CN217133662U - Heat dissipation mechanism and computer mainframe - Google Patents
Heat dissipation mechanism and computer mainframe Download PDFInfo
- Publication number
- CN217133662U CN217133662U CN202221085353.2U CN202221085353U CN217133662U CN 217133662 U CN217133662 U CN 217133662U CN 202221085353 U CN202221085353 U CN 202221085353U CN 217133662 U CN217133662 U CN 217133662U
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- CN
- China
- Prior art keywords
- heat dissipation
- dissipation fan
- hole
- plate
- hanging plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 50
- 230000007246 mechanism Effects 0.000 title claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000007373 indentation Methods 0.000 abstract description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 210000003811 finger Anatomy 0.000 description 1
- 210000005224 forefinger Anatomy 0.000 description 1
- 210000004247 hand Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the field of heat dissipation fans, in particular to a heat dissipation mechanism and a computer mainframe box, which comprises a heat dissipation fan, wherein the surface of the heat dissipation fan is provided with a baffle plate, and the surface of the heat dissipation fan is provided with a plurality of through holes; the limiting hanging plate is inserted into the through hole, a sponge sealing piece is arranged between the limiting hanging plate and the through hole, one end of the limiting hanging plate is inserted into the inserting hole, and the inserting hole is formed in the side wall of the heat dissipation fan; the limiting device comprises a through hole, a limiting rod and a spring, wherein the through hole is formed in the surface of a limiting hanging plate, the limiting rod is inserted into the through hole and fixed on the inner wall of a through hole, and the spring is sleeved on the outer side of the limiting rod; the beneficial effects are that: the utility model provides an install the spacing link plate that the multiunit was held in the palm by elasticity top on heat dissipation mechanism's the casing additional, hold between the fingers spacing link plate indentation opening of hand, will dispel the heat fan and insert behind the reservation installing port of host computer box, loosen spacing link plate, the spacing link plate of spring-back top support reset card in one side of box backplate, the cooperation baffle realizes the spacing installation to the heat dissipation fan, so simplifies heat dissipation fan loading and unloading operation.
Description
Technical Field
The utility model relates to a heat dissipation fan field specifically is a heat dissipation mechanism and computer mainframe.
Background
The host refers to the main body part of the computer except the input and output equipment. And is also a control box body for placing the main board and other main components. Typically including a CPU, memory, motherboard, hard disk, optical drive, power supply, chassis, heat dissipation system, and other input/output controllers and interfaces.
In the prior art, the heat dissipation fan of the mainframe box is installed on the box body back plate and is fixed by a plurality of screws.
However, when the heat dissipation fan is damaged, the heat exchange fan needs to be disassembled after the case is disassembled by means of a tool, a large number of screws need to be screwed in the operation, and the efficiency of assembling and disassembling the heat dissipation fan is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation mechanism and computer mainframe to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation mechanism, the heat dissipation mechanism comprising:
the surface of the heat dissipation fan is provided with a baffle, and the surface of the heat dissipation fan is provided with a plurality of through holes;
the limiting hanging plate is inserted into the through hole, a sponge sealing piece is arranged between the limiting hanging plate and the through hole, one end of the limiting hanging plate is inserted into the inserting hole, and the inserting hole is formed in the side wall of the heat dissipation fan; and
the perforation is seted up on the surface of spacing link plate, and the perforated inside is pegged graft and is had the gag lever post, and the inner wall at the opening is fixed to the gag lever post, and the outside cover of gag lever post is equipped with the spring.
Preferably, the baffles are of square plate structures, rubber gaskets are arranged on the surfaces of the baffles, the baffles are provided with two groups, and the two groups of baffles are symmetrically distributed around the heat dissipation fan.
Preferably, the opening is square groove, and the opening is provided with four, and four openings distribute respectively in four edges of heat dissipation fan, and opening and socket intercommunication, and the bottom surface of opening and socket flushes.
Preferably, the limiting hanging plate is of an L-shaped plate structure, and the height of the limiting hanging plate is larger than that of the through opening.
Preferably, the top cover of spacing link plate is equipped with the silica gel cover, and spring coupling is between spacing link plate and opening.
Preferably, the remaining two side walls of the sponge sealing piece are not connected with the side walls of the through opening.
Preferably, the top surface of the bottom plate of the limiting hanging plate is provided with anti-skid grains.
A computer mainframe box comprises the heat dissipation mechanism.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides an install the spacing link plate that the multiunit was held in the palm by elasticity top on heat dissipation mechanism's the casing additional, hold between the fingers spacing link plate indentation opening of hand, will dispel the heat fan and insert behind the reservation installing port of host computer box, loosen spacing link plate, the spacing link plate of spring-back top support reset card in one side of box backplate, the cooperation baffle realizes the spacing installation to the heat dissipation fan, so simplifies heat dissipation fan loading and unloading operation.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is the schematic diagram of the structure of the limiting hanging plate of the utility model.
In the figure: the heat dissipation fan comprises a heat dissipation fan 1, a baffle 2, a rubber gasket 3, a through hole 4, a limiting hanging plate 5, a through hole 6, a limiting rod 7, a spring 8, a sponge sealing sheet 9, a silica gel cover 10, anti-skid patterns 11 and a socket 12.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of some embodiments of the invention and are not limiting of the invention, and that all other embodiments obtained by those of ordinary skill in the art without the exercise of inventive faculty are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a," "an," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
For the purposes of simplicity and explanation, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
Referring to fig. 1-2, the present invention provides a technical solution: a heat dissipation mechanism comprises a heat dissipation fan 1, wherein baffles 2 are arranged on the surface of the heat dissipation fan 1, the baffles 2 are of a square plate-shaped structure, rubber gaskets 3 are arranged on the surface of the baffles 2, two groups of baffles 2 are arranged, the two groups of baffles 2 are symmetrically distributed about the heat dissipation fan 1, a plurality of through holes 4 are formed in the surface of the heat dissipation fan 1, the through holes 4 are square grooves, the through holes 4 are four in number, the four through holes 4 are respectively distributed at four corners of the heat dissipation fan 1, the through holes 4 are communicated with a socket 12, and the bottom surfaces of the through holes 4 and the socket 12 are flush;
the limiting hanging plate 5 is inserted into the through hole 4, the limiting hanging plate 5 is of an L-shaped plate structure, the height of the limiting hanging plate 5 is larger than that of the through hole 4, a sponge sealing piece 9 is arranged between the limiting hanging plate 5 and the through hole 4, one end of the limiting hanging plate 5 is inserted into the socket 12, and the socket 12 is formed in the side wall of the heat dissipation fan 1;
A computer mainframe box comprises the heat dissipation mechanism. .
During the in-service use, as shown in the attached drawing 1, spacing link plate 5 at this moment is pushed up by spring 8 and holds in the palm, the bottom plate of spacing link plate 5 stretches out socket 12 promptly, and sponge mounting plate 9 is straightened this moment, it is on the spring 8 surface to reduce the adhesion in the dust gets into opening 4, when installation heat dissipation fan 1, the forefinger and the thumb of both hands press down corresponding spacing link plate 5 respectively, so in bottom plate locking socket 12 of spacing link plate 5, and spring 8 is compressed, after will dispel the heat fan 1 and insert the installing port of mainframe box backplate, loosen spacing link plate 5, spring 8 kick-backs and hold in the palm spacing link plate 5 and reset, the part card that spacing link plate 5 stretches out socket 12 is in one side of mainframe box backplate, and baffle 2 keeps off the opposite side at the mainframe box backplate, so realize the installation of heat dissipation fan 1, and easy operation is convenient, need not with the help of the instrument.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A heat dissipation mechanism, its characterized in that: the heat dissipation mechanism includes:
the heat dissipation fan comprises a heat dissipation fan (1), wherein a baffle (2) is arranged on the surface of the heat dissipation fan (1), and a plurality of through holes (4) are formed in the surface of the heat dissipation fan (1);
the limiting hanging plate (5) is inserted into the through hole (4), a sponge sealing piece (9) is arranged between the limiting hanging plate (5) and the through hole (4), one end of the limiting hanging plate (5) is inserted into the socket (12), and the socket (12) is arranged on the side wall of the heat dissipation fan (1); and
perforation (6) are seted up on the surface of spacing link plate (5), and the inside grafting of perforation (6) has gag lever post (7), and gag lever post (7) are fixed at the inner wall of opening (4), and the outside cover of gag lever post (7) is equipped with spring (8).
2. A heat dissipating mechanism according to claim 1, wherein: baffle (2) are square plate structure, and the surface of baffle (2) is provided with rubber gasket (3), and baffle (2) are provided with two sets ofly, and two sets of baffle (2) are about heat dissipation fan (1) symmetric distribution.
3. A heat dissipating mechanism according to claim 1, wherein: opening (4) are square groove, and opening (4) are provided with four, and four openings (4) distribute respectively in four edges of heat dissipation fan (1), and opening (4) and socket (12) intercommunication, and the bottom surface of opening (4) and socket (12) flushes.
4. A heat dissipating mechanism according to claim 1, wherein: the limiting hanging plate (5) is of an L-shaped plate structure, and the height of the limiting hanging plate (5) is larger than that of the through hole (4).
5. A heat dissipating mechanism according to claim 1, wherein: the top cover of spacing link plate (5) is equipped with silica gel cover (10), and spring (8) are connected between spacing link plate (5) and opening (4).
6. A heat dissipating mechanism according to claim 1, wherein: the remaining two side walls of the sponge sealing sheet (9) are not connected with the side walls of the through holes (4).
7. A heat dissipating mechanism according to claim 1, wherein: the top surface of the bottom plate of the limiting hanging plate (5) is provided with anti-skid grains (11).
8. A computer mainframe, comprising: comprising a heat dissipating mechanism according to any of the preceding claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221085353.2U CN217133662U (en) | 2022-04-29 | 2022-04-29 | Heat dissipation mechanism and computer mainframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221085353.2U CN217133662U (en) | 2022-04-29 | 2022-04-29 | Heat dissipation mechanism and computer mainframe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217133662U true CN217133662U (en) | 2022-08-05 |
Family
ID=82651650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221085353.2U Expired - Fee Related CN217133662U (en) | 2022-04-29 | 2022-04-29 | Heat dissipation mechanism and computer mainframe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217133662U (en) |
-
2022
- 2022-04-29 CN CN202221085353.2U patent/CN217133662U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220805 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |