CN217241050U

CN217241050U - Multi-layer conductive circuit and display module

Info

Publication number: CN217241050U
Application number: CN202123124583.3U
Authority: CN
Inventors: 孙晓辉; 奚玉琳
Original assignee: Shenzhen Huadingxing Technology Co ltd
Current assignee: Shenzhen Huadingxing Technology Co ltd
Priority date: 2021-12-13
Filing date: 2021-12-13
Publication date: 2022-08-19
Anticipated expiration: 2031-12-13

Abstract

The utility model provides a multilayer conducting wire, include: the first conducting layer comprises a first conducting metal film and a first insulating light-resistant layer, the first insulating light-resistant layer is provided with a first window, and a first conducting part exposed out of the first window is formed on the first conducting metal film at the position corresponding to the first window; and the second conducting layer comprises a second conducting metal film and a second insulating photoresist layer, the second insulating photoresist layer is provided with a second window, the second conducting metal film is provided with an opening at the position corresponding to the second window so that the second conducting metal film forms a second conducting part which is exposed out of the second window and arranged around the opening, the second conducting metal film is attached to the first insulating photoresist layer, the first window and the second window are correspondingly arranged, and the first conducting part is electrically connected with the second conducting part. Furthermore, the utility model also provides a display module assembly. The utility model discloses technical scheme has effectively solved the problem that multilayer conducting wire preparation technology is complicated, thickness is thick.

Description

Multilayer conductive circuit and display module

Technical Field

The utility model relates to a conducting wire technical field especially relates to a multilayer conducting wire and display module assembly.

Background

Printed circuit boards, i.e., copper clad laminates, include rigid copper clad laminates and flexible copper clad laminates. The substrate of the rigid copper-clad laminate is a resin laminate, including but not limited to epoxy, phenolic aldehyde and other resin plates; the substrate of the flexible copper clad laminate is a high molecular film or a single-layer heat-resistant glass varnished cloth, and the high molecular film comprises but is not limited to polyester, polyimide, a fluorine-containing polymer film and the like. In the conventional printed circuit board, a metal coating is usually disposed on a substrate, and conductive traces are formed on the metal coating. However, the printed circuit board with the substrate is thick.

The printed circuit board comprises a multilayer circuit board, wherein the multilayer circuit board is formed by mutually overlapping two or more conductive layers. The conductive layers in the multilayer wiring board are generally bonded together by an insulating material such as resin, and the manufacturing process is complicated.

SUMMERY OF THE UTILITY MODEL

The utility model provides a multilayer conducting wire and display module assembly, preparation simple process, and the conducting wire thickness of making is thinner.

In a first aspect, embodiments of the present invention provide a multilayer conductive circuit, including:

the first conductive layer comprises a first conductive metal film and a first insulating photoresist layer, the first insulating photoresist layer is arranged on one surface of the first conductive metal film, the first insulating photoresist layer is provided with a first window, and a first conductive part exposed out of the first window is formed on the first conductive metal film at the position corresponding to the first window; and

the second conducting layer comprises a second conducting metal film and a second insulating photoresist layer, the second insulating photoresist layer is arranged on one surface of the second conducting metal film, the second insulating photoresist layer is provided with a second window, the second conducting metal film is provided with an opening at the position corresponding to the second window, so that the second conducting metal film forms a second conducting part exposed out of the second window and surrounding the opening, one surface of the second conducting metal film departing from the second insulating photoresist layer is attached to one surface of the first insulating photoresist layer departing from the first conducting metal film, the first window and the second window are correspondingly arranged, and the first conducting part is electrically connected with the second conducting part.

In a second aspect, the embodiment of the utility model provides a display module assembly, display module assembly includes a plurality of LED lamp pearls and as above multilayer conducting wire, a plurality of LED lamp pearls with multilayer conducting wire electric connection.

According to the multilayer conductive circuit and the display module, the first insulating photoresist layer and the second insulating photoresist layer are respectively arranged on the first conductive metal film and the second conductive metal film to respectively form the first conductive layer and the second conductive layer, and the first conductive layer and the second conductive layer are arranged in a stacked mode to form the multilayer conductive circuit. The first insulating light resistance layer is attached to the second conductive metal film, so that the first conductive layer and the second conductive layer are attached together, and meanwhile, the first insulating light resistance layer can also insulate the first conductive metal film from the second conductive metal film. The first insulating photoresist layer and the second insulating photoresist layer are respectively provided with a corresponding first window and a corresponding second window, the second conductive metal film is provided with an opening at the position corresponding to the second window, and the first conductive part arranged corresponding to the first window is electrically connected with the second conductive part arranged corresponding to the second window through the first window, the second window and the opening. The multiple layers of conducting circuits are directly made of conducting metal films and insulating photoresist layers, so that substrates are saved, and cost is effectively saved. Meanwhile, the multilayer conductive circuit is thin in overall thickness, high in applicability and wide in applicable scene.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a multilayer conductive circuit according to an embodiment of the present invention.

Fig. 2 is another schematic cross-sectional view of a multi-layer conductive circuit according to an embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of a display module according to an embodiment of the present invention.

Fig. 4 is a flowchart of a method for manufacturing a multilayer conductive circuit according to an embodiment of the present invention.

Fig. 5 is a first sub-flowchart of a method for manufacturing a multi-layer conductive circuit according to an embodiment of the present invention.

Fig. 6 is a second sub-flowchart of a method for manufacturing a multi-layer conductive circuit according to an embodiment of the present invention.

Fig. 7 is a third sub-flowchart of a method for manufacturing a multi-layer conductive circuit according to an embodiment of the present invention.

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The terms "first," "second," "third," "fourth," and the like in the description and claims of this application and in the above-described drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances, in other words, the described embodiments may be practiced other than as illustrated or described herein. Moreover, the terms "comprises," "comprising," and any other variation thereof, may also include other things, such as processes, methods, systems, articles, or apparatus that comprise a list of steps or elements is not necessarily limited to only those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such processes, methods, articles, or apparatus.

It should be noted that the description relating to "first", "second", etc. in the present invention is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Please refer to fig. 1, which is a schematic cross-sectional view of a multi-layer conductive circuit according to an embodiment of the present invention. The multilayer conductive trace 100 includes a first conductive layer 10 and a second conductive layer 20. In the present embodiment, the multi-layer conductive trace 100 is a dual-layer conductive trace.

The first conductive layer 10 includes a first conductive metal film 11 and a first insulating photoresist layer 12, and the first insulating photoresist layer 12 is disposed on one surface of the first conductive metal film 11. The first conductive metal film 11 includes, but is not limited to, a copper film, a silver film, etc., and the thickness of the first conductive metal film 11 is 3 to 500 micrometers. The first insulating photoresist layer 12 is made of a transparent insulating photoresist material, and the thickness of the first insulating photoresist layer 12 is 2 to 500 micrometers. Preferably, the first conductive metal film 11 is a copper film. The first insulating photoresist layer 12 is provided with a first window 121. The first window 121 is formed by etching, and the first window 121 includes a plurality of windows. The shape of the first window 121, the position of the first insulating photoresist layer 12, and the like may be set according to actual conditions. The first conductive metal film 11 forms a first conductive portion 111 exposed to the first window 121 at a position corresponding to the first window 121.

The surface of the first conductive metal film 11 facing away from the first insulating photoresist layer 12 is provided as a first wiring surface 113, and the first wiring surface 113 is provided with a first conductive trace 13 in a region outside the first conductive part 111. The first conductive traces 13 and the first conductive portions 111 do not overlap each other.

The second conductive layer 20 includes a second conductive metal film 21 and a second insulating photoresist layer 22, and the second insulating photoresist layer 22 is disposed on one side of the second conductive metal film 21. Wherein, the second conductive metal film 21 includes but not limited to copper film, silver film, etc., and the thickness of the second conductive metal film 21 is 3-500 μm. The second insulating photoresist layer 22 is made of a transparent insulating photoresist material, and the thickness of the second insulating photoresist layer 22 is 2-500 μm. Preferably, the second conductive metal film 21 is a copper film. The second insulating photoresist layer 22 has a second window 221. The second window 221 is formed by etching, and the second window 221 includes a plurality of windows. The number of the second windows 221 is the same as that of the first windows 121, and the shapes of the second windows 221 and the positions formed on the second insulating photoresist layer 22 correspond to the shapes of the first windows 121 and the positions formed on the first insulating photoresist layer 12 one by one. The second conductive metal film 21 has an opening 212 at a position corresponding to the second window 221, so that the second conductive metal film 21 forms a second conductive portion 211 exposed out of the second window 221 and surrounding the opening 212. The opening 212 is formed by etching, and the opening 212 includes a plurality of openings. The shape of the opening 212, the position of the second conductive metal film 21, and the like may be set according to actual conditions.

The surface of the second conductive metal film 21 away from the second insulating photoresist layer 22 is a second wiring surface 213, and the second wiring surface 213 is provided with a second conductive trace 23 in the region outside the second conductive portion 211. The second conductive traces 23 do not overlap with the second conductive portions 211. The second conductive traces 23 may be the same as or different from the first conductive traces 13.

The surface of the second conductive metal film 21 away from the second insulating photoresist layer 22 is attached to the surface of the first insulating photoresist layer 12 away from the first conductive metal film 11. The transparent insulating photoresist material has viscosity, so that the second conductive metal film 21 can be adhered to the first insulating photoresist layer 12, and the second conductive layer 20 and the first conductive layer 10 are disposed together. The first conductive metal film 11, the first insulating photoresist layer 12, the second conductive metal film 21 and the second insulating photoresist layer 22 are sequentially stacked to form a multi-layer conductive circuit 100. In some possible embodiments, a material with viscosity such as glue may be disposed between the first conductive layer 10 and the second conductive layer 20 to tightly bond the first conductive layer 10 and the second conductive layer 20.

In the multi-layer conductive circuit 100, the first window 121 and the second window 221 are correspondingly disposed, and the first conductive portion 111 is electrically connected to the second conductive portion 211. In this embodiment, multilayer conductive trace 100 further includes conductive material 40. The conductive material 40 is disposed in the second window 221, such that the conductive material 40 is attached to the second conductive portion 211 and attached to the first conductive portion 111 through the opening 212, such that the first conductive portion 111 is electrically connected to the second conductive portion 211. It is understood that the conductive material 40 penetrates through the second window 221, the opening 212 and the first window 121, so that the first conductive portion 111 and the second conductive portion 211 are electrically connected. The conductive material 40 includes, but is not limited to, solder paste, silver paste, and the like.

In the above embodiment, the first conductive layer and the second conductive layer are formed by disposing the first insulating photoresist layer and the second insulating photoresist layer on the first conductive metal film and the second conductive metal film, respectively, and the first conductive layer and the second conductive layer are disposed in a stacked manner to form the multilayer conductive line. The first insulating light resistance layer is attached to the second conductive metal film, so that the first conductive layer and the second conductive layer are attached together, and meanwhile, the first insulating light resistance layer can also insulate the first conductive metal film from the second conductive metal film. The first insulating photoresist layer and the second insulating photoresist layer are respectively provided with a corresponding first window and a corresponding second window, the second conductive metal film is provided with an opening at the position corresponding to the second window, and the first conductive part arranged corresponding to the first window is electrically connected with the second conductive part arranged corresponding to the second window through the first window, the second window and the opening. The multiple layers of conducting circuits are directly made of the conducting metal films and the insulating photoresist layers, so that the substrate is saved, and the cost is effectively saved. Meanwhile, the multilayer conductive circuit is thin in overall thickness, high in applicability and wide in applicable scene. When the thickness of the insulating photoresist layer is thinner, the multiple layers of conducting circuits can be used for manufacturing a large-size display screen; when the thickness of the insulating photoresist layer is thicker, the multilayer conductive circuit can be used for manufacturing a small-sized display screen, so that the multilayer conductive circuit has higher practicability.

In some possible embodiments, the first conductive metal film 11 may have an opening (not shown) at a position corresponding to the first window 121, so that the first conductive part 111 is disposed around the opening. Wherein, the opening can be formed by etching, and the opening comprises a plurality of openings. The number of openings is the same as the number of openings 212, and the positions where the openings are disposed in the first conductive metal film 11 are the same as the positions where the openings 212 are disposed in the second conductive metal film 21. The shape of the opening can be set according to actual conditions. The conductive material 40 penetrates the second window 221, the opening 212, the first window 121, and the opening, thereby enhancing the electrical connection between the first conductive portion 111 and the second conductive portion 211.

Please refer to fig. 2, which is a schematic cross-sectional view of a multi-layer conductive circuit according to an embodiment of the present invention. Multilayer conductive trace 100 also includes at least one third conductive layer 30. The first conductive layer 10, the second conductive layer 20, and the at least one third conductive layer 30 form a multi-layer conductive trace 100. The structure of the third conductive layer 30 is the same as that of the second conductive layer 20. Specifically, the third conductive layer 30 includes a third conductive metal film 31 and a third insulating photoresist layer 32, and the third insulating photoresist layer 32 has a third window 321. The third conductive metal film 31 is provided with a through hole 312 at a position corresponding to the third window 321, so that the third conductive metal film 31 forms a third conductive portion 311 exposed out of the third window 321 and disposed around the through hole 312. The specific structure of the third conductive layer 30 corresponds to the specific structure of the second conductive layer 20 one to one, and is not described herein again.

The third conductive layer 30 is disposed on a side of the second conductive layer 20 away from the first conductive layer 10. Taking the example that the multilayer conductive circuit 100 includes two third conductive layers 30, the second conductive layer 20, and the first conductive layer 10 are sequentially stacked. The third conductive metal films 31 and the third insulating photoresist layers 32 of the two third conductive layers 30 are sequentially stacked, and the outermost third conductive metal film 31 of the two third conductive layers 30 is attached to the second insulating photoresist layer 22. The conductive material 40 penetrates through the third window 321, the through hole 312, the second window 221, the opening 212 and the first window 121, so that the first conductive portion 111 is electrically connected to the second conductive portion 211 and the third conductive portion 311. Wherein, the conductive traces of each third conductive layer 30 may be the same or different; the conductive traces of the third conductive layer 30 and the second conductive traces 23 of the second conductive layer 20 may be the same or different.

In the above embodiment, at least one third conductive layer is disposed on a side of the second conductive layer away from the first conductive layer, so as to form a plurality of layers of conductive traces. The structure of the third conducting layer is the same as that of the second conducting layer, and the multilayer conducting circuit is simple in overall structure, so that the manufacturing process of the multilayer conducting circuit is simple, and the production efficiency can be greatly improved.

Please refer to fig. 4 to fig. 7 in combination, fig. 4 is a flowchart of a manufacturing method of a multilayer conductive circuit provided in an embodiment of the present invention, fig. 5 is a first sub-flowchart of a manufacturing method of a multilayer conductive circuit provided in an embodiment of the present invention, fig. 6 is a second sub-flowchart of a manufacturing method of a multilayer conductive circuit provided in an embodiment of the present invention, and fig. 7 is a third sub-flowchart of a manufacturing method of a multilayer conductive circuit provided in an embodiment of the present invention. The method for fabricating the multilayer conductive trace is used to fabricate the multilayer conductive trace 100 described in the above embodiments. In the present embodiment, the multi-layer conductive trace 100 is a double-layer conductive trace, and includes a first conductive layer 10 and a second conductive layer 20. The method for manufacturing the multilayer conductive circuit specifically comprises the following steps.

In step S1, a first conductive layer is formed. The manufacturing of the first conductive layer 10 specifically includes the following steps.

Step S102, a first conductive metal film is provided. The first conductive metal film 11 includes, but is not limited to, a copper film, a silver film, etc., and the thickness of the first conductive metal film 11 is 3 to 500 micrometers. Preferably, the first conductive metal film 11 is a copper film.

Step S104, coating an insulation photoresist on one side of the first conductive metal film to form a first insulation photoresist layer on one side of the first conductive metal film. After an insulating photoresist is coated on one surface of the first conductive metal film 11, the insulating photoresist is baked to be cured, thereby forming a first insulating photoresist layer 12. Wherein the insulation photoresist is transparent insulation photoresist, and the baking temperature is 60-150 ℃. The first insulating photoresist layer 12 is formed to have a thickness of 2 to 500 micrometers.

In step S106, the first insulating photoresist layer is etched to form a first window in the first insulating photoresist layer. In this embodiment, a first preset mask is disposed to expose the first insulating photoresist layer 12, and then the first insulating photoresist layer 12 is developed by using a developing solution, so as to etch the first insulating photoresist layer 12, thereby forming first windows 121 corresponding to the first preset mask one to one on the first insulating photoresist layer 12. Wherein the first window 121 includes a plurality. The etched first insulating photoresist layer 12 is heated to cure the first insulating photoresist layer 12. Wherein the heating temperature is below 300 ℃. The first conductive metal film 11 forms a first conductive portion 111 exposed to the first window 121 at a position corresponding to the first window 121.

After step S106 is executed, the manufacturing of the first conductive layer 10 further includes: the first conductive trace 13 is printed on a surface of the first conductive metal film 11 away from the first insulating photoresist layer 12. One surface of the first conductive metal film 11 facing away from the first insulating photoresist layer 12 is provided as a first circuit surface 113, and the first conductive trace 13 is provided in an area of the first circuit surface 113 outside the first conductive part 111. The first conductive traces 13 and the first conductive portions 111 do not overlap each other.

In step S2, a second conductive layer is formed. The manufacturing of the second conductive layer 20 specifically includes the following steps.

Step S202, a second conductive metal film is provided. The second conductive metal film 21 includes, but is not limited to, a copper film, a silver film, etc., and the thickness of the second conductive metal film 21 is 3 to 500 micrometers. Preferably, the second conductive metal film 21 is a copper film.

Step S204, coating an insulating photoresist on one side of the second conductive metal film to form a second insulating photoresist layer on one side of the second conductive metal film. After an insulating photoresist is coated on one surface of the second conductive metal film 21, the insulating photoresist is baked to be cured, thereby forming a second insulating photoresist layer 22. Wherein the insulation photoresist is transparent insulation photoresist, and the baking temperature is 60-150 ℃. The second insulating photoresist layer 22 is formed to have a thickness of 2-500 μm.

In step S206, the second insulating photoresist layer is etched to form a second window on the second insulating photoresist layer. In this embodiment, a first predetermined mask is disposed to expose the second insulating photoresist layer 22, and then the second insulating photoresist layer 22 is developed by using a developing solution to etch the second insulating photoresist layer 22, so as to form second windows 221 corresponding to the first predetermined mask on the second insulating photoresist layer 22. Wherein the second window 221 includes a plurality. It is understood that the number of the second windows 221 is the same as the number of the first windows 121, and the positions of the second windows 221 formed on the second insulating photoresist layer 22 correspond to the positions of the first windows 121 formed on the first insulating photoresist layer 12 in a one-to-one manner. The etched second insulating photoresist layer 22 is heated to cure the second insulating photoresist layer 22. Wherein the heating temperature is below 300 ℃. The second conductive metal film 21 forms a second conductive portion 211 exposed to the second window 221 at a position corresponding to the second window 221.

In step S208, the second conductive metal film is etched to form an opening in the second conductive metal film. In this embodiment, a second predetermined mask is disposed to expose the second conductive metal film 21, and then the second conductive metal film 21 is developed by using a developing solution to etch the second conductive metal film 21, so as to form openings 212 corresponding to the second predetermined mask one by one on the second conductive metal film 21. The opening 212 includes a plurality thereof.

After step S208 is performed, the step of forming the second conductive layer 20 further includes: the second conductive traces 23 are printed on the surface of the second conductive metal film 21 away from the second insulating photoresist layer 22. One surface of the second conductive metal film 21 away from the second insulating photoresist layer 22 is set as a second line surface 213. The second conductive traces 23 are disposed on the second wiring surface 213 in regions other than the second conductive portion 211. Wherein the second conductive traces 23 and the second conductive portions 211 are not overlapped with each other. The second conductive traces 23 may or may not be the same as the first conductive traces 13.

Step S3, the surface of the second conductive metal film away from the second insulating photoresist layer is attached to the surface of the first insulating photoresist layer away from the first conductive metal film. In this embodiment, the insulating photoresist has viscosity, and the first insulating photoresist layer 12 can be heated during the attaching process, so that the second conductive metal film 21 can be attached to the first insulating photoresist layer 12, and the second conductive layer 20 and the first conductive layer 10 are disposed together. The first conductive metal film 11, the first insulating photoresist layer 12, the second conductive metal film 21, and the second insulating photoresist layer 22 are sequentially stacked. The first window 121 and the second window 221 are correspondingly disposed. In some possible embodiments, the first conductive layer 10 and the second conductive layer 20 may be tightly combined by disposing a material having viscosity such as glue between the first conductive layer 10 and the second conductive layer 20.

Step S4, a conductive material is coated on the second window to electrically connect the first conductive portion and the second conductive portion. The step of coating the conductive material 40 on the second window 221 specifically includes the following steps.

In step S402, solder paste is disposed in the second window. In this embodiment, the solder paste is disposed on the second window 221 by printing.

Step S404, the solder paste is heated to be attached to the second conductive portion and to the first conductive portion through the opening. The heated solder paste is molten and has fluidity. Then, the solder paste flows from the second window 221 to be attached to the second conductive portion 211, and then flows to the first window 121 through the opening 212, so that the solder paste is attached to the first conductive portion 111.

Step S406, solidifying the solder paste. In this embodiment, the solder paste may be solidified by cooling. The solidified solder paste penetrates through the second window 221, the opening 212 and the first window 121, so that the first conductive portion 111 and the second conductive portion 211 are electrically connected.

In some possible embodiments, a conductive material such as silver paste may be further disposed in the second window 221 to electrically connect the first conductive portion 111 and the second conductive portion 211.

In the embodiment, the plurality of openings are formed in the second conductive part at one time directly in an etching mode, so that the production efficiency is greatly improved. Meanwhile, the manufacturing flows of the first conducting layer and the second conducting layer are similar, the overall manufacturing process of the multilayer conducting circuit is simple, and the production efficiency can be greatly improved.

In some possible embodiments, multilayer conductive trace 100 further includes at least one third conductive layer 30. The manufacturing process of the third conductive layer 30 is the same as the manufacturing process of the second conductive layer 20, and is not described herein again.

In other possible embodiments, when the first insulating photoresist layer 12 and the second insulating photoresist layer 22 are formed to have a relatively thick thickness, the multilayer conductive circuit 100 can be used to fabricate a small-sized display screen; when the first insulating photoresist layer 12 and the second insulating photoresist layer 22 are formed to have a small thickness, the multi-layer conductive circuit 100 can be used to fabricate a large-sized display panel.

When the thicknesses of the first insulating photoresist layer 12 and the second insulating photoresist layer 22 are relatively thin, in the process of manufacturing the first conductive layer 10, after the etched first insulating photoresist layer 12 is heated to cure the first insulating photoresist layer 12, a protective film (not shown) is laminated on one surface of the first insulating photoresist layer 12 away from the first conductive metal film 11. Accordingly, in the process of manufacturing the second conductive layer 20, after the etched second insulating photoresist layer 22 is heated to cure the second insulating photoresist layer 22, a protective film (not shown) is laminated on a surface of the second insulating photoresist layer 22 away from the second conductive metal film 21. Wherein the protective film is made of high temperature resistant material, and the high temperature resistant temperature range is 140-. Before step S3 is executed, the protective film compounded on the first insulating photoresist layer 12 is removed, and then the first insulating photoresist layer 12 is attached to the second conductive metal film 21.

Please refer to fig. 3, which is a schematic cross-sectional view of a display module according to an embodiment of the present invention. The display module 1000 comprises a plurality of LED lamp beads 200 and a plurality of layers of conductive circuits 100, wherein the plurality of layers of conductive circuits 100 are electrically connected with the plurality of LED lamp beads 200. In this embodiment, the plurality of LED beads 200 are disposed on a surface of the first conductive metal film 11 departing from the first insulating photoresist layer 12, and electrically connected to the first conductive traces 13. The specific structure of the multilayer conductive circuit 100 is described with reference to the above embodiments. Since the display module 1000 adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and details are not repeated herein.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, to the extent that such modifications and variations fall within the scope of the invention and the equivalent techniques thereof, it is intended that the present invention also encompass such modifications and variations.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the following claims.

Claims

1. A multilayer conductive trace, comprising:

2. The multilayer conductive trace of claim 1, further comprising a conductive material disposed in the second window such that the conductive material conforms to the second conductive portion and conforms to the first conductive portion through the opening such that the first conductive portion and the second conductive portion are electrically connected.

3. The multilayer conductive trace according to claim 1, wherein a surface of the first conductive metal film facing away from the first insulating resist layer is provided as a first trace surface provided with a first conductive trace in a region other than the first conductive portion, the first conductive trace and the first conductive portion being not overlapped with each other; one surface of the second conductive metal film, which is far away from the second insulating light resistance layer, is set to be a second line surface, a second conductive circuit is arranged on the second line surface in a region outside the second conductive part, and the second conductive circuit and the second conductive part are not overlapped.

4. The multilayer conductive trace of claim 1, wherein the first window, the second window, and the opening are formed by etching, and the first window, the second window, and the opening comprise a plurality.

5. The multilayer conductive trace of claim 1, further comprising at least one third conductive layer having the same structure as the second conductive layer, the third conductive layer being disposed on a side of the second conductive layer remote from the first conductive layer.

6. The multilayer conductive trace of claim 1, wherein the first conductive metal film and the second conductive metal film are both copper films, and wherein the first conductive metal film and the second conductive metal film each have a thickness of 3 to 500 micrometers.

7. The multilayer conductive trace of claim 1, wherein the first insulating photoresist layer and the second insulating photoresist layer are each made of a transparent insulating photoresist material, and the first insulating photoresist layer and the second insulating photoresist layer are each 2 to 500 μm thick.

8. A display module, characterized in that, the display module includes a plurality of LED lamp pearls and the multilayer conducting circuit of any one of claims 1 to 7, the plurality of LED lamp pearls and the multilayer conducting circuit are electrically connected.