CN216940089U - A repair face and groove integral type equipment for carborundum processing - Google Patents
A repair face and groove integral type equipment for carborundum processing Download PDFInfo
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- CN216940089U CN216940089U CN202220683874.1U CN202220683874U CN216940089U CN 216940089 U CN216940089 U CN 216940089U CN 202220683874 U CN202220683874 U CN 202220683874U CN 216940089 U CN216940089 U CN 216940089U
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Abstract
The utility model discloses a face and groove repairing integrated device for silicon carbide processing, which relates to the field of silicon carbide processing equipment and comprises an integrally formed frame, wherein a processing area is arranged on one side of the integrally formed frame, a pressure disc is arranged above the processing area, a ceramic disc is arranged below the pressure disc, a polishing disc is arranged below the processing area, a grinding fluid collecting tank is arranged below the polishing disc, a driven gear is driven to rotate when a driving gear is driven by a driving unit, the driven gear is fixed on the outer ring of a base column, the base column rotates along with the driven gear, the base column is driven to descend by a lifting unit, the ceramic disc is attached to the surface of adhesive wax above a wafer product, so that the wafer product on the surface of the wafer product is polished and repaired, a convex part is arranged at the lower end of the ceramic disc, the convex part can synchronously extend into a hole in the wafer product, the face and the groove of the wafer product are synchronously repaired, the efficiency is higher.
Description
Technical Field
The utility model relates to the field of silicon carbide processing equipment, in particular to integrated equipment for face trimming and groove trimming for silicon carbide processing.
Background
Silicon carbide (SiC) is a third-generation compound semiconductor material, and is a strategic advanced material of national emphasis on development. Because of its excellent physical properties, high forbidden band width (corresponding to high breakdown electric field and high power density), high conductivity, high thermal conductivity, high hardness and high wear resistance, the silicon carbide can be used for easily cutting ruby next to diamond, and has high thermal stability, and thus will be the most widely used base material for manufacturing semiconductor chips in the future. Power devices and microwave communication devices made of silicon carbide single crystals have been widely used in the fields of 5G communication, military radars, new energy vehicles, large data centers, smart grids, industrial inverters, and the like.
The crystal base used as the substrate is generally 4 inches, 6 inches, etc. The substrate used as a semiconductor substrate has high requirements on the surface thereof, including total thickness deviation of a wafer, parallelism required to be less than 0.005mm, and silicon surface roughness required to be less than Ra0.3nm. Because the hardness of silicon carbide is higher than that of other semiconductor materials, the requirements on the precision, the process and the stability of substrate processing equipment are extremely strict.
In the prior art, when a superhard material such as silicon carbide is ground and polished, because the removal rate (polishing rate) is slow, most users increase the pressure and the rotating speed on a wafer during polishing in order to increase the removal rate, so that the temperature of a polishing disk and a pressure disk rises quickly, and the wafer stuck on a ceramic disk is displaced or even falls off due to softening of sticking wax.
Therefore, it is necessary to develop a facing and grooving integrated apparatus for silicon carbide processing to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a face-repairing and groove-repairing integrated equipment for silicon carbide processing, so as to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a repair face and repair groove integral type equipment for carborundum processing, includes the integrated into one piece frame, one side of integrated into one piece frame is provided with the processing district, and processing district top is provided with the pressure disk, and the below of pressure disk is provided with ceramic dish, and processing district below is provided with polishing dish, polishing dish's below is provided with the lapping liquid collecting vat, be provided with on the polishing dish and press polishing dish and hold fixed clamp plate, the top in processing district is provided with the safe bolt subassembly that prevents the pressure disk and drop, the inside of integrated into one piece frame is provided with the cavity of storage lapping liquid, and one side of cavity is provided with the peristaltic pump with lapping liquid output, the output of peristaltic pump is connected with the shower nozzle through output pipeline, the shower nozzle is towards between ceramic dish and the polishing dish, the top of pressure disk is provided with cooling water business turn over subassembly and broken vacuum subassembly.
Preferably, the upper end of pressure disc is fixed and is provided with the foundation column, the fixed cover in middle part of foundation column is equipped with driven gear, and one side of driven gear is provided with the driving gear of meshing transmission with it, and the below of driving gear is provided with fixes and just fixes driving gear pivoted drive unit in the foundation column side, the upper end of foundation column is provided with the lift unit that the drive foundation column reciprocated.
In this embodiment, the drive unit can use devices such as servo motor, driven gear is driven when drive unit drive driving gear rotates, because driven gear fixes the outer lane at the pillar, the pillar rotates thereupon, through the decline of lift unit drive pillar, and laminate the ceramic dish on the wax surface of pasting of wafer product top, thereby polish and maintain the wafer product on wafer product surface, the lower extreme of ceramic dish has the bulge simultaneously, the bulge can stretch into the inside hole of wafer product in step, repair face and repair the groove to the wafer product in step, high efficiency.
Preferably, safe bolt subassembly includes the beaded finish of fixed welding in the lower extreme outer lane department of foundation column, the outer lane department of beaded finish is provided with flexible groove, flexible groove is provided with the multiunit, and the fixed welding in bottom in flexible groove has the promotion unit, and the end fixing that promotes the unit is provided with gliding cardboard in flexible groove, the fixed welding of upper surface of pressure disc has the fixed plate, is provided with on the fixed plate to supply the horizontal male card hole of cardboard.
It should be noted that the pushing unit can use devices such as a cylinder or an electric push rod, and the pushing unit can push the clamping plate to be inserted into the clamping hole, so that the upper end of the pressure plate is fixed, the pressure plate is prevented from falling, and the safety is high.
Preferably, the cooling water inlet and outlet assembly comprises a first channel and a second channel which are arranged inside the foundation column, a first cavity is arranged inside the pressure disc, and the lower ends of the first channel and the second channel are respectively communicated with the two ends of the first cavity.
Furthermore, the cooling water enters the first channel and exits the second channel in the cooling water inlet and outlet assembly, so that the circulating cooling water in the first cavity can be kept, the temperature rise of the pressure plate, the ceramic plate and the polishing plate can be avoided, and the phenomenon that a wafer adhered to the ceramic plate is displaced or even falls off due to softening of the adhered wax is avoided.
Preferably, the vacuum breaking assembly comprises a third channel arranged inside the base column, a second cavity communicated with the lower end of the third channel is arranged inside the pressure disc, a plurality of groups of micro-pores penetrating through the lower surface of the ceramic disc are arranged at the bottom of the second cavity, a rotary joint is arranged at the upper end of the base column, and pipelines corresponding to the first channel, the second channel and the third channel are arranged on the rotary joint.
Specifically, compressed gas can enter the third channel, and when the compressed gas enters the space between the ceramic disc and the adhesive wax through the micro-pores at the bottom of the second cavity, the ceramic disc and the wafer product can be separated, so that the phenomenon that the adhesive wax is adhered to the ceramic disc and is not easy to fall off is avoided, and the demolding effect is good.
Preferably, the wafer product has been placed to the upper surface of polishing dish, and the upper surface of wafer product has paste wax, and the ceramic dish laminating of pressure dish below is at the upper surface of pasting wax, the middle part of wafer product is provided with porosely, and the lower surface an organic whole of ceramic dish is provided with the bulge in stretching into the hole, its bulge outer lane is run through to the micropore lower extreme that corresponds on the ceramic dish.
Wherein, the direct concatenation of pressure dish is in the bottom of foundation column, the dismouting of being convenient for and change, and the position of both contacts is sealed through the sealing washer, and is sealed effectual.
Preferably, the integrated machine frame is provided with a grinding fluid magnetic stirrer for stirring grinding fluid in the chamber, and the integrated machine frame is further provided with an electric control cabinet and a pneumatic control cabinet.
In the device, the lapping liquid in the grinding liquid magnetic stirrer can stir the cavity for the lapping liquid misce bene, and the grinding liquid after the peristaltic pump will grind carries the position of lapping between ceramic dish, the polishing dish through output tube and shower nozzle, and the lapping liquid collecting vat is used for collecting the waste liquid after grinding, and pneumatic control cabinet, automatically controlled cabinet are used for placing some electrical components of control drive unit, elevating unit, pushing unit, lapping liquid magnetic stirrer, peristaltic pump work respectively.
The utility model has the technical effects and advantages that:
the utility model relates to a face and groove repairing integrated device for processing silicon carbide, which comprises an integrated machine frame, a processing area is arranged at one side of the integrated machine frame, a pressure disc is arranged above the processing area, a ceramic disc is arranged below the pressure disc, a polishing disc is arranged below the processing area, a grinding fluid collecting tank is arranged below the polishing disc, the driven gear is driven when the driving gear is driven by the driving unit to rotate, because the driven gear is fixed on the outer ring of the base column, the base column rotates along with the driven gear, the base column is driven to descend by the lifting unit, and the ceramic disc is attached to the surface of the adhesive wax above the wafer product, therefore, the wafer product on the surface of the wafer product is polished and trimmed, the lower end of the ceramic disc is provided with the convex part, the convex part can synchronously extend into the hole in the wafer product, the wafer product is synchronously trimmed, and the efficiency is higher;
according to the integrated surface and groove repairing device for silicon carbide processing, cooling water enters and exits from the first channel and the second channel in the assembly, so that circulating cooling water is kept in the first cavity, the temperature rise of the pressure disc, the ceramic disc and the polishing disc can be avoided, and the phenomenon that a wafer adhered to the ceramic disc is displaced or even falls off due to softening of the adhesive wax is avoided;
according to the integrated equipment for repairing the surface and the groove for processing the silicon carbide, provided by the utility model, compressed gas can enter the third channel, and when the compressed gas enters the space between the ceramic disc and the adhesive wax through the micropores at the bottom of the second cavity, the ceramic disc and a wafer product can be separated, so that the phenomenon that the adhesive wax is adhered on the ceramic disc and is not easy to fall off is avoided, and the demolding effect is good.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
Fig. 2 is a front view of the present invention.
Fig. 3 is a schematic view of the pressure disk structure of the present invention.
FIG. 4 is an enlarged view of the structure at A in FIG. 3 according to the present invention.
In the figure: 1. integrally forming a frame; 2. a ceramic pan; 3. a polishing disk; 4. a grinding fluid collecting tank; 5. pressing a plate; 6. a magnetic stirrer for the grinding fluid; 7. a peristaltic pump; 8. a pneumatic control cabinet; 9. an electric control cabinet; 10. an output pipe; 11. a spray head; 12. a pressure disc; 13. a rotary joint; 14. a base pillar; 15. a lifting unit; 16. a first channel; 17. a second channel; 18. a third channel; 19. a driven gear; 20. a driving gear; 21. a drive unit; 22. a reinforcement ring; 23. a first chamber; 24. a second chamber; 25. pasting wax; 26. a wafer product; 27. a pushing unit; 28. a telescopic groove; 29. a fixing plate; 30. a clamping hole; 31. and (4) clamping the board.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model provides a face-repairing and groove-repairing integrated device for silicon carbide processing, which comprises an integrally-formed frame 1, wherein a processing area is arranged on one side of the integrally-formed frame 1, a pressure disc 12 is arranged above the processing area, a ceramic disc 2 is arranged below the pressure disc 12, a polishing disc 3 is arranged below the processing area, a grinding fluid collecting tank 4 is arranged below the polishing disc 3, a pressing plate 5 for pressing and fixing the polishing disc 3 is arranged on the polishing disc 3, a safety bolt component for preventing the pressure disc 12 from falling is arranged above the processing area, a chamber for storing grinding fluid is arranged inside the integrally-formed frame 1, a peristaltic pump 7 for outputting the grinding fluid is arranged on one side of the chamber, the output end of the peristaltic pump 7 is connected with a spray head 11 through an output pipeline 10, the spray head 11 faces between the ceramic disc 2 and the polishing disc 3, and a cooling water inlet-outlet component and a vacuum breaking component are arranged above the pressure disc 12.
The upper end of the pressure plate 12 is fixedly provided with a base column 14, the middle part of the base column 14 is fixedly sleeved with a driven gear 19, one side of the driven gear 19 is provided with a driving gear 20 which is in meshing transmission with the driven gear, a driving unit 21 which is fixed on the side surface of the base column 14 and fixes the driving gear 20 to rotate is arranged below the driving gear 20, and the upper end of the base column 14 is provided with a lifting unit 15 which drives the base column 14 to move up and down.
In this embodiment, the driving unit 21 may use a servo motor or the like, the driving unit 21 drives the driving gear 20 to rotate, the driven gear 19 is driven, the driven gear 19 is fixed to the outer ring of the pillar 14, the pillar 14 rotates along with the driven gear, the pillar 14 is driven to descend by the lifting unit 15, and the ceramic disc 2 is attached to the surface of the adhesive wax 25 above the wafer product 26, so as to polish and trim the wafer product 26 on the surface of the wafer product 26, the lower end of the ceramic disc 2 has a protruding portion at the same time, the protruding portion can synchronously extend into a hole in the wafer product 26, and the wafer product 26 is synchronously trimmed and grooved, so that the efficiency is high.
Safety bolt subassembly includes the beaded finish 22 of fixed welding in the lower extreme outer lane department of foundation column 14, the outer lane department of beaded finish 22 is provided with flexible groove 28, flexible groove 28 is provided with the multiunit, the fixed welding in bottom in flexible groove 28 has promotion unit 27, the fixed gliding cardboard 31 that is provided with in flexible groove 28 of tip of promotion unit 27, the fixed welding of upper surface of pressure disc 12 has fixed plate 29, be provided with on the fixed plate 29 and supply cardboard 31 horizontal male card hole 30.
It should be noted that the pushing unit 27 may use a device such as an air cylinder or an electric push rod, and the pushing unit 27 may push the clamping plate 31 to be inserted into the clamping hole 30, so as to fix the upper end of the pressure plate 12, thereby preventing the pressure plate 12 from falling off, and having strong safety.
The cooling water inlet and outlet assembly comprises a first channel 16 and a second channel 17 which are arranged inside the base column 14, a first cavity 23 is arranged inside the pressure disc 12, and the lower ends of the first channel 16 and the second channel 17 are respectively communicated with the two ends of the first cavity 23.
Furthermore, the cooling water enters the first channel 16 and exits the second channel 17 in the cooling water inlet and outlet assembly, so that the circulating cooling water is kept in the first chamber 23, the temperature rise of the pressure plate 12, the ceramic plate 2 and the polishing plate 3 can be avoided, and the phenomenon that the wafer adhered on the ceramic plate is displaced or even falls off due to softening of the adhered wax is avoided.
The vacuum breaking assembly comprises a third channel 18 arranged in the base column 14, a second chamber 24 communicated with the lower end of the third channel 18 is arranged in the pressure disc 12, a plurality of groups of micro-pores penetrating through the lower surface of the ceramic disc 2 are arranged at the bottom of the second chamber 24, a rotary joint 13 is arranged at the upper end of the base column 14, and pipelines corresponding to the first channel 16, the second channel 17 and the third channel 18 are arranged on the rotary joint 13.
Specifically, compressed gas can enter the third channel 18, and when the compressed gas enters the space between the ceramic disc 2 and the adhesive wax 25 through the micro-pores at the bottom of the second cavity 24, the ceramic disc 2 and the wafer product 26 can be separated, so that the phenomenon that the adhesive wax 25 is adhered to the ceramic disc 2 and is not easy to fall off is avoided, and the demolding effect is good.
Wherein, pressure disc 12 directly splices in the bottom of foundation column 14, and the dismouting and the change of being convenient for, the position of both contacts is sealed through the sealing washer, and is sealed effectual.
The integrated machine frame 1 is provided with a grinding fluid magnetic stirrer 6 for stirring grinding fluid in the chamber, and the integrated machine frame 1 is also provided with an electric control cabinet 9 and a pneumatic control cabinet 8.
In the device, the grinding fluid in the cavity can be stirred by the grinding fluid magnetic stirrer 6, so that the grinding fluid is uniformly mixed, the ground grinding fluid is conveyed to a grinding position between the ceramic disc 2 and the polishing disc 3 by the peristaltic pump 7 through the output pipeline 10 and the spray head 11, the grinding fluid collecting tank 4 is used for collecting the ground waste fluid, and the pneumatic control cabinet 8 and the electric control cabinet 9 are respectively used for placing some electric appliance elements for controlling the work of the driving unit 21, the lifting unit 15, the pushing unit 27, the grinding fluid magnetic stirrer 6 and the peristaltic pump 7.
The working principle is as follows: driven gear 19 is driven when drive unit 21 drive driving gear 20 rotates, because driven gear 19 fixes at the outer lane of pillar 14, pillar 14 rotates thereupon, through the decline of elevating unit 15 drive pillar 14, and paste wax 25 surface above wafer product 26 with ceramic dish 2 laminating, thereby polish and repair the wafer product 26 on wafer product 26 surface, the lower extreme of ceramic dish 2 has the bulge simultaneously, the bulge can stretch into the hole of wafer product 26 inside synchronously, carry out face repair and groove repair to wafer product 26 synchronously, and efficiency is higher.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a repair face and groove integral type equipment for carborundum processing, includes integrated into one piece frame (1), its characterized in that: a processing area is arranged at one side of the integrated frame (1), a pressure disc (12) is arranged above the processing area, a ceramic disc (2) is arranged below the pressure disc (12), a polishing disc (3) is arranged below the processing area, a grinding fluid collecting tank (4) is arranged below the polishing disk (3), a pressing plate (5) for pressing and fixing the polishing disk (3) is arranged on the polishing disk (3), a safety bolt component for preventing the pressure disc (12) from falling is arranged above the processing area, a chamber for storing grinding fluid is arranged in the integrated machine frame (1), a peristaltic pump (7) for outputting the grinding fluid is arranged on one side of the chamber, the output end of the peristaltic pump (7) is connected with a spray head (11) through an output pipeline (10), the spray head (11) faces to the space between the ceramic disc (2) and the polishing disc (3), and a cooling water inlet and outlet assembly and a vacuum breaking assembly are arranged above the pressure disc (12).
2. The integrated faceting and grooving apparatus for silicon carbide processing of claim 1, wherein: the fixed pillar (14) that is provided with in upper end of pressure dish (12), the fixed cover in middle part of pillar (14) is equipped with driven gear (19), and one side of driven gear (19) is provided with meshing driven driving gear (20) with it, and the below of driving gear (20) is provided with fixes fixing in pillar (14) side and fixed driving gear (20) pivoted drive unit (21), the upper end of pillar (14) is provided with the lift unit (15) that drives pillar (14) and reciprocate.
3. The integrated faceting and grooving apparatus for silicon carbide processing of claim 2, wherein: safety bolt subassembly is including fixed welding beaded finish (22) of the lower extreme outer lane department of foundation column (14), the outer lane department of beaded finish (22) is provided with flexible groove (28), flexible groove (28) are provided with the multiunit, and the fixed welding in bottom of flexible groove (28) has promotion unit (27), and the end fixing of promotion unit (27) is provided with gliding cardboard (31) in flexible groove (28), the last fixed surface welding of pressure disc (12) has fixed plate (29), is provided with on fixed plate (29) and supplies cardboard (31) horizontal male card hole (30).
4. The integrated faceting and grooving apparatus for silicon carbide processing of claim 3, wherein: the cooling water inlet and outlet assembly comprises a first channel (16) and a second channel (17) which are arranged inside a foundation column (14), a first cavity (23) is arranged inside the pressure disc (12), and the lower ends of the first channel (16) and the second channel (17) are respectively communicated with the two ends of the first cavity (23).
5. The integrated faceting and grooving apparatus for silicon carbide processing of claim 4, wherein: the vacuum breaking assembly comprises a third channel (18) arranged inside a base column (14), a second cavity (24) communicated with the lower end of the third channel (18) is arranged inside a pressure disc (12), multiple groups of micro-pores penetrating through the lower surface of a ceramic disc (2) are arranged at the bottom of the second cavity (24), a rotary joint (13) is arranged at the upper end of the base column (14), and pipelines corresponding to the first channel (16), the second channel (17) and the third channel (18) are arranged on the rotary joint (13).
6. The integrated faceting and grooving apparatus for silicon carbide processing of claim 5, wherein: wafer product (26) have been placed to the upper surface of polishing dish (3), and the upper surface of wafer product (26) has pastes wax (25), and ceramic dish (2) laminating of pressure disk (12) below is at the upper surface of pasting wax (25), the middle part of wafer product (26) is provided with porosely, and the lower surface an organic whole of ceramic dish (2) is provided with the bulge in stretching into the hole, its bulge outer lane is run through to the micropore lower extreme that corresponds on ceramic dish (2).
7. The integrated faceting and grooving apparatus for silicon carbide processing of claim 6, wherein: the grinding fluid magnetic stirrer is characterized in that a grinding fluid magnetic stirrer (6) used for stirring grinding fluid in the cavity is arranged on the integrated machine frame (1), and an electric control cabinet (9) and a pneumatic control cabinet (8) are further arranged on the integrated machine frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220683874.1U CN216940089U (en) | 2022-03-28 | 2022-03-28 | A repair face and groove integral type equipment for carborundum processing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202220683874.1U CN216940089U (en) | 2022-03-28 | 2022-03-28 | A repair face and groove integral type equipment for carborundum processing |
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| CN216940089U true CN216940089U (en) | 2022-07-12 |
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| CN202220683874.1U Active CN216940089U (en) | 2022-03-28 | 2022-03-28 | A repair face and groove integral type equipment for carborundum processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115847278A (en) * | 2023-01-09 | 2023-03-28 | 江苏纳沛斯半导体有限公司 | Wafer back grinding device and grinding process |
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2022
- 2022-03-28 CN CN202220683874.1U patent/CN216940089U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115847278A (en) * | 2023-01-09 | 2023-03-28 | 江苏纳沛斯半导体有限公司 | Wafer back grinding device and grinding process |
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