CN217134354U - Boss oxygen-free copper pipe shell with water-cooling heat dissipation device - Google Patents
Boss oxygen-free copper pipe shell with water-cooling heat dissipation device Download PDFInfo
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- CN217134354U CN217134354U CN202220828233.0U CN202220828233U CN217134354U CN 217134354 U CN217134354 U CN 217134354U CN 202220828233 U CN202220828233 U CN 202220828233U CN 217134354 U CN217134354 U CN 217134354U
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- dissipation device
- cooling heat
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Abstract
The utility model discloses a take water-cooling heat abstractor's boss anaerobic copper pipe shell. Belongs to the technical field of power semiconductor devices and components. The heat dissipation structure mainly solves the problems of large heat productivity and slow heat dissipation due to the need of additionally arranging a heat dissipation device in the application of the existing boss tube shell, and particularly solves the problems of large occupied volume, more material consumption, heavy weight and complex assembly in the fields of ships and transportation. It is mainly characterized in that: comprises an upper sealing part and a lower sealing part; the lower sealing part comprises a lower sealing flange, a ceramic ring and a lower flange ring which are connected in sequence; the upper sealing piece or/and the lower sealing piece also comprises a water-cooling heat dissipation device. The utility model has the characteristics of from taking water-cooling heat abstractor, thickness is thin, small and can simplify the installation of integrated component, mainly used high-power semiconductor device's encapsulation tube.
Description
Technical Field
The utility model belongs to the technical field of power semiconductor device and subassembly, specifically a boss anaerobic copper pipe shell that is used for the encapsulation of high-power semiconductor device and takes water-cooling heat abstractor certainly.
Background
At present, in the field of power semiconductor devices, the commonly used tube shells are all pure boss type tube shells or concave boss type tube shells, and as shown in fig. 7, the tube shells consist of a cathode copper block 1, an upper sealing flange 2, a lower sealing flange 3, a ceramic ring 4, a lower flange ring 5 and an anode copper block 9. The flat plate device formed by packaging does not have a heat dissipation device, and when the high-power device is applied, an additional heat dissipation device and the flat plate device need to be designed in a matched mode and are superposed and combined for use. In practical power-on application, heat generated by the high-power semiconductor chip needs to be conducted to the tube shell and then conducted to the radiator through the tube shell. When the device and the radiator are pressed, the heat productivity is large and the heat dissipation is slow due to the influence of multiple factors such as multiple contact surfaces, machining precision, pressure control and the like. In the fields of ships and transportation, the common flat-plate device and radiator superposition cooperation field has the disadvantages of large occupied volume, more material consumption, heavy weight, complex assembly and the like.
Disclosure of Invention
The utility model aims at providing a poor problem among the above-mentioned background art, provide a pipe and water-cooling heat abstractor integration, boss anaerobic copper pipe from taking the radiator function. After the flat-plate device is packaged, the thickness is thin, the size is small, a water-cooling heat dissipation device is arranged, and the installation of an integrated assembly can be simplified.
The technical solution of the utility model is that: the utility model provides a take water cooling device's boss anaerobic copper tube shell, includes sealing member and lower sealing member, its characterized in that: the lower sealing part comprises a lower sealing flange, a ceramic ring and a lower flange ring which are connected in sequence; the upper sealing piece or/and the lower sealing piece also comprises a water-cooling heat dissipation device.
The upper sealing piece in the technical proposal of the utility model consists of a cathode copper block and an upper sealing flange; the lower sealing piece further comprises a water-cooling heat dissipation device, and the water-cooling heat dissipation device is fixed in the lower flange ring.
The lower sealing piece in the technical proposal of the utility model also comprises an anode copper block which is fixedly connected with the lower flange ring; the upper sealing piece is composed of a water-cooling heat dissipation device and an upper sealing flange, and the water-cooling heat dissipation device is fixedly connected to the upper sealing flange.
The upper sealing piece in the technical solution of the utility model is composed of a water-cooling heat dissipation device and an upper sealing flange, wherein the water-cooling heat dissipation device is fixedly connected with the upper sealing flange; the lower sealing piece further comprises a water-cooling heat dissipation device, and the water-cooling heat dissipation device is fixed in the lower flange ring.
The water cooling heat dissipation device in the technical proposal of the utility model consists of a disc-shaped closed cavity and a water nozzle; the water nozzle is fixedly arranged on the closed cavity.
The closed cavity in the technical proposal of the utility model consists of a water-cooling cavity and a cover body; one surface of the water-cooling cavity is a plane, and the other surface of the water-cooling cavity is provided with a groove; the cover body is a circular plate and is welded on one surface of the water-cooling cavity, which is provided with the groove; the water nozzle comprises a water inlet nozzle and a water outlet nozzle, and is in threaded sealing connection with the water-cooling cavity.
The material of the water-cooling cavity and the cover body in the technical proposal of the utility model is oxygen-free copper, and the surface is plated with a nickel layer; the water nozzle is made of stainless steel.
The technical solution of the utility model is that the outer wall of the ceramic ring is provided with a raised annular curved surface.
The technical solution of the utility model is that the material of the upper sealing flange, the lower flange ring and the cathode copper block is oxygen-free copper, and the surface is plated with a nickel layer.
The technical solution of the utility model is that the material of the upper sealing flange, the lower flange ring and the anode copper block is oxygen-free copper, and the surface is plated with a nickel layer.
The technical solution of the utility model is that the material of the upper sealing water cooling cavity, the cover body, the upper sealing flange, the lower flange ring and the anode copper block is oxygen-free copper, and the surface is plated with a nickel layer.
The utility model discloses owing to adopt by last sealing member, the boss anaerobic copper tube shell of taking water cooling device that lower sealing member and water cooling device constitute, wherein, lower sealing member is including connecting gradually sealing flange down, ceramic ring and lower flange circle, go up sealing member or/and lower sealing member still include water cooling device, therefore when sealing, earlier seal up member or lower sealing member and semiconductor chip welding, pour into protection silica gel for the semiconductor chip again, will go up sealing member and lower sealing member welding at last, go into dull and stereotyped device and water cooling device integrated device. When the power module is applied, an additional heat dissipation device does not need to be additionally installed, the height and the weight of the integrated power semiconductor assembly are reduced, the manufacturing cost is saved, and the miniaturization of the power assembly is realized. When the heat dissipation device is used, external cooling water directly enters the water channel through the water nozzle to take away heat in the use process of the device, and the heat dissipation efficiency is improved. When the assembly is assembled, the flat devices are directly superposed and assembled, and the assembly is simple and convenient to maintain.
The utility model has the characteristics of from taking water-cooling heat abstractor, thickness is thin, small and can simplify the installation of integrated component. The utility model discloses mainly used high-power semiconductor device's encapsulation tube.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the following figures briefly describe the use of the embodiments. It is to be understood that the drawings described below are merely exemplary of some of the invention. Other figures can also be derived from these figures without inventive effort for a person skilled in the art.
Fig. 1 is a front sectional view of the structure of embodiment 1 of the present invention.
Fig. 2 is a plan view of the structure of embodiment 1 of the present invention.
Fig. 3 is a schematic structural view of an upper sealing member in embodiment 1 of the present invention.
Fig. 4 is a schematic structural view of a lower sealing member in embodiment 1 of the present invention.
Fig. 5 is a front sectional view of the structure of embodiment 2 of the present invention.
Fig. 6 is a front sectional view of the structure of embodiment 3 of the present invention.
Fig. 7 is a front sectional view showing a structure of a boss type cartridge which is conventionally used.
In the figure: 1. a cathode copper block; 2. an upper sealing flange; 3. a lower sealing flange; 4. a ceramic ring; 5. a lower flange ring; 6. a water nozzle; 7. water-cooling the cavity; 8. a cover body; 9. and an anode copper block.
Detailed Description
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Any other embodiments that can be obtained by those skilled in the art without creative efforts based on the practical examples of the present invention belong to the protection scope of the present invention.
Example 1 is shown in fig. 1 to 4. The utility model relates to a take water-cooling heat abstractor's boss anaerobic copper pipe comprises last sealing member and lower sealing member, and lower sealing member is equipped with water-cooling heat abstractor.
The upper sealing part consists of a cathode copper block 1 and an upper sealing flange 2. Wherein, the cathode copper block 1 has the same shape as the existing anode copper block, and the upper sealing flange 2 has the same shape as the existing upper sealing flange. The cathode copper block 1 is welded on the upper sealing flange 2.
The lower sealing part consists of a lower sealing flange 3, a ceramic ring 4, a lower flange ring 5, a water nozzle 6, a water-cooling cavity 7 and a cover body 8. Wherein, the lower sealing flange 3, the ceramic ring 4 and the lower flange ring 5 are welded and connected in sequence. The lower sealing flange 3 is the same as the existing lower sealing flange, the ceramic ring 4 forms the cavity side wall of the lower sealing part, and the lower flange ring 5 is used for welding connection of the ceramic ring 4 and the water-cooling cavity 7. The water-cooling cavity 7 is a disc, one surface of the water-cooling cavity is a plane, the other surface of the water-cooling cavity is provided with a water through groove, the cover body 8 is a circular plate, and the cover body 8 is welded on the surface, provided with the groove, of the water-cooling cavity 7 to form a closed water-cooling cavity. The water-cooling cavity 7 is welded and fixed in the lower flange ring 5, and the cover body 8 faces outwards. The water nozzle 6 comprises a water inlet nozzle and a water outlet nozzle, and is hermetically connected with the water-cooling cavity 7 through thread sealant, and the water nozzle 6, the cavity 7 and the cover body 8 form a water-cooling heat dissipation device.
The cathode copper block 1, the upper sealing flange 2, the lower sealing flange 3, the lower flange ring 5, the water-cooling cavity 7 and the cover body 8 are made of oxygen-free copper, and the surfaces of the oxygen-free copper and the cover body are plated with nickel layers. The water nozzle 6 is made of stainless steel, so that metal oxidation generated when water is introduced for a long time can be reduced. The ceramic ring 4 is 95% Al 2 O 3 The ceramic is sintered, the surface is glazed to increase the strength, and the outer wall is provided with annular bulges to increase the creepage distance.
Different from the traditional lower sealing piece only provided with the anode copper block, the water-cooling heat dissipation device replaces the traditional anode copper block, and the tube shell is provided with the heat dissipation device. When reducing volume and consumptive material quantity, the heat of semiconductor chip need not transmit the positive pole copper billet and propagates heat abstractor again but directly transmits water-cooling heat abstractor and spreads away during the application to reduce the contact surface between radiator and the oxygen-free copper pipe shell, reduce the heat and propagate and hinder, increase radiating efficiency.
Example 2 is shown in figure 5. The utility model relates to a take water-cooling heat abstractor's boss anaerobic copper pipe comprises last sealing member and lower sealing member, and last sealing member is equipped with water-cooling heat abstractor.
The difference from the embodiment 1 is the installation position of the anode copper block 9 and the water-cooled heat sink. The anode copper block 9 is the same as the existing anode copper block, and the anode copper block 9 is welded on the lower flange ring 5. The anode copper block 9 is made of oxygen-free copper and is plated with a nickel layer on the surface. The water-cooling heat dissipation device replaces the cathode copper block 1 and is fixedly connected to the upper sealing flange 2 in a welding mode. Embodiment 2 belongs to a derivative assembly with a structure similar to that of embodiment 1, and is equivalent to that the water-cooling heat dissipation device is switched from a lower sealing member to an upper sealing member.
Example 3 is shown in figure 6. The utility model relates to a take water-cooling heat abstractor's boss anaerobic copper pipe comprises last sealing member and lower sealing member, and last sealing member all is equipped with water-cooling heat abstractor with lower sealing member.
Different from the embodiment 1, the water-cooling heat dissipation device is adopted to replace the cathode copper block 1 and is fixedly connected to the upper sealing flange 2 in a welding way. Embodiment 3 belongs to a derivative assembly with a structure similar to that of embodiment 1, and corresponds to the upper and lower sealing members with heat dissipation devices.
Claims (10)
1. The utility model provides a take water cooling device's boss anaerobic copper tube shell, includes sealing member and lower sealing member, its characterized in that: the lower sealing part comprises a lower sealing flange (3), a ceramic ring (4) and a lower flange ring (5) which are connected in sequence; the upper sealing piece or/and the lower sealing piece also comprises a water-cooling heat dissipation device.
2. The boss oxygen-free copper pipe shell with the water-cooling heat dissipation device as recited in claim 1, wherein: the upper sealing part consists of a cathode copper block (1) and an upper sealing flange (2); the lower sealing piece further comprises a water-cooling heat dissipation device, and the water-cooling heat dissipation device is fixed in the lower flange ring (5).
3. The boss oxygen-free copper pipe shell with the water-cooling heat dissipation device as recited in claim 1, wherein: the lower sealing piece also comprises an anode copper block (9), and the anode copper block (9) is fixedly connected with the lower flange ring (5); the upper sealing piece is composed of a water-cooling heat dissipation device and an upper sealing flange (2), and the water-cooling heat dissipation device is fixedly connected to the upper sealing flange (2).
4. The boss oxygen-free copper pipe shell with the water-cooling heat dissipation device as recited in claim 1, wherein: the upper sealing piece consists of a water-cooling heat dissipation device and an upper sealing flange (2), and the water-cooling heat dissipation device is fixedly connected to the upper sealing flange (2); the lower sealing piece further comprises a water-cooling heat dissipation device, and the water-cooling heat dissipation device is fixed in the lower flange ring (5).
5. The boss oxygen-free copper pipe shell with the water-cooled heat dissipation device as recited in any one of claims 1-4, wherein: the water-cooling heat dissipation device consists of a disc-shaped closed cavity and a water nozzle (6); the water nozzle (6) is fixedly arranged on the closed cavity.
6. The boss oxygen-free copper pipe shell with the water-cooling heat dissipation device as recited in claim 5, wherein: the closed cavity consists of a water-cooling cavity (7) and a cover body (8); one surface of the water-cooling cavity (7) is a plane, and the other surface is provided with a groove; the cover body (8) is a circular plate and is welded on one surface of the water-cooling cavity (7) with the groove; the water nozzle (6) comprises a water inlet nozzle and a water outlet nozzle and is in threaded sealing connection with the water-cooling cavity (7).
7. The boss oxygen-free copper pipe shell with the water-cooling heat dissipation device as recited in claim 6, wherein: the water-cooling cavity (7) and the cover body (8) are made of oxygen-free copper, and a nickel layer is plated on the surfaces of the oxygen-free copper and the cover body; the water nozzle (6) is made of stainless steel.
8. The boss oxygen-free copper pipe shell with the water-cooled heat dissipation device as recited in any one of claims 1 to 4 and 6 to 7, wherein: the outer wall of the ceramic ring (4) is provided with a raised annular curved surface.
9. The boss oxygen-free copper pipe shell with the water-cooling heat dissipation device as recited in claim 2, wherein: the upper sealing flange (2), the lower sealing flange (3), the lower flange ring (5) and the cathode copper block (1) are made of oxygen-free copper, and the surfaces of the upper sealing flange, the lower flange ring and the cathode copper block are plated with nickel layers.
10. The boss oxygen-free copper pipe shell with the water-cooling heat dissipation device as recited in claim 3, wherein: the upper sealing flange (2), the lower sealing flange (3), the lower flange ring (5) and the anode copper block (9) are made of oxygen-free copper, and the surfaces of the upper sealing flange, the lower flange ring and the anode copper block are plated with nickel layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220828233.0U CN217134354U (en) | 2022-04-12 | 2022-04-12 | Boss oxygen-free copper pipe shell with water-cooling heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220828233.0U CN217134354U (en) | 2022-04-12 | 2022-04-12 | Boss oxygen-free copper pipe shell with water-cooling heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217134354U true CN217134354U (en) | 2022-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220828233.0U Active CN217134354U (en) | 2022-04-12 | 2022-04-12 | Boss oxygen-free copper pipe shell with water-cooling heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217134354U (en) |
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2022
- 2022-04-12 CN CN202220828233.0U patent/CN217134354U/en active Active
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