CN217114369U - Flip chip package structure and display device - Google Patents
Flip chip package structure and display device Download PDFInfo
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- CN217114369U CN217114369U CN202220722517.1U CN202220722517U CN217114369U CN 217114369 U CN217114369 U CN 217114369U CN 202220722517 U CN202220722517 U CN 202220722517U CN 217114369 U CN217114369 U CN 217114369U
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Abstract
The utility model discloses a flip chip packaging structure and display device, wherein, flip chip packaging structure, include: the flexible circuit board comprises a flexible substrate and a circuit layer arranged on the flexible substrate; the chip is arranged on the flexible substrate and electrically connected with the circuit layer, and the circuit layer is positioned between the flexible substrate and the chip; the packaging colloid is arranged beside the chip and positioned on the upper side of the flexible substrate; the first cooling fin is attached to the flexible substrate and provided with an avoidance hole opposite to the chip in position, and the first cooling fin is provided with an inner edge arranged along the edge of the avoidance hole; and the second radiating fin is attached to one side of the chip, which is far away from the flexible substrate, and is attached to the adhesive sealing colloid. The utility model discloses a flip chip packaging structure can more conveniently realize the attached of heat dissipation subsides, easy operation, and be difficult to produce fold or bubble after attached.
Description
Technical Field
The utility model relates to a chip package technical field, especially flip chip package knot and display device.
Background
Flip Chip (Flip Chip), also known as Flip Chip package or Flip Chip packaging method, is one of the Chip packaging technologies. The packaging technology is different from the traditional mode that a chip is placed on a substrate and then connected with connecting points on the substrate by a wire bonding technology. Instead, the bond pads are grown on the die attach sites and the die is flipped over so that the bond pads are directly connected to the substrate. At present, flip chip technology has been widely used in microprocessor packaging, and has also become the mainstream packaging technology for graphics, special applications, computer chipsets, and the like. In particular, representative examples of flip Chip technology are Chip On Glass (COG) and Chip On Film (COF).
In the above packaging process, the chip-on-film package is a soft-film packaging technology for fixing an Integrated Circuit (IC) on a flexible circuit board, and a flexible additional circuit board is used as a carrier of a packaged chip to combine the chip with a flexible substrate circuit, and a packaging colloid is disposed on the upper side of a flexible substrate beside the chip for packaging. The chip can generate a large amount of heat in the using process, and if the heat can not be effectively released, the performance and the using condition of the chip are affected, so that the heat dissipation paste is generally attached to the back surface of the chip to dissipate the heat of the chip after the chip and the flexible substrate are packaged by adopting the packaging colloid.
In order to enhance the heat dissipation effect of the conventional Chip On Film (COF) package, a heat dissipation patch is attached to the surface of the package structure, especially the surface having a Chip. However, in the field of Liquid Crystal Display (LCD) panels, the definition of the display panel is higher and higher, the higher definition requires that the heat generated during the operation of the chip is correspondingly increased, and the heat generation amount of the circuit layer disposed on the flexible substrate is also correspondingly increased.
In the prior art, the heat dissipation sticker is attached to the packaging structure in a rolling manner, and the chip has a certain height, and the packaging colloid covering the periphery of the chip and filled at the bottom is in an irregular slope shape, so that the heat dissipation effect is influenced and the smoothness of the surface is also influenced by the fact that the chip and the flexible substrate are easily arched or bubbles appear at the transition position in the attachment manner in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a flip chip packaging structure to solve not enough among the prior art, it can more conveniently realize the attaching of heat dissipation subsides, easy operation, and be difficult to produce fold or bubble after attached.
The embodiment of the utility model discloses flip chip packaging structure, include:
the flexible circuit board comprises a flexible substrate and a circuit layer arranged on the flexible substrate;
the chip is arranged on the flexible substrate and electrically connected with the circuit layer, and the circuit layer is positioned between the flexible substrate and the chip;
the packaging colloid is arranged beside the chip and positioned on the upper side of the flexible substrate;
the first cooling fin is attached to the flexible substrate and provided with an avoidance hole opposite to the chip in position, and the first cooling fin is provided with an inner edge arranged along the edge of the avoidance hole;
and the second radiating fin is attached to one side of the chip, which is far away from the flexible substrate, and is attached to the adhesive sealing colloid.
Further, the edge of the second heat dissipation fin covers the first heat dissipation fin.
Furthermore, the shape of the avoiding hole is matched with the shape of the outer contour of the packaging colloid.
Furthermore, the avoiding hole is a rectangular hole.
Further, the encapsulation colloid has a colloid bottom surface arranged on the upper side of the flexible circuit board and a colloid side surface arranged on the side surface of the chip, one side of the colloid bottom surface, which is far away from the chip, is an outer colloid edge, and the distance from the outer colloid edge to the plane where the chip side surface is located is L, wherein L satisfies the following condition L1< L2; l1 is the shortest distance, L2 is the longest distance;
the width a1 of the avoiding hole is not greater than D1+2 × L1, wherein D1 is the dimension of the chip in the width direction and is measured in mm;
the length A2 of the avoiding hole is not more than D2+ 2L 1, wherein D2 is the size of the chip in the length direction and the unit is mm.
Furthermore, the packaging colloid is arranged along the periphery of the chip and is provided with a left colloid and a right colloid which are oppositely arranged at the two opposite sides of the chip;
the second fin has chip connecting portion and forms two edge connection portions in the relative both sides of chip connecting portion, chip connecting portion with the chip deviates from one side of flexible substrate is laminated mutually, two edge connection portion laminate respectively the surface of left side colloid with the surface of right side colloid.
Further, the width C1 of the second heat dissipation fin is not less than
Wherein H1 is the height of the chip in mm.
Further, the length C2 of the second heat sink is not greater than the length D2 of the chip.
Further, the edge of the second cooling fin is arranged in parallel with the inner edge of the first cooling fin.
The utility model discloses another embodiment still discloses a display device, include: the flexible circuit board is also provided with an outer pin arranged on the flexible substrate, and the outer pin is electrically connected with the display screen.
Compared with the prior art, the flip chip package structure disclosed in the embodiment of the present invention splits the whole heat dissipation patch originally attached to the flexible circuit board and the chip into the first heat dissipation patch and the second heat dissipation patch, wherein the first heat dissipation patch is mainly used for attaching to the flexible substrate to dissipate heat from the flexible substrate, and the second heat dissipation patch is attached to the chip and the package colloid beside the chip to dissipate heat from the chip; attached first fin earlier need attached at attached in-process, attached second fin again, can more conveniently realize the attached of heat dissipation subsides, easy operation, and be difficult to produce fold or bubble after attached.
Drawings
Fig. 1 is a schematic structural diagram of a flip chip package structure according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken in the direction AA of FIG. 1;
fig. 3 is a schematic structural view of the flip chip package structure according to the embodiment of the present invention before the second heat sink is attached to the second heat sink and the rolling mechanism is rolled;
fig. 4 is a schematic structural view of the flip chip package structure according to the embodiment of the present invention after the second heat sink is attached to the second heat sink and the rolling mechanism rolls;
fig. 5 is a schematic structural view of a first heat sink in a flip chip package structure according to an embodiment of the present invention;
description of reference numerals:
1-flexible circuit board, 11-flexible substrate, 12-circuit layer, 13-inner pin,
2-chip, 21-bump,
3-encapsulation colloid, 31-colloid bottom, 32-colloid side, 33-colloid outer edge, 34-left colloid, 35-right colloid,
4-first fins, 41-relief holes, 42-inner edge,
5-second fin, 51-center fit, 52-edge fit,
100-rolling mechanism.
Detailed Description
The embodiments described below by referring to the drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.
The embodiment of the utility model provides a: a method for forming a flip chip package structure is disclosed, which can be applied to Liquid Crystal Display (LCD) and organic light-emitting diode (OLED) display devices. With the increasing of the display requirements, the temperature of the chip in the flip chip package structure will increase continuously during the operation of the display device, and if the temperature of the chip is too high, the performance of the display device will be affected, and the use experience will be affected.
In order to reduce the temperature of the chip, a heat dissipation paste is generally attached to the chip, but it is studied that the circuit layer on the flexible substrate in the conventional flip chip package structure also has a problem of high temperature during the use process, and therefore, heat dissipation needs to be performed on the flexible substrate.
In the prior art, the upper surface of the flexible substrate is covered during the process of attaching the heat dissipation paste to the chip, so that the heat dissipation paste can dissipate heat of the circuit layer and the chip on the flexible substrate at the same time. However, since the flexible substrate and the chip are bonded by the pins and the bumps, the flexible circuit board and the chip have a height difference, and the heat dissipation sticker cannot be completely attached to the chip due to the height difference.
The existing attaching mode is that a marking head is used for absorbing a heat dissipation sticker, the heat dissipation sticker is attached to the upper surface of a chip, the heat dissipation sticker is only formed by an intermediate attaching area of the middle part and is attached to the chip, but an edge attaching area of the edge of the heat dissipation sticker is not attached to a flexible substrate, and after the heat dissipation sticker is attached to the chip, the heat dissipation sticker is attached to the chip by a rolling mechanism 100, and the heat dissipation sticker is pressed and attached to the flexible substrate in the direction from the chip to two ends.
The existing attaching mode is adopted, so that air bubbles and wrinkles are easily formed in gaps among the flexible substrate, the chip and the heat dissipation paste, and the heat dissipation effect of the heat dissipation paste can be reduced.
Therefore, the embodiment of the present invention discloses a method for forming a flip chip package structure, which specifically comprises the following steps:
s100: providing a flexible circuit board 1, wherein the flexible circuit board 1 comprises a flexible substrate 11, and a circuit layer 12 and inner pins 13 which are arranged on the flexible substrate 11;
s200: providing a chip 2, wherein the chip 2 is provided with a bump 21; the chip 2 may be a driving chip for a display device;
s300: electrically connecting the inner pins 13 of the flexible circuit board 1 with the bumps 21 of the chip 2;
s400: forming a packaging colloid 3 beside the chip 2, wherein the packaging colloid 3 is positioned on the upper side of the flexible substrate 11;
s500: attaching a first heat sink 4 to the upper surface of the flexible substrate 11, wherein an avoiding hole 41 adapted to the encapsulant 3 is formed in the first heat sink 4;
s600: attaching a second heat sink 5 to the upper surface of the chip 2, wherein the second heat sink 5 includes a central attaching portion 51 adapted to the upper surface of the chip 2 and edge attaching portions 52 extending from the central attaching portion 51 to both sides;
s700: the edge bonding part 52 of the second heat sink 5 is bent and bonded onto the encapsulant 3 by using a rolling mechanism 100, and the edge of the second heat sink 5 covers the first heat sink 4 after the bonding is completed.
As shown in fig. 1-4, in the present embodiment, when attaching the heat sink, the whole heat sink attached to the flexible circuit board 1 and the chip 2 is split into a first heat sink 4 and a second heat sink 5, wherein the first heat sink 4 is mainly used for being attached to the flexible substrate 11 to dissipate heat from the flexible substrate 11, and the second heat sink 5 is attached to the chip 2 and the encapsulant 3 beside the chip 2 to dissipate heat from the chip 2.
In the embodiment, as shown in fig. 3, the first heat sink 4 is attached first and then the second heat sink 5 is attached, the first heat sink 4 is attached to the relatively flat flexible substrate 11, which is relatively easy to operate, and wrinkles or bubbles are not easily generated after the attachment. If attach second heat dissipation earlier and stick 5 and then attach first fin 4 and the interval position of second heat dissipation after the attachment 5 is difficult to handle the accuse, it is uncertain that the position of second heat dissipation stick 5 at its edge is attached behind chip 2, this is just so make on the first fin 4 the hole of dodging of formation probably can't form dodging to second heat dissipation stick 5 to produce the interference when first fin 4 is attached, influence the attached of first fin 4.
In this embodiment, since the flexible substrate 11 is a whole plane, the operation can be better performed when the first heat sink 4 is attached; in addition, the avoidance hole 41 is provided in the first heat sink 4 to avoid the influence of the chip 2, so that bubbles or wrinkles are less likely to be generated when the first heat sink 4 is attached, and the attached first heat sink 4 can be made more flat.
When the second heat sink 5 is attached, the attached heat sink only needs to cover the encapsulant 3. Therefore, the size of the second heat sink 5 can be controlled to be relatively narrow, so that after the second heat sink 5 is attached to the upper surface of the chip 1, before the second heat sink is rolled by the rolling mechanism 100, the edge attaching part 52 extending out of the upper surface of the chip 1 can be set to be short, and the edge attaching part 52 cannot easily sag, so that the heat sink attached to the upper surface of the chip 2 can be bent only when the rolling mechanism 100 rolls, and the heat sink attached to the upper surface of the chip 2 can be smoothly transited from the chip 2 to the encapsulant 3 under the rolling action of the rolling mechanism 100, so that the attached heat sink is more flat.
In the prior art, the heat dissipation sticker needs to be attached to the package colloid 3 and the flexible substrate 11 simultaneously, so that the size needs to be wide enough, after the central attaching portion of the heat dissipation sticker is attached to the upper surface of the chip 2 to complete pre-attachment, due to the fact that the size extending outside the chip 2 is large, sagging easily occurs, the partial position of the heat dissipation sticker after sagging can be attached to the flexible substrate, and bubbles and wrinkles are easily formed between the attaching position and the chip after attachment, so that the heat dissipation effect is affected, and the attached heat dissipation sticker wrinkles are more and cannot meet the requirements of customers. The embodiment of the utility model provides a can effectually avoid the appearance of above-mentioned problem.
Specifically, "S500: attaching a first heat sink 4 to an upper surface of the flexible substrate 11; "comprises the following steps:
s502: absorbing the first heat radiating fin 4 by adopting a first header head, wherein an avoiding groove for avoiding the chip 2 is arranged on the first header head, and the avoiding groove is opposite to the avoiding hole 41 after the first heat radiating fin 4 is absorbed by the first header head;
s504: moving the first heading head adsorbing the first heat sink 4 to the upper side of the flexible substrate 11, and making the avoidance groove opposite to the chip 2;
s506: and controlling the first header head to move towards the flexible substrate 11 and pressing and attaching the first heat sink 4 on the flexible substrate 11.
It is understood that, at "S502: before the first heat sink is sucked by the first heading head, the method further comprises the following steps:
s501: a heat dissipating substrate is provided, and an avoiding hole 41 is cut in the center of the heat dissipating substrate to form the first heat dissipating fin 4.
Specifically, "S600: attaching a second heat sink to the upper surface of the chip; "comprises the following steps:
s601: providing a second heat sink 5;
s602: absorbing the second heat radiating fin 5 by adopting a second header extracting head, wherein the bottom surface of the second header extracting head, which absorbs the second heat radiating fin 5, is a plane;
s603: moving the second heat sink 5 above the chip 2 so that the intermediate bonding portion 51 faces the chip 2;
s604: and controlling the second header head to move towards the direction of the chip 2 and pressing and attaching the second heat sink 5 on the chip 1.
Adopt two kinds to get the mark in this embodiment and acquire first fin 4 and second fin 5 respectively, for the convenience of the attached of first fin 4, be provided with the groove of dodging with chip 2 looks adaptation on first mark head of getting, can avoid prominent chip 2 to produce the influence to it when pasting the pressfitting to the heat dissipation like this.
The area of the first header head adsorbing the first heat dissipation fin 4 is a smooth press-fit portion, the smooth press-fit portion is located at the edge of the avoidance groove and surrounds the avoidance groove, and the smooth press-fit portion is provided with a planar structure so as to conveniently realize the pressing and attaching of the first heat dissipation fin 4. The second header has a flat size and is attached to the chip 2 after the second heat spreader 5 is attached.
Further, "S700: in the process of bending and attaching the edge attaching portion 52 of the second heat sink 5 onto the encapsulant 3 by using the rolling mechanism 100, "the moving trajectory of the rolling mechanism 100 is as follows: the chip 2 is moved from the top surface to the side surface of the chip 2, and finally, the chip is moved to the flexible circuit board 1 along the outer surface of the packaging colloid 3.
The rolling manner of the rolling mechanism 100 can better adhere the heat dissipation paste to the side surfaces of the encapsulant 3 and the chip 2, and can reduce the occurrence of bubbles.
In the present embodiment, the edge bonding portions of the second fin 5 are provided only on the opposite sides of the center bonding portion 51, and are not provided on the other two sides of the center bonding portion 51. The chip 2 is rectangular in this embodiment and has a length direction and a width direction.
Accordingly, the central bonding portion 51 is also rectangular, and the two edge bonding portions 52 are formed to extend outward from the long sides of the central bonding portion 51, so that wrinkles at the positions where the longitudinal direction and the width direction of the chip 2 meet during the process of attaching the second heat sink 5 can be avoided. The edge bonding portion 52 is extended along the long side direction of the center bonding portion 51, so that more bonding with the chip 2 can be realized, and heat dissipation of the chip 2 can be better realized.
As shown in fig. 1-5, another embodiment of the present invention further discloses a flip chip package structure, which includes: the flexible printed circuit board comprises a flexible printed circuit board 1, a chip 2, a packaging colloid 3, a first radiating fin 4 and a second radiating fin 5;
the flexible circuit board 1 includes a flexible substrate 11, and a circuit layer 12 and inner leads 13 disposed on the flexible substrate 11.
The flexible substrate 11 has a first surface and a second surface opposite to each other, the first surface includes a chip bonding area, the circuit layer 12 and the inner leads 13 are disposed on the first surface of the flexible substrate 11, and the inner leads 13 are exposed from the chip bonding area and used for bonding with the chip 2. The flexible substrate 11 is made of, for example, polyethylene terephthalate (PET), Polyimide (PI), Polyether (PES), Polycarbonate (PC), or other suitable flexible materials.
The chip 2 is disposed on the flexible substrate 11 and electrically connected to the circuit layer 12, specifically, a bump 21 is disposed on the chip 2, and the circuit layer 12 is located between the flexible substrate 11 and the chip 2; the chip 2 is electrically connected to the flexible substrate 11 and then faces the chip bonding region, and the bumps 21 are used for connecting with the inner leads 13 on the circuit layer 12.
The packaging colloid 3 is arranged beside the chip 2 and positioned on the upper side of the flexible substrate; the encapsulant 3 at least fills the space between the chip 2 and the flexible substrate 11 to protect the electrical contacts between the chip 2 and the conductive traces 12 and prevent moisture and contaminants from entering.
The encapsulation colloid 3 is provided with a colloid bottom surface 31 arranged on the upper side of the flexible substrate 11 and a colloid side surface 32 arranged on the side surface of the chip 2, and one side of the colloid bottom surface 31 far away from the chip 2 is a colloid outer edge 33. The material of the potting compound 3 is, for example, Epoxy Molding Compound (EMC).
The first radiating fin 4 is attached to the flexible substrate 11 and is provided with an avoiding hole 41 opposite to the chip 2, and the first radiating fin 4 is provided with an inner edge 42 arranged along the edge of the avoiding hole 41;
the second heat sink 5 is attached to a side of the chip 2 away from the flexible substrate 11 and attached to the molding compound 3.
It is understood that the shape of the avoiding hole 41 is adapted to the shape of the outer contour of the molding compound 3. In this embodiment, the upper surface of the chip 2 has a rectangular structure. Correspondingly, the outline of the molding compound 3 is also rectangular, and the avoiding hole 41 is a corresponding rectangular hole.
The avoiding hole 41 may be sized slightly larger than the outer contour of the molding compound 3, and at this time, after the first heat sink 4 is attached, the inner edge 42 of the first heat sink 4 is juxtaposed to the outer contour of the molding compound 3, i.e., the outer edge 33 of the molding compound.
In another embodiment, the relief hole 41 may be sized larger than the outer contour of the molding compound 3, such that a gap is formed between the inner edge 42 of the first heat sink 4 and the outer edge 33 of the molding compound after the first heat sink 4 is attached.
Further, the edge of the second heat sink 5 is covered on the first heat sink 4 or the edge of the second heat sink 5 is juxtaposed to the inner edge 42 of the first heat sink 4.
Preferably, the edge of the second heat sink 5 covers the first heat sink 4, so that the encapsulant 3 can be completely covered by the heat sink, and the chip 2 can be sufficiently heat-dissipated. In addition, the edge of the second heat sink 5 is covered on the first heat sink 4, so that the size of the second heat sink 5 can be set more conveniently, and the production and manufacturing are also more convenient.
Covering the edge of the second heat sink 5 on the first heat sink 4 may form a gap at the joint position of the two, thereby possibly affecting the heat dissipation of the flexible substrate 11, so a better scheme is that the second heat sink 5 and the first heat sink 4 are arranged in parallel after the second heat sink 5 is attached, that is, the second heat sink 5 is not attached on the flexible substrate 11, at this time, the size of the avoiding hole 41 on the first heat sink 4 is slightly larger than the size of the encapsulant 3, after the first heat sink 4 is attached, a gap is formed between the outer edge 33 and the inner edge 42 of the encapsulant, and when the second heat sink 5 is attached, the gap is covered.
Although the scheme that the second heat sink 5 and the first heat sink 4 are arranged in parallel can achieve a better heat dissipation effect, a great requirement is made on the difficulty of attachment, and particularly when the second heat sink 5 is attached, the second heat sink 5 and the encapsulant 3 need to be completely attached.
In this embodiment, the distance from the outer edge 33 of the colloid to the plane where the side surface of the chip 2 is located is L, where L satisfies the following condition L1< L2, L1 is the shortest distance, and L2 is the longest distance, and the unit is mm;
the width a1 of the avoiding hole 41 is not greater than D1+2 × L1, wherein D1 is the dimension of the chip 2 in the width direction; in mm.
The length a2 of the avoiding hole 41 is not greater than D2+2 × L1, wherein D2 is the dimension of the chip 2 in the length direction, and the unit is mm.
The arrangement of the above structure can make the size of the avoiding hole 41 larger than the size of the outer edge 33 of the colloid, so that the first heat sink 4 can be attached to the flexible substrate 11 more smoothly in the process of attaching the first heat sink 4.
In this embodiment, the encapsulant 3 is disposed along the periphery of the chip, and has a left encapsulant 34 and a right encapsulant 35 disposed on opposite sides of the chip;
Left side colloid 34 and right colloid 35 all extend along the length direction of chip 2 and set up and laminate on the length direction's of chip 2 side, and left side colloid 34 and right colloid 35 are located the both sides of chip 2 relatively in the width direction of chip 2.
In this embodiment, the second heat dissipation sticker 52 is only provided with two edge attaching portions, which can prevent the heat dissipation sticker from generating wrinkles when being attached to the positions where the length direction and the width direction of the chip 2 are crossed, so that the second heat dissipation sticker is more smooth.
After the center bonding portion 51 is bonded to the upper surface of the chip 2, the width of the edge bonding portions 52 extending from the center bonding portion 51 to both sides is not less than
Wherein H1 is the height of the chip in mm. The arrangement of the structure can ensure that the second heat dissipation paste 5 is better attached to the chip.
According to the above formula, it can be obtained that the width C1 of the second heat dissipation fin is not less than the width C1 of the second heat dissipation fin in the present embodiment
Wherein H1 is the height of the chip and the unit is mm; the length C2 of the second heat sink is not greater than the length D2 of the chip. It should be noted that the above lengths and dimensions are all in units of mm, and the attachment accuracy is +/-0.2mm, so the attachment accuracy of the first heat dissipation patch 4 after attachment needs to be considered when calculating the length of the second heat dissipation patch C1.
Another embodiment of the utility model also discloses a display device, include: the flexible circuit board is also provided with an outer pin arranged on the flexible substrate, and the outer pin is electrically connected with the display screen.
The structure, features and effects of the present invention have been described in detail above according to the embodiment shown in the drawings, and the above description is only the preferred embodiment of the present invention, but the present invention is not limited to the implementation scope shown in the drawings, and all changes made according to the idea of the present invention or equivalent embodiments modified to the same changes should be considered within the protection scope of the present invention when not exceeding the spirit covered by the description and drawings.
Claims (10)
1. A flip chip package structure, comprising:
the flexible circuit board comprises a flexible substrate and a circuit layer arranged on the flexible substrate;
the chip is arranged on the flexible substrate and electrically connected with the circuit layer, and the circuit layer is positioned between the flexible substrate and the chip;
the packaging colloid is arranged beside the chip and positioned on the upper side of the flexible substrate;
the first cooling fin is attached to the flexible substrate and provided with an avoidance hole opposite to the chip in position, and the first cooling fin is provided with an inner edge arranged along the edge of the avoidance hole;
and the second radiating fin is attached to one side of the chip, which deviates from the flexible substrate, and is attached to the packaging colloid.
2. The flip chip package structure of claim 1, wherein an edge of the second heat spreader overlies the first heat spreader.
3. The flip chip package structure of claim 1, wherein the shape of the avoiding hole is adapted to the shape of the outer contour of the encapsulant.
4. The flip chip package structure of claim 3, wherein the avoiding hole is a rectangular hole.
5. The flip chip package structure of claim 4, wherein the encapsulant has an encapsulant bottom surface disposed on the upper side of the flexible circuit board and an encapsulant side surface disposed on the side surface of the chip, one side of the encapsulant bottom surface away from the chip is an outer edge of the encapsulant, and a distance between the outer edge of the encapsulant and a plane where the side surface of the chip is located is L, wherein L satisfies the following condition L1< L < L2, L1 is a shortest distance, and L2 is a longest distance;
the width a1 of the avoiding hole is not greater than D1+2 × L1, wherein D1 is the dimension of the chip in the width direction and is measured in mm;
the length A2 of the avoiding hole is not more than D2+ 2L 1, wherein D2 is the size of the chip in the length direction and the unit is mm.
6. The flip chip package structure of claim 5, wherein the encapsulant is disposed along the periphery of the chip and has a left encapsulant and a right encapsulant disposed on opposite sides of the chip;
the second fin has chip connecting portion and forms two edge connection portions in the relative both sides of chip connecting portion, chip connecting portion with the chip deviates from one side laminating mutually of flexible substrate, two edge connection portion laminates respectively the surface of left side colloid with the surface of right side colloid.
7. The flip chip package structure of claim 6, wherein the width C1 of the second heat spreader is not less than
Wherein H1 is the height of the chip in mm.
8. The flip chip package structure of claim 7, wherein the length C2 of the second heat spreader is not greater than the length D2 of the chip.
9. The flip chip package structure of claim 1, wherein an edge of the second heat spreader is juxtaposed to an inner edge of the first heat spreader.
10. A display device, comprising: the flip chip package structure of any one of claims 1 to 9 and a display screen, wherein the flexible circuit board further has an outer lead disposed on the flexible substrate, and the outer lead is electrically connected to the display screen.
Priority Applications (1)
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| CN202220722517.1U CN217114369U (en) | 2022-03-29 | 2022-03-29 | Flip chip package structure and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114721188A (en) * | 2022-03-29 | 2022-07-08 | 颀中科技（苏州）有限公司 | Forming method of flip chip packaging structure, flip chip packaging structure and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114721188A (en) * | 2022-03-29 | 2022-07-08 | 颀中科技（苏州）有限公司 | Forming method of flip chip packaging structure, flip chip packaging structure and display device |
| CN114721188B (en) * | 2022-03-29 | 2024-05-17 | 颀中科技（苏州）有限公司 | Flip chip packaging structure forming method, flip chip packaging structure and display device |
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