CN217009576U - Novel high-efficient radiating bus duct connects device - Google Patents
Novel high-efficient radiating bus duct connects device Download PDFInfo
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- CN217009576U CN217009576U CN202220333763.8U CN202220333763U CN217009576U CN 217009576 U CN217009576 U CN 217009576U CN 202220333763 U CN202220333763 U CN 202220333763U CN 217009576 U CN217009576 U CN 217009576U
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- bus duct
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- cover plate
- insulating heat
- heat dissipation
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Abstract
The utility model discloses a novel bus duct joint device capable of efficiently dissipating heat, and relates to the field of power distribution.A connector is used for connecting two groups of conductive busbars into a conductive path; the connector comprises an insulating heat conducting plate and a conductive connecting bar; the insulating heat conduction plates are provided with a plurality of blocks, the insulating heat conduction plates are arranged in parallel, a certain gap is formed between every two adjacent insulating heat conduction plates, grooves are formed in the two side walls of each insulating heat conduction plate, and conductive connecting rows are arranged in the grooves; the conductive busbar is arranged in the gap between the insulating heat conducting plates and is contacted with the conductive connecting bar. The insulating heat conducting plate is adopted and is in contact with the joint cover plate; gaps between the conductive busbars protruding from the first bus duct and the conductive busbars protruding from the second bus duct are filled with heat conduction mud; the left side plate and the right side plate of the joint cover plate adopt the radiating fins, the problem that heat at the joints of the traditional intensive bus duct is accumulated is solved, the heat radiating capacity of the joints is improved, potential safety hazards are reduced, and the service life of the jointer is prolonged.
Description
Technical Field
The utility model mainly relates to the field of power distribution, in particular to a novel bus duct joint device capable of efficiently dissipating heat.
Background
In the field of power distribution, the bus duct is used as equipment for transmitting and distributing power, and has the advantages of large current-carrying capacity, convenience in installation, safety, reliability, convenience in power distribution and the like. In recent years, as people have more and more demand for electricity, bus ducts are gradually used in large power supply equipment.
However, as the intensive bus duct has some disadvantages in current transmission, for example, because the current transmission is large, at the connector position of each section of the joint of the intensive bus duct, because the gap between the conductive bus bar and the conductive connecting bar of the connector is unavoidable, the internal heating degree of the connector is generally higher than that of the intensive bus duct main body, and the insulation board at the joint of the traditional intensive bus duct product is not heat-conducting and the cover plate is not in contact with the joint, the heat resistance is too large, so that the heat generated at the joint cannot be dissipated, the internal temperature of the connector position is higher than that of other parts of the intensive bus duct, and potential safety hazards exist.
Although the 'bus duct connector with heat conducting plates' disclosed in the chinese patent application No. 201720400649.1 can solve the problem of too high temperature at the joint part of the bus duct, the heat conducting plates are added, so once the bolts are loosened, the thermal resistance is larger. Although the 'bus duct joint connecting assembly with the heat dissipation function' disclosed in the chinese patent application No. 201921376840.2 solves the heat dissipation problem of the joint cover plate, the heat dissipation plate makes the joint position higher than the main structure body, which is not beneficial to installation.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides a novel bus duct joint device with efficient heat dissipation, wherein an insulating heat conducting plate is adopted and is in contact with a joint cover plate; gaps between the conductive busbars protruding from the first bus duct and the conductive busbars protruding from the second bus duct are filled with heat conduction mud; the left side plate and the right side plate of the joint cover plate adopt the radiating fins, the problem that heat at the joint of the traditional intensive bus duct is accumulated is solved, the radiating capacity of the joint is improved, potential safety hazards are reduced, and the service life of the joint device is prolonged.
The present invention achieves the above-described object by the following technical means.
A novel bus duct joint device with efficient heat dissipation comprises a joint device, wherein the joint device is used for connecting two groups of conductive busbars into a conductive path; the connector comprises an insulating heat conducting plate and a conductive connecting bar; the insulating heat conduction plates are provided with a plurality of blocks, the insulating heat conduction plates are arranged in parallel, gaps are formed between every two adjacent insulating heat conduction plates, grooves are formed in the two side walls of each insulating heat conduction plate, and conductive connecting rows are arranged in the grooves; the conductive busbar is arranged in a gap between the insulating heat conducting plates and is contacted with the conductive connecting bar.
In the scheme, the joints of the two groups of conductive busbars are filled with heat conduction mud.
In the scheme, the connector is provided with a through hole, and the torque bolt in the through hole vertically penetrates through the insulating heat-conducting plate and the conductive connecting bar.
In the scheme, the number of the insulating heat conduction plates is 6, and the number of the conductive busbars in one group is 5.
In the above scheme, the conductive busbar is respectively arranged at the end parts of the first bus duct and the second bus duct in a protruding manner.
In the above scheme, the upper end surface and the lower end surface of the splicer are respectively provided with an upper side splice cover plate and a lower side splice cover plate; and the upper side joint cover plate and the lower side joint cover plate are connected to the first bus duct and the second bus duct through bolts.
In the scheme, the surface of the insulating heat conducting plate, which is in contact with the upper side joint cover plate and the lower side joint cover plate, is coated with the silicone grease heat dissipation paste.
In the above scheme, the upper side joint cover plate and the lower side joint cover plate are provided with the radiating fins.
In the above-mentioned scheme, the fin sets up respectively on the both sides face of upper side joint cover plate and lower side joint cover plate.
In the scheme, the insulating heat conducting plate is made of filling type composite materials, common ceramics or alumina ceramics. Compared with the prior art, the utility model has the following advantages:
1. aiming at the problem that the heat conductivity of an insulating plate adopted by the traditional intensive bus duct splicer is low, the utility model adopts an insulating heat conducting plate (any one of filling type composite materials, common ceramics, alumina ceramics and the like), has high-efficiency heat dissipation characteristic and insulativity and improves the heat conduction capability at the joint of the bus duct.
2. Aiming at the problem that parts of the parts at the joint of the traditional intensive bus duct are incompletely contacted, the utility model fills heat conduction mud in the gap between the conductive busbar in the first bus duct and the conductive busbar joint in the second bus duct, and simultaneously coats a layer of silicone grease heat dissipation paste on the inner side of the joint cover plate, thereby improving the effective contact area, more effectively dissipating heat generated at the joint, prolonging the service life of the joint device and effectively reducing the potential safety hazard caused by overhigh temperature at the joint.
3. Aiming at the problem that the heat dissipation area of the traditional intensive bus duct joint cover plate is small, the left side plate and the right side plate of the joint cover plate adopt the form of radiating fins, and in order to not influence the installation, the two sides of the joint are retracted so as to ensure that the whole width of the joint cover plate is consistent with that of a bus duct main body.
Drawings
Fig. 1 is a three-dimensional view of a novel efficient heat dissipating busway junction apparatus of the present invention;
FIG. 2 is a top view of the overall structure of the present invention;
fig. 3 is a top view of the interior of the adapter of fig. 1 according to the present invention.
Reference numerals:
1-a first bus duct; 2-a second bus duct; 3-upper side joint cover plate; 4-a splicer; 5-lower side joint cover plate; 6-conductive busbar; 401-heat conducting mud; 402-an insulating thermally conductive plate; 403-conductive connection banks; 404-torque bolts; 405-splicer side panels.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
A novel bus duct joint device with efficient heat dissipation comprises a joint device 4, wherein the joint device 4 is used for connecting two groups of conductive busbars 6 into a conductive path; the connector 4 comprises an insulating heat-conducting plate 402 and a conductive connecting bar 403; the insulating heat conducting plates 402 are provided with a plurality of blocks, a plurality of insulating heat conducting plates 402 are arranged in parallel, a certain gap is formed between every two adjacent insulating heat conducting plates 402, grooves are formed in two side walls of each insulating heat conducting plate 402, and conductive connecting rows 403 are arranged in the grooves; the conductive busbar 6 is arranged in the gap between the insulating heat-conducting plates 402, and the conductive busbar 6 is in contact with the conductive connecting bar 403.
In the scheme, the joints of the two groups of conductive busbars 6 are filled with heat conducting mud 401.
In the above scheme, the adapter 4 is provided with a through hole, and a torque bolt 404 in the through hole vertically penetrates through the insulating heat conduction plate 402, the conductive connection row 403 and the adapter side plate 405. The connection and installation stability of the conductive busbar can be better realized through the fastening of the torque bolt; the connector side plate, the upper side connector cover plate and the lower side connector cover plate jointly play a role in enabling the insulating heat conducting plate, the conductive connecting bar and the conductive busbar in the connector to be in a closed environment and simultaneously play a role in heat dissipation.
In the above scheme, the number of the insulating heat conducting plates 402 is 6, and the number of the group of the conducting wire bus bars 6 is 5.
In the above scheme, the conducting busbars 6 are respectively arranged at the end parts of the first bus duct 1 and the second bus duct 2 in a protruding manner.
In the above scheme, the upper end surface and the lower end surface of the splicer 4 are respectively provided with an upper side splice cover plate 3 and a lower side splice cover plate 5; the upper side joint cover plate 3 and the lower side joint cover plate 5 are connected to the first bus duct 1 and the second bus duct 2 through bolts.
In the above-described embodiment, the insulating heat conductive plate 402 is coated with a silicone grease heat dissipating paste on the surface that contacts the upper joint cover 3 and the lower joint cover 5.
In the above scheme, the upper side joint cover plate 3 and the lower side joint cover plate 5 are provided with cooling fins.
In the above-described embodiment, the heat dissipation fins are respectively provided on both side surfaces of the upper joint cover 3 and the lower joint cover 5.
In the above scheme, the insulating heat conducting plate 402 is made of a filling composite material, a common ceramic or an alumina ceramic.
With reference to fig. 1 to 3, a novel bus duct joint device with efficient heat dissipation comprises a first bus duct 1, a second bus duct 2, an upper side joint cover plate 3, a jointer 4, a lower side joint cover plate 5, a conductive bus bar 6 and a joint baffle 7; the connection of the conductive busbar 6 between the first bus duct 1 and the second bus duct 2 which are adjacently butted is realized, the heat conduction mud 401 is filled at the joint of the conductive busbar 6 in the gap in the connector 4, the upper surface of the upper side connector cover plate 3 is in close contact with the upper surface of the insulating heat conduction plate 402, the lower surface of the lower side connector cover plate 5 is in close contact with the lower surface of the insulating heat conduction plate 402, the upper side connector cover plate 3 and the lower side connector cover plate 5 are arranged in a vertically parallel and opposite mode, and the sealing covers for the upper side and the lower side of the connector are sealed. When the bus duct is in an initial state, because a gap inevitably exists between the conductive busbar 6 and the conductive connecting row of the splicer 4, heat can be generated due to large thermal resistance, but because each part inside the splice, the upper side splice cover plate 3 and the lower side splice cover plate 5 are in contact with the splicer 4, and meanwhile, the new structures of the upper side splice cover plate 3 and the lower side splice cover plate 5 are more favorable for heat dissipation, so that the generated heat can be transmitted to the outside of the bus duct in a heat conduction mode.
The working principle is as follows: the utility model forms a novel bus duct joint device with high-efficiency heat dissipation by contacting all parts in the joint and the joint device with the shell. The upper side joint cover plate 3 is in close contact with the upper surface of the insulating heat conducting plate 402, the lower side joint cover plate 5 is in close contact with the lower surface of the insulating heat conducting plate 402, and the upper side joint cover plate 3 and the lower side joint cover plate 5 are arranged in parallel up and down and are used for sealing the upper side and the lower side of the joint device 4. When the bus duct is powered on, because a gap inevitably exists between the conductive busbar 6 and the conductive connecting row 403 of the splicer 4, heat can be generated due to large thermal resistance, for the upper side and the lower side, the generated heat can be transferred to the insulating heat-conducting plate 402 contacted with the conductive connecting row 403 of the splicer 4, and finally the heat is radiated outside the bus duct through the upper side splice cover plate 3 and the lower side splice cover plate 5 contacted with the upper side splice cover plate and the lower side splice cover plate; for the left side and the right side, because the heat conduction mud 401 fills up the gap that exists in the joint, the heat conduction effective area has been improved, and the heat can be more high-efficiently dispersed from the curb plate of joint apron to improve the heat-sinking capability in bus duct joint department.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (10)
1. The novel bus duct joint device with efficient heat dissipation is characterized by comprising a joint device (4), wherein the joint device (4) is used for connecting two groups of conductive bus bars (6) into a conductive path; the connector (4) comprises an insulating heat-conducting plate (402) and a conductive connecting row (403); the insulating heat-conducting plates (402) are provided with a plurality of blocks, the insulating heat-conducting plates (402) are arranged in parallel, a gap is formed between every two adjacent insulating heat-conducting plates (402), two side walls of each insulating heat-conducting plate (402) are provided with grooves, and conductive connecting rows (403) are arranged in the grooves; the conductive busbar (6) is arranged in a gap between the insulating heat-conducting plates (402), and the conductive busbar (6) is in contact with the conductive connecting bar (403).
2. A novel bus duct joint device with efficient heat dissipation according to claim 1, wherein the joints of the two groups of conductive busbars (6) are filled with heat conduction mud (401).
3. The novel bus duct joint device with efficient heat dissipation function as recited in claim 1, wherein a through hole is formed in the joint device (4), and a torque bolt (404) in the through hole vertically penetrates through the insulating heat conduction plate (402) and the conductive connecting row (403).
4. A novel bus duct joint device with efficient heat dissipation as defined in claim 1, wherein the number of the insulating heat conduction plates (402) is 6, and the number of the conductive busbars (6) in a group is 5.
5. A novel bus duct joint device with efficient heat dissipation as defined in claim 1, wherein the conductive busbar (6) is respectively arranged at the end parts of the first bus duct (1) and the second bus duct (2) in a protruding manner.
6. A novel bus duct joint device with efficient heat dissipation as defined in claim 5, wherein an upper joint cover plate (3) and a lower joint cover plate (5) are respectively arranged on the upper end surface and the lower end surface of the joint device (4); and the upper side joint cover plate (3) and the lower side joint cover plate (5) are connected to the first bus duct (1) and the second bus duct (2) through bolts.
7. A novel bus duct joint device with high heat dissipation efficiency as recited in claim 6, wherein the surface of the insulating heat conduction plate (402) contacting with the upper joint cover plate (3) and the lower joint cover plate (5) is coated with silicone grease heat dissipation paste.
8. A novel bus duct joint device with efficient heat dissipation as defined in claim 6, wherein heat dissipation fins are arranged on the upper joint cover plate (3) and the lower joint cover plate (5).
9. A novel bus duct joint device with high heat dissipation efficiency as recited in claim 8, wherein the heat dissipation fins are respectively arranged on two side surfaces of the upper joint cover plate (3) and the lower joint cover plate (5).
10. The novel bus duct joint device with efficient heat dissipation function as recited in claim 1, wherein the insulating heat conducting plate (402) is made of filling type composite material, common ceramic or alumina ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220333763.8U CN217009576U (en) | 2022-02-18 | 2022-02-18 | Novel high-efficient radiating bus duct connects device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220333763.8U CN217009576U (en) | 2022-02-18 | 2022-02-18 | Novel high-efficient radiating bus duct connects device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217009576U true CN217009576U (en) | 2022-07-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220333763.8U Active CN217009576U (en) | 2022-02-18 | 2022-02-18 | Novel high-efficient radiating bus duct connects device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217009576U (en) |
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2022
- 2022-02-18 CN CN202220333763.8U patent/CN217009576U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230605 Address after: No. 21, Zhouhuajiao Lane, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province, 215314 Patentee after: Suzhou Peilinchang Electric Technology Co.,Ltd. Address before: Zhenjiang City, Jiangsu Province, 212013 Jingkou District Road No. 301 Patentee before: JIANGSU University |
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| TR01 | Transfer of patent right |