CN217306495U - Lead frame containing solid cutting connecting rib - Google Patents
Lead frame containing solid cutting connecting rib Download PDFInfo
- Publication number
- CN217306495U CN217306495U CN202221013025.1U CN202221013025U CN217306495U CN 217306495 U CN217306495 U CN 217306495U CN 202221013025 U CN202221013025 U CN 202221013025U CN 217306495 U CN217306495 U CN 217306495U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- solid
- cutting connecting
- connecting rib
- base island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007787 solid Substances 0.000 title claims abstract description 52
- 238000005520 cutting process Methods 0.000 title claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 210000003205 muscle Anatomy 0.000 description 5
- 239000011435 rock Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 101100334009 Caenorhabditis elegans rib-2 gene Proteins 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
A lead frame comprising entity cutting connecting ribs comprises a lead frame body and at least one lead frame unit, wherein first cutting connecting ribs are arranged between adjacent lead frame units, and each first cutting connecting rib comprises an entity structure positioned on the central line of the first cutting connecting rib and half-etched structures positioned on two sides of the entity structure; and a second cutting connecting rib is arranged between the lead frame unit and the edge of the lead frame body and is of a full-solid structure. According to the invention, the stability and the strength of the frame can be increased by the solid connection mode, the production efficiency of the lead frame is effectively improved, and meanwhile, the frame of the production line can be reduced in shaking in the packaging operation process of the lead frame, so that the performance of the product is improved, and the operation risk of the production line is reduced.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a lead frame comprising entity cutting connecting ribs.
Background
With the continuous development of the integration of the packaging technology, more and more pins and bonding wires are used in the traditional packaging wiring drawing, so that the packaging size of the product design is developed towards a large and oversized direction. The structural schematic diagram of the existing lead frame design is shown in fig. 1 and fig. 2, the unit of the lead frame is connected with the unit or the unit is connected with the cutting connecting rib 2 at the edge of the whole lead frame by half etching, and aiming at a large-packaged product, the connection can cause unstable support when being connected with the edge by half etching, when the production line works, the frame is easy to shake, the frame is easy to deform, and further the operation of the chip-mounting welding wire is influenced.
Disclosure of Invention
An object of the utility model is to provide a lead frame that contains entity cutting even muscle to solve the frame and support the technical problem unstable, rock easily and warp.
In order to solve the technical problem, the utility model discloses a lead frame that contains entity cutting even muscle's concrete technical scheme as follows:
a lead frame comprising entity cutting connecting ribs comprises a lead frame body and at least one lead frame unit, wherein first cutting connecting ribs are arranged between adjacent lead frame units, and each first cutting connecting rib comprises an entity structure positioned on the central line of the first cutting connecting rib and half-etched structures positioned on two sides of the entity structure; a second cutting connecting rib is arranged between the lead frame unit and the edge of the lead frame body, and the second cutting connecting rib is of a full-solid structure; the stability and the frame intensity of the frame are increased, so that the frame can reduce shaking in the operation process of the production line, and the performance of the product is improved.
Further, the solid structure of the first cutting connecting rib is a special solid structure, and the special solid structure comprises an elongated solid structure, a point-broken solid structure and an omega-shaped solid structure. The advantages of adopting the special entity structure are as follows: the omega-shaped solid structure has no edges on the back, and the strength of the frame can be increased under the condition that the back of the frame is not displayed and the appearance of a client product is not influenced. Due to the fact that short circuit between pins can be caused by cutting burrs between the pins, the thin strip entity and the point-breaking entity are convenient to cut, and the cutting burrs and the loss of the cutting blade can be reduced. The cutting streets, i.e. the cell-to-cell webs, are 0.3mm wide, and the width of the slivers may be only 0.1mm, and a full body with a width of 0.1mm will be easier to cut than a full body with a width of 0.3 mm.
Further, the maximum thickness of the solid structure is equal to the thickness of the lead frame body.
Further, the thickness of the solid structure positioned on the center line of the omega-shaped solid structure is at least 0.03mm lower than the thickness of the lead frame body.
Furthermore, the lead frame unit also comprises a base island and a radiating fin, wherein the base island is used for bearing a chip, the base island is arranged on the front surface of the lead frame unit, the radiating fin is arranged on the back surface of the base island, and a glue locking groove is formed between the radiating fin and the base island.
Furthermore, the front surface of the lead frame unit is provided with a pin, the surface of the pin is provided with electroplating, and the pin and the base island are arranged on the same plane.
Furthermore, support rods are led out from four corners of the base island, and the support rods are connected to the edge of the lead frame body and connected with cutting connecting ribs arranged between adjacent frame units.
The utility model discloses a lead frame that contains entity cutting even muscle has following advantage:
1. the cutting that lead frame unit and unit or unit and whole frame edge even muscle point adopt the entity to be connected, because a plurality of lead frame units are the linear type and arrange, the cutting between lead frame unit and the unit is even muscle interconnect, forms netted, can increase the stability and the frame strength of frame.
2. When effectively improving the production efficiency of lead frame, can let produce the line and reduce to rock at the encapsulation operation in-process frame of lead frame to improve the performance of product, reduce the operation risk of producing the line.
Drawings
FIG. 1 is a schematic diagram of a half-etched interconnect structure according to the background art;
FIG. 2 is a cross-sectional view of a half-etched interconnect structure of the background art;
FIG. 3 is a schematic view of the whole lead frame structure of the present invention;
FIG. 4 is a schematic view of the solid connection structure of the present invention;
FIG. 5 is a cross-sectional view of the solid connection structure of the present invention;
fig. 6(a) is a schematic structural diagram of the slender rod entity of the present invention;
FIG. 6(b) is a schematic structural diagram of the dot-broken solid of the present invention;
fig. 6(c) is a schematic view of the omega-shaped solid structure of the present invention;
fig. 7 is a cross-sectional view of the omega-shaped solid connection structure of the present invention;
fig. 8 is a schematic view of a single structure of the lead frame of the present invention;
fig. 9 is a schematic diagram of the lead frame unit structure of the present invention.
The notation in the figure is: 1. a lead frame body; 2-1, cutting the connecting ribs; 2-2, cutting the connecting ribs for the second time; 3. a frame unit; 4. plastic packaging material; 5. a chip; 6. welding wires; 7. A base island; 8. electroplating; 9. a pin; 10. mounting the chip adhesive; 11. a heat sink; 12. a support rod.
Detailed Description
In order to better understand the purpose, structure and function of the present invention, the following will describe in detail a lead frame including solid cutting connecting ribs according to the present invention with reference to the accompanying drawings.
As shown in fig. 3, a lead frame including solid cut connecting ribs includes a lead frame body 1 and at least one lead frame unit 3, a first cut connecting rib 2-1 is disposed between adjacent lead frame units 3, and the first cut connecting rib 2-1 includes a solid structure located at a center line of the first cut connecting rib 2-1 and half-etched structures located at two sides of the solid structure; and a second cutting connecting rib 2-2 is arranged between the lead frame unit 3 and the edge of the lead frame body 1, and the second cutting connecting rib 2-2 is of a full-solid structure. The stability and the frame intensity of frame have been increased, make and produce the line and can reduce at operation in-process frame and rock to improve the performance of product.
As shown in fig. 4 and 5, the thickness of the solid structure is equal to that of the lead frame body 1, and the solid structure of the first cutting connecting rib is a special solid structure.
As shown in fig. 6(a), 6(b) and 6(c), the specific solid structure types are classified into a dot-broken solid structure, a slender bar solid structure and an omega-shaped solid structure. The advantages of adopting the special entity structure are as follows: (1) the omega-shaped solid structure has no edges on the back, and the strength of the frame can be increased under the condition that the back of the frame is not displayed and the appearance of a client product is not influenced. (2) Due to the fact that short circuit between pins can be caused by cutting burrs between the pins, the thin strip entity and the point-breaking entity are convenient to cut, and the cutting burrs and the loss of the cutting blade can be reduced. (3) The cutting streets, i.e. the cell-to-cell webs, are 0.3mm wide, and the width of the slivers may be only 0.1mm, and a full body with a width of 0.1mm will be easier to cut than a full body with a width of 0.3 mm. Therefore, according to different application scenes of the lead frame, a specific entity structure is selected to achieve the optimal effect.
As shown in fig. 7, the thickness of the omega-shaped solid structure is min0.03mm from the surface of the solid to the bottom of the back frame, and the omega-shaped solid structure is different from the slender solid in that the middle solid part is not bordered, and different from the front half-etching design in that the back side is not bordered, i.e. not leaked to the surface of the back side of the product, and is at least 0.03mm from the bottom of the back side of the product.
As shown in fig. 8 and 9, the lead frame unit 3 further includes a molding compound 4 and a base island 7 for carrying the chip 5, and a heat sink 11, wherein the molding compound 4 is used to wrap the frame and the chip 5 to form a final packaged product.
The chip 5 can be arranged on the front surface of the base island 7 in a chip mounting adhesive 10 mode, the base island 7 is arranged on the front surface of the lead frame unit 3, the radiating fin 11 is arranged on the back surface of the base island 7, an adhesive locking groove is arranged between the radiating fin 11 and the base island 7, and the radiating fin is an outer leakage entity on the back surface of the base island 7 and can embody the appearance of a packaged product.
The front surface of the lead frame unit 3 is provided with a pin, the surface of the pin is provided with an electroplating layer 8, a chip 5 is connected with the front surface of the pin through a welding wire 6 to realize signal output, and the pin and the base island 7 are arranged on the same plane. The back of the lead frame is provided with a pin 9, and the pin 9 is an outer leakage entity on the back of the frame and can embody the appearance of a packaged product.
A support rod 12 is led out from the base island 7, the support rod 12 is connected to the edge of the lead frame body 1, is connected with the cutting connecting rib 2 arranged between the adjacent frame units 3, and is used for connecting the base island 7 and the frame, so that the base island 7 is supported and stabilized.
Above-mentioned improvement mode can increase the stability and the frame intensity of frame, when effectively improving the production efficiency of lead frame, can let produce the line and reduce at the encapsulation operation in-process frame of lead frame and rock to improve the performance of product, reduce the risk of producing the line operation.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (7)
1. The lead frame comprising the solid cutting connecting ribs is characterized by comprising a lead frame body (1) and at least one lead frame unit (3), wherein a first cutting connecting rib (2-1) is arranged between every two adjacent lead frame units (3), and each first cutting connecting rib (2-1) comprises a solid structure positioned at the central line of the corresponding first cutting connecting rib (2-1) and half-etched structures positioned on two sides of the solid structure;
the lead frame unit (3) and the edge of the lead frame body (1) are provided with a second cutting connecting rib (2-2), and the second cutting connecting rib (2-2) is of a full-solid structure.
2. Leadframe comprising physically cut ribs according to claim 1, characterized in that the solid structures of the first cut ribs (2-1) comprise elongated solid structures, dot-broken solid structures and omega-shaped solid junctions.
3. Leadframe comprising solid cut ribs according to claim 2 characterized in that the maximum thickness of the solid structure is equal to the thickness of the leadframe body (1).
4. Leadframe comprising physically cut ribs according to claim 2, characterized in that the thickness of the solid structure at the centre line of the omega-shaped solid structure is at least 0.03mm lower than the thickness of the leadframe body (1).
5. Lead frame comprising physically cut ribs according to claim 1, wherein the lead frame unit (3) further comprises a base island (7) for carrying a chip (5) and a heat sink (11), the base island (7) is disposed on the front side of the lead frame unit (3), the heat sink (11) is disposed on the back side of the base island (7), and an adhesive locking groove is disposed between the heat sink (11) and the base island (7).
6. Lead frame comprising solid cut ribs according to claim 5, characterized in that the lead frame unit (3) is provided with pins on the front surface, the surfaces of the pins are provided with plating (8), and the pins and the base island (7) are arranged on the same plane.
7. Lead frame comprising solid cut ribs according to claim 5 characterized in that support bars (12) are led out at the four corners of the base island (7), said support bars (12) are connected to the edges of the lead frame units (3) and connected to the cut ribs (2) arranged between adjacent frame units (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221013025.1U CN217306495U (en) | 2022-04-27 | 2022-04-27 | Lead frame containing solid cutting connecting rib |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221013025.1U CN217306495U (en) | 2022-04-27 | 2022-04-27 | Lead frame containing solid cutting connecting rib |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217306495U true CN217306495U (en) | 2022-08-26 |
Family
ID=82914707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221013025.1U Active CN217306495U (en) | 2022-04-27 | 2022-04-27 | Lead frame containing solid cutting connecting rib |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217306495U (en) |
-
2022
- 2022-04-27 CN CN202221013025.1U patent/CN217306495U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6744118B2 (en) | Frame for semiconductor package | |
| KR100233863B1 (en) | Grid array type leadframe and a lead end grid array semiconductor package | |
| CN105470234A (en) | SOT23 lead frame and packaging process flow thereof | |
| CN217306495U (en) | Lead frame containing solid cutting connecting rib | |
| CN104900625A (en) | High-density IDF SOP8 lead frame structure | |
| CN112086426A (en) | QFN chip packaging body structure and cutting production method thereof | |
| CN101894822B (en) | Lead frame band construction for semiconductor packaging | |
| CN102332441A (en) | High-alignment-packaging-type lead frame and packaging structure thereof | |
| CN206003768U (en) | A kind of DFN3810 9L lead frame | |
| CN209119089U (en) | A kind of novel SOT89 potted element and chi frame | |
| CN102903695A (en) | SOT223 matrix lead frame capable of increasing utilization ratio of materials | |
| CN202888165U (en) | SOT223 (Small Outline Transistor 223) matrix type lead wire framework capable of improving material utilization rate | |
| US7247515B2 (en) | Frame for semiconductor package | |
| CN212570981U (en) | QFN chip packaging body structure | |
| CN208336212U (en) | SMC lead frame | |
| CN205303459U (en) | Be used for quad flat not have pin lead frame of a package | |
| CN218414566U (en) | 7 arrange 7X 7 encapsulation lead frames of 32 pins | |
| CN218585977U (en) | 7 rows of 7 x 7 encapsulation lead frames of 48 pins | |
| CN221041121U (en) | Lead frame | |
| CN203800033U (en) | Leading wire frame and semiconductor packaging body | |
| CN216054692U (en) | Novel high-density semiconductor lead frame structure | |
| CN221080009U (en) | Packaging frame and semiconductor packaging structure | |
| CN219811496U (en) | Lead frame structure and lead frame | |
| CN212907725U (en) | DFN1610-6 chip frame | |
| CN109860139B (en) | Lead frame structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 210000 No. 8, Linchun Road, Pukou Economic Development Zone, Pukou District, Nanjing, Jiangsu Province Patentee after: Jiangsu Xinde Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 210000 No. 8, Linchun Road, Pukou Economic Development Zone, Pukou District, Nanjing, Jiangsu Province Patentee before: Jiangsu Xinde Semiconductor Technology Co.,Ltd. Country or region before: China |