CN217215204U

CN217215204U - High-temperature ceramic packaging socket

Info

Publication number: CN217215204U
Application number: CN202220352506.9U
Authority: CN
Inventors: 何莉; 何辉; 张宝中; 方伟
Original assignee: Sichuan Yonggui Science and Technology Co Ltd
Current assignee: Sichuan Yonggui Science and Technology Co Ltd
Priority date: 2022-02-22
Filing date: 2022-02-22
Publication date: 2022-08-16
Anticipated expiration: 2032-02-22

Abstract

The utility model discloses a high temperature ceramic encapsulation socket, include socket shell and be connected to socket shell one and serve the ceramic cover plate, be fixed with a plurality of contact pin subassemblies in the socket shell, be provided with a plurality of jack subassemblies on the ceramic cover plate, the one end of contact pin subassembly is connected with the one end plug of jack subassembly. This scheme no longer adopts the mode of high temperature encapsulating, has solved traditional in-process complex operation, and assembly efficiency is low, the problem of the qualification rate low (high temperature epoxy is mobile very poor, can not embedment completely, and the product has the risk of short circuit), and the structure through this scheme has realized that ceramic sintering socket subassembly and hat spring jack subassembly are simple, convenient, swift fixed, realize product leak protection and high temperature resistance function.

Description

High-temperature ceramic packaging socket

Technical Field

The utility model relates to a connector field, concretely relates to high temperature ceramic encapsulation socket.

Background

At present ceramic package socket, what adopted is that the encapsulation is carried out to the direct conventional encapsulating mode that carries on, and under general condition, conventional glue can not bear 1000 degrees high temperatures, and high temperature resistant glue is thick very much, and the mobility is poor to lead to the embedment effect bad, has the gap to lead to probably the short circuit. And if the connector is damaged, the product after glue pouring needs to be integrally replaced, and the maintenance and operation of the product in the later period are very inconvenient.

SUMMERY OF THE UTILITY MODEL

The utility model aims at designing a new construction of ceramic package socket, adopting the mode of non-encapsulating to realize the encapsulation to the socket, and realizing the separable structure between connector and the jack, realize the convenience of installation, maintenance in later stage.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a high temperature ceramic encapsulation socket, includes socket shell and is connected to socket shell one and serves ceramic cover plate, the socket shell internal fixation has a plurality of contact pin subassemblies, be provided with a plurality of jack subassemblies on the ceramic cover plate, the one end of contact pin subassembly is connected with the one end plug of jack subassembly.

In the technical scheme, the ceramic cover plate is provided with a plurality of through holes, and each through hole is internally connected with one jack assembly.

In the technical scheme, the jack component comprises a jack body, wherein a crown spring is arranged in the jack body, and one end of the jack body is fixedly connected with the lead through a buckle.

In the technical scheme, the circumference of the jack body is sleeved with the gear sleeve, and the through hole corresponding to the gear sleeve is internally provided with the corresponding groove.

In the technical scheme, the socket is characterized in that the ceramic cover plate is connected with the socket shell through a connecting piece.

In the technical scheme, the socket is characterized in that the connecting piece is a screw, and the ceramic cover plate and the socket shell can be separated from each other.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:

the contact surface between the crown spring structure and the contact pin is close and reliable, and the problem that the connection is unreliable due to the gap between the contact pin and the jack possibly caused in the traditional glue pouring process is avoided.

This scheme no longer adopts the mode of high temperature encapsulating, has solved traditional in-process complex operation, and assembly efficiency is low, the problem of the qualification rate low (high temperature epoxy is mobile very poor, can not embedment completely, and the product has the risk of short circuit), and the structure through this scheme has realized that ceramic sintering socket subassembly and hat spring jack subassembly are simple, convenient, swift fixed, realize product leak protection and high temperature resistance function.

Drawings

The invention will now be described, by way of example, with reference to the accompanying drawings, in which:

FIG. 1 is a schematic structural view of a jack housing;

FIG. 2 is a schematic structural view of a ceramic cover plate;

FIG. 3 is a schematic structural view of a receptacle assembly;

FIG. 4 is a schematic diagram of the overall structure of the present solution;

wherein: the socket comprises a socket shell 1, a contact pin 1-1, a ceramic cover plate 2, a through hole 2-2, a jack component 3, a crown spring 3-1, a jack body 3-2, a gear sleeve 3-3, a screw 4 and a wire fixing clamp 5.

Detailed Description

All of the features disclosed in this specification, or all of the steps of any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

The ceramic socket in this embodiment has three parts, and three parts are mutually independent structures, and the structure through pulling out and inserting structure and fixed connection realizes encapsulating whole socket between the three parts.

As shown in fig. 1, a socket housing 1 in this embodiment is provided, a plurality of pins 1-1 are regularly distributed in the socket housing, the pins 1-1 are fixed inside the socket housing 1 through an insulating member, and two ends of the pins 1-1 respectively extend out of the insulating member.

As shown in fig. 2, the ceramic cover plate 2 in this embodiment is provided with a plurality of through holes 2-2 corresponding to the number and positions of the pins 1-1, and a groove capable of preventing slipping is further provided in the through holes 2-2 for fastening the gear sleeve.

As shown in FIG. 3, the jack assembly 3 in the present embodiment, the jack assembly 3 includes a jack body 3-2, a crown spring 3-1 is disposed in the jack of the jack body 3-2, the other end of the jack body 3-2 is used for connecting a cable, and a gear sleeve 3-3 is annularly sleeved on the circumferential outer wall of the jack body 3-2.

As shown in FIG. 4, when assembling, the socket assembly 3 is inserted into the through hole 2-2 of the ceramic cover plate 2, so that the grooves in the remaining through holes 2-2 of the gear sleeve 3-3 on the socket assembly 3 are matched with each other, thereby preventing the socket assembly 3 from falling off from the through hole 2-2. Then, the whole ceramic cover plate 2 is butted with the socket shell 1, so that the contact pin 1-1 is inserted into the jack body 3-2 in the through hole 2-2, the contact pin 1-1 is reliably connected with the jack body 3-2 through the crown spring 3-1, and finally the ceramic cover plate 2 is fixedly connected with the socket shell 1 through the screw 4. The wire fixing clip 5 tightens the wires together, and one end of the wire fixing clip 5 is connected to the ceramic cover plate 2, thereby completing the integral packaging of the embodiment.

The present invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification, and to any novel method or process steps or any novel combination of features disclosed.

Claims

1. The utility model provides a high temperature ceramic package socket, its characterized in that includes socket shell and is connected to socket shell one and serves ceramic cover plate, the socket shell internal fixation has a plurality of contact pin subassemblies, be provided with a plurality of jack subassemblies on the ceramic cover plate, the one end of contact pin subassembly is connected with the one end plug of jack subassembly.

2. A high temperature ceramic package socket as claimed in claim 1, wherein the ceramic cover plate has a plurality of through holes, and each through hole is connected to a socket assembly.

3. A high temperature ceramic package socket according to claim 1 or 2, wherein the socket assembly comprises a socket body, a crown spring is disposed in the socket body, and one end of the socket body is fixedly connected to the lead by a snap.

4. The high-temperature ceramic package socket as claimed in claim 3, wherein the socket body is provided with a gear sleeve around the circumference thereof, and a corresponding groove is formed in the through hole corresponding to the gear sleeve.

5. A high temperature ceramic package socket as claimed in claim 1, wherein the ceramic cover plate is connected to the socket housing by a connecting member.

6. A high-temperature ceramic package socket as claimed in claim 5, wherein the connecting member is a screw, and the ceramic cover plate and the socket housing are separable from each other.