CN217183681U

CN217183681U - Heat radiator

Info

Publication number: CN217183681U
Application number: CN202220220797.6U
Authority: CN
Inventors: 胡爱国
Original assignee: Dongguan Sitshan Tiger Electronic Technology Co ltd
Current assignee: Dongguan Sitshan Tiger Electronic Technology Co ltd
Priority date: 2022-01-26
Filing date: 2022-01-26
Publication date: 2022-08-12
Anticipated expiration: 2032-01-26

Abstract

The application discloses radiator for hand-held type electronic equipment heat dissipation such as cell-phone includes: the cooling device comprises a shell assembly, a cooling assembly and a power supply assembly; the shell assembly is provided with a connecting unit, the connecting unit is used for configuring the radiator on a target object to be radiated, and the shell assembly is provided with a shell radiating side; the cooling assembly is provided with a refrigerating part and a radiating unit, the refrigerating part is used for cooling the radiating side of the shell, and the radiating unit is used for accelerating the radiation of the refrigerating part; the heat dissipation unit comprises a heat dissipation component, a fan component and an air guide component, the heat dissipation unit is provided with a heat dissipation unit air inlet part and a heat dissipation unit air outlet part, and the shell component is provided with a shell air inlet part corresponding to the heat dissipation unit air inlet part and a shell air outlet part corresponding to the heat dissipation unit air outlet part; the fan component is used for driving airflow to pass through the heat dissipation unit, and enabling the airflow to enter from the air inlet part of the shell and be discharged from the air outlet part of the shell; the power supply assembly is electrically connected with the cooling assembly and used for providing electric energy for the cooling assembly.

Description

Heat radiator

Technical Field

The application relates to the field of 3C electronic accessories, in particular to a radiator.

Background

The handheld electronic product, such as a mobile phone, generates a large amount of heat during high-load operation, for example, when playing a game, a CPU and a GPU of the mobile phone are in a high-load state during the game playing process, the mobile phone generates a large amount of heat in a short time, if the high-load state is continuously maintained, the mobile phone cannot dissipate heat in time, the CPU and the GPU of the mobile phone may have a down-conversion operation state, and the down-conversion operation may cause the mobile phone to be stuck, which may affect the use experience of the mobile phone.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems existing in the related art, the application provides a radiator which is provided with a radiating unit and can radiate a refrigerating part of the radiator so as to improve the cooling effect of the refrigerating part on the radiating side of a shell.

In order to solve the technical problem, the technical scheme adopted by the application is as follows:

a heat radiator is provided, which is used for heat radiation of handheld electronic equipment such as mobile phones and the like, and comprises: the cooling device comprises a shell assembly, a cooling assembly and a power supply assembly; the shell assembly is provided with a connecting unit, the connecting unit is used for configuring the radiator on a target object to be radiated, the shell assembly is provided with a shell radiating side, and the shell radiating side is used for cooling the target object to be radiated; the cooling component is provided with a refrigeration part and a heat dissipation unit, the refrigeration part is used for cooling the heat dissipation side of the shell, and the heat dissipation unit is used for accelerating the heat dissipation of the refrigeration part; the heat dissipation unit comprises a heat dissipation component, a fan component and an air guide component, the heat dissipation unit is provided with a heat dissipation unit air inlet part and a heat dissipation unit air outlet part, and the shell component is provided with a shell air inlet part corresponding to the heat dissipation unit air inlet part and a shell air outlet part corresponding to the heat dissipation unit air outlet part; the fan component is used for driving airflow to pass through the heat dissipation unit, and enabling the airflow to enter from the air inlet part of the shell and be discharged from the air outlet part of the shell; the power supply assembly is electrically connected with the cooling assembly and used for providing electric energy for the cooling assembly.

Preferably, the cooling assembly is provided with a heat conducting sheet and a semiconductor refrigerating sheet, and the semiconductor refrigerating sheet is used as the refrigerating component; the heat conducting fins are arranged on the shell assembly, one outward side of each heat conducting fin serves as the heat radiating side, the other side of each heat conducting fin is in heat conduction connection with the cooling side of the semiconductor refrigerating fin, and the heating side of the semiconductor refrigerating fin is in heat conduction connection with the heat radiating part; the air guide part is provided with an air guide part air inlet part and an air guide part air outlet part, and the air guide part air inlet part is used as the air inlet part of the heat dissipation unit; the heat dissipation part is provided with a plurality of heat dissipation flow channels, and each heat dissipation flow channel is provided with a heat dissipation part air inlet part and a heat dissipation part air outlet part; the heat radiation member air outlet part is used as the heat radiation unit air outlet part and the shell air outlet part are in butt joint, and the heat radiation member air inlet part is in butt joint with the air outlet part of the air guide member.

Preferably, the air guide member has an air guide member accommodating cavity, and the fan member is mounted to the air guide member and disposed in the air guide member accommodating cavity.

Preferably, the heat dissipation member includes a heat dissipation base plate and a plurality of heat dissipation fins formed at a lower end of the heat dissipation base plate, and the heat dissipation grooves between the heat dissipation fins serve as the heat dissipation flow channels.

Preferably, the air guide part comprises an air guide front shell and an air guide bottom shell which are mounted in a buckling manner; the periphery of the air guide component is provided with an opening as an air inlet part of the air guide member, and the upper end surface of the air guide front shell is provided with an opening as an air outlet part of the air guide member; the casing is installed in casing subassembly before the air guide, and the upper end butt of casing before the air guide is kept away from in heat radiation fins the one end of radiating bottom plate, so that radiating groove bottom opening is as radiating piece air inlet portion radiating groove outside opening is as radiating piece air-out portion.

Preferably, the heat dissipation fins cover an opening formed in the upper end surface of the air guide front shell.

Preferably, the fan component comprises a fan blade, and the fan blade is a turbine fan blade, so as to drive the air flow to enter from the periphery of the fan blade and to be discharged from the axial direction of the fan blade.

Preferably, the housing assembly comprises a front housing, the outer side of the front housing being the heat dissipation side of the housing; the shell assembly is provided with a clamping component as a connecting unit, the clamping component comprises a first clamping component and a second clamping component, at least the first clamping component is movably arranged on the shell and an elastic component is arranged between the first clamping component and the shell assembly, and the elastic component is used for driving the first clamping component to approach the second clamping component based on the shell assembly.

Preferably, the power supply assembly comprises a power supply control component and a battery compartment detachably connected to the housing assembly; the power supply control part is electrically connected with the heat dissipation assembly, a display part is arranged on the periphery of the shell assembly, and the display part is controlled by the power supply control part and is used for displaying the state information of the heat sink; an energy storage component is arranged in the battery compartment, and the energy storage component arranged in the battery compartment of the shell assembly is electrically connected with the power supply control component.

Preferably, the battery compartment is clamped in a shell clamping groove formed in the shell component through a compartment body clamping buckle arranged on the battery compartment, so that the battery compartment is detachably mounted on the shell component; the battery compartment is provided with a power supply contact, correspondingly, the power supply control component is provided with a power taking probe, and the power supply contact is in contact with the electric core of the power taking probe so as to electrically connect the energy storage component with the power supply control component.

The technical scheme provided by the application can comprise the following beneficial effects: a heat radiator is provided, which is used for heat radiation of handheld electronic equipment such as mobile phones and the like, and comprises: the cooling device comprises a shell assembly, a cooling assembly and a power supply assembly; the shell assembly is provided with a connecting unit, the connecting unit is used for configuring the radiator on a target object to be radiated, the shell assembly is provided with a shell radiating side, and the shell radiating side is used for cooling the target object to be radiated; the cooling assembly is provided with a refrigerating part and a radiating unit, the refrigerating part is used for cooling the radiating side of the shell, and the radiating unit is used for accelerating the radiation of the refrigerating part; the heat dissipation unit comprises a heat dissipation component, a fan component and an air guide component, the heat dissipation unit is provided with a heat dissipation unit air inlet part and a heat dissipation unit air outlet part, and the shell component is provided with a shell air inlet part corresponding to the heat dissipation unit air inlet part and a shell air outlet part corresponding to the heat dissipation unit air outlet part; the fan component is used for driving airflow to pass through the heat dissipation unit, and enabling the airflow to enter from the air inlet part of the shell and be discharged from the air outlet part of the shell; the power supply assembly is electrically connected with the cooling assembly and used for providing electric energy for the cooling assembly. The radiator is provided with a heat dissipation unit, and can dissipate heat of a refrigeration part of the radiator to improve the cooling effect of the refrigeration part on the heat dissipation side of the shell.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.

Fig. 1 is a schematic view 1 of the overall structure shown in embodiment 1 of the present application.

Fig. 2 is a schematic view 2 of the overall structure shown in embodiment 1 of the present application.

Fig. 3 is a schematic view 3 of the overall structure shown in embodiment 1 of the present application.

Fig. 4 is a schematic sectional view at B-B in fig. 3 according to embodiment 1 of the present application.

Fig. 5 is an exploded view of the entire structure shown in embodiment 1 of the present application.

Fig. 6 is a schematic view showing the assembly of the holding member in embodiment 1 of the present application.

Fig. 7 is a schematic view of the assembly of the semiconductor chilling plate shown in embodiment 1 of the present application.

Fig. 8 is an exploded view of a semiconductor chilling plate shown in embodiment 1 of the present application.

Fig. 9 is a schematic view of a battery pack shown in embodiment 1 of the present application.

Description of the reference numerals

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through the communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.

Example 1

Referring to fig. 1 to 9, a heat sink for dissipating heat of a handheld electronic device such as a mobile phone includes: a housing assembly 100, a cooling assembly and a power supply assembly 300; the shell assembly 100 is provided with a connecting unit, the connecting unit is used for configuring the radiator on a target object to be radiated, the shell assembly 100 is provided with a shell radiating side 102, and the shell radiating side 102 is used for cooling the target object to be radiated; the cooling component is provided with a refrigerating part and a heat dissipation unit, the refrigerating part is used for cooling the heat dissipation side 102 of the shell, and the heat dissipation unit is used for accelerating the heat dissipation of the refrigerating part; the heat dissipation unit comprises a heat dissipation part 207, a fan part 213 and an air guide part 214, the heat dissipation unit is provided with a heat dissipation unit air inlet part and a heat dissipation unit air outlet part, the shell assembly 100 is provided with a shell air inlet part 103 corresponding to the heat dissipation unit air inlet part and a shell air outlet part 104 corresponding to the heat dissipation unit air outlet part; the fan component 213 is used for driving the airflow to pass through the heat dissipation unit, and making the airflow enter from the housing air inlet part 103 and be discharged from the housing air outlet part 104; the power supply assembly 300 is electrically connected to the cooling assembly and is used for providing electric energy to the cooling assembly.

Specifically, the cooling assembly is provided with a heat conducting sheet 202 and a semiconductor refrigerating sheet 203; in this embodiment, in order to make the heat conducting plate 202 and the semiconductor chilling plate 203 fully contact to improve the heat conducting effect, a heat conducting silicone sheet 201 is arranged between the heat conducting plate 202 and the semiconductor chilling plate 203; the semiconductor refrigeration piece 203 is used as the refrigeration component; the heat conducting sheet 202 is disposed on the housing assembly 100, one side of the heat conducting sheet 202 facing outward serves as the heat radiating side, the other side of the heat conducting sheet 202 is connected to the cooling side of the semiconductor cooling sheet 203 in a heat conducting manner, and the heating side of the semiconductor cooling sheet 203 is connected to the heat radiating member 207 in a heat conducting manner; the air guiding component 214 is provided with an air guiding component air inlet part 215 and an air guiding component air outlet part 216, and the air guiding component air inlet part 215 is used as the air inlet part of the heat dissipation unit; the heat dissipation component 207 is provided with a plurality of heat dissipation flow channels 210, and each heat dissipation flow channel 210 is provided with a heat dissipation component air inlet part 211 and a heat dissipation component air outlet part 212; the heat dissipation member air outlet part 212 serves as the heat dissipation unit air outlet part and the shell air outlet part 104 are in butt joint, the heat dissipation member air inlet part 211 and the air guide member air outlet part 216 are in butt joint, the structure is used for enabling the heat dissipation member 207 to dissipate heat at an accelerated speed, and enabling heat dissipation airflow to form an independent air channel, so that influence on other electronic components in the shell caused by hot air is avoided, or influence on use experience caused by temperature rise of the shell is avoided.

The air guide member 214 forms an air guide member accommodating cavity, and the fan member 213 is mounted on the air guide member 214 and disposed in the air guide member accommodating cavity. Unlike the fan member 213 directly mounted to the heat dissipation member 207, the advantage of mounting the fan member 213 to the air guiding member 214 is also shown in that the vibration of the fan is not directly transmitted to the heat conductive sheet 202, and the air guiding member 214 can play a role of shock absorption.

Regarding the heat dissipation member 207, the heat dissipation member 207 includes a heat dissipation base plate 208 and a plurality of heat dissipation fins 209 formed at a lower end of the heat dissipation base plate 208, and heat dissipation grooves between the heat dissipation fins 209 serve as the heat dissipation flow channels 210.

Specifically, the air guide part 214 includes an air guide front shell and an air guide bottom shell which are mounted in a snap-fit manner; an opening is arranged on the periphery of the air guide component 214 and serves as an air inlet part 215 of the air guide component, and an opening is arranged on the upper end face of the air guide front shell and serves as an air outlet part 216 of the air guide component; the front shell of the air guide element is mounted on the shell assembly 100, the upper end of the front shell of the air guide element is abutted to one end, away from the heat dissipation bottom plate 208, of the heat dissipation fins 209, so that the bottom opening of the heat dissipation groove serves as the air inlet portion 211 of the heat dissipation piece, and the outer opening of the heat dissipation groove serves as the air outlet portion 212 of the heat dissipation piece.

In order to reduce or prevent air leakage from the joint between the air outlet part 216 of the air guide member and the air inlet part 211 of the heat dissipation member, which affects other components in the housing, and also reduces the air pressure and flow rate of the heat dissipation airflow to affect the heat dissipation effect, the heat dissipation fins 209 cover the opening formed in the upper end surface of the air guide front housing.

More specifically, the fan part 213 includes fan blades, and the fan blades are turbine fan blades, so as to drive the air flow to enter from the periphery of the fan blades and to be discharged from the axial direction of the fan blades.

On the other hand, the housing assembly 100 includes, as an example, a front case, an outer side of which is the housing heat radiation side 102; the housing assembly 100 is configured with a clamping member as a connection unit, the clamping member includes a first clamping member 105 and a second clamping member 106, at least the first clamping member 105 is movably configured on the housing, and an elastic member 110 is disposed between the first clamping member 105 and the housing assembly 100, the elastic member 110 is used for driving the first clamping member 105 to approach the second clamping member 106 based on the housing assembly 100.

Meanwhile, the power supply assembly 300 includes not only a power receiving interface but also a battery compartment 302 in the present application, where the power receiving interface may be, but not limited to, a USB-C interface, so that the heat sink can be used independently without external power supply, and in the using process, the electromagnetic compartment is designed to be replaceable, which can meet the requirement of a user to replace the battery compartment 302 quickly, and reserve multiple battery compartments 302, which can improve the use experience, specifically, the power supply assembly 300 includes a power supply control component 301 and a battery compartment 302 detachably connected to the housing assembly 100; the power supply control part 301 is electrically connected with the heat dissipation assembly, the display part 109 is arranged on the periphery of the shell assembly 100, and the display part 109 is controlled by the power supply control part 301 and is used for displaying the state information of the heat sink; an energy storage component 303 is disposed in the battery compartment 302, and the energy storage component 303 mounted in the battery compartment 302 of the housing assembly 100 is electrically connected to the power supply control component 301.

In order to facilitate the detachment of the battery compartment 302, and the battery compartment 302 is electrically connected to the power supply control component 301, the battery compartment 302 is clamped in the housing clamping slot 107 of the housing assembly 100 through the compartment body buckle 304 arranged on the battery compartment 302, so that the battery compartment 302 is detachably mounted on the housing assembly 100; the battery compartment 302 is provided with a power supply contact 305, and correspondingly, the power supply control component 301 is provided with a power taking probe 108, which is in electrical contact with the power taking probe 108 through the power supply contact 305, so that the energy storage component 303 is electrically connected with the power supply control component 301.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is a more detailed description of the present application in connection with specific embodiments thereof, and it is not intended that the present application be limited to the specific embodiments thereof. It will be apparent to those skilled in the art from this disclosure that many more simple derivations or substitutions can be made without departing from the spirit of the disclosure.

Claims

1. A heat sink for dissipating heat from a handheld electronic device, comprising: the cooling device comprises a shell assembly, a cooling assembly and a power supply assembly;

the shell assembly is provided with a connecting unit, the connecting unit is used for configuring the radiator on a target object to be radiated, the shell assembly is provided with a shell radiating side, and the shell radiating side is used for cooling the target object to be radiated;

the cooling assembly is provided with a refrigerating part and a radiating unit, the refrigerating part is used for cooling the radiating side of the shell, and the radiating unit is used for accelerating the radiation of the refrigerating part;

the heat dissipation unit comprises a heat dissipation component, a fan component and an air guide component, the air guide component is provided with an air guide component accommodating cavity, the fan component is arranged in the air guide component accommodating cavity of the air guide component, the heat dissipation unit is provided with a heat dissipation unit air inlet part and a heat dissipation unit air outlet part, and the shell assembly is provided with a shell air inlet part corresponding to the heat dissipation unit air inlet part and a shell air outlet part corresponding to the heat dissipation unit air outlet part;

the fan component is used for driving airflow to pass through the heat dissipation unit, and enabling the airflow to enter from the air inlet part of the shell and be discharged from the air outlet part of the shell;

the power supply assembly is electrically connected with the cooling assembly and used for providing electric energy for the cooling assembly.

2. The radiator of claim 1, wherein the cooling assembly is provided with a heat conducting sheet and a semiconductor refrigerating sheet, and the semiconductor refrigerating sheet is used as the refrigerating component;

the heat conducting fins are arranged on the shell assembly, one outward side of each heat conducting fin serves as the heat radiating side, the other side of each heat conducting fin is in heat conduction connection with the cooling side of the semiconductor refrigerating fin, and the heating side of the semiconductor refrigerating fin is in heat conduction connection with the heat radiating part;

the air guide part is provided with an air guide part air inlet part and an air guide part air outlet part, and the air guide part air inlet part is used as the air inlet part of the heat dissipation unit;

the heat dissipation part is provided with a plurality of heat dissipation flow channels, and each heat dissipation flow channel is provided with a heat dissipation part air inlet part and a heat dissipation part air outlet part;

the heat radiation member air outlet part is used as the heat radiation unit air outlet part and the shell air outlet part are in butt joint, and the heat radiation member air inlet part is in butt joint with the air outlet part of the air guide member.

3. The heat sink as claimed in claim 2, wherein the air guide member has an air guide receiving chamber formed therein, and the fan member is mounted to the air guide member and disposed in the air guide receiving chamber.

4. The heat sink as claimed in claim 2, wherein the heat dissipating member comprises a heat dissipating base plate and a plurality of heat dissipating fins formed at a lower end of the heat dissipating base plate, and the heat dissipating grooves between the heat dissipating fins serve as the heat dissipating flow paths.

5. The heat sink as claimed in claim 4, wherein the air guiding component comprises a front air guiding shell and a bottom air guiding shell which are snap-fitted;

the periphery of the air guide component is provided with an opening as an air inlet part of the air guide member, and the upper end surface of the air guide front shell is provided with an opening as an air outlet part of the air guide member;

the casing is installed in casing subassembly before the air guide, and the upper end butt of casing before the air guide is kept away from in heat radiation fins the one end of radiating bottom plate, so that radiating groove bottom opening is as radiating piece air inlet portion radiating groove outside opening is as radiating piece air-out portion.

6. The heat sink as claimed in claim 5, wherein the heat dissipating fins cover an opening provided on an upper end surface of the air guide front case.

7. The heat sink as claimed in claim 5, wherein the fan member comprises a fan blade, and the fan blade is a turbine fan blade, so as to drive the air flow into the periphery of the fan blade and out of the axial direction of the fan blade.

8. The heat sink of claim 1, wherein the housing assembly comprises a front housing, an outer side of the front housing being the housing heat sink side;

the shell assembly is provided with a clamping component as a connecting unit, the clamping component comprises a first clamping component and a second clamping component, at least the first clamping component is movably arranged on the shell and an elastic component is arranged between the first clamping component and the shell assembly, and the elastic component is used for driving the first clamping component to approach the second clamping component based on the shell assembly.

9. The heat sink of claim 1, wherein the power supply assembly includes a power supply control component and a battery compartment removably connected to the housing assembly;

the power supply control part is electrically connected with the heat dissipation assembly, a display part is arranged on the periphery of the shell assembly, and the display part is controlled by the power supply control part and is used for displaying the state information of the heat sink;

an energy storage component is arranged in the battery compartment, and the energy storage component arranged in the battery compartment of the shell assembly is electrically connected with the power supply control component.

10. The heat sink according to claim 9, wherein the battery compartment is snap-fitted into a housing slot of the housing assembly through a compartment body snap provided thereon, so that the battery compartment is detachably mounted to the housing assembly;

the battery compartment is provided with a power supply contact, correspondingly, the power supply control component is provided with a power taking probe, and the power supply contact is in contact with the electric core of the power taking probe so as to electrically connect the energy storage component with the power supply control component.