CN217183532U - Double-layer flexible circuit board with high bending performance - Google Patents
Double-layer flexible circuit board with high bending performance Download PDFInfo
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- CN217183532U CN217183532U CN202123076945.6U CN202123076945U CN217183532U CN 217183532 U CN217183532 U CN 217183532U CN 202123076945 U CN202123076945 U CN 202123076945U CN 217183532 U CN217183532 U CN 217183532U
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Abstract
The utility model discloses a double-layer flexible circuit board with high bending performance, the bending area is used for bending the flexible circuit board, because the lower surface and the upper surface of the circuit board body in the bending area are respectively provided with a first hollowed part and a second hollowed part, the first hollowed part is hollowed to the lower surface of a first metal routing layer, the second hollowed part is hollowed to the upper surface of a second insulating PI layer, so that the thickness of the circuit board body in the bending area is greatly reduced, the bending capability of the circuit board body is improved, and because the lower surface of the first metal routing layer in the first hollowed part is provided with a first insulating green oil layer, the original first insulating PI layer is replaced by the first insulating green oil layer, under the condition of ensuring the insulating performance of the flexible circuit board, the thickness of the bending area is reduced, the flexibility of the bending area is further optimized, a third insulating PI layer extends to the side surface of the second metal routing layer in the second hollowed part, so as to ensure the insulation of the side surface of the second metal routing layer.
Description
Technical Field
The utility model relates to a printed circuit board technical field, more specifically say, relate to a double-deck flexible printed circuit board with high bending performance.
Background
The flexible circuit board, namely the FPC, is widely used in the mobile phone industry, but in the use process, a customer often feeds back that the flexible circuit board is not soft enough, the use is not convenient enough, and the bending performance is to be improved urgently to meet the bending requirement for use.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is to provide a double-layer flexible printed circuit board with high bending performance, the bending area is used for bending the flexible printed circuit board, because the lower surface and the upper surface of the circuit board body in the bending area are respectively provided with a first hollowed part and a second hollowed part, the first hollowed part is hollowed to the lower surface of the first metal routing layer, the second hollowed part is hollowed to the upper surface of the second insulated PI layer, so that the thickness of the circuit board body in the bending area is greatly reduced, the bending capability of the circuit board body is improved, and because the lower surface of the first metal routing layer in the first hollowed part is provided with a first insulated green oil layer, the original first insulated PI layer is replaced by the first insulated green oil layer, under the condition of ensuring the insulating performance of the flexible printed circuit board, the thickness of the bending area is reduced, the flexibility of the bending area is further optimized, the third insulated PI layer extends to the side surface of the second metal routing layer in the second hollowed part, so as to ensure the insulation of the side surface of the second metal routing layer. The utility model provides a pair of double-deck flexible printed circuit board with high bending property can reduce the thickness in district of buckling by a wide margin, improves the compliance in district of buckling to satisfy customer's growing compliance demand, promote the competitiveness of product.
The utility model discloses the technical problem that will solve realizes through following technical scheme:
in order to solve the technical problem, the utility model provides a double-layer flexible printed circuit board with high bending performance, which comprises a printed circuit board body, wherein the printed circuit board body comprises a first insulation PI layer, a first metal routing layer, a second insulation PI layer, a second metal routing layer and a third insulation PI layer which are sequentially overlapped from bottom to top, the printed circuit board body comprises a first working area, a bending area and a second working area which are sequentially arranged from left to right, the lower surface and the upper surface of the printed circuit board body positioned in the bending area are respectively provided with a first hollowed part and a second hollowed part, the first hollowed part is hollowed to the lower surface of the first metal routing layer, the lower surface of the first metal routing layer positioned in the first hollowed part is provided with a first insulation green oil layer, the second hollowed part is hollowed to the upper surface of the second insulation PI layer, and the third insulating PI layer extends to the side face of the second metal routing layer positioned at the second hollowed part.
In a preferred embodiment, the second hollow portion is hollowed to an upper surface of the first metal wiring layer, and a second insulating green oil layer is provided on the upper surface of the first metal wiring layer located in the second hollow portion.
As a preferred embodiment, the lower surfaces of the first insulating PI layers located in the first working area and the second working area are provided with red ink layers.
As a preferred embodiment, a through hole penetrating through the first insulating PI layer, the first metal routing layer, the second insulating PI layer, the second metal routing layer, and the third insulating PI layer is formed in the circuit board body located in the first working area, and a heat conduction layer contacting with the first metal routing layer and the second metal routing layer is disposed on an inner wall of the through hole.
In a preferred embodiment, a heat conductor connected to an external heat conducting structure is disposed in the through hole, and the heat conductor is in contact with the heat conducting layer.
As a preferred embodiment, a black ink layer and a white ink layer disposed on the black ink layer are disposed on the upper surface of the third insulating PI layer located in the first working area, and the white ink layer is laser-formed with a two-dimensional code.
In a preferred embodiment, the thickness of the black ink layer is 30 to 40 μm.
In a preferred embodiment, the thickness of the white ink layer is 10 to 20 μm.
As a preferred embodiment, the circuit board body located in the bending region is provided with a plurality of through holes, the central connecting line of the through holes is perpendicular to the bending direction, and the through holes avoid the circuit region.
As a preferred embodiment, the through holes are round holes, a connection line of circle centers of the round holes is perpendicular to the bending direction, a semicircular hole or a U-shaped hole is arranged at an edge of the circuit board body located in the bending area, and the center of the semicircular hole or the U-shaped hole is located on the connection line of the circle centers.
The utility model discloses following beneficial effect has:
the bending area is used for bending the flexible circuit board, as the lower surface and the upper surface of the circuit board body positioned in the bending area are respectively provided with a first hollowed part and a second hollowed part, the first hollowed part is hollowed to the lower surface of the first metal routing layer, the second hollowed part is hollowed to the upper surface of the second insulating PI layer, so that the thickness of the circuit board body in the bending area is greatly reduced, the bending capability of the circuit board body is improved, and because the lower surface of the first metal routing layer positioned in the first hollowed part is provided with the first insulating green oil layer, the original first insulating PI layer is replaced by the first insulating green oil layer, under the condition of guaranteeing flexible circuit board insulating properties, reduced the thickness in bending zone, and then optimized the compliance in bending zone, third insulating PI layer extends to the side that is located the second metal routing layer of second hollowed portion to guarantee the insulating nature of the side on second metal routing layer. The utility model provides a pair of double-deck flexible printed circuit board with high bending property can reduce the thickness in district of buckling by a wide margin, improves the compliance in district of buckling to satisfy customer's growing compliance demand, promote the competitiveness of product.
Drawings
Fig. 1 is a schematic structural diagram of a double-layer flexible printed circuit board with high bending performance according to the present invention.
Fig. 2 is a schematic structural view of embodiment 2.
Fig. 3 is a schematic structural view of embodiment 3.
Fig. 4 is a schematic structural view of embodiment 4.
FIG. 5 is a schematic structural view of example 5.
Fig. 6 is a schematic structural view of embodiment 6.
Detailed Description
The invention is described in detail below with reference to the drawings and embodiments, examples of which are illustrated in the drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and "disposed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the interconnection of two elements or through the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Example 1
Please refer to fig. 1, which is a double-layer flexible printed circuit board with high bending performance provided by the present invention, comprising a printed circuit board body, wherein the printed circuit board body comprises a first insulating PI layer 1, a first metal routing layer 2, a second insulating PI layer 3, a second metal routing layer 4 and a third insulating PI layer 5 sequentially stacked from bottom to top, the printed circuit board body comprises a first working area 100, a bending area 200 and a second working area 300 sequentially stacked from left to right, a first hollowed portion 201 and a second hollowed portion 202 are respectively disposed on the lower surface and the upper surface of the printed circuit board body in the bending area 200, the first hollowed portion 201 is hollowed to the lower surface of the first metal routing layer 2, a first insulating green oil layer 6 is disposed on the lower surface of the first metal routing layer 2 in the first hollowed portion 201, and the second hollowed portion 202 is hollowed to the upper surface of the second insulating PI layer 3, the third insulating PI layer 5 extends to the side of the second metal wiring layer 3 located in the second hollow portion 202. The bending area 200 is used for bending the flexible circuit board, because the lower surface and the upper surface of the circuit board body positioned in the bending area 200 are respectively provided with a first hollowed part 201 and a second hollowed part 202, the first hollowed part 201 is hollowed to the lower surface of the first metal routing layer 2, the second hollowed part 202 is hollowed to the upper surface of the second insulating PI layer 3, so that the thickness of the circuit board body of the bending area 200 is greatly reduced, the bending capability of the circuit board body is improved, and because the lower surface of the first metal routing layer 2 positioned in the first hollowed part 201 is provided with a first insulating green oil layer 6, the original first insulating PI layer 1 is replaced by the first insulating green oil layer 6, under the condition of ensuring the flexible insulating performance, the thickness of the bending area 200 is reduced, the flexibility of the bending area 200 is further optimized, the third insulating PI layer 5 extends to the side surface of the second metal routing layer 3 positioned in the second hollowed part 202, to ensure insulation of the side surfaces of second metal wiring layer 3. The utility model provides a pair of double-deck flexible printed circuit board with high bending property can reduce bending region 200's thickness by a wide margin, improves bending region 200's compliance to satisfy customer's growing compliance demand, promote the competitiveness of product.
Example 2
Referring to fig. 2, another double-layer flexible printed circuit board with high bending performance provided by the present invention comprises a printed circuit board body, wherein the printed circuit board body comprises a first insulating PI layer 1, a first metal routing layer 2, a second insulating PI layer 3, a second metal routing layer 4 and a third insulating PI layer 5, which are sequentially stacked from bottom to top, the printed circuit board body comprises a first working area 100, a bending area 200 and a second working area 300, which are sequentially disposed from left to right, a first hollowed portion 201 and a second hollowed portion 202 are respectively disposed on the lower surface and the upper surface of the printed circuit board body in the bending area 200, the first hollowed portion 201 is hollowed to the lower surface of the first metal routing layer 2, a first insulating green oil layer 6 is disposed on the lower surface of the first hollowed portion 201, and the second hollowed portion 202 is hollowed to the upper surface of the second insulating PI layer 3, the third insulating PI layer 5 extends to the side of the second metal wiring layer 3 located in the second hollow portion 202. The bending area 200 is used for bending the flexible circuit board, because the lower surface and the upper surface of the circuit board body positioned in the bending area 200 are respectively provided with a first hollowed part 201 and a second hollowed part 202, the first hollowed part 201 is hollowed to the lower surface of the first metal routing layer 2, the second hollowed part 202 is hollowed to the upper surface of the second insulating PI layer 3, so that the thickness of the circuit board body of the bending area 200 is greatly reduced, the bending capability of the circuit board body is improved, and because the lower surface of the first metal routing layer 2 positioned in the first hollowed part 201 is provided with a first insulating green oil layer 6, the original first insulating PI layer 1 is replaced by the first insulating green oil layer 6, under the condition of ensuring the flexible insulating performance, the thickness of the bending area 200 is reduced, the flexibility of the bending area 200 is further optimized, the third insulating PI layer 5 extends to the side surface of the second metal routing layer 3 positioned in the second hollowed part 202, to ensure insulation of the side surfaces of second metal wiring layer 3. The utility model provides a pair of double-deck flexible printed circuit board with high bending property can reduce bending region 200's thickness by a wide margin, improves bending region 200's compliance to satisfy customer's growing compliance demand, promote the competitiveness of product. The present embodiment is different from the above embodiments in that, in the present embodiment, the second hollowed portion 202 is hollowed to the upper surface of the first metal routing layer 2, and a second insulating green oil layer 7 is disposed on the upper surface of the first metal routing layer 2 of the second hollowed portion 202, so as to further reduce the thickness of the bending region 200 and improve the flexibility of the bending region 200.
Example 3
Referring to fig. 3, the difference between this embodiment and the above embodiments is that in this embodiment, a red ink layer 8 is disposed on the lower surface of the first insulating PI layer 1 in the first working area 100 and the second working area 300, and the red ink layer 8 can be used as a way to distinguish the front surface and the back surface of the circuit board body to perform a fool-proofing function.
Example 4
Referring to fig. 4, a difference between the present embodiment and the above-mentioned embodiment is that in the present embodiment, a through hole 9 penetrating through the first insulating PI layer 1, the first metal routing layer 2, the second insulating PI layer 3, the second metal routing layer 4 and the third insulating PI layer 5 is formed on the circuit board body in the first working area 100, a heat conduction layer contacting the first metal routing layer 2 and the second metal routing layer 4 is disposed on an inner wall of the through hole 9, and the heat conduction layer can provide a heat conduction function by utilizing a good heat conduction performance at the through hole 9, so as to achieve a good heat dissipation effect. Further, the heat conducting layer can be a copper paste conductive ink layer.
As a preferred embodiment, a heat conductor connected to an external heat conducting structure is disposed in the through hole 9, and the heat conductor is in contact with the heat conducting layer, so that the first metal wiring layer 2 and the second metal wiring layer 3 can be connected to the external heat conducting structure through the through hole 9, and thus heat in the flexible printed circuit board is diffused to the external heat conducting structure through the heat conductor in the through hole 9, so as to further improve the heat dissipation efficiency of the flexible printed circuit board. Preferably, the through hole 9 is disposed at an edge of the flexible printed circuit board so that the through hole 9 can be connected to an external heat conducting structure.
Example 5
Referring to fig. 5, the embodiment is different from the above embodiment in that a black ink layer 10 and a white ink layer 11 disposed on the black ink layer 10 are disposed on the upper surface of the third insulating PI layer 5 in the first working area 100, the white ink layer 11 is formed into a two-dimensional code by laser, and due to the two layers of ink of the black ink layer 10 and the white ink layer 11, the white ink layer 11 on the surface layer is laser-removed by laser to expose the black ink layer 10 on the bottom layer, and the laser-removed area is displayed as black.
In a preferred embodiment, the thickness of the black ink layer 10 is 30 to 40 μm, and the thickness of the white ink layer 11 is 10 to 20 μm. The thickness is just the thickness which can be penetrated by common ultraviolet laser, and no dust is around the laser, so that the laser has the advantages of high beat and efficiency; the reason why the thickness of the black ink layer 10 of the lower layer is thicker than that of the white ink layer 11 of the upper layer is to avoid laser power energy fluctuation and prevent the black ink layer 10 from being penetrated by laser to damage the inner layer of the circuit board body.
Example 6
Referring to fig. 6, the difference between this embodiment and the above embodiments is that, in this embodiment, the circuit board body located in the bending region 200 is provided with a plurality of through holes 12, the central connection line of the plurality of through holes 12 is perpendicular to the bending direction, the through holes 12 avoid the circuit region, and when the FPC is bent, the through holes 12 can be used as a reference to ensure that no offset phenomenon occurs during bending, thereby avoiding undesirable phenomena such as circuit board body fracture and display explosion caused by a large pulling force, and meanwhile, due to the arrangement of the plurality of through holes 12, the circuit board body can be easily bent, thereby improving the working efficiency, and also preventing the circuit board body from being broken.
As a preferred embodiment, the through holes 12 are round holes, and the connecting line of the circle centers of a plurality of round holes is perpendicular to the bending direction, so that the round holes are easy to manufacture and form and low in manufacturing cost; the edge of the circuit board body in the bending area 200 is provided with a semicircular hole or a U-shaped hole 13, and the center of the semicircular hole or the U-shaped hole 13 is located on a connection line of the circle center.
The above embodiments only express the embodiments of the present invention, and the description thereof is specific and detailed, but the invention can not be understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by adopting the equivalent substitution or equivalent transformation should fall within the protection scope of the present invention.
Claims (10)
1. A double-layer flexible circuit board with high bending performance is characterized in that the circuit board comprises a circuit board body, the circuit board body comprises a first insulating PI layer, a first metal routing layer, a second insulating PI layer, a second metal routing layer and a third insulating PI layer which are sequentially overlapped from bottom to top, the circuit board body comprises a first working area, a bending area and a second working area which are sequentially arranged from left to right, a first hollowed part and a second hollowed part are respectively arranged on the lower surface and the upper surface of the circuit board body positioned in the bending area, the first hollowed part is hollowed to the lower surface of the first metal routing layer, a first insulating green oil layer is arranged on the lower surface of the first metal routing layer positioned at the first hollowed part, the second hollowed part is hollowed to the upper surface of the second insulating PI layer, and the third insulating PI layer extends to the side face of the second metal wiring layer located in the second hollowed part.
2. The double-layered flexible printed circuit board with high bending performance as claimed in claim 1, wherein the second hollow portion is hollowed to an upper surface of the first metal routing layer, and a second insulating green oil layer is disposed on the upper surface of the first metal routing layer of the second hollow portion.
3. The double-layer flexible printed circuit board with high bending performance as claimed in claim 1, wherein the lower surface of the first insulating PI layer in the first and second working areas is provided with a red ink layer.
4. The double-layered flexible printed circuit board with high bending performance according to claim 1, wherein a through hole penetrating through the first insulating PI layer, the first metal routing layer, the second insulating PI layer, the second metal routing layer and the third insulating PI layer is formed on the circuit board body in the first working area, and a heat conducting layer contacting with the first metal routing layer and the second metal routing layer is disposed on an inner wall of the through hole.
5. The double-layered flexible printed circuit board with high bending performance as claimed in claim 4, wherein a heat conductor connected to an external heat conducting structure is disposed in the through hole, and the heat conductor is in contact with the heat conducting layer.
6. The double-layer flexible printed circuit board with high bending performance as claimed in claim 1, wherein a black ink layer and a white ink layer are disposed on the upper surface of the third insulating PI layer in the first working area, and the white ink layer is laser-formed with a two-dimensional code.
7. The double-layered flexible wiring board having high bending property according to claim 6, wherein the thickness of the black ink layer is 30 μm to 40 μm.
8. The double-layered flexible wiring board having high bending property according to claim 6, wherein the thickness of the white ink layer is 10 μm to 20 μm.
9. The double-layered flexible printed circuit board with high bending performance as claimed in claim 1, wherein the circuit board body at the bending region has a plurality of through holes, the center lines of the plurality of through holes are perpendicular to the bending direction, and the through holes avoid the circuit region.
10. The double-layered flexible printed circuit board with high bending performance according to claim 9, wherein the through holes are round holes, a connection line of centers of a plurality of the round holes is perpendicular to the bending direction, a semicircular hole or a U-shaped hole is formed in an edge of the circuit board body located in the bending region, and a center of the semicircular hole or the U-shaped hole is located on the connection line of the centers of the round holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123076945.6U CN217183532U (en) | 2021-12-08 | 2021-12-08 | Double-layer flexible circuit board with high bending performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123076945.6U CN217183532U (en) | 2021-12-08 | 2021-12-08 | Double-layer flexible circuit board with high bending performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217183532U true CN217183532U (en) | 2022-08-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123076945.6U Active CN217183532U (en) | 2021-12-08 | 2021-12-08 | Double-layer flexible circuit board with high bending performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217183532U (en) |
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2021
- 2021-12-08 CN CN202123076945.6U patent/CN217183532U/en active Active
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