CN217404829U - Heat dissipation top cap of central processing unit, central processing unit and electronic equipment - Google Patents
Heat dissipation top cap of central processing unit, central processing unit and electronic equipment Download PDFInfo
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- CN217404829U CN217404829U CN202220624131.7U CN202220624131U CN217404829U CN 217404829 U CN217404829 U CN 217404829U CN 202220624131 U CN202220624131 U CN 202220624131U CN 217404829 U CN217404829 U CN 217404829U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 47
- 239000007788 liquid Substances 0.000 claims abstract description 73
- 239000000110 cooling liquid Substances 0.000 claims description 32
- 238000001816 cooling Methods 0.000 claims description 23
- 238000005192 partition Methods 0.000 claims description 8
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 17
- 239000002826 coolant Substances 0.000 abstract description 9
- 238000009434 installation Methods 0.000 abstract 1
- 238000002955 isolation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
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- 238000010168 coupling process Methods 0.000 description 2
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- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
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- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
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- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a central processing unit's heat dissipation top cap, central processing unit and electronic equipment relates to heat dissipation technical field. The application provides a central processing unit's heat dissipation top cap, including the casing, the casing is inside to have the passageway, has held the coolant liquid in the passageway to when the casing lid was established on the central processing unit body, reduce the temperature of central processing unit body. The casing of central processing unit body top to coolant liquid in the casing can carry out the heat exchange with the central processing unit body, thereby the central processing unit body can realize dispelling the heat fast, and central processing unit's radiating effect is better, and the radiating efficiency is higher, thereby improves central processing unit's work efficiency, extension life. And then radiator fan in the electronic equipment can be with lower rotational speed operation, reduces electronic equipment's noise, and central processing unit's operating frequency has obtained obvious promotion, can also save the dedicated radiator of installation central processing unit in addition, reduces the volume and the weight of part by a wide margin.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation top cover of a central processing unit, the central processing unit and an electronic device.
Background
At present, the central processing unit generates heat in the working process, and if the heat dissipation is not good, the temperature is too high, so that the working efficiency of the central processing unit is influenced, the service life of the central processing unit is shortened, and even the central processing unit is damaged.
However, the cpu in the prior art has poor heat dissipation, large size, heavy weight, and loud noise.
Therefore, how to provide a heat dissipation device that can improve the heat dissipation effect of the cpu, reduce the size and weight of the cpu, and reduce the noise of the fan is an urgent problem to be solved.
SUMMERY OF THE UTILITY MODEL
An object of the embodiments of the present invention is to provide a heat dissipating cover for a cpu, a cpu and an electronic device, in which the heat dissipating cover for the cpu has a channel for receiving a cooling fluid therein, and the heat dissipating cover is covered on a cpu body, so that when the cpu body generates heat during operation, the heat generated by the heat exchanger can be transmitted to the heat dissipation top cover of the central processing unit and absorbed by the cooling liquid which circularly flows inside, the heat exchanger cools the cooling liquid with the increased temperature and pumps the low-temperature cooling liquid into the channel inside the heat dissipation top cover to absorb the heat again, thereby being capable of quickly radiating heat for the central processing unit, having better radiating effect, higher radiating efficiency, smaller volume, weight and noise of the fan, thereby improving the work efficiency of the central processing unit, extending the service life of the central processing unit and reducing the probability of high-temperature damage.
In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:
this application first aspect provides a central processing unit's heat dissipation top cap, includes:
the cooling device comprises a shell, wherein a channel is formed in the shell, and cooling liquid is contained in the channel so as to reduce the temperature of the central processing unit body when the shell is covered on the central processing unit body.
In some modified embodiments of the first aspect of the present application, the housing has a liquid inlet and a liquid outlet, the liquid inlet is communicated with one end of the channel, and the liquid outlet is communicated with the other end of the channel;
the liquid outlet and the liquid inlet are arranged at any position of the shell, which does not face the central processing unit.
In some modified embodiments of the first aspect of the present application, a surface of the housing facing the cpu body has a groove adapted to the cpu body.
In some modified embodiments of the first aspect of the present application, the channel is provided with a plurality of partition plates arranged at intervals on a top wall or a side wall close to the bottom wall of the cpu body or far from the top wall or the side wall of the cpu body, the partition plates are arranged along an extending direction of the channel, and the partition plates are parallel to the side wall or the bottom wall. In some variations of the first aspect of the present application, the channel is serpentine within the housing.
In some modified embodiments of the first aspect of the present application, a filling layer is disposed on a side of the groove bottom surface facing the cpu body, so as to achieve better contact, and better transmit heat of the cpu body to the groove bottom surface; an adhesion layer is arranged between the bottom surface of the groove and the filling layer, so that the filling layer can be better adhered.
In some modified embodiments of the first aspect of the present application, a side of the groove bottom surface facing the cpu body is a concave-convex surface to increase adhesion friction and reinforce the adhesion layer.
In some modified embodiments of the first aspect of the present application, the method further comprises:
and one end of the water-cooling heat exchange device is connected with the liquid outlet, the other end of the water-cooling heat exchange device is connected with the liquid inlet, and the water-cooling heat exchange device is used for cooling the cooling liquid after the temperature rises.
On the other hand, the application also provides a central processing unit, which comprises the heat dissipation top cover of the central processing unit; and
the CPU comprises a CPU body, wherein a heat dissipation top cover of the CPU is arranged on the CPU body in a covering mode.
In still another aspect, the present application further provides an electronic device, which includes the aforementioned central processing unit.
Compared with the prior art, the heat dissipation top cover of the central processing unit provided by the first aspect of the present application comprises a casing, a channel for containing cooling liquid is arranged inside the casing, the casing is covered on the central processing unit body, so that when the central processing unit body generates heat during operation, the heat generated by the cooling device can be conducted to a heat dissipation top cover which is covered on the upper part of the central processing unit body and absorbed by cooling liquid which circularly flows inside, so that the low-temperature cooling liquid in the shell can exchange heat with the central processing unit body, the central processing unit body can realize quick heat dissipation, through the arrangement of the heat dissipation top cover of the central processing unit, the heat dissipation can be rapidly carried out on the central processing unit, the heat dissipation effect is better, the heat dissipation efficiency is higher, the volume, the weight and the fan noise are lower, therefore, the working efficiency of the central processing unit is improved, the service life of the central processing unit is prolonged, and the probability of high-temperature damage is reduced.
The second aspect of the present application further provides a central processing unit, comprising the heat dissipation top cover of the central processing unit as described above; and
the CPU comprises a CPU body, wherein a heat dissipation top cover of the CPU is arranged on the CPU body in a covering mode.
The central processing unit comprises a heat-radiating top cover of the central processing unit and a central processing unit body, wherein a bulge is arranged above the central processing unit body, the heat-radiating top cover of the central processing unit is arranged on a groove matched with the bulge, the heat-radiating top cover of the central processing unit is arranged on a cover above the central processing unit body, the heat-radiating top cover comprises a shell, and a channel for containing cooling liquid is arranged inside the shell, so that when the central processing unit body works to generate heat, the generated heat can be conducted to the heat-radiating top cover arranged above the central processing unit body, and the low-temperature cooling liquid in the shell can exchange heat with the central processing unit body, so that the central processing unit body can realize quick heat radiation, the heat-radiating effect of the central processing unit is better, the heat-radiating efficiency is higher, the volume weight and the fan noise are smaller, and the working efficiency of the central processing unit is improved, the service life of the central processing unit is prolonged, and the probability of high-temperature damage is reduced.
The third aspect of the present application provides an electronic device, including the aforementioned central processing unit, therefore including all technical features and beneficial technical effects as aforementioned, because central processing unit has realized the heat dissipation under the effect of central processing unit heat radiating cover plate, the central processing unit temperature was lower this moment, radiator fan in the electronic device can operate with lower rotational speed, reduce electronic device's noise, and central processing unit's operating frequency has obtained obvious promotion, extend central processing unit's life when having brought higher performance. In addition, the special radiator for the central processing unit can be omitted, and the size and the weight of the parts are greatly reduced, so that the size and the weight of the case can be reduced, and the computer host can be portable.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
Fig. 1 schematically illustrates a cross-sectional view of a front view angle of a heat dissipation top cover of a cpu provided by the present application;
FIG. 2 is a cross-sectional view schematically illustrating a side view angle of a heat dissipation top cover of a CPU provided by the present application;
fig. 3 schematically illustrates a top view of a heat dissipation top cover of a cpu provided herein;
FIG. 4 is a schematic diagram illustrating the structure of the cooling liquid channel inside the heat dissipation top cover of the CPU provided by the present application;
fig. 5 schematically illustrates a side view of the present application at a groove of a heat dissipation top cover of a cpu;
FIG. 6 schematically illustrates a side view of another channel provided herein;
the reference numbers illustrate:
the heat dissipation top cap 1 of the cpu, the housing 11, the channel 12, the bottom wall 121, the side wall 122, the top wall 123, the isolation plate 124, the liquid inlet 13, the liquid outlet 14, the groove 15, the bottom surface 151, the filling layer 16, and the adhesion layer 17.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1 to 4, the present application provides a heat dissipation top cover 1 of a cpu, including:
the CPU comprises a shell 11, wherein a channel 12 is arranged inside the shell 11, and cooling liquid is contained in the channel 12 so as to reduce the temperature of the CPU body when the shell 11 is covered on the CPU body.
The application provides a central processing unit's heat dissipation top cap 1, including casing 11, casing 11 is inside to have the passageway 12 that holds the coolant liquid, casing 11 lid is established on the central processing unit body, thereby when central processing unit body work produced heat, the heat of its production can conduct to the casing 11 of lid establishment in the central processing unit body top, the heat that the central processing unit body produced can be taken away to the coolant liquid of the part circulation flow in the casing 11, thereby the central processing unit body can realize dispelling the heat fast, central processing unit's radiating effect is better, the radiating efficiency is higher, volume weight and fan noise are littleer, thereby improve central processing unit's work efficiency, extend central processing unit's life.
As shown in fig. 1 to 4, in the embodiment of the present application, the housing 11 has a liquid inlet 13 and a liquid outlet 14, the liquid inlet 13 is communicated with one end of the channel 12, and the liquid outlet 14 is communicated with the other end of the channel 12; the liquid outlet 14 and the liquid inlet 13 are disposed at any position of the housing 11 not facing the central processing unit.
In this embodiment, the housing is provided with a liquid inlet 13 and a liquid outlet 14, the liquid inlet 13 communicating with one end of the channel, the liquid outlet communicating with the other end of the channel, whereby the cooling liquid enters the channel from the liquid inlet, heat exchange is carried out in the channel to reduce the heat of the central processing unit, and then the heat is discharged through the liquid outlet, wherein, the liquid inlet 13 on the shell 11 can be arranged on one surface of the shell 11 departing from the central processing unit body, or can be arranged on any surface of the shell 11 adjacent to one surface facing the central processing unit body, namely, the liquid outlet 14 and the liquid inlet 13 of the housing 11 are not arranged on the surface of the housing 11 facing the cpu, therefore, the shell 11 can be ensured not to be interfered by the liquid outlet 14 and the liquid inlet 13 when being covered on the central processing unit body, and the liquid outlet 14 and the liquid inlet 13 are also convenient to be communicated with a pipeline communicated with the heat exchange device.
The cooling liquid may be water or other liquid.
Optionally, the housing 11 is a thermally conductive housing 11.
Preferably, the housing 11 is a heat conductive metal, which may be copper or silver.
In the embodiment of the present application, a surface of the housing 11 facing the cpu body has a groove 15 adapted to the cpu body.
In this embodiment, the central processing unit top is provided with the arch, casing 11 has the recess 15 with the protruding looks adaptation of central processing unit body towards the one side of central processing unit body, thereby casing 11 can be better to cover and establish in central processing unit body top, the heat of central processing unit body can be absorbed by the coolant liquid in the passageway 12 in casing 11 fast, rather than need conduct the central processing unit original-pack protecting cover earlier like prior art the heat of central processing unit body, the visor is again on conducting the heat to the radiator, dispel the heat by the radiator at last, thereby cool down for the central processing unit body fast, the radiating effect is better.
As shown in fig. 6, in the present embodiment,
the channel is provided with a plurality of spaced isolation plates 124 near the bottom wall 121 of the central processing unit body or far away from the top wall 123 or the side wall 122 of the central processing unit body, the isolation plates 124 are arranged along the extending direction of the channel, and the isolation plates 124 are parallel to the side wall 122 or the bottom wall 121.
In the case of the embodiment shown in the figure,
as shown in fig. 6, the channel has a plurality of partition plates 124 arranged at intervals on the bottom wall 121 close to the cpu body or the top wall 123 or the side wall 122 far from the cpu body, and the partition plates 124 are arranged to make the contact area between the coolant and the channel larger, so that the coolant can have a more efficient heat of the cpu body, thereby facilitating the improvement of the heat dissipation effect. Wherein the spacer is generally one quarter of the extent of the parallel side or bottom wall.
Preferably, the spacing plate is a fin, and the distance between two adjacent fins is 0.2 mm.
In the present embodiment, the passage 12 is arranged to meander inside the housing 11.
In this embodiment, the channel 12 is arranged in the housing 11 in a winding manner, that is, the channel 12 includes a plurality of bent pipelines, so that the range of the channel 12 in the housing 11 is larger, more areas can be covered, and the heat of the cpu body at the corresponding position can be absorbed more quickly, so that more heat can be absorbed, and the heat dissipation efficiency and the heat dissipation effect are further improved.
Alternatively, the liquid inlet 13 is disposed at the central position inside the housing 11, and the liquid inlet 13 at the central position is used as a starting point, and the liquid outlet 14 is disposed at the tail of the outermost annular ring and has multiple layers of annular rings around the liquid inlet 13.
Alternatively, the liquid inlet 13 is disposed at one end inside the housing 11, and then the bending setting is performed from the liquid inlet 13 until the liquid inlet reaches the other end inside the housing 11 after being bent a plurality of times, and the liquid outlet 14 is disposed at the other end.
As shown in fig. 5, in the embodiment of the present application, a filling layer 16 is disposed on a side of the bottom surface 151 of the groove 15 facing the cpu body.
In this embodiment, one side of bottom surface 151 towards central processing unit of recess 15 is provided with filling layer 16, and the clearance between 15 bottom surfaces 151 of recess and the central processing unit can be filled in the setting of filling layer 16 for recess 15 bottom surfaces 151 and the laminating of central processing unit body are inseparabler, and inseparable laminating can make the area of contact of heat-conducting surface bigger, makes the heat of central processing unit body can pass to in the casing 11 fast, thereby further improves the radiating effect. The filling layer 16 is generally a heat conductive metal layer, so as to facilitate heat conduction from the cpu body to the housing 11, thereby further improving the heat dissipation effect.
Preferably, the filler layer 16 is made of a material consisting of an alloy of smoke and gallium.
As shown in fig. 5, in the embodiment of the present application, an adhesion layer 17 is disposed between the bottom surface 151 of the groove 15 and the filling layer 16.
In this embodiment, an adhesion layer 17 is disposed between the bottom surface 151 of the groove 15 and the filling layer 16, so as to facilitate the filling layer 16 to adhere to the bottom surface 151 of the groove 15, thereby further ensuring the close contact between the bottom surface 151 of the groove 15 and the cpu body, so that the heat of the cpu body can be rapidly transferred to the casing 11, and further improving the heat dissipation effect.
Preferably, the adhesion layer 17 is a gold plating layer made of a gold plating material.
In the embodiment of the present application, a side of the bottom surface 151 of the groove 15 facing the cpu body is a concave-convex surface.
In this embodiment, recess 15 bottom surface 151 is concave-convex surface towards the one side of central processing unit body, and concave-convex structure's recess 15 bottom surface 151 can be favorable to the adhesion of adhesion coating 17 more to further guaranteed hugging closely of recess 15 bottom surface 151 and central processing unit body, made the heat of central processing unit body pass to the casing 11 in fast, thereby further improved the radiating effect.
Preferably, the side of the bottom surface 151 of the groove 15 facing the cpu body is a frosted surface.
The application provides a central processing unit's heat dissipation top cap 1, when the central processing unit body moves, can reduce central processing unit's temperature to about 25 ℃, because the central processing unit temperature is lower, radiator fan in the electronic equipment can be with lower rotational speed operation, reduces electronic equipment's noise to central processing unit's operating frequency has obtained obvious promotion, has brought higher performance. In addition, a radiator special for a central processing unit can be omitted, and the size and the weight of the parts are greatly reduced, so that the size and the weight of the case can be reduced, and the computer host can be portable.
In the embodiment of the present application, the method further includes:
and one end of the water-cooling heat exchange device is connected with the liquid outlet, the other end of the water-cooling heat exchange device is connected with the liquid inlet, and the water-cooling heat exchange device is used for cooling the cooling liquid after the temperature rises.
In this embodiment, the housing 11 has a liquid inlet 13 and a liquid outlet 14, the liquid inlet 13 is used for transferring the cooling liquid to the channel 12, the liquid outlet 14 is used for guiding the cooling liquid to the channel 12, the liquid inlet 13 is communicated with the liquid inlet end of the channel 12, so as to transfer the cooling liquid into the channel 12 through the liquid inlet 13 and the liquid inlet end, the liquid inlet and the liquid outlet of the heat dissipation top cap are compatible with the interface of the water-cooling heat exchange device, the cooling liquid arranged in the channel 12 can absorb heat to the cpu body, the heat of the cpu body is reduced after absorbing heat, so as to achieve the purpose of heat dissipation, the temperature of the cooling liquid is raised, the liquid outlet 14 is communicated with the liquid outlet end of the channel 12, the cooling liquid with raised temperature is transferred from the liquid outlet end to the liquid outlet 14, and then transferred from the liquid outlet 14 to the water-cooling heat exchange device, the cooling liquid with raised temperature is dissipated in the water-cooling heat exchange device, so as to lower the temperature, the water-cooling heat exchange device is also connected with the liquid inlet 13, so that the cooling liquid with reduced temperature is transmitted to the channel 12 through the liquid inlet 13, the circulation of the cooling liquid is realized, and the cooling liquid can continuously dissipate heat and cool the central processing unit body.
Wherein, water-cooling heat transfer device passes through the tube coupling with the liquid outlet to the coolant liquid that the receipt passageway internal heating rose, heat abstractor passes through the tube coupling with the inlet, in order will be through the transmission of water-cooling heat transfer device refrigerated coolant liquid to the passageway in.
Alternatively, the water-cooled heat exchange device may be a fan or a fanless radiator.
Preferably, the water-cooling heat exchange device comprises a water pump for providing power for the circulation of the cooling liquid.
On the other hand, the application also provides a central processing unit, which comprises the heat dissipation top cover 1 of the central processing unit; and
the CPU comprises a CPU body, wherein a heat dissipation top cover 1 of the CPU is arranged on the CPU body in a covering mode.
The central processing unit comprises a heat-radiating top cover 1 of the central processing unit and a central processing unit body, wherein a bulge 125 is arranged above the central processing unit body, the heat-radiating top cover 1 of the central processing unit is arranged in a groove 15 matched with the bulge 125, a cover above the central processing unit body is provided with the heat-radiating top cover 1 of the central processing unit, the heat-radiating top cover comprises a shell 11, and a channel 12 for containing cooling liquid is arranged inside the shell 11, so that when the central processing unit body works to generate heat, the generated heat can be conducted to the shell 11 covered above the central processing unit body, and the cooling liquid in the shell 11 can exchange heat with the central processing unit body, so that the central processing unit body can realize quick heat radiation, the heat radiation effect of the central processing unit is better, the heat radiation efficiency is higher, the volume weight and the fan noise are smaller, and the working efficiency of the central processing unit is improved, the service life of the central processing unit is prolonged.
In another aspect, the present application provides an electronic device, which includes the aforementioned central processing unit, and therefore includes all technical features and beneficial technical effects of the aforementioned central processing unit, which are not described herein again.
Preferably, the electronic device is a computer.
The application provides a heat-dissipating top cover of a central processing unit, the central processing unit and an electronic device, wherein the electronic device comprises the central processing unit, the central processing unit comprises a heat-dissipating top cover of the central processing unit and a central processing unit body, the central processing unit body is covered with the heat-dissipating top cover of the central processing unit, the central processing unit body can generate heat when working, the heat-dissipating top cover of the central processing unit comprises a shell, a channel for containing cooling liquid is arranged inside the shell, the shell is covered on the central processing unit body, so that when the central processing unit body generates heat when working, the generated heat can be conducted to the shell covered above the central processing unit body, the cooling liquid in the shell can exchange heat with the central processing unit body, the central processing unit body can realize quick heat dissipation, and the heat-dissipating effect of the central processing unit is better, the radiating efficiency is higher, and volume weight and fan noise are less to improve central processing unit's work efficiency, extend central processing unit's life.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (8)
1. A heat dissipation top cap of a central processing unit, comprising:
the cooling device comprises a shell, a cooling device and a control device, wherein a channel is formed in the shell, and cooling liquid is contained in the channel so as to reduce the temperature of the central processing unit body when the shell is covered on the central processing unit body;
the shell is provided with a liquid inlet and a liquid outlet, the liquid inlet is communicated with one end of the channel, and the liquid outlet is communicated with the other end of the channel;
the liquid outlet and the liquid inlet are arranged at any position of the shell, which does not face the central processing unit;
one surface of the shell facing the central processor body is provided with a groove matched with the central processor body.
2. The heat dissipating top cover for a CPU of claim 1,
The channel is close to the bottom wall of the central processing unit body or is far away from the top wall or the side wall of the central processing unit body, a plurality of partition plates are arranged at intervals, the partition plates are arranged along the extending direction of the channel, and the partition plates are parallel to the side wall or the bottom wall.
3. The heat dissipating top cover for a CPU of claim 1,
the channel is serpentine within the housing.
4. The heat dissipating top cover for a CPU of claim 1,
a filling layer is arranged on one side of the bottom surface of the groove, which faces the central processing unit body;
an adhesion layer is arranged between the bottom surface of the groove and the filling layer.
5. The heat dissipating top cover for a CPU of claim 4,
one side of the bottom surface of the groove, which faces the central processing unit body, is a concave-convex surface.
6. The heat dissipating top cover of the cpu of claim 1, further comprising:
and one end of the water-cooling heat exchange device is connected with the liquid outlet, the other end of the water-cooling heat exchange device is connected with the liquid inlet, and the water-cooling heat exchange device is used for cooling the cooling liquid after the temperature rises.
7. A cpu comprising the heat dissipating top cover of the cpu of any one of claims 1 to 6; and
the CPU comprises a CPU body, wherein a heat dissipation top cover of the CPU is arranged on the CPU body in a covering mode.
8. An electronic device comprising the central processor of claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220624131.7U CN217404829U (en) | 2022-03-22 | 2022-03-22 | Heat dissipation top cap of central processing unit, central processing unit and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202220624131.7U CN217404829U (en) | 2022-03-22 | 2022-03-22 | Heat dissipation top cap of central processing unit, central processing unit and electronic equipment |
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| CN217404829U true CN217404829U (en) | 2022-09-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115373498A (en) * | 2022-10-21 | 2022-11-22 | 苏州浪潮智能科技有限公司 | Radiator, radiator manufacturing method and computer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115373498A (en) * | 2022-10-21 | 2022-11-22 | 苏州浪潮智能科技有限公司 | Radiator, radiator manufacturing method and computer |
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Effective date of registration: 20240616 Address after: Room 205, Room 01, 2nd Floor, Building 4, No. 53 Yanqi Street, Yanqi Economic Development Zone, Huairou District, Beijing, 101400 Patentee after: Beijing soten Technology Co.,Ltd. Country or region after: China Address before: No. 1308, 203rd Floor, Nongguangli Second District, Chaoyang District, Beijing 100021 Patentee before: Zhang Bohan Country or region before: China |