axis direction of the main board body 20, the horizontal height of the first pressing plate portion 132 is greater than the horizontal height of the second pressing plate portion 133, the first pressing plate portion 132 is disposed on the side of the second limiting portion 13 close to the memory socket 21, and the second pressing plate portion 133 is disposed on the side of the second limiting portion 13 far from the memory socket 21.

In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used merely for convenience in description and simplicity of operation, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims (11)

1. A memory fixing bracket, comprising:

a holder body (10) provided with a fixing portion (11), the fixing portion (11) being configured to be detachably connected with a printed circuit board or an apparatus body (30);

the bracket body (10) is further provided with a first limiting part (12) and a second limiting part (13), the fixing part (11) is connected with the first limiting part (12) and/or the second limiting part (13), and the first limiting part (12) and the second limiting part (13) are arranged in an angle manner to jointly define a memory mounting space;

the first limiting portion (12) and the second limiting portion (13) are respectively configured to be arranged on two adjacent side portions of the memory, the first limiting portion (12) is used for abutting against a first side of the memory to limit the degree of freedom of the memory in the pulling direction, and the second limiting portion (13) is used for abutting against a second side of the memory to limit the degree of freedom of the memory in the first thickness direction.

2. The memory fixing bracket according to claim 1, wherein the first limiting portion (12) is provided with a first heat-conducting member having a deformation capability;

one side of the first heat-conducting piece is connected with the first limiting part (12), and the other side of the first heat-conducting piece is configured to abut against the first side of the memory and apply acting force in the inserting direction to the memory.

3. The memory fixing bracket according to claim 1, wherein the second limiting portion (13) is provided with a second heat-conducting member (131), and the second heat-conducting member (131) has a deformation capability;

one side of the second heat-conducting piece (131) is connected with the second limiting part (13), and the other side of the second heat-conducting piece (131) is configured to abut against the second side of the memory and apply acting force in the first thickness direction to the memory.

4. The memory fixing bracket according to claim 1, wherein the bracket body (10) is provided with heat dissipation holes (14), and the heat dissipation holes (14) penetrate through two opposite sides of the bracket body (10), so that the heat dissipation holes (14) communicate the memory mounting space with an external environment of the bracket body (10).

5. The memory fixing bracket according to claim 4, wherein the heat dissipation hole (14) is opened in the second limiting portion (13).

6. A motherboard, comprising:

the main board body (20) is provided with a memory socket (21), and the memory socket (21) provides a memory inserting space;

the memory fixing bracket of any one of claims 1-5, which is disposed at one side of the memory socket (21), the memory mounting space being in communication with the memory insertion space;

the first limiting part (12) and the memory socket (21) are arranged oppositely at intervals, and the first limiting part (12) and the memory socket (21) respectively limit the degree of freedom in the plugging direction;

the second limiting part (13) and the main board body (20) are arranged oppositely at intervals, and the second limiting part (13) and the main board body (20) respectively limit the degree of freedom in the first thickness direction and the second thickness direction.

7. Motherboard according to claim 6, characterized in that the memory socket (21) comprises a first socket (211) and a second socket (212) providing memory insertion or extraction, the first socket (211) and the second socket (212) being oriented in line and both parallel to the motherboard body (20);

the first socket (211) and the second socket (212) are arranged on the main board body (20) in a stepped manner, so that when memories are inserted into the first socket (211) and the second socket (212), the two memories are arranged in a staggered manner, so that the two memories have exposed parts in the Z-axis direction of the main board body (20);

the second limiting portion (13) is provided with a first pressing plate portion (132) and a second pressing plate portion (133) at intervals along the plugging direction, the first pressing plate portion (132) is configured to abut against a second side of the memory inserted into the first insertion opening (211), and the second pressing plate portion (133) is configured to abut against a second side of the memory inserted into the second insertion opening (212).

8. The motherboard of claim 7, characterized in that in the X-axis direction of the motherboard body (20), the horizontal height of the first socket (211) is greater than the horizontal height of the second socket (212), and in the Z-axis direction of the motherboard body (20), the second socket (212) is disposed on the side of the first socket (211) close to the memory fixing bracket, so that the memory inserted in the second socket (212) can extend out from the lower side of the memory inserted in the first socket (211);

correspondingly, in the X-axis direction of the main board body (20), the horizontal height of the first pressing plate portion (132) is greater than the horizontal height of the second pressing plate portion (133), the first pressing plate portion (132) is arranged on one side, close to the memory socket (21), of the second limiting portion (13), and the second pressing plate portion (133) is arranged on one side, far away from the memory socket (21), of the second limiting portion (13).

9. A computer, comprising:

an apparatus body (30) provided with a mounting portion (31), the mounting portion (31) providing a component mounting space;

the main board according to any one of claims 6 to 8, wherein the main board body (20) and the memory fixing bracket are both disposed in the component mounting space, and the memory fixing bracket is detachably connected to the mounting portion (31).

10. The computer according to claim 9, wherein the mounting portion (31) and the fixing portion (11) are provided with a fixing hole (111) and a threaded hole (32), respectively;

the fixing part (11) is provided with the fixing hole (111) in the state that the mounting part (31) is provided with the threaded hole (32);

the mounting part (31) is provided with the fixing hole (111) in the state that the fixing part (11) is provided with the threaded hole (32);

a hand screw (15) is arranged between the threaded hole (32) and the fixing hole (111), the threaded section of the hand screw (15) can be in threaded connection with the threaded hole (32), and the diameter of the screw head of the hand screw (15) is larger than that of the fixing hole (111).

11. The computer according to claim 9 or 10, wherein the mounting portion (31) and the fixing portion (11) are respectively provided with a positioning hole (112) and a positioning post (33) which are matched with each other, and the positioning post (33) can be inserted into the positioning hole (112);

the fixing part (11) is provided with the positioning hole (112) in the state that the mounting part (31) is provided with the positioning column (33);

the fixing portion (11) is provided with the positioning column (33), and the mounting portion (31) is provided with the positioning hole (112).

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