CN216960656U - Be applied to multimedia equipment's radiator unit and multimedia equipment - Google Patents

Abstract

The utility model discloses a heat dissipation assembly applied to multimedia equipment and the multimedia equipment, wherein the heat dissipation assembly comprises a heat conduction partition plate, a heat dissipation top shell and a heat dissipation bottom shell, the heat conduction partition plate is clamped between the heat dissipation top shell and the heat dissipation bottom shell, the heat conduction partition plate comprises a heat conduction plate and a heat dissipation plate, the heat dissipation top shell and the heat conduction plate are respectively contacted with a heat dissipation piece to be dissipated on an installation assembly and conduct heat in the heat dissipation piece to the outer surface of the heat dissipation assembly for heat dissipation, and the outer surfaces of the heat dissipation top shell, the heat dissipation bottom shell and the heat dissipation plate are respectively provided with heat dissipation fins. The heat-conducting plate and the heat-radiating plate which are connected are additionally arranged in the internal space of the heat-radiating assembly, so that the heat-radiating structure of the internal space is perfected, the heat-to-be-radiated pieces which are originally arranged in the device and overlapped can contact the heat-conducting plate, the heat-radiating area of the internal space is increased, the heat is conducted to the heat-radiating plate to complete heat radiation, the heat-to-be-radiated pieces arranged in the internal space of the heat-radiating assembly are uniformly and fully radiated, and the overall heat-radiating efficiency of the heat-radiating assembly is improved.

Description

Be applied to multimedia equipment's radiator unit and multimedia equipment

Technical Field

The utility model relates to the technical field of heat dissipation equipment, in particular to a heat dissipation assembly applied to multimedia equipment and the multimedia equipment.

Background

The heat dissipation of the working assembly is crucial to the sustainable operation of the assembly, has important effects in the technical fields of machinery, batteries, communication storage and the like, is applied to the heat dissipation assembly during the operation of multimedia equipment, has the characteristics of simple and compact structural design, clear use principle, convenience in design and manufacture, simplicity in assembly, convenience in use and the like, and has become one of the key research directions of the current heat dissipation assembly. The multimedia equipment has many components and complex structure, and the reduction of heat dissipation efficiency caused by insufficient heat dissipation area due to compact layout of the multimedia equipment becomes a main problem facing the heat dissipation of the multimedia equipment. However, the existing multimedia device heat dissipation assembly accommodates multimedia devices into a device space, and utilizes the heat conduction principle to realize the heat dissipation of the multimedia devices by arranging a heat dissipation surface with a heat dissipation structure on a device shell, which is in contact with a heat dissipation member to be cooled, but the multimedia devices are often overlapped or closely arranged, so that the multimedia devices in the device space are difficult to contact with the heat dissipation surface with the heat dissipation structure, the heat dissipation efficiency is reduced, and the rapid heat dissipation is difficult to realize. Therefore, the heat dissipation component of the multimedia device in the prior art method has the problem of low heat dissipation efficiency.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a heat dissipation assembly applied to multimedia equipment, and aims to solve the problem that a heat dissipation piece to be dissipated is low in heat dissipation efficiency in the prior art.

In a first aspect, an embodiment of the present invention discloses a heat dissipation assembly applied to a multimedia device, where the multimedia device includes a placement assembly and a to-be-dissipated part disposed on the placement assembly, and the heat dissipation assembly is disposed in the multimedia device and dissipates heat of the to-be-dissipated part; the heat dissipation assembly comprises a heat conduction clapboard, a heat dissipation top shell and a heat dissipation bottom shell; the heat-conducting partition plate comprises a heat-conducting plate and a heat-radiating plate, and the end part of the heat-conducting plate is connected with one side surface of the heat-radiating plate; the outer surfaces of the heat dissipation top shell, the heat dissipation bottom shell and the heat dissipation plate are all provided with heat dissipation fins; the heat-conducting partition plate is clamped between the heat-radiating top shell and the heat-radiating bottom shell, the heat-radiating top shell and the heat-radiating bottom shell are mutually covered to form a shell, the heat-radiating plate is located on one side face of the shell and clamped between the heat-radiating top shell and the heat-radiating bottom shell, and the heat-conducting plate extends towards the other side of the shell from the heat-radiating plate to separate the shell into a first space and a second space.

Firstly, the arrangement assembly comprises a first arrangement plate, a second arrangement plate and a third arrangement plate, wherein the first arrangement plate and the second arrangement plate are arranged in the first space, and the third arrangement plate is arranged in the second space; the heat dissipation top shell is in contact with the heat dissipation pieces to be arranged on the first arrangement plate and the second arrangement plate, and the heat conduction plate is in contact with the heat dissipation pieces to be arranged on the first arrangement plate, the second arrangement plate and the third arrangement plate.

In a further aspect, a heat conducting member is disposed on a lower surface of the heat conducting plate, and the heat conducting member contacts with a heat-dissipating member to be disposed on the third mounting plate, so as to conduct heat on the heat-dissipating member to the heat-dissipating plate.

In a further aspect, the heat dissipation top shell comprises a top cover, a first side plate and a second side plate, wherein the first side plate and the second side plate are arranged oppositely and are respectively connected with two sides of the top cover; the heat dissipation bottom shell is connected with the heat dissipation plate, the first side plate and the second side plate respectively to form an integral heat dissipation structure with a hollow ventilation air duct.

Furthermore, a notch is formed in the first side plate or the second side plate, and the heat dissipation plate is embedded into the notch and is clamped and connected with the first side plate or the second side plate.

In a further aspect, the upper surface of the heat conducting plate is provided with heat dissipation cavities arranged in parallel.

Furthermore, reinforcing ribs are arranged at the connecting positions of the heat conducting plate and the heat radiating plate.

Furthermore, the vertical section of the heat-conducting partition plate is L-shaped or T-shaped.

In one embodiment, the top heat dissipation case, the bottom heat dissipation case, and the heat conductive partition are integrally formed aluminum heat dissipation members.

On the other hand, the embodiment of the utility model also discloses multimedia equipment, which comprises the heat dissipation component, the mounting component and a to-be-dissipated part arranged on the mounting component, wherein the heat dissipation component dissipates heat of the to-be-dissipated part.

Foretell be applied to multimedia device's radiator unit, through install connected heat-conducting plate and heating panel additional in radiator unit inner space, perfect inner space's heat radiation structure, make originally install the heat-dissipating piece of treating that overlaps in the device inside can contact the heat-conducting plate, increased inner space's heat radiating area, accomplish the heat dissipation with heat conduction to the heating panel, realize treating that the heat-dissipating piece that sets up to the radiator unit inner space evenly and fully dispels the heat, improved the holistic heat dispersion of radiator unit.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is an exploded view of a multimedia device according to an embodiment of the present invention;

fig. 2 is a partial structural view of a heat dissipation assembly applied to a multimedia device according to an embodiment of the present invention;

fig. 3 is an overall structural diagram of a multimedia device according to an embodiment of the present invention;

fig. 4 is a partial structure diagram of a heat dissipation assembly applied to a multimedia device according to an embodiment of the present invention;

fig. 5 is another partial structural diagram of a heat dissipation assembly applied to a multimedia device according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

Referring to fig. 1 to 2, as shown in fig. 1, a heat dissipation assembly 1 applied to a multimedia device includes a mounting assembly 2 and a to-be-dissipated part 4 disposed on the mounting assembly 2, wherein the heat dissipation assembly 1 is disposed in the multimedia device and dissipates heat to the to-be-dissipated part 4; the heat dissipation assembly 1 comprises a heat conduction clapboard 11, a heat dissipation top shell 12 and a heat dissipation bottom shell 13; as shown in fig. 2, the heat conductive partition 11 includes a heat conductive plate 111 and a heat dissipation plate 112, and an end of the heat conductive plate 111 is connected to one side of the heat dissipation plate 112; the outer surfaces of the heat dissipation top shell 12, the heat dissipation bottom shell 13 and the heat dissipation plate 112 are all provided with heat dissipation fins; the heat-conducting partition plate 11 is sandwiched between the heat-dissipating top shell 12 and the heat-dissipating bottom shell 13, the heat-dissipating top shell 12 and the heat-dissipating bottom shell 13 are mutually covered to form a housing, the heat-dissipating plate 112 is located on one side surface of the housing and sandwiched between the heat-dissipating top shell 12 and the heat-dissipating bottom shell 13, and the heat-conducting plate 111 extends from the heat-dissipating plate 112 to the other side of the housing to divide the housing into a first space and a second space.

The heat dissipation assembly 1 applied to multimedia equipment provided in this embodiment is a device having a heat dissipation surface with a heat dissipation structure and an installation structure, and its specific structure is shown in fig. 1. Fig. 1 is an exploded structure diagram of a multimedia device according to an embodiment of the present invention, and as shown in the drawing, a heat dissipation assembly 1 is disposed in the multimedia device and dissipates heat to a heat dissipation member 4. In this embodiment, the to-be-cooled element 4 refers to a circuit module that generates a large amount of heat during operation, and the heat dissipation assembly 1 conducts the heat to the heat dissipation structure of the heat dissipation assembly 1 to dissipate the heat through direct contact with the to-be-cooled element 4. Specifically, the heat dissipation assembly 1 includes a heat conduction partition plate 11, a heat dissipation top shell 12 and a heat dissipation bottom shell 13, the heat conduction partition plate 11 includes a heat conduction plate 111 and a heat dissipation plate 112, an end portion of the heat conduction plate 111 is connected with a side surface of the heat dissipation plate 112, so that heat of the heat conduction plate 111 can be conducted to the heat dissipation plate 112 to achieve heat dissipation. Specifically, the outer surfaces of the heat-conducting partition plate 11, the heat-dissipating bottom shell 13 and the heat-dissipating plate 112 are all provided with heat-dissipating fins, so that the surface area of each component in the heat-dissipating assembly 1 for dissipating heat is greatly increased by the arrangement of the heat-dissipating fins, and the heat-dissipating efficiency of each component in the heat-dissipating assembly 1 can be remarkably improved. Specifically, the heat conducting partition plate 11 is sandwiched between the heat dissipating top shell 12 and the heat dissipating bottom shell 13, and the heat conducting partition plate 11 is connected with the heat dissipating top shell 12 and forms a first space. The first space is used for combining the placement component 2 and providing space for placing the to-be-cooled piece 4, so that the heat dissipation is convenient. The heat conductive partition 11 is connected with the heat dissipation top case 12 and the heat dissipation bottom case 13 to form a second space for combining and placing another part of the module 2 and placing the member to be heat dissipated 4. The combination of the first space and the second space provides a wider heat dissipation area for heat dissipation of the to-be-dissipated part 4, that is, provides a better space condition for the to-be-dissipated part 4. The heat dissipation top shell 12 is provided with a heat dissipation surface with a heat dissipation structure on the surface in the first space, and contacts with the heat dissipation member 4 to be cooled, the heat conduction plate 111 is provided with a heat conduction structure on the surface in the first space and the second space, and can contact with the heat dissipation member 4 to be cooled, so that the heat of the heat dissipation member 4 is conducted to the heat dissipation plate 112 to be cooled, and the problem of undersize heat dissipation surface caused by overlapping arrangement of the heat dissipation member 4 to be cooled is eliminated, so that the heat dissipation member 4 can be fully contacted with the heat dissipation surface with the heat dissipation structure, and the heat can be effectively conducted to the outside of the heat dissipation assembly 1.

In summary, in the heat dissipation assembly 1, the heat conduction partition plate 11 is provided with the heat conduction and dissipation related structures in the internal space, and the device space is utilized to increase the contact area between the heat dissipation surface of the heat dissipation member 4 to be dissipated and the heat dissipation surface with the heat dissipation structure in the device space, so that the heat conduction process between the heat dissipation member 4 to be dissipated and the heat dissipation related structures is optimized, and the heat dissipation efficiency of the heat dissipation member 4 to be dissipated is improved.

Further, the mounting assembly 2 includes a first mounting plate 21, a second mounting plate 22 and a third mounting plate 23, the first mounting plate 21 and the second mounting plate 22 are disposed in the first space, and the third mounting plate 23 is disposed in the second space. Specifically, the heat dissipation top case 12 contacts with the heat dissipation members 4 to be dissipated provided on the first and second installation plates 21 and 22, and the heat conduction plate 111 contacts with the heat dissipation members 4 to be dissipated provided on the third installation plate 23. The first space and the second space are combined to provide a better space condition for heat dissipation of the heat dissipation piece 4, the heat dissipation top shell 12 is provided with a heat dissipation surface with a heat dissipation structure on the surface in the first space, and is in contact with the heat dissipation piece 4 placed on the first placing plate 21 and the second placing plate 22, the heat conduction plate 111 is provided with heat conduction structures on the surfaces in the first space and the second space, and can be in contact with the heat dissipation pieces 4 to be arranged on the first placing plate 21, the second placing plate 22 and the third placing plate 23, so that heat of the heat dissipation piece 4 to be dissipated is conducted to the heat dissipation plate 112 to achieve heat dissipation, the problem that the heat dissipation surface is too small due to the overlapping arrangement of the heat dissipation pieces 4 to be dissipated is solved, and the heat dissipation piece 4 can be in full contact with the heat dissipation surface with the heat dissipation structure and effectively conducts the heat to the outside of the heat dissipation device.

Further, referring to fig. 2, the lower surface of the heat conducting plate 111 is provided with a heat conducting member 1111, and the heat conducting member 1111 contacts the to-be-cooled member 4 provided on the third mounting plate 23 for conducting heat on the to-be-cooled member 4 to the cooling plate 112. Specifically, the heat conduction member 1111 is made of a heat conduction material such as silicone grease, the heat conduction member 1111 may be protrusions arranged regularly, when the heat conduction plate 111 contacts the heat dissipation member 4, the contact area between the heat conduction plate and the heat dissipation member 4 is increased as much as possible by the heat conduction member 1111 arranged regularly, the heat conduction effect is enhanced, and the heat of the heat dissipation member 4 is conducted to the heat dissipation plate 112 by the heat conduction member 1111 to achieve heat dissipation.

Further, referring to fig. 1, in an embodiment, the heat dissipation top case 12 includes a top cover 121, a first side plate 122 and a second side plate 123, wherein the first side plate 122 and the second side plate 123 are disposed oppositely and respectively connected to two sides of the top cover 121; the bottom heat dissipation housing 13 is connected to the heat dissipation plate 112, the first side plate 122 and the second side plate 123 respectively to form an integral heat dissipation structure with a hollow ventilation duct. As shown in fig. 3, the front end of the heat dissipation bottom shell 13 is open, a gap is formed between the rear end and the set connection interface 10, a hollow ventilation air duct is formed by a passage between the opening and the gap of the connection interface 10 in the heat dissipation device, and the air flow passes through the hollow ventilation air duct to circulate, so as to take out the heat inside the first space, the second space and the third space, thereby further improving the heat dissipation efficiency of the heat dissipation device in this embodiment. Specifically, referring to fig. 5, a notch is formed on the first side plate 122 or the second side plate 123, the heat dissipation plate 112 is embedded in the notch and is connected with the first side plate 122 or the second side plate 123 in a clamping manner, the heat dissipation plate 112 can receive the heat of the heat dissipation member 4 to be dissipated through heat conduction and conduct the heat to the heat dissipation bottom case 13 in a dispersing manner, so that the heat dissipation bottom case 13 distributes part of the heat from the heat dissipation plate 112 within a bearing range, thereby further solving the problem of poor heat dissipation effect caused by uneven heat distribution of the heat dissipation member 4 to be dissipated or overheating of the heat dissipation plate 112, improving the heat dissipation efficiency of the integral heat dissipation structure, and the front end and the rear end of the integral heat dissipation structure are hollowed to form a hollowed ventilation air duct, so that the integral heat dissipation structure can introduce air flow from the outside under necessary conditions, accelerate the air flow rate in the space of the heat dissipation device, and take away the heat in the air to prevent the temperature in the space from being too high, promote the heat dissipation of the whole heat dissipation structure.

Further, referring to fig. 4, the heat-dissipating cavities 1112 are disposed in parallel on the upper surface of the heat-conducting plate 111. The design can ensure that the heat conducting plate 111 obtains larger surface area under the condition of equal weight, thereby exerting better conducting effect.

Further, referring to fig. 4, a reinforcing rib 113 is disposed at a connection position of the heat conducting plate 111 and the heat dissipating plate 112. The strength of the joint surface at the joint between the heat conductive plate 111 and the heat dissipating plate 112 is increased, and the weight limit of the entire load of the heat conductive plate 11 is increased.

Further, the vertical section of the heat-conducting partition plate 11 is "L" shaped or "T" shaped. Further, in some embodiments, the vertical cross section of the heat conductive clamping plate 11 is "L" shaped, that is, the joint of the heat conductive plate 111 and the heat dissipation plate 112 is located at the end of the cross section of the heat dissipation plate 112, in other embodiments, the horizontal cross section of the heat conductive clamping plate 11 is "T" shaped, that is, the joint of the heat conductive plate 111 and the heat dissipation plate 112 is located at the middle of the cross section of the heat dissipation plate 112, so that heat can be uniformly guided to the two ends of the joint after being conducted from the heat conductive plate 111 to the heat dissipation plate 112.

Further, the heat dissipation top case 12, the heat dissipation bottom case 13, and the heat conductive partition plate 11 are all integrally formed aluminum heat dissipation members.

The embodiment of the utility model also provides multimedia equipment which comprises the heat dissipation component 1, the mounting component 2 and a to-be-dissipated part 4 arranged on the mounting component 2, wherein the heat dissipation component 1 dissipates heat of the to-be-dissipated part 4, and the specific arrangement position of the heat dissipation device is as described in the scheme. The placement component 2 includes a first placement plate 21, a second placement plate 22, and a third placement plate 23, the heat dissipation member 4 includes a circuit module disposed on the first placement plate 21, a circuit module disposed on the second placement plate 22, and a circuit module disposed on the third placement plate 23, the heat dissipation member 4 is a circuit module that generates a large amount of heat during operation, and the circuit module is also a circuit component that can be used to implement a multimedia function, such as a CPU chip, a GPU chip, and the like.

The utility model discloses a heat dissipation component 1 applied to multimedia equipment, wherein the multimedia equipment comprises a mounting component 2 and a to-be-dissipated part 4 arranged on the mounting component 2, and the heat dissipation component 1 is arranged in the multimedia equipment and dissipates heat of the to-be-dissipated part 4; the heat dissipation assembly 1 comprises a heat conduction clapboard 11, a heat dissipation top shell 12 and a heat dissipation bottom shell 13; the heat conductive partition plate 11 includes a heat conductive plate 111 and a heat dissipation plate 112, and an end of the heat conductive plate 111 is connected to one side of the heat dissipation plate 112; the outer surfaces of the heat dissipation top shell 12, the heat dissipation bottom shell 13 and the heat dissipation plate 112 are all provided with heat dissipation fins; the heat-conducting partition plate 11 is sandwiched between the heat-dissipating top shell 12 and the heat-dissipating bottom shell 13, the heat-dissipating top shell 12 and the heat-dissipating bottom shell 13 are mutually covered to form a housing, the heat-dissipating plate 112 is located on one side surface of the housing and sandwiched between the heat-dissipating top shell 12 and the heat-dissipating bottom shell 13, and the heat-conducting plate 111 extends from the heat-dissipating plate 112 to the other side of the housing to divide the housing into a first space and a second space. The heat-conducting plate 111 and the heat-radiating plate 112 which are connected are additionally arranged in the internal space of the heat-radiating component 1, so that the heat-radiating structure of the internal space is perfected, the overlapped heat-to-be-radiated pieces 1 which are originally arranged in the device can contact with the heat-conducting plate 111, the heat-radiating area of the internal space is increased, heat is conducted to the heat-radiating plate 112 to complete heat radiation, the heat-to-be-radiated pieces 4 arranged in the internal space of the heat-radiating component 1 are uniformly and fully radiated, and the overall heat-radiating efficiency of the heat-radiating component 1 is improved.

While the utility model has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A heat radiation component applied to multimedia equipment, wherein the multimedia equipment comprises a mounting component and a to-be-radiated piece arranged on the mounting component, and the heat radiation component is arranged in the multimedia equipment and radiates the to-be-radiated piece;

the heat dissipation assembly comprises a heat conduction clapboard, a heat dissipation top shell and a heat dissipation bottom shell;

the heat-conducting partition plate comprises a heat-conducting plate and a heat-radiating plate, and the end part of the heat-conducting plate is connected with one side surface of the heat-radiating plate;

the outer surfaces of the heat dissipation top shell, the heat dissipation bottom shell and the heat dissipation plate are all provided with heat dissipation fins;

the heat-conducting partition plate is clamped between the heat-radiating top shell and the heat-radiating bottom shell, the heat-radiating top shell and the heat-radiating bottom shell are mutually covered to form a shell, the heat-radiating plate is located on one side face of the shell and clamped between the heat-radiating top shell and the heat-radiating bottom shell, and the heat-conducting plate extends towards the other side of the shell from the heat-radiating plate to separate the shell into a first space and a second space.

2. The heat dissipation assembly applied to multimedia equipment as claimed in claim 1, wherein the mounting assembly comprises a first mounting plate, a second mounting plate and a third mounting plate, the first mounting plate and the second mounting plate are disposed in the first space, and the third mounting plate is disposed in the second space;

the heat dissipation top shell is in contact with the heat dissipation pieces to be arranged on the first arrangement plate and the second arrangement plate, and the heat conduction plate is in contact with the heat dissipation pieces to be arranged on the first arrangement plate, the second arrangement plate and the third arrangement plate.

3. The heat dissipating module applied to a multimedia device as claimed in claim 2, wherein the lower surface of the heat conducting plate is provided with a heat conducting member, the heat conducting member is in contact with a member to be dissipated provided on the third installation plate, for conducting heat of the member to be dissipated to the heat dissipating plate.

4. The heat dissipation assembly applied to the multimedia device as claimed in any one of claims 1 to 3, wherein the heat dissipation top case comprises a top cover, a first side plate and a second side plate, the first side plate and the second side plate are disposed opposite to each other and are respectively connected to two sides of the top cover; the heat dissipation bottom shell is connected with the heat dissipation plate, the first side plate and the second side plate respectively to form an integral heat dissipation structure with a hollow ventilation air duct.

5. The heat dissipating assembly applied to the multimedia device as claimed in claim 4, wherein a notch is formed on the first side plate or the second side plate, and the heat dissipating plate is inserted into the notch and engaged with the first side plate or the second side plate.

6. The heat dissipating module as claimed in claim 1, wherein the heat conductive plate is provided at an upper surface thereof with heat dissipating cavities arranged in parallel.

7. The heat dissipating module as claimed in claim 1, wherein the heat conducting plate has a rib at the junction with the heat dissipating plate.

8. The heat dissipating assembly applied to the multimedia device as claimed in claim 1, wherein the vertical section of the heat conductive spacer has an "L" shape or a "T" shape.

9. The heat dissipating assembly applied to a multimedia device as claimed in claim 1, wherein the heat dissipating top case, the heat dissipating bottom case and the heat conductive spacer are all integrally formed aluminum heat dissipating members.

10. A multimedia device, comprising the heat dissipation assembly as claimed in any one of claims 1 to 9, a placement assembly, and a member to be dissipated disposed on the placement assembly, wherein the heat dissipation assembly dissipates heat of the member to be dissipated.

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