CN217251704U - U type deck thermoforming setting device - Google Patents
U type deck thermoforming setting device Download PDFInfo
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- CN217251704U CN217251704U CN202220821758.1U CN202220821758U CN217251704U CN 217251704 U CN217251704 U CN 217251704U CN 202220821758 U CN202220821758 U CN 202220821758U CN 217251704 U CN217251704 U CN 217251704U
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Abstract
The utility model provides a U type deck thermoforming setting device, including die carrier, guide pillar, reference column and adjusting screw. The positioning columns are arranged on the surfaces of the square rectangular pipes on the upper layer of the die carrier, and the installation positions of the positioning columns are the same as those of a positioning tool used in the thermal forming of the U-shaped deck; a plurality of adjusting screws are arranged on the upper surfaces of a plurality of middle square tubes on the upper layer of the die carrier and the lower surfaces of a plurality of middle square tubes on the lower layer; when stacking up from top to bottom when a plurality of setting devices, the adjusting screw of below setting device upper surface and the contact of U type deck lower surface, the adjusting screw of top setting device lower surface and the contact of U type deck upper surface, through the height of screw thread regulation adjusting screw for upper and lower adjusting screw combined action, with the correction U type deck bottom surface shape, guarantee the bottom surface roughness. Adopt the utility model discloses can reduce the deformation of sheet material under the natural cooling state behind the thermoforming. The device is formed by welding square and rectangular tubes, and is light in weight; by using the guide columns and the supporting legs, a plurality of devices can be stacked.
Description
Technical Field
The utility model belongs to the technical field of high strength steel sheet hot stamping, concretely relates to U type deck thermoforming setting device.
Background
After the high-strength steel plate is subjected to hot forming, the high-strength steel plate is seriously deformed in a natural cooling state and cannot meet the requirements of the current products. Therefore, a shaping device for a high-strength steel plate after hot forming needs to be designed to solve the problem of deformation of the plate in a natural cooling state after hot forming.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a U type deck thermoforming setting device to solve the technical problem of serious deformation under the thermoforming back sheet material natural cooling state.
(II) technical scheme
In order to solve the technical problem, the utility model provides a U-shaped deck thermal forming and shaping device, which comprises a die carrier, a guide pillar, a positioning pillar and an adjusting screw; wherein the content of the first and second substances,
the die carrier is an H-shaped frame structure formed by welding a square tube and a triangular block and is divided into an upper layer, a middle layer and a lower layer; the middle layer is of a long square grid structure formed by welding a plurality of square tubes; the upper layer comprises a plurality of upper layer square tube and a plurality of tripod blocks, the upper layer square tube at the left end and the right end is welded on the top of the middle layer square tube through a supporting square tube, other upper layer square tube is positioned between the upper layer square tubes at the left end and the right end, the other upper layer square tubes are placed in the same direction and are directly welded on the top of the middle layer square tube, and the upper layer square tubes at the left end and the right end are respectively supported through a triangular block; the lower layer comprises a plurality of lower layer square tube and a plurality of square tube supporting legs, the lower layer square tube is welded at the bottom of the middle layer, the placing direction of the lower layer square tube is the same as that of the upper layer square tube, and the square tube supporting legs are respectively welded at four corners of the lower surface of the middle layer and at the middle positions of the edges of the lower surface of the middle layer; the inner side size of the square rectangular pipes at the left and right ends of the upper layer of the die carrier is the same as the size of the outer skin opening of the U-shaped deck, and the outer side size of the square rectangular pipes at the left and right ends of the lower layer of the die carrier is the same as the size of the inner skin opening of the U-shaped deck;
guide posts are respectively fixed at four corners of the upper layer of the die set, and the inner diameter of the lower layer square tube support leg of the die set is in transition fit with the diameter of the guide posts; when a plurality of shaping devices are stacked up and down, the guide posts of the lower thermal forming shaping device are inserted into the square tube supporting legs of the upper thermal forming shaping device;
the positioning columns are installed on the surface of the square tube on the upper layer of the die carrier through screws, and the installation positions of the positioning columns are the same as those of a positioning tool used in the thermal forming of the U-shaped deck;
a plurality of adjusting screws are arranged on the upper surfaces of a plurality of middle square tube of the upper layer of the die carrier and the lower surfaces of a plurality of middle square tube of the lower layer of the die carrier in a threaded connection mode; when stacking up from top to bottom as a plurality of setting devices, the adjusting screw and the lower surface contact of U type deck of below setting device upper surface, the adjusting screw and the upper surface contact of U type deck of top setting device lower surface, through the height of screw thread regulation adjusting screw for the adjusting screw combined action of upper and lower side, with the shape of correcting U type deck bottom surface, guarantee the bottom surface roughness.
Furthermore, a plurality of lifting lugs are welded on the side of the die carrier.
(III) advantageous effects
The utility model provides a U type deck thermoforming setting device, including die carrier, guide pillar, reference column and adjusting screw. A plurality of positioning columns are arranged on the surface of the square rectangular tube on the upper layer of the die set, and the installation positions of the positioning columns are the same as those of a positioning tool used in the thermal forming of the U-shaped deck; a plurality of adjusting screws are arranged on the upper surfaces of a plurality of middle square tubes on the upper layer of the die carrier and the lower surfaces of a plurality of middle square tubes on the lower layer; when stacking up from top to bottom when a plurality of setting devices, the adjusting screw of below setting device upper surface and the contact of U type deck lower surface, the adjusting screw of top setting device lower surface and the contact of U type deck upper surface, through the height of screw thread regulation adjusting screw for upper and lower adjusting screw combined action, with the correction U type deck bottom surface shape, guarantee the bottom surface roughness. Adopt the utility model discloses can reduce the deformation of sheet material under the natural cooling state behind the thermoforming. The device is formed by welding square and rectangular tubes, and is light in weight; by using the guide columns and the supporting legs, a plurality of devices can be stacked.
Drawings
FIG. 1 is a perspective view of a thermal forming device according to an embodiment of the present invention;
fig. 2 is a front view (stacked state) of the thermoforming setting device according to the embodiment of the present invention.
Detailed Description
In order to make the objects, contents and advantages of the present invention clearer, the following description will make a detailed description of embodiments of the present invention with reference to the accompanying drawings and examples.
The present embodiment provides a U-shaped deck thermoforming setting device, which has a structure shown in fig. 1 and 2, and includes a mold frame 2, a guide pillar 1, a positioning pillar 3, an adjusting screw 4, and a lifting lug 5.
The die carrier 2 is an H-shaped frame structure formed by welding a square rectangular pipe and a triangular block and is divided into an upper layer, a middle layer and a lower layer. The middle layer is of a long square grid structure formed by welding six square tubes (one square tube at the periphery and two parallel square tubes in the middle); the upper layer comprises nine square rectangular pipes and four triangular blocks, the upper square rectangular pipes at the left end and the right end are welded at the top of the middle square rectangular pipe through supporting square pipes, the other seven upper square rectangular pipes are positioned between the upper square rectangular pipes at the left end and the right end, are placed in the same direction and are directly welded at the top of the middle square rectangular pipe, and the upper square rectangular pipes at the left end and the right end are respectively supported through two welded triangular blocks; the lower floor includes six square tubes and six square tube landing legs, and lower floor's square tube welding is in the intermediate level bottom and place the orientation the same with upper square tube, and six square tube landing legs weld respectively in the lower surface four corners and the marginal intermediate position in intermediate level.
The inner side dimension L1 of the square rectangular tubes at the left and right ends of the upper layer of the die carrier 2 is the same as the outer skin opening dimension of the U-shaped deck, and the outer side dimension L2 of the square rectangular tubes at the left and right ends of the lower layer of the die carrier 2 is the same as the inner skin opening dimension of the U-shaped deck. After the U-shaped deck is placed into the shaping device, the opening sizes of the inner skin and the outer skin in the cooling process are controlled by the thermal forming shaping device, so that the opening sizes of the cooled U-shaped deck can be guaranteed.
Guide posts 1 are respectively fixed at four corners of the upper layer of the die carrier 2, and the inner diameter of the lower layer square tube supporting leg of the die carrier 2 is in transition fit with the diameter of the guide posts 1. When a plurality of shaping devices are stacked up and down, the guide posts 1 of the lower thermoforming shaping device are inserted into the square tube support legs of the upper thermoforming shaping device.
The four positioning columns 3 are installed on the surface of the square tube on the upper layer of the die carrier 2 through screws, and the installation positions of the positioning columns are the same as those of a positioning tool used in the thermal forming of the U-shaped deck.
The adjusting screws 4 are installed on the upper surfaces of five middle square tubes and the lower surfaces of four middle square tubes of the upper square tube and the lower square tube of the die carrier 2 in a threaded connection mode. When the utility model discloses a when piling up from top to bottom, adjusting screw 4 and the U type deck surface contact of below setting device upper surface, adjusting screw 4 and the U type deck surface contact of top setting device lower surface, through the height of screw thread regulation adjusting screw 4 for 4 combined action of adjusting screw of upper and lower side, with the shape of correcting U type deck bottom surface, guarantee the bottom surface roughness.
The four lifting lugs 5 are connected to the side of the die carrier 2 in a welding mode.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (2)
1. A U-shaped deck thermal forming and shaping device is characterized by comprising a die carrier, a guide pillar, a positioning column and an adjusting screw; wherein, the first and the second end of the pipe are connected with each other,
the die carrier is an H-shaped frame structure formed by welding a square rectangular pipe and a triangular block and is divided into an upper layer, a middle layer and a lower layer; the middle layer is of a long square grid structure formed by welding a plurality of square tubes; the upper layer comprises a plurality of upper layer square tube and a plurality of tripod blocks, the upper layer square tube at the left end and the right end is welded on the top of the middle layer square tube through a supporting square tube, other upper layer square tube is positioned between the upper layer square tubes at the left end and the right end, the placing directions of the other upper layer square tubes are the same, the other upper layer square tubes are directly welded on the top of the middle layer square tube, and the upper layer square tubes at the left end and the right end are respectively supported through the triangular blocks; the lower layer comprises a plurality of lower layer square tube and a plurality of square tube supporting legs, the lower layer square tube is welded at the bottom of the middle layer, the placing direction of the lower layer square tube is the same as that of the upper layer square tube, and the square tube supporting legs are respectively welded at four corners of the lower surface of the middle layer and at the middle positions of the edges of the lower surface of the middle layer; the inner side size of the square rectangular pipes at the left and right ends of the upper layer of the die carrier is the same as the size of the outer skin opening of the U-shaped deck, and the outer side size of the square rectangular pipes at the left and right ends of the lower layer of the die carrier is the same as the size of the inner skin opening of the U-shaped deck;
guide posts are respectively fixed at four corners of the upper layer of the die set, and the inner diameter of the lower layer square tube support leg of the die set is in transition fit with the diameter of the guide posts; when a plurality of shaping devices are stacked up and down, the guide posts of the lower thermal forming shaping device are inserted into the square tube supporting legs of the upper thermal forming shaping device;
the positioning columns are installed on the surface of the square tube on the upper layer of the die carrier through screws, and the installation positions of the positioning columns are the same as those of a positioning tool used in the thermal forming of the U-shaped deck;
a plurality of adjusting screws are arranged on the upper surfaces of a plurality of middle square tube of the upper layer of the die carrier and the lower surfaces of a plurality of middle square tube of the lower layer of the die carrier in a threaded connection mode; when stacking up from top to bottom when a plurality of setting devices, the adjusting screw of below setting device upper surface and the contact of U type deck lower surface, the adjusting screw of top setting device lower surface and the contact of U type deck upper surface, through the height of screw thread regulation adjusting screw for the adjusting screw combined action of upper and lower place, with the shape of correcting U type deck bottom surface, guarantee the bottom surface roughness.
2. The thermoforming setting device as claimed in claim 1, wherein the plurality of lifting lugs are welded to the side of the mold frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220821758.1U CN217251704U (en) | 2022-04-11 | 2022-04-11 | U type deck thermoforming setting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220821758.1U CN217251704U (en) | 2022-04-11 | 2022-04-11 | U type deck thermoforming setting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217251704U true CN217251704U (en) | 2022-08-23 |
Family
ID=82874756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220821758.1U Active CN217251704U (en) | 2022-04-11 | 2022-04-11 | U type deck thermoforming setting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217251704U (en) |
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2022
- 2022-04-11 CN CN202220821758.1U patent/CN217251704U/en active Active
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