CN217072049U - Polishing disk and polishing equipment - Google Patents
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- CN217072049U CN217072049U CN202220270351.4U CN202220270351U CN217072049U CN 217072049 U CN217072049 U CN 217072049U CN 202220270351 U CN202220270351 U CN 202220270351U CN 217072049 U CN217072049 U CN 217072049U
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Abstract
The application relates to a polishing equipment technical field, especially a polishing dish, polishing dish includes: the polishing device comprises a disc body, a first polishing head and a second polishing head, wherein the disc body is provided with a first surface and a second surface, the first surface is used for directly or indirectly contacting with a polishing sheet to polish the polishing sheet, and a heat source is formed on the disc body in a polishing working state; a first member connected to the second side at a position corresponding to the heat source such that heat from the heat source is conducted to the first member to dissipate heat. The technical problems that the prior art cannot have good heat dissipation effect and the structure of the polishing disc is simplified at the same time are solved; the technical effect that the polishing disc has a good heat dissipation effect while the structure is simplified is achieved.
Description
Technical Field
The application relates to the technical field of polishing equipment, in particular to a polishing disc and polishing equipment.
Background
Silicon wafer production is an important foundation in the chip industry and is also the largest part of the chip manufacturing material market. With the continuous improvement of chip manufacturing process and technological progress, the silicon chip size used in the advanced manufacturing process production line is larger and larger due to the high utilization rate and low cost of large-size silicon chips. The 300mm large silicon chip is mainly used for integrated circuit chips with the line width below 90nm, comprises chips with advanced processes such as logic chips (GPA, CPU and FGPA), memory chips (SSD and DRAM) and the like, and serves terminal semiconductor product technologies such as smart phones, computers, cloud computing, artificial intelligence and the like. The production of 300mm silicon wafers mainly passes through more than ten complex processes of long crystal, slicing, chamfering, lapping, thinning, double polishing, side polishing, final polishing, cleaning, detecting and the like, and finally qualified silicon wafers are produced and enter the front-end process of chips. The highest technical threshold is the double-side polishing technology, and the double-side polishing technology adopts a Chemical Mechanical Polishing (CMP) technology to remove a damaged layer on the surface of a silicon wafer and obtain excellent surface flatness at the same time.
In the prior art, heat is generated in the rotary polishing process of a polishing disc, a heat dissipation structure is additionally arranged on the polishing disc for cooling the polishing disc in a heat dissipation manner in order to prevent the polishing disc from deforming and warping, generally, the polishing disc is cooled by adopting a water-cooling heat dissipation structure, and cooling water takes away the heat on the polishing disc through a water channel so as to complete the cooling effect on the polishing disc; in addition, because the pressure of the polishing disk on the polishing sheet is increased after water is supplied, in order to meet the fine polishing steps of double polishing, the polishing disk needs to be lifted, and the structural complexity of the polishing disk is further increased.
Therefore, the technical problems of the prior art are as follows: how to combine the good heat dissipation effect and the simplification of structure of polishing dish concurrently.
SUMMERY OF THE UTILITY MODEL
The application provides a polishing disc and polishing equipment, which solve the technical problems that the prior art cannot have good heat dissipation effect and simplified structure of the polishing disc; the technical effect that the polishing disc has a good heat dissipation effect while the structure is simplified is achieved.
In a first aspect, the present application provides a polishing disk, which adopts the following technical scheme:
a polishing disk, comprising: the polishing disc comprises a disc body, a first polishing head and a second polishing head, wherein the disc body is provided with a first surface and a second surface, the first surface is directly or indirectly contacted with a polishing sheet to polish the polishing sheet, and a heat source is formed on the disc body in a polishing working state; a first member connected to the second side at a position corresponding to the heat source such that heat from the heat source is conducted to the first member to dissipate heat.
Preferably, the disc body is provided with heat sources distributed in an annular shape; the first member is arranged in a ring shape and is connected to the second face at a position corresponding to the heat source.
Preferably, the centre of the first distribution coincides with the centre of the heat source distribution.
Preferably, the polishing disk further comprises: a second member in an annular arrangement, the second member attached to the second face of the polishing disk; the second member has one or more sets, and the second member is arranged concentrically with the first member.
Preferably, the radius R of the first member arrangement 0 Comprises the following steps: r 0 1/2 × (R-R) + R, wherein the disk body is annular, R is an outer ring radius of the disk body, and R is an inner ring radius of the disk body.
Preferably, the radial width of the first member is greater than the radial width of the second member.
Preferably, the polishing disk further comprises: a third member having a plurality of sets, the third member being radially and uniformly distributed and connected to the second side of the polishing disk.
In a second aspect, the present application provides a polishing apparatus, which adopts the following technical solutions:
a polishing apparatus comprising: a first disk; a second disc disposed opposite the first disc, a polishing space being formed between the second disc and the first disc; and the driving mechanism is respectively connected with the first disc and the second disc and is used for driving the first disc and the second disc to rotate.
Preferably, the number N of said third members 1 Comprises the following steps: n is a radical of 1 ＝(N 2 -1)×10，N 2 2 × α +1, wherein N 2 Is the sum of the number of first and second pieces, and N 2 Is odd; α is a rotation speed ratio of the first disk and the second disk.
Preferably, the radius R of the second piece arrangement x Comprises the following steps: r x ＝R 0 +x/(N 2 -1) + α) x (R-R), wherein the disc body is annular, R 0 Is the arrangement radius of the first piece, R is the outer ring radius of the disc body, R is the inner ring radius of the disc body; α is a rotation speed ratio of the first disk and the second disk; and x is a mark number arranged on the second piece, the mark number takes the first piece as a reference of 0, the mark numbers of the second piece positioned in the first piece are sequentially minus 1 from outside to inside, and the mark numbers of the second piece positioned outside the first piece are sequentially plus 1 from inside to outside.
In summary, the present application includes at least one of the following beneficial technical effects:
1. in this application among the polishing dish, arrange on the position that corresponds the heat source on the dish body and be used for radiating first, through first heat conduction on with the heat source, give off to the air in to play and carry out refrigerated effect to the polishing dish, make the polishing dish under the condition that has simple and easy structure, still have good heat dispersion concurrently. The technical problems that the prior art cannot have good heat dissipation effect and the structure of the polishing disc is simplified at the same time are solved; the technical effect that the polishing disc has a good heat dissipation effect while the structure is simplified is achieved.
2. The first piece is arranged on the corresponding heat source distributed annularly in an annular mode, the first piece and the second piece are matched to achieve a heat dissipation effect, the third piece is used for enhancing the radial strength, meanwhile, the heat dissipation area is increased, the heat dissipation effect is improved, and the polishing disc is smaller in thermal deformation under the condition of the same polishing disc material.
Drawings
FIG. 1 is a schematic view of a polishing disk according to the present application;
FIG. 2 is a top view of a polishing disk according to the present application;
FIG. 3 is a schematic view of a polishing apparatus according to the present application;
FIG. 4 is a schematic view of the arrangement of the first, second and third members on the polishing pad of the present application;
FIG. 5 is a schematic illustration of a comparative example of a polishing pad described herein;
FIG. 6 is a schematic view of deformation in the polishing pad of the present embodiment;
figure 7 is a schematic representation of the deformation of a comparative example in a polishing pad as described herein.
Description of reference numerals: 100. a disc body; 200. a first piece; 201. a first heat dissipation rib; 300. a second piece; 301. a second heat dissipation rib; 400. a third piece; 401. a radial rib; 500. a first disk; 600. a second disc; 700. polishing the space; 800. a drive mechanism; 801. a first drive wheel; 802. a second drive wheel.
Detailed Description
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
The embodiment of the application provides a polishing disc and polishing equipment, and solves the technical problems that the prior art cannot have good heat dissipation effect and simplified structure of the polishing disc; the technical effect that the polishing disc has a good heat dissipation effect while the structure is simplified is achieved.
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The polishing refers to a process of reducing the roughness of the surface of a polishing sheet by using mechanical or/and chemical actions to obtain a bright and flat surface, in the polishing process, heat is generated due to the mechanical friction action between the surface of a polishing disc and the polishing sheet, generally, the heat source is distributed annularly, the thermal deformation of the polishing disc is caused to a certain extent due to the generation of heat, and the flatness of the polished polishing sheet is not good under the condition of low flatness of the polishing disc. Wherein, the heat source is distributed in a ring shape, which means that the polishing disk has a ring-shaped distribution area, the temperature of the area is higher during the polishing rotation, and the temperature of the area is gradually decreased along the radial direction inside and the radial direction outside, thereby forming the ring-shaped distribution heat source.
Therefore, in order to ensure high polished sheet surface quality and flatness, the problem of thermal deformation caused by polishing heat is solved first. The applicant adopts a way of pressurizing in a subarea way, radiating by water cooling or radiating by air cooling to solve the problem of thermal deformation of the polishing disk; the problem of heat generation is not solved essentially by zone pressurization, and although the distribution change of the pressure on the surface of the silicon wafer caused by thermal deformation can be controlled, the problem of deterioration of polishing solution caused by high temperature easily influences the chemical reaction with the surface of the silicon wafer. The water cooling mode needs to design a water channel in the polishing disc, and cooling water takes away heat on the polishing disc through the water channel so as to finish the cooling effect on the polishing disc, and meanwhile, the structure of the heat radiator is additionally arranged to increase the complexity of the structure of the polishing disc; in addition, the whole thickness of the polishing disk is large, and because the pressure of the polishing disk on the polishing sheet is increased after water is supplied, in order to meet the requirement of the fine polishing steps of double polishing, the polishing disk needs to be lifted, and the structural complexity of the polishing disk is further increased. The air cooling heat dissipation is that a heat dissipation structure is added outside the polishing disc to increase the heat dissipation area, the heat dissipation of the polishing disc is realized through the heat exchange between the heat dissipation mechanism and the air, the air cooling heat dissipation structure is indirect, but a reasonable heat dissipation structure needs to be designed and a proper polishing disc material needs to be selected, otherwise, the disc shape stability of the polishing disc is poor. Even if the overall heat dissipation effect is good, the polishing disk cannot be prevented from having good flatness and warping of the polishing disk, and therefore the design of the air cooling structure of the polishing disk and the material selection of the polishing disk are particularly important.
A polishing pad, as shown in FIG. 1, comprises a pad body 100, a first member 200, a second member 300, and a third member 400, the pad body 100 is used for polishing a polishing pad, specifically, the pad body 100 is ring-shaped, the pad body 100 has a first surface and a second surface, the pad body 100 has an expansion coefficient less than or equal to 3.5 x 10 -6 The material is prepared from the material of/K; generally, the disk body 100 is horizontally placed, the first surface is the lower surface of the disk body 100, and the first surface is used for directly or indirectly contacting with a polishing sheet to polish the polishing sheet; the second surface is an upper surface of the disc body 100, the first member 200 is connected to the second surface, and the first member 200 is used to conduct heat generated from the disc body 100 to the air, thereby dissipating heat from the disc body 100.
Wherein, during the rotation polishing process of the disk body 100, a heat source is formed on the disk body 100 due to the friction between the polishing sheet and the first surface, and the first member 200 is connected to the second surface at a position corresponding to the heat source; in one embodiment, during the polishing process, the polishing pad rotates circularly around the center of the disk body 100 as the rotation center, and correspondingly, the heat sources formed on the disk body 100 are distributed along the rotation track, so that during the polishing disk rotation, the heat sources distributed annularly are formed on the disk body 100, and the center of the circle of the heat sources distributed annularly coincides with the center of the disk body 100. Correspondingly, on the second face, the positions where the first pieces 200 are distributed correspond to the positions where the heat sources are distributed in the ring shape, and the first pieces 200 are connected to the second face.
The first member 200, as shown in fig. 1 and 2, the first member 200 serves to dissipate heat of the disc body 100. The first part 200 is connected to the second surface corresponding to the heat source distribution, in one embodiment, the first part 200 is an annular first heat dissipation rib 201, the first heat dissipation rib 201 is connected to the second surface or integrally formed with the second surface, a circle center of the first heat dissipation rib 201 coincides with a circle center of the disk body 100, and a radius of the first heat dissipation rib 201 is the same as a radius of the heat source distribution, so that the first heat dissipation rib 201 is located on a region where the heat source is distributed, that is, the first heat dissipation rib is located on an annular region where the temperature of the annular heat source is higher, but not on a region where the temperature is decreasing. Further, the radius R of the distribution of the first heat dissipating ribs 201 is based on the disc body 100 and the formed source heat distribution 0 Comprises the following steps:
R 0 ＝1/2×(R-r)+r
wherein, the disk body 100 is annular, R is the outer ring radius of the disk body 100, and R is the inner ring radius of the disk body 100.
The second member 300, as shown in fig. 1 and 2, the second member 300 serves to dissipate heat of the disc body 100. Like the first member 200, the second member 300 is attached to the second face of the disc body 100, and the second member 300 is annularly arranged, and the center of the annular arrangement of the second member 300 coincides with the center of the annular arrangement of the first member 200, that is, the second member 300 forms a concentric circle with the first member 200. The second member 300 has one or more groups, each group of the second members 300 is concentrically arranged with the first member 200, in an embodiment, the second member 300 is specifically an annular second heat dissipation rib 301, the number of the second heat dissipation ribs 301 is two, and the two second heat dissipation ribs 301 are respectively located at the inner side and the outer side of the first heat dissipation rib 201, that is, the radius of one of the second heat dissipation ribs 301 is smaller than that of the first heat dissipation rib 201 and located inside the first heat dissipation rib 201, and the radius of the other second heat dissipation rib 301 is larger than that of the first heat dissipation rib 201 and located outside the first heat dissipation rib 201.
It should be noted that the heights of the first heat dissipation rib 201 and the second heat dissipation rib 301 should satisfy: in the direction perpendicular to the disk body 100, the first heat dissipation ribs 201 and the second heat dissipation ribs 301 are arranged at the same height and equal to the thickness of the disk body 100; the height of the radial ribs 401 is less than or equal to the height of the first heat dissipation ribs 201. The radial widths of the first heat dissipation ribs 201 and the second heat dissipation ribs 301 should satisfy: the radial width of the first heat dissipation rib 201 is greater than the radial width of each second heat dissipation rib 301, so that the first heat dissipation rib 201 can effectively conduct heat on an annular heat source to the first heat dissipation rib 201, and further, the radial width of the first heat dissipation rib 201 can be greater than or equal to the radial width of the heat source distribution.
The third member 400, as shown in fig. 1 and 2, is used to reinforce the strength of the disc body 100. The third piece 400 has a plurality of groups and all connects on the second face of the disc body 100, specifically, the radial evenly distributed of the third piece 400 along the disc body 100 is on the second face, in an embodiment, the third piece 400 specifically is radial rib 401, the number of the radial ribs 401 is 20, and the radial ribs 401 evenly distributed is on the second face, that is to say, the included angle between every two adjacent radial ribs 401 is equal. Radial reinforcing ribs are arranged on the second surface of the disc body 100, so that the strength of the disc body 100 in the radial direction is improved in the process of polishing the rotation of the polishing disc, and the radial ribs 401 are favorable for resisting the deformation of the heat source area of the disc surface and improving the flatness of the disc body 100.
The application further provides a polishing apparatus, the polishing apparatus is used for polishing a polished wafer, as shown in fig. 3, the polishing apparatus includes a first disk 500, a second disk 600 and a driving mechanism 800, the first disk 500 and the second disk 600 are both horizontally arranged, a polishing space 700 is formed between the first disk 500 and the second disk 600, the polished wafer is located in the polishing space 700 and clamped by the first disk 500 and the second disk 600, and the driving mechanism 800 is respectively connected to and acts on the first disk 500 and the second disk 600, so that the first disk 500 and the second disk 600 rotate, and polishing of the polished wafer is achieved.
The first tray 500, as shown in fig. 3, the first tray 500 serves as an upper tray of the polishing apparatus. The first plate 500 is located above the second plate 600, and the first plate 500 is specifically a polishing plate as described above, and the mechanism of the first plate 500 will not be described again. The lower surface of the first plate 500 is for direct or indirect contact with the polishing pad, and the upper surface is for connection of the first member 200, the second member 300, and the third member 400.
The second plate 600, as shown in fig. 3, the second plate 600 serves as a lower plate of the polishing apparatus. The second disc 600 is positioned directly below the first disc 500, and polishing is performed by sandwiching a polishing sheet between the first disc 500 and the second disc 600 by a polishing pad, and driving the first disc 500 and the second disc 600 to rotate. A water passage is formed in the second plate 600 to allow cooling water to flow therethrough. Wherein, the materials of the first disk 500 and the second disk 600 are low expansion coefficient materials, and the expansion coefficient is lower than 3.5 multiplied by 10 < -6 >/K.
As shown in fig. 3 and 4, the number of the second member 300 (second heat dissipation rib 301) and the third member 400 (radial rib 401) is required to satisfy: number N of third pieces 400 (radial ribs 401) 1 Comprises the following steps:
N 1 ＝(N 2 -1)×10，N 2 ＝2×α+1
wherein N is 2 Is the sum of the number of first pieces 200 and second pieces 300, and N 2 Is odd; α is a rotation speed ratio of the first disc 500 to the second disc 600; in one embodiment, the number of the radial ribs 401 is 20, and at this time, the sum of the numbers of the first and second members 200 and 300 is 3, and the rotation speed ratio of the first and second disks 500 and 600 is 1.
As shown in fig. 3 and 4, on the first disk 500, one or more groups of the second members 300 (second heat dissipation ribs 301) may be arranged, and the radius of arrangement of the second members 300 (second heat dissipation ribs 301) needs to satisfy: radius R of arrangement of the second member 300 (second heat dissipating rib 301) x Comprises the following steps:
R x ＝R 0 +x/(N 2 -1)+α)×(R-r)
wherein the disc body 100 is annular, R0 is the arrangement radius of the first piece 200, R is the outer ring radius of the disc body 100, R is the inner ring radius of the disc body 100; α is a rotation speed ratio of the first disc 500 to the second disc 600; x is the number of the second member 300 in the arrangement, the number being given as the first member200 is a 0 reference, the second member 300 located inside the first member 200 is numbered sequentially from outside to inside by-1, and the second member 300 located outside the first member 200 is numbered sequentially from inside to outside by + 1. As shown in FIG. 7, taking the second member 300 having two sets as an example, the reference of the position of the first member 200 is taken as 0, i.e. the radius of the arrangement for positioning the first member 200 is R 0 In the radial direction of the disc body 100, the radii of the second members 300 arranged from the edge to the center of the circle are sequentially R -1 、R -2 The radius of the second member 300 arranged from the center to the edge is R 1 、R 2 。
The polishing sheet is arranged between the upper polishing pad and the lower polishing pad, and a polishing area is filled with polishing liquid during polishing, and the polishing liquid and the surface of the silicon wafer are subjected to chemical reaction and are peeled off by the rotating polishing pad. A large amount of polishing heat is generated in the chemical mechanical polishing process, a part of heat is taken away by the polishing liquid, a part of heat is taken away by the cooling water of the lower polishing disc, a part of heat raises the temperature of the first disc 500, the heat is conducted to the first element 200, the second element 300 and the third element 400 and is dissipated to the surrounding air, and the heat dissipation area is increased by the heat dissipation ribs. An air conditioner is arranged in the space where the first plate 500 is located, the temperature of the air conditioner is set to be 20 ℃, the air outlet is 200mm higher than the first plate, and air is blown obliquely at 45 degrees.
Fig. 5 is a schematic diagram of a structural comparison example of 30 radial ribs 401, without an annular heat-dissipating rib structure, having a heat-dissipating area larger than that of the above-described embodiment having annular heat-dissipating ribs; fig. 6 and 7 are comparison results of thermal deformation calculation of two heat dissipation structures under the same heat source. In the figure, the upper right corner 50-250 is the size of the heat source, the abscissa is the length of the sectional line of the disk surface, the disk diameter is 2000mm, the middle hollow part is 540mm in diameter and the ordinate is the deformation, and it can be seen that although the heat dissipation area of the comparative structure is larger, the thermal deformation result of the comparative example is larger than that of the above example. This is related to the form of heat generated by polishing, which is a heat source of thermal energy with a circular contour, i.e., a gradient along the radial direction. Therefore, the heat dissipation structure provided by the application can have smaller thermal deformation under the same heat dissipation area and heat source.
The driving mechanism 800, as shown in fig. 3, the driving mechanism 800 is used to drive the first disk 500 and the second disk 600 to rotate. The driving mechanism 800 includes a first driving wheel 801 and a second driving wheel 802, the first driving wheel 801 is connected to and acts on the first disk 500, the second driving wheel 802 is connected to and acts on the second disk 600, and is driven by a driving source such as an external motor, so that the first disk 500 and the second disk 600 are rotated by the first driving wheel 801 and the second driving wheel 802.
Working principle/steps:
in the rotary polishing process of the polishing disk, a heat source is formed on the polishing disk in an annular distribution, the shape of the first member 200 corresponds to the shape of the heat source, and the first member 200 is connected to the disk body 100 at a position corresponding to the heat source, so that heat generated in the heat source area is conducted to the first member 200, and the first member 200 dissipates the heat into the air to complete cooling. The second member 300 and the third member 400 are used for increasing the heat dissipation area of the upper surface of the disc body 100, and are used for assisting the first member 200 to conduct and dissipate heat in the air, so that the polishing disc has good heat dissipation effect and simplified structure, and meanwhile, the radially arranged third members 400 have good inhibition effect on the deformation of the disc surface.
The technical effects are as follows:
1. in the polishing disc of the present application, the first piece 200 for heat dissipation is arranged at a position corresponding to the heat source on the disc body 100, and the heat on the heat source is conducted and dissipated to the air through the first piece 200, so that the effect of cooling the polishing disc is achieved, and the polishing disc also has good heat dissipation performance under the condition of having a simple structure. The technical problems that the prior art cannot have good heat dissipation effect and the structure of the polishing disc is simplified at the same time are solved; the technical effect that the polishing disc has a good heat dissipation effect while the structure is simplified is achieved.
2. The first member 200 is annularly arranged on the corresponding annularly distributed heat sources, the first member 200 and the second member 300 are matched to play a role in heat dissipation, and the third member 400 is used for enhancing the radial strength, increasing the heat dissipation area, improving the heat dissipation effect and having smaller thermal deformation under the condition of the same polishing disc material. While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A polishing disk, comprising:
the polishing device comprises a disc body, a first polishing head and a second polishing head, wherein the disc body is provided with a first surface and a second surface, the first surface is used for directly or indirectly contacting with a polishing sheet to polish the polishing sheet, and a heat source is formed on the disc body in a polishing working state;
a first member connected to the second side at a position corresponding to the heat source such that heat from the heat source is conducted to the first member to dissipate heat.
2. The polishing disk of claim 1 wherein said disk body has an annular distribution of heat sources;
the first member is arranged in a ring shape and is connected to the second face at a position corresponding to the heat source.
3. A polishing pad according to claim 2 wherein the centre of the first member distribution coincides with the centre of the heat source distribution.
4. The polishing pad of claim 2, further comprising:
a second member in an annular arrangement, the second member attached to the second face of the polishing disk; the second member has one or more sets, and the second member is arranged concentrically with the first member.
5. A polishing pad according to claim 2 wherein the radius R of the first member arrangement is 0 Comprises the following steps:
R 0 ＝1/2×(R-r)+r
the disc body is annular, R is the radius of an outer ring of the disc body, and R is the radius of an inner ring of the disc body.
6. A polishing pad according to claim 4 wherein the radial width of said first member is greater than the radial width of said second member.
7. The polishing pad of claim 4, further comprising:
a third member having a plurality of sets, the third member being radially and uniformly distributed and connected to the second side of the polishing disk.
8. A polishing apparatus, characterized by comprising:
a first tray, said first tray being the polishing tray of claim 7;
a second disc disposed opposite the first disc, a polishing space being formed between the second disc and the first disc; and
and the driving mechanism is respectively connected with the first disc and the second disc and is used for driving the first disc and the second disc to rotate.
9. A polishing device according to claim 8, characterized in that the number N of said third members 1 Comprises the following steps:
N 1 ＝(N 2 -1)×10，N 2 ＝2×α+1
wherein, N 2 Is the sum of the number of first and second pieces, and N 2 Is odd; α is a rotation speed ratio of the first disk and the second disk.
10. A polishing device according to claim 8, in which the radius R of the second member arrangement is x Comprises the following steps:
R x ＝R 0 +x/(N 2 -1)+α)×(R-r)
wherein the disc body is annular, R 0 Is the arrangement radius of the first piece, R is the outer ring radius of the disc body, R is the inner ring radius of the disc body; α is a rotation speed ratio of the first disk and the second disk; and x is a mark number arranged on the second piece, the mark number takes the first piece as a reference of 0, the mark numbers of the second piece positioned in the first piece are sequentially minus 1 from outside to inside, and the mark numbers of the second piece positioned outside the first piece are sequentially plus 1 from inside to outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220270351.4U CN217072049U (en) | 2022-02-10 | 2022-02-10 | Polishing disk and polishing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220270351.4U CN217072049U (en) | 2022-02-10 | 2022-02-10 | Polishing disk and polishing equipment |
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| CN217072049U true CN217072049U (en) | 2022-07-29 |
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| CN202220270351.4U Active CN217072049U (en) | 2022-02-10 | 2022-02-10 | Polishing disk and polishing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117245520A (en) * | 2023-11-17 | 2023-12-19 | 苏州博宏源机械制造有限公司 | Wafer polishing and grinding equipment and process |
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2022
- 2022-02-10 CN CN202220270351.4U patent/CN217072049U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117245520A (en) * | 2023-11-17 | 2023-12-19 | 苏州博宏源机械制造有限公司 | Wafer polishing and grinding equipment and process |
| CN117245520B (en) * | 2023-11-17 | 2024-01-26 | 苏州博宏源机械制造有限公司 | Wafer polishing and grinding equipment and process |
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