CN217088244U - Printed circuit board and electronic device - Google Patents

Abstract

A printed circuit board and electronic equipment, the printed circuit board includes base plate, circuit and shielding case, the circuit is formed on base plate, the shielding case is connected with base plate, and cover on the circuit; the circuit comprises a first element and a second element which are arranged at intervals, wherein the first element is grounded on the substrate, the substrate is used as a reference, the first element is higher than the second element, when the shielding cover is pressed and bent towards the substrate, the first element is in contact with the shielding cover to support the shielding cover, and the second element has a spacing distance from the shielding cover. Through the height that sets up first component in the circuit is higher than the second component, contacts with first component when the shield cover pressurized deformation, and first component is a part of circuit, and with the ground connection of base plate, on the basis of not introducing new material, also can not lead to the short circuit of circuit, also need not to change the structural design of shield cover, can reduce cost.

Description

Printed circuit board and electronic device

Technical Field

The present disclosure relates to the field of electronic product technology, and more particularly, to a printed circuit board and an electronic device.

Background

At present, the radiation of electronic products is increased along with the increasing frequency of internal signals, more and more electronic products are added with shielding cases in order to avoid the mutual influence of the internal signals and the influence on external equipment, and the shielding cases are smaller, thinner, shorter and shorter along with the trend of miniaturization and lightness and thinness of the products. This has to face the problem that the thinner the shield, the easier it is to deform; the shorter the shield, the smaller the gap inside the device and the easier it is to access the device body. If the product is in a power-on state, the shielding case contacts with the device pin, short circuit can be caused, the product is halted if the product is light, and the PCB is burnt if the product is heavy. The existing solutions are difficult to solve at low cost.

SUMMERY OF THE UTILITY MODEL

In a first aspect, the present disclosure provides a printed circuit board including a substrate, a circuit formed on the substrate, and a shield case connected to the substrate and covering the circuit; the circuit comprises a first element and a second element which are arranged at intervals, the first element is grounded on the substrate, the first element is higher than the second element by taking the substrate as a reference, when the shielding cover is pressed to bend towards the substrate, the first element is in contact with the shielding cover to support the shielding cover, and the second element has a spacing distance with the shielding cover.

Through the height that sets up first component in the circuit is higher than the second component, contacts with first component when the shield cover pressurized deformation, and first component is a part of circuit, and with the ground connection of base plate, on the basis of not introducing new material, also can not lead to the short circuit of circuit, also need not to change the structural design of shield cover, can reduce cost.

In one embodiment, the shielding case includes a support rib and a housing, the housing is wrapped on the support rib, the housing is located on a side of the support rib opposite to the substrate, and the first element is opposite to the support rib. Through the shield cover structure that sets up brace rod and shell, and first component is relative with the brace rod, and when the shield cover pressurized deformation, first component and brace rod contact and support the brace rod, and the structural strength of brace rod is greater than the shell, so can play the holistic supporting role to the shield cover, and the structure of brace rod and shell collocation, can make the shield cover realize lightweight design.

In one embodiment, the second element is spaced apart from the support rib in an orthographic projection on the substrate. So set up, even the brace bar warp to the height with the high the same of second component, the second component also can not contact with the brace bar to avoid the short circuit of circuit.

In one embodiment, the support rib comprises a first rib extending along a first direction and a second rib extending along a second direction, the first rib and the second rib are connected, the first direction and the second direction form an included angle, and the first element is opposite to the first rib. Different extending direction's first muscle and second muscle form skeletal structure, on the basis that reduces the whole weight of shield cover, guarantee its structural strength, and set up first component relative with first muscle, when the brace rod warp, first muscle is supported to first component, and the second muscle is connected with first muscle, so first component also can indirect play the effect of supporting the second muscle to the realization is to the holistic supporting role of brace rod and shield cover.

In one embodiment, the circuit further includes a third element and a fourth element arranged at intervals, the third element is grounded on the substrate, the third element is higher than the fourth element with reference to the substrate, and the third element is opposite to the second rib. Third component and the relative setting of second muscle for when the second muscle warp, third component and second muscle contact and play the supporting role, on the basis that first muscle was supported to first component, increase the third component again and support the second muscle, further promote the supporting role to brace muscle and shield cover.

In one embodiment, the third element is the same height as the first element. The height of the shielding cover is the same, the same supporting effect can be achieved, and the consistency of supporting force when the shielding cover deforms is guaranteed.

In one embodiment, the support rib further comprises a ring rib, the ring rib is annular, the ring rib is connected with the base plate, the first rib and the second rib, and an included angle is formed between the ring rib and the first rib. The ring rib is arranged to surround the circuit, support the first rib and the second rib and play a role in structural support.

In one embodiment, the support rib further comprises a connecting rib, the connecting rib is annular, the connecting rib is connected with the annular rib, the first rib and the second rib, and the connecting rib is flush and coplanar with the first rib. The connecting ribs are arranged, so that the effect of strengthening the structural strength can be achieved.

In one embodiment, the first element is an element required for realizing electrical performance, so that the electrical performance of the first element can be realized on the basis of the support, the integration level of the element is improved, and the number of elements is reduced.

In one embodiment, the first element is a patch capacitor. Set up first component and be paster electric capacity, use paster technology that can be convenient makes, and the technology is ripe and simple.

In a second aspect, the present disclosure also provides an electronic device comprising a housing and the printed circuit board of any one of the various embodiments of the first aspect, the printed circuit board being disposed within the housing.

The electronic equipment adopts the printed circuit board provided by the embodiment of the disclosure, the printed circuit board is provided with the shielding case, the printed circuit board is provided with the first element for supporting the shielding case, and the first element is an element in the circuit, so that the problem of short circuit between the shielding case and the circuit can be solved under the condition that no new material and no new process are added.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment.

Fig. 2 is a schematic structural diagram of a printed circuit board according to an embodiment.

Fig. 3 is a schematic structural diagram of a printed circuit board with a shielding case removed and a housing of an embodiment.

Fig. 4 is a perspective view of a printed circuit board with a shield removed from the housing according to an embodiment.

Fig. 5 is a partial structural sectional view of a printed circuit board of an embodiment.

Fig. 6 is a schematic perspective view of a shield according to an embodiment.

Fig. 7 is a schematic perspective view of a support rib according to an embodiment.

Description of reference numerals:

100-an electronic device;

10-printed circuit board, 11-substrate, 12-circuit, 121-first element, 122-second element, 123-third element, 124-fourth element;

20-shielding case, 21-supporting rib, 211-ring rib, 212-connecting rib, 213-first rib, 214-second rib, 215-hollow space and 22-shell.

Detailed Description

Technical solutions in embodiments of the present disclosure will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present disclosure without making any creative effort belong to the protection scope of the present disclosure.

Referring to fig. 1 and fig. 2, an embodiment of the present disclosure provides an electronic device 100, which includes a housing and a printed circuit board 10 in any embodiment of the present disclosure, where the printed circuit board 10 is disposed in the housing. The printed circuit board 10 is provided with a shield case 20.

The housing may be made of any material, such as metal, glass, plastic, etc. It should be noted that the electronic device 100 of the present disclosure can radiate and receive electromagnetic waves and can perform wireless communication, so when selecting a housing, such as metal, which has a shielding effect on electromagnetic waves, a window needs to be cut on the housing, and the window may be cut in a specific manner, such as cutting a block on a frame of the housing, and filling a non-metal material, such as plastic, in the cut portion, so as to enable electromagnetic wave signals of the electronic device 100 to be transmitted and received through the window. When the housing is made of a material having no shielding effect on electromagnetic waves, such as glass, plastic, etc., it is not necessary to open a window on the housing. The shape, configuration, and the like of the housing may be set as needed according to the difference of the electronic apparatus 100, and are not limited to this.

The printed circuit board 10 may be any one of a plurality of boards in the electronic device 100, various components are generally integrated on the printed circuit board 10, the various components and the wires connecting the components form a circuit 12, and a plurality of circuits 12 may be further disposed on each printed circuit board 10 as required, and the plurality of circuits are respectively used for implementing different functions. A shield 20 is provided over each circuit 12, and the shield 20 is used to prevent signal interaction between boards in the electronic device 100, interaction between the boards 12 on each pcb 10, and interference with external devices outside the electronic device 100. It should be understood that, for the antenna for wireless communication, the shielding case 20 does not cover the antenna, the shielding case 20 can cover a radio frequency chip or the like for providing radio frequency signals to the antenna, but it should be ensured that the antenna is outside the shielding case 20 to avoid affecting the wireless communication.

The electronic device 100 of the present disclosure may specifically be a smart phone, a face recognition machine, a tablet computer, a desktop computer, a notebook computer, etc., and may specifically not be limited.

The electronic device 100 of the present disclosure employs the printed circuit board 10 provided by the embodiment of the present disclosure, the printed circuit board 10 is provided with the shielding case 20, and as will be known hereinafter, the printed circuit board 10 is provided with the first element 121 for supporting the shielding case 20, and the first element 121 is an element in the circuit 12, so that the problem of short circuit between the shielding case 20 and the circuit 12 can be solved without adding new materials or adding new processes.

The printed circuit board 10 of the present disclosure is described in detail below.

Referring to fig. 2 and 3, a printed circuit board 10 according to an embodiment of the present disclosure includes a substrate 11, a circuit 12, and a shielding cover 20, wherein the circuit 12 is formed on the substrate 11, and the shielding cover 20 is connected to the substrate 11 and covers the circuit 12.

The circuit 12 includes various components and traces connecting the components, and during manufacturing, a copper layer may be formed on the substrate 11, the traces may be formed on the copper layer by etching or other processes, and then the components and the traces may be connected by a mounting process such as reflow soldering or other processes.

The substrate 11 is made of an insulating material. Optionally, the shielding case 20 is made of metal. The metallic material of the shield can 20 plays a role of electromagnetic field shielding.

It should be understood that a plurality of circuits 12 may be disposed on a substrate 11, and a shielding can 20 may be disposed on each circuit 12, so as to avoid the interaction among the plurality of circuits 12.

The connection manner of the shielding cover 20 and the substrate 11 includes, but is not limited to, screwing, clamping, welding, and the like, and is not particularly limited.

Referring to fig. 3 to 5, the circuit 12 includes a first element 121 and a second element 122 disposed at an interval, and the first element 121 is grounded on the substrate 11. The first element 121 is higher than the second element 122 with respect to the substrate 11, and when the shield can 20 is pressed to be bent toward the substrate 11, the first element 121 contacts the shield can 20 to support the shield can 20, and the second element 122 has a spaced distance from the shield can 20.

The first element 121 and the second element 122 are elements constituting the circuit 12, that is, the first element 121 and the second element 122 are not additionally provided elements, and are elements required by the circuit 12 itself for realizing electrical performance.

The first element 121 and the second element 122 may be elements required for realizing electrical performance, such as a capacitor, an inductor, a resistor, and the like, so that the first element 121 can also realize electrical performance on the basis of being used as a support, thereby improving the integration level of the elements and reducing the number of the elements. Optionally, the first element 121 may be a chip capacitor, and the second element 122 may also be a chip capacitor, for example, the first element 121 may be 0805 capacitor, and the second element 122 may be 0603 capacitor, where 0805 and 0603 refer to the types of chip capacitors, and the size of the 0805 capacitor is larger than the size of the 0603 capacitor. The first element 121 and the second element 122 are arranged to be patch capacitors, so that the patch capacitors can be conveniently manufactured by using a patch process, and the process is mature and simple. Of course, the specific selection of the first element 121 and the second element 122 is not limited thereto.

The first element 121, the second element 122 and the shielding case 20 are all arranged on the substrate 11, the height of the first element 121 is higher than that of the second element 122, when the shielding case 20 is pressed, the shielding case 20 is deformed to be in contact with the first element 121 but not in contact with the second element 122, and since the first element 121 is grounded on the substrate 11, the contact between the shielding case 20 and the first element 121 does not cause short circuit at the first element 121 and does not affect the normal electrical performance of the first element 121 and the second element 122.

The height difference between the first element 121 and the second element 122 is not limited, and it is only necessary that the second element 122 does not contact the shield can 20 when the first element 121 contacts the shield can 20. The height of the first element 121 is less than or equal to the height of the shielding can 20; when the height of the first element 121 is equal to the height of the shielding case 20, the first element 121 contacts the shielding case 20 to play a supporting role when the shielding case 20 is not pressed; when the height of the first element 121 is smaller than the height of the shielding can 20, the shielding can 20 is pressed and deformed to contact with the shielding can 20, and the first element 121 can also play a supporting role. There may be several elements in circuit 12 in addition to first element 121 and second element 122, but it should be understood that first element 121 is the highest height element in circuit 12, and that other elements are all lower in height than first element 121. It will also be understood that the second element 122 represents an element other than the first element 121.

In a specific arrangement, a first element 121 which is higher and a second element 122 which is lower are included in the circuit 12, and the first element 121 is adjusted to a position where the shield can 20 can be supported, so that a new element does not need to be introduced, only the position of the element is changed, and the cost is reduced.

In the related art, there is a scheme that a copper pillar or other supporting structures are additionally arranged on the substrate 11 to be used as a support, so that a new material is introduced, and the copper pillar or other supporting structures are inconvenient to manufacture and form by a surface mount technology and have high cost.

In the related art, another solution is to increase the height of the shield can 20 so that the shield can 20 does not collide with the components in the circuit 12 even if it is deformed by pressure, thereby avoiding the problem of short circuit of the circuit 12. However, this solution would increase the thickness of the electronic device 100, which is not favorable for light and thin design.

In the related art, there is also a solution to provide an insulating material on the inner surface of the shielding can 20, so that when the shielding can 20 contacts with the components in the circuit 12, the insulating material blocks the contact and does not cause a short circuit problem in the circuit 12. However, this solution requires the cost of the insulating material to be increased, and requires a new process of spraying or adhering the insulating material, which is relatively high.

In the embodiment, by setting the height of the first element 121 in the circuit 12 to be higher than that of the second element 122, the shielding case 20 is in contact with the first element 121 when being deformed by pressure, and the first element 121 is a part of the circuit 12 and is grounded with the substrate 11, so that the circuit 12 is not short-circuited on the basis of not introducing new materials, and the structural design of the shielding case 20 is not required to be changed, thereby reducing the cost.

Optionally, referring to fig. 3, 4, 6 and 7, the shielding cover 20 includes a supporting rib 21 and a housing 22, the housing 22 is covered on the supporting rib 21, the housing 22 is located on a side of the supporting rib 21 opposite to the substrate 11, and the first element 121 is opposite to the supporting rib 21.

The support ribs 21 are made of metal, such as stainless steel or aluminum alloy, and the support ribs 21 constitute a skeleton of the shield case 20, which has a strength to support the shield case, and the metal of the support ribs 21 also serves to shield the electromagnetic waves.

The housing 22 may be made of a metal material, and the housing 22 is wrapped on the support rib 21, so that the shielding case 20 can enclose a closed space together with the substrate 11 after being disposed on the substrate 11, thereby protecting the circuit 12 enclosed therein and further shielding the electromagnetic waves. The metal material of shell 22 and the metal material of brace rod 21 can be different, for example, brace rod 21 adopts the foreign white copper, can conveniently go up tin, is convenient for with base plate 11 welded fastening, and shell 22 adopts tinplate, and the low price is with low costs.

The supporting ribs 21 and the shell 22 are matched, so that the thickness of the supporting ribs 21 can be thicker, and the shell 22 can be thinner, and the light weight is realized. The support rib 21 and the housing 22 may be an integral structure or a detachable structure. When the structure is an integrated structure, the whole shielding cover 20 is welded on the substrate 11 at one time; in the detachable structure, the supporting ribs 21 can be welded and fixed on the substrate 11, and then the housing 22 is installed on the supporting ribs 21, which can facilitate the maintenance of the components in the circuit 12.

When the shielding case 20 is deformed under pressure, the pressure of the housing 22 acts on the support rib 21, the support rib 21 is bent and deformed, and the first element 121 is opposite to the support rib 21, so that the support rib 21 contacts with the first element 121 to support the support rib 21, thereby supporting the shielding case 20.

Therefore, through the structure of the shielding case 20 provided with the supporting ribs 21 and the housing 22, and the first element 121 is opposite to the supporting ribs 21, when the shielding case 20 is deformed under pressure, the first element 121 contacts the supporting ribs 21 and supports the supporting ribs 21, and the structural strength of the supporting ribs 21 is greater than that of the housing 22, so that the shielding case 20 can be supported integrally, and the shielding case 20 can be designed in a light weight manner due to the matched structure of the supporting ribs 21 and the housing 22.

Alternatively, the support ribs 21 may not be provided, and the whole of the shield case 20 may be the structure of the housing 22.

Optionally, referring to fig. 3, fig. 4, fig. 6 and fig. 7, in the orthographic projection of the base plate 11, the second element 122 has a spacing distance from the support rib 21.

With this arrangement, when the support rib 21 contacts the first element 121, since the distance and the height difference between the first element 121 and the second element 122 are small, in case of an excessive pressure, the support rib 21 contacts the second element 122, so that the arrangement is performed as described above, and even if the support rib 21 is deformed to a height equal to the height of the second element 122, the second element 122 does not contact the support rib 21, thereby preventing the short circuit of the circuit 12.

In addition, since the housing 22 is provided on the side of the support rib 21 facing away from the base plate 11, that is, the height of the housing 22 is higher than the height of the support rib 21, the housing 22 around the support rib 21 is hardly brought into contact with the second element 122 even when it is deformed.

Optionally, the second element 122 may also be opposite to the support rib 21, and the height difference between the first element 121 and the second element 122 may be larger, so that the support rib 21 may not contact with the second element 122 when deformed.

In the related art, there is a proposal to modify the layout of the circuit 12 on the substrate 11 so that the components avoid the support ribs 21, so that when the shield case 20 is deformed under pressure, the deformation will not contact the components at any position opposite to the support ribs 21, and short circuit of the circuit 12 can be avoided. However, this solution requires modification of the layout of the circuit 12 of the pcb 10, and since the layout and the routing of each component are highly integrated and dense, the layout of the circuit 12 cannot be modified or is difficult to modify, even if it can be modified at a high cost.

In the related art, another solution is to modify the position of the support rib 21 to avoid the components in the circuit 12, but after modifying the position of the support rib 21, the support property may be insufficient, and the shielding can 20 may not function properly.

In the present disclosure, the first element 121 is arranged to support the support rib 21, and the layout of the circuit 12 or the position of the support rib 21 does not need to be modified, so that the cost can be reduced, the structural strength of the shielding case 20 can be ensured, and the support rib 21 has sufficient support performance.

Optionally, referring to fig. 3, fig. 4, fig. 6, and fig. 7, the support rib 21 includes a first rib 213 extending along a first direction and a second rib 214 extending along a second direction, the first rib 213 is connected to the second rib 214, an included angle is formed between the first direction and the second direction, and the first element 121 is opposite to the first rib 213.

The first rib 213 and the second rib 214 may be formed in a cross shape, a T shape, an L shape, or the like, and may be formed in an integral structure. Different extending direction's first muscle 213 and second muscle 214, form skeleton texture, on the basis of the whole weight of reduction shield 20, guarantee its structural strength, and it is relative with first muscle 213 to set up first component 121, when the brace rod 21 warp, first component 121 supports first muscle 213, and second muscle 214 is connected with first muscle 213, so first component 121 also can indirect play the effect of supporting second muscle 214, thereby the realization is to the holistic supporting role of brace rod 21 and shield 20.

Optionally, referring to fig. 3, 4, 6 and 7, the circuit 12 further includes a third element 123 and a fourth element 124 which are arranged at an interval, the third element 123 is grounded on the substrate 11, the third element 123 is higher than the fourth element 124 with reference to the substrate 11, and the third element 123 is opposite to the second rib 214.

The third element 123 is arranged opposite to the second ribs 214, so that when the second ribs 214 deform, the third element 123 is in contact with the second ribs 214 to play a supporting role, and on the basis that the first element 121 supports the first ribs 213, the third element 123 is additionally arranged to support the second ribs 214, so that the supporting role of the supporting ribs 21 and the shielding case 20 is further improved.

The third element 123 may be the same as the first element 121, and reference may be made to the arrangement of the first element 121, so that the arrangement of the third element 123 does not cause a short circuit in the circuit 12.

The fourth element 124 may be the same as the second element 122, and the arrangement of the second element 122 may be referred to, and therefore, the electrical performance of the circuit 12 can be achieved by providing the third element 123 and the fourth element 124.

Alternatively, referring to fig. 4, the third element 123 has the same height as the first element 121. Specifically, the two capacitors can be 0805 capacitors, and the heights of the two capacitors are the same, so that the same supporting effect can be achieved, and the consistency of supporting force when the shielding case 20 deforms is ensured.

Optionally, referring to fig. 3, fig. 4, fig. 6, and fig. 7, the support rib 21 further includes a ring rib 211, the ring rib 211 is annular, the ring rib 211 is connected to the base plate 11, the first rib 213, and the second rib 214, and an included angle is formed between the ring rib 211 and the first rib 213.

The ring rib 211 is in the shape of a ring connected end to end, and substantially encloses a cylindrical or table-shaped space, the circuit 12 is accommodated in the space, the bottom of the ring rib 211 is connected with the substrate 11, and the top of the ring rib 211 is connected with the first rib 213 and the second rib 214. The annular rib 211 supports the first rib 213 and the second rib 214, when the first rib 213 and the second rib 214 are not deformed by pressure, the first rib 213 and the second rib 214 may be substantially parallel to the plane of the substrate 11 on which the circuit 12 is disposed, and the top of the annular rib 211 is smaller than or equal to the bottom of the annular rib, that is, the included angle between the annular rib 211 and the first rib 213 is greater than or equal to 90 °, and smaller than 180 °, optionally, the included angle is 90 °, 120 °, 150 °, and the like. It should be understood that the bottom dimension and the top dimension of the ring rib 211 refer to the area of the space enclosed therein, and the bottom dimension of the ring rib 211 is larger than the top dimension, so that the structure of the support rib 21 is more stable.

Thus, the annular rib 211 is provided to surround the circuit 12 and to support the first rib 213 and the second rib 214 for structural support.

Optionally, referring to fig. 3, fig. 4, fig. 6, and fig. 7, the support rib 21 further includes a connection rib 212, the connection rib 212 is annular, the connection rib 212 connects the annular rib 211, the first rib 213, and the second rib 214, and the connection rib 212 is flush and coplanar with the first rib 213.

The connecting rib 212 is annular in an end-to-end connection, and its entirety is coplanar with the planes of the first rib 213 and the second rib 214. The connecting ribs 212 are arranged to play a role in enhancing the structural strength.

The connection rib 212, the first rib 213 and the second rib 214 can enclose a hollow space 215, and a plurality of hollow spaces 215 can be disposed on one shielding case 20, and the purpose of the hollow spaces 215 is to remove the housing 22 when the components in the circuit 12 are damaged and need to be repaired or replaced, and then repair or replace the components through the hollow spaces 215. Meanwhile, due to the design of the ring rib 211, the connecting rib 212, the first rib 213 and the second rib 214, a framework of the shielding case 20 is formed, the circuit 12 is surrounded, and the electromagnetic shielding effect is also achieved.

The housing 22 is wrapped on the ring rib 211, the connecting rib 212, the first rib 213 and the second rib 214, so that the whole of the shielding case 20 forms a groove-shaped space, and after the shielding case 20 is connected with the substrate 11, the space for accommodating the circuit 12 can be closed.

While the disclosure has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the disclosure.

Claims (11)

1. A printed circuit board comprising a substrate, a circuit formed on the substrate, and a shield case connected to the substrate and covering the circuit;

the circuit comprises a first element and a second element which are arranged at intervals, the first element is grounded on the substrate, the first element is higher than the second element by taking the substrate as a reference, when the shielding cover is pressed to bend towards the substrate, the first element is in contact with the shielding cover to support the shielding cover, and the second element has a spacing distance with the shielding cover.

2. The pcb of claim 1, wherein the shield includes a support rib and a housing, the housing is wrapped around the support rib, and the housing is located on a side of the support rib opposite to the substrate, and the first element is opposite to the support rib.

3. The printed circuit board of claim 2, wherein the second element is spaced from the support rib in an orthographic projection on the substrate.

4. The printed circuit board of claim 2, wherein the support rib comprises a first rib extending in a first direction and a second rib extending in a second direction, the first rib and the second rib are connected, the first direction and the second direction form an included angle, and the first element is opposite to the first rib.

5. The printed circuit board of claim 4, wherein the circuit further comprises a third element and a fourth element spaced apart from each other, the third element being grounded on the substrate with respect to the substrate, the third element being higher than the fourth element, the third element being opposite to the second rib.

6. The printed circuit board of claim 5, wherein the third element is the same height as the first element.

7. The PCB of claim 4, wherein the support rib further comprises a ring rib, the ring rib is annular, the ring rib connects the substrate, the first rib and the second rib, and the ring rib and the first rib have an included angle.

8. The printed circuit board of claim 7, wherein the support rib further comprises a connection rib, the connection rib is annular, the connection rib connects the annular rib, the first rib and the second rib, and the connection rib is flush and coplanar with the first rib.

9. A printed circuit board according to any of claims 1 to 8, wherein the first component is a component required to achieve electrical performance.

10. The printed circuit board of claim 9, wherein the first component is a patch capacitor.

11. An electronic device comprising a housing and a printed circuit board according to any one of claims 1 to 10, the printed circuit board being disposed within the housing.

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