CN216859570U - Disassembling tool for semiconductor film forming equipment - Google Patents

Disassembling tool for semiconductor film forming equipment Download PDF

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Publication number
CN216859570U
CN216859570U CN202123426694.XU CN202123426694U CN216859570U CN 216859570 U CN216859570 U CN 216859570U CN 202123426694 U CN202123426694 U CN 202123426694U CN 216859570 U CN216859570 U CN 216859570U
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telescopic rod
disassembly
plate
outer tube
bottom end
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Chinese (zh)
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张燕军
陈杰
文响龙
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Beijing Yandong Microelectronic Technology Co ltd
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Beijing Yandong Microelectronic Technology Co ltd
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Abstract

An embodiment of the present application provides a mounting and dismounting tool for a semiconductor film forming apparatus, including: the supporting column is vertically arranged on the upper surface of the bottom end connecting piece; the end part of the telescopic rod is rotatably connected to the upper end of the support, and the angle between the telescopic rod and the support can be adjusted; and the grabbing structure is connected to the end part of the bottom end connecting piece and used for grabbing the sleeve of the semiconductor film forming equipment. According to the assembly and disassembly tool provided by the embodiment of the application, the length of the telescopic rod is adjusted by matching the telescopic rod, the support and the grabbing structure according to the structure and the installation form of the external member, so that the assembly and disassembly tool can be suitable for external members with different calibers; the angle of snatching between adjustment telescopic link and the pillar can snatch the external member from the angle of snatching of difference, improves assembly and disassembly tools's practicality. In addition, the assembly and disassembly tools can prevent the sleeve from being clamped in the cavity, so that the working efficiency of the equipment is improved.

Description

Disassembling tool for semiconductor film forming equipment
Technical Field
The present invention relates to the field of semiconductor manufacturing technology, and for example, to a mounting and dismounting tool for a semiconductor film forming apparatus.
Background
In a semiconductor manufacturing process, a film formation process is an important process for forming an insulating or conductive thin film on a wafer surface by using a technique such as chemical vapor deposition or sputtering. In a semiconductor film forming apparatus, for example, a multichamber film forming apparatus, a chamber is mostly of a cylindrical structure, and a plurality of annular kits are mounted in the chamber to separate the inside of the chamber to prevent contamination. However, in the process of forming a thin film on the surface of a wafer, related materials inevitably adhere to and deposit on the inner wall of the chamber and the surface of the kit, so that the film forming equipment needs to be maintained regularly, the kit is completely disassembled and cleaned by using a specific cleaning machine, and the cleanliness in the chamber is ensured to meet the production requirement.
In the process, because the external member is tightly attached to the inner wall of the cavity and the surface of the external member is smooth, the external member is difficult to disassemble and install by hands; if the external member is stressed unevenly, the external member and the inner wall of the cavity can be dislocated, and the external member is clamped in the cavity instead. If the kit is knocked by an auxiliary tool and is forcibly detached or installed, the kit may be damaged and the chamber may be polluted.
The above related art has at least the following problems: because the characteristics of the external member and the structure installed on the inner wall of the cavity mainly depend on the experience and the operation skill of maintenance personnel, the external member is inconvenient to detach or install by the maintenance personnel through bare hands or auxiliary tools, and the operation difficulty and the equipment maintenance difficulty are increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical defects, the embodiment of the application provides a disassembling tool for a semiconductor film forming device, which can disassemble and assemble a kit in a time-saving and labor-saving manner.
In order to achieve the above object, an embodiment of the present invention provides a mounting and demounting tool for a semiconductor film forming apparatus, including:
the supporting column is vertically arranged on the upper surface of the bottom end connecting piece;
the end part of the telescopic rod is rotatably connected to the upper end of the support, and the angle between the telescopic rod and the support can be adjusted;
and the grabbing structure is connected to the end part of the bottom end connecting piece and used for grabbing the sleeve of the semiconductor film forming equipment.
As above assembly and disassembly tools, the bottom end connector includes:
the mounting plate is fixed on the upper surface of the mounting plate by the support;
the rotating plate is connected to the end part of the mounting plate and can rotate relative to the mounting plate in the plate surface direction of the mounting plate to drive the grabbing structure to rotate; wherein the grabbing structure is connected to the end of the rotating plate.
Like above assembly and disassembly tools, bottom connecting piece still includes adjusting bolt, and adjusting bolt's screw cooperates with the screw hole that the rotor plate was reserved, snatchs the structure and fixes the bottom at adjusting bolt.
According to the dismounting tool, the number of the support columns and the number of the mounting plates are two, and the two support columns are connected to two ends of the telescopic rod respectively;
the two ends of each mounting plate, which are back to back, are respectively connected with a rotating plate, and the two ends of each rotating plate, which are back to back, are connected with a grabbing structure.
As above assembly and disassembly tools, the bottom end connector still includes:
the positioning shaft is vertically connected to the mounting plate, and the rotating plate is connected with the positioning shaft hole so that the rotating plate can rotate.
As the dismounting tool, the positioning shaft is vertically connected to the upper plate surface or the lower plate surface of the mounting plate.
The assembly and disassembly tools as above, the circumference of mounting panel is provided with logical groove, and the rotor plate inserts logical inslot, and the location axle passes logical groove and the shaft hole cooperation that the rotor plate was reserved.
As above assembly and disassembly tools, the end connection of telescopic link has articulated seat, and articulated seat rotates with the pillar to be connected.
According to the dismounting tool, the telescopic rod comprises an outer pipe and two inner pipes, the inner pipes are inserted into the outer pipe and can axially move along the outer pipe, and the end parts of the inner pipes, which are far away from the outer pipe, are connected with the hinge seats;
or, the telescopic link includes outer tube and an inner tube, and the inner tube is inserted and is located in the outer tube and can follow outer tube axial motion, and the inner tube and the tip that the outer tube deviates from each other all are connected with articulated seat.
As above assembly and disassembly tools, snatch the structure and include:
the sucking disc body, its upper portion is provided with the connection boss, connects boss and bottom connecting piece and is connected.
As above assembly and disassembly tools, the sucking disc body includes:
the connecting boss is arranged at the upper part of the gland;
the sucking disc part is arranged below the gland and is provided with a sucking surface for sucking the external member;
the pull rod is arranged at the upper part of the sucker part, and the end part of the pull rod penetrates through the gland and is connected with the sucker part;
the pressure rod is arranged at the upper part of the gland and is connected with the end part of the pull rod; the pull rod is pulled by the pressure rod, so that the sucker part can be switched between a first state and a second state, wherein the first state is a state that the adsorption surface does not adsorb the external member, and the second state is a state that the adsorption surface adsorbs the external member.
By adopting the dismounting tool for the semiconductor film forming equipment provided by the embodiment of the application, the length of the telescopic rod is adjusted by matching the telescopic rod, the support and the grabbing structure according to the structure and the installation form of the external member, so that the dismounting tool can be suitable for external members with different calibers; the angle of snatching between adjustment telescopic link and the pillar can snatch the external member from the angle of snatching of difference to adaptation improves assembly and disassembly tools's practicality in the external member of different structural style. In addition, the assembly and disassembly tools can prevent the sleeve from being clamped in the cavity, so that the working efficiency of the equipment is improved.
Drawings
FIG. 1 is a schematic structural view of a disassembly and assembly tool provided in an embodiment of the present disclosure;
FIG. 2 is a schematic view of the extension pole of FIG. 1 in an expanded configuration;
FIG. 3 is a front view of FIG. 1;
FIG. 4 is a top view of FIG. 1;
FIG. 5 is a side view of FIG. 1;
FIG. 6 is an enlarged view of a chuck body in a first configuration according to an embodiment of the present disclosure;
fig. 7 is an enlarged view of the chuck body in a second configuration according to an embodiment of the present disclosure.
Reference numerals:
10: a telescopic rod; 11: a hinged seat; 12: an outer tube; 13: an inner tube;
20: a pillar;
30: a bottom end connector; 31: mounting a plate; 32: a rotating plate; 33: positioning the shaft;
40: adjusting the bolt; 41: adjusting the screw cap;
50: a suction cup body; 51: a chuck section; 52: a gland; 53: a pull rod; 54: a pressure lever; 55: and connecting the lug bosses.
Detailed Description
In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
An embodiment of the present application provides a mounting and demounting tool for a semiconductor film forming apparatus, including: the supporting column is vertically arranged on the upper surface of the bottom end connecting piece; the end part of the telescopic rod is rotatably connected to the upper end of the support column, and the angle between the telescopic rod and the support column can be adjusted; and the grabbing structure is connected to the end part of the bottom end connecting piece and used for grabbing the sleeve of the semiconductor film forming equipment.
Wherein, in the process of installing or disassembling the external member, the length of the telescopic rod can be adjusted according to the size of the external member; according to the structural form of the surface of the external member, the grabbing angles of the supporting column and the telescopic rod are adjusted, so that the grabbing structure of the disassembling tool can be fixed on the surface of the external member; after the fixation is finished, the telescopic rod is lifted by the hand, so that the external member can be grabbed, and the external member can be conveniently detached and installed.
By adopting the disassembling tool provided by the embodiment of the application, the length of the telescopic rod is adjusted by matching the telescopic rod, the support and the grabbing structure according to the structure and the installation form of the external member, so that the disassembling tool can be suitable for external members with different calibers; the angle of snatching between adjustment telescopic link and the pillar can snatch the external member from the angle of snatching of difference, improves assembly and disassembly tools's practicality. In addition, with the aid of the dismounting tool, the mounting and dismounting difficulty of the external member is reduced, and the external member can be prevented from being clamped in the cavity, so that the working efficiency of the equipment is improved.
Fig. 1 is a schematic structural view of an attaching and detaching tool according to an embodiment of the present disclosure, fig. 2 is a schematic structural view of an expansion link in fig. 1 in an expanded state, fig. 3 is a front view of fig. 1, fig. 4 is a top view of fig. 1, fig. 5 is a side view of fig. 1, and fig. 6 and 7 are enlarged views of a suction cup portion in the attaching and detaching tool according to an embodiment of the present disclosure in a first form and a second form, respectively. The structure, function and implementation process of the dismounting tool provided by the present embodiment are illustrated in the following with reference to fig. 1 to 7.
As shown in fig. 1, an embodiment of the present disclosure provides a mounting and demounting tool for a semiconductor film forming apparatus, which mainly includes a telescopic rod 10, a support column 20, a bottom end connector 30 and a grabbing structure. Wherein, the pillar 20 is vertically arranged on the upper surface of the bottom end connecting piece 30; the end part of the telescopic rod 10 is rotatably connected with the upper end of the support post 20, and the angle between the telescopic rod 10 and the support post 20 can be adjusted; the gripping structure is attached to the end of the bottom end connector 30. In actual operation, the length of the telescopic rod 10 and the angle between the telescopic rod 10 and the support column 20 are adjusted, so that the grabbing structure grabs the external member, and the operation of detaching or installing the external member can be completed. The dismounting tool is simple in overall structure and easy to operate.
In this embodiment, there are two support columns 20 and two bottom end connectors 30, the two support columns 20 are respectively connected to two ends of the telescopic rod 10, and each support column 20 is correspondingly connected to a bottom end connector 30. Two snatch the structure like this and can snatch the different positions of external member, for example snatch the both ends that the annular external member corresponds same diameter for the external member atress is more even, further avoids taking place because of external member and cavity inner wall dislocation and block the problem in the cavity.
As shown in fig. 2, 3 and 4, in the present embodiment, the telescopic rod 10 includes an outer tube 12 and an inner tube 13, the outer tube 12 is sleeved outside the inner tube 13, and the inner tube 13 can be drawn and moved inside the outer tube 12, that is, the inner tube 13 can move along the axial direction of the outer tube 12, so as to adjust the length of the telescopic rod 10. One end of the inner tube 13 is movably connected with a strut 20, and one end of the outer tube 12 is movably connected with another strut 20. The bottom end connecting piece 30 is provided with a grabbing structure, and the two grabbing structures are matched for use, so that the external member can be taken up.
In other embodiments, the telescopic rod 10 may also comprise an outer tube 12 and two inner tubes 13, the two inner tubes 13 being capable of moving in the axial direction of the outer tube 12, respectively, and the ends of the two inner tubes 13 facing away from each other being connected to struts 20, respectively, so as to allow adjustment of the length of the telescopic rod 10 and adjustment of the distance between the two gripping structures.
Alternatively, a positioning bolt penetrating through the side wall is provided at a position of the outer tube 12 near the end, and the end of the screw of the positioning bolt is brought into abutment with the outer wall of the inner tube 13 by screwing the positioning bolt, so that the inner tube 13 can be fixed at a certain telescopic position. In actual production, because the types of the semiconductor film forming equipment are limited, and correspondingly, the specification of the kit is limited, according to the specification of the kit, especially the size of the kit, the outer tube 12 is provided with a positioning bolt penetrating through the side wall, and a plurality of grooves are arranged at certain positions on the side wall of the inner tube 13, so that the positioning bolt can penetrate into the grooves, and the firm fixation between the outer tube 12 and the inner tube 13 is ensured. Or, one (or more) bolt holes may be formed in the side wall of the outer tube 12, and a plurality (or one) bolt holes may be formed in the side wall of the inner tube 13, so that the positioning bolts pass through the corresponding bolt holes, and the relative fixing of the outer tube 12 and the inner tube 13 and the adjustment of the length of the telescopic rod 10 as required can be realized.
In the above embodiment, in order to facilitate the movement of the inner tube 13 in the outer tube 12, a sliding groove may be provided on the outer wall of the inner tube 13, and a sliding rail may be provided on the inner wall of the outer tube 12; alternatively, a slide rail is provided on the outer wall of the inner tube 13, and a slide groove is provided on the inner wall of the outer tube 12. The inner pipe 13 is ensured to move smoothly in the outer pipe 12 by the matching use of the sliding chute and the sliding rail.
In the above embodiment, the cross section of the telescopic rod 10 may be circular or polygonal, but is not limited thereto. The cross-section of the telescopic rod 10 is substantially rectangular or even square in configuration, due to considerations of manufacture and use.
In above-mentioned embodiment, when needing to take up heavier external member, if the cross section of telescopic link 10 is thinner, increased the pressure to the maintainer palm, the palm can not be comfortable and feel, consequently, can overlap on the outer wall of telescopic link 10 and be equipped with the protection pad, for example cushion or inflatable packer, the effectual adversary pressure that slows down telescopic link 10, in addition also can increase the frictional force between telescopic link 10 and the palm.
The length of the telescopic rod 10 can be adjusted, and the maximum length of the telescopic rod 10 is L1And the minimum length is denoted as L2That is, the length of the telescopic rod 10 can be L1To L2To fit a set having different diameters. In practice, L is generally used1In the range of 32cm to 40cm, L2In the range of 20cm to 25 cm. Such as L1=37cm、L2=25cm。
The movable angle between the support pole 20 and the telescopic pole 10 can be adjusted, and the maximum movable angle between the telescopic pole 10 and the support pole 20 is recorded as
Figure BDA0003451867490000061
Minimum Angle of motion is noted
Figure BDA0003451867490000062
Namely, the angle between the telescopic rod 10 and the support post 20 is adjusted
Figure BDA0003451867490000063
To
Figure BDA0003451867490000064
Therein, for example
Figure BDA0003451867490000065
In some embodiments, the two ends of the telescopic rod 10 are rotatably connected with the supporting column 20, so that the inclination angles of the grasping surfaces of the grasping structures at the two ends can be effectively adjusted, and the grasping structures are more matched with the structure of the external member to realize firm grasping.
In this embodiment, the pillar 20 is a column structure for connecting the telescopic rod 10 and the bottom end connecting member 30, and a connecting mechanism is disposed at an end of the telescopic rod 10 connected to the pillar 22 to ensure that the pillar 20 has a certain moving angle.
In some embodiments, the end of the telescopic rod 10 is connected with a hinge base 11, a hinge shaft is provided on the hinge base 11, and the upper end of the pillar 20 is rotatably connected with the hinge shaft. Wherein, the hinged seat 11 can be fastened to the end of the telescopic rod 10, which is convenient for maintaining or replacing the grabbing structure.
In some embodiments, when the telescopic rod 10 comprises an outer tube 12 and an inner tube 13, one end of the inner tube 13 is connected with one strut 20 through the hinge base 11, and one end of the outer tube 12 is connected with the other strut 20 through the hinge base 11. In other embodiments, the telescopic rod 10 comprises an outer tube 12 and two inner tubes 13, the ends of the two inner tubes 13 facing away from each other being connected to a support 20, each via a hinged seat 11.
In this embodiment, the supporting pillar 20 and the bottom end connector 30 may be movably connected or fixedly connected.
Optionally, the lower end of the strut 20 is fixedly connected to the bottom end connector 30. A groove for inserting the support column 20 is arranged on the bottom end connecting piece 30, and the end part of the support column 20 is inserted into the groove and fixedly connected through welding; or the ends of the struts 20 are welded directly to the upper surface of the bottom end connector 30; or the support post 20 and the bottom end connector 30 are integrally formed. Alternatively, the support post 20 and the bottom end connector 30 are connected by bolts.
Optionally, the struts 20 are movably connected to the bottom end connector 30, allowing some flexibility to the bottom end connector 30. For example, a connecting shaft is provided on the bottom end connecting piece 30, the pillar 20 is provided with a corresponding shaft hole, and the connecting shaft and the shaft hole of the pillar are matched with each other through the shaft hole.
The bottom end connector 30 is used to mount gripping structures, and in order to increase the flexibility of the gripping structures, in some embodiments, one or more mounting locations for the gripping structures are provided on the bottom end connector 30, as shown in fig. 5. Specifically, the bottom end connector 30 includes: a mounting plate 31, the lower end of the strut 20 is fixed on the upper surface of the mounting plate 31; the rotating plate 32 is rotatably connected to the end of the mounting plate 31, and the rotating plate 32 can rotate relative to the mounting plate 31 in the plate surface direction of the mounting plate 31 and drive the grabbing structure to rotate along with the rotating plate 32; wherein the grasping structure is attached to the end of the rotating plate 32. The rotating plate 32 is rotatably connected with the mounting plate 31, so that the grabbing surface of the grabbing structure can be adjusted.
In this embodiment, the mounting plate 31 is a flat plate structure, and the groove or the connecting shaft in the structure of the bottom end connector 30 is disposed on the mounting plate 31.
In the embodiment, the rotating plate 32 is a flat plate structure, and the rotating plate 32 can be movably connected with the mounting plate 31 through a movable connection mechanism, so that the grabbing structure can be adjusted at different angles by using the rotating plate 32.
In the above embodiment, the rotating plate 32 can also rotate relative to the mounting plate 31, for example, the grabbing structure rotates around the mounting position on the mounting plate 31 as the center of a circle, so as to adjust the position of the grabbing surface. Wherein the gripping surface is the surface of the gripping structure that contacts the surface of the sleeve.
To facilitate mounting of the rotating plate 32, as shown in fig. 2 and 5, in some embodiments, the bottom end connector 30 further comprises: and a positioning shaft 33 disposed on the mounting plate 31, wherein a central axis of the positioning shaft 33 is perpendicular to a plate surface of the mounting plate 31, and the rotating plate 32 is hinged to the positioning shaft 33.
As an alternative, the positioning shaft 33 is disposed on the upper surface of the mounting plate 31 or the lower surface of the mounting plate 31, and the rotating plates 32 are disposed parallel to the mounting plate 31, so that the rotating plates 32 and the grabbing structure can rotate around the positioning shaft 33.
When the positioning shaft 33 is arranged on the upper plate surface of the mounting plate 31, a limiting stop piece is arranged on the upper part of the positioning shaft 33 to prevent the rotating plate 32 from being separated from the positioning shaft 33; when the positioning shaft 33 is disposed at the lower plate surface of the mounting plate 31, a limit stopper is disposed at the lower portion of the positioning shaft 33.
As another alternative, a shaft hole is formed in the rotating plate 32, a through groove is formed in the circumferential direction of the mounting plate 31, the shaft hole side of the rotating plate 32 is inserted into the through groove, and the positioning shaft 33 penetrates through the plate surface of the mounting plate 31 to be hinged to the rotating plate 32. In this embodiment, the thickness of the rotating plate 32 is smaller than that of the mounting plate 31, and the rotating plate 32 is inserted into the through groove. The positioning shaft 33 sequentially penetrates through the upper plate surface of the mounting plate 31, the shaft hole of the rotating plate 32 and the lower plate surface of the mounting plate 31 to form a movable connecting mechanism.
In the above embodiment, the rotation angle of the rotation plate 32 and the grasping structure may be limited by the through groove. Or, the two ends of the positioning shaft 33 are provided with positioning blocking pieces, the upper plate surface and the lower plate surface of the mounting plate 31 are correspondingly provided with limiting grooves, and the positioning blocking pieces are fixed in the limiting grooves, so that the grabbing structure can be stably rotated by taking the positioning shaft 33 as the center of a circle.
In some embodiments, the grasping configuration may be moved up and down at the rotating plate 32 to adjust the height of the grasping configuration. With further reference to fig. 5, the bottom end connector 30 further comprises: and the adjusting bolt 40, the thread of the adjusting bolt 40 is matched with the threaded hole reserved in the rotating plate 32, and the grabbing structure is fixed at the bottom end of the adjusting bolt 40.
In this embodiment, adjusting bolt 40 sets up in the outside of mounting panel 31, sets up the screw hole on swivel plate 32, and adjusting bolt 40 passes the face of swivel plate 32, and adjusting bolt 40's screw thread and screw hole cooperation can make adjusting bolt 40 reciprocate on the screw hole through rotating adjusting bolt 40, and then drive and snatch the structure motion, make and snatch the distance between structure and the swivel plate 32 and change thereupon.
According to the structure of the external member, when the grabbing structure needs to compress the surface of the external member, the adjusting bolt 40 rotates in the positive direction, the grabbing structure gradually gets away from the telescopic rod 10, and the surface of the external member is compressed; when the adjusting bolt 40 is turned in the opposite direction, the gripping structure gradually approaches the telescopic bar 10, moving away from the surface of the sleeve.
To facilitate adjustment, in some embodiments, the end of the adjustment bolt 40 remote from the grasping configuration is provided with an adjustment nut 41. Thus the maintenance person can adjust the distance between the gripping structure and the telescopic rod 10 by turning the adjusting nut 41.
As an alternative, in the case that the mounting and dismounting tool for the semiconductor film forming apparatus does not include a rotating plate, the adjusting bolt 40 may also pass through the plate surface of the mounting plate 31, a threaded hole is cooperatively formed on the mounting plate 31, the adjusting bolt 40 is connected with the threaded hole, and the distance between the grabbing structure and the external member can be adjusted by rotating the adjusting bolt 40.
For more stable gripping, in some embodiments, a plurality of gripping structures may also be provided, which are circumferentially arranged on the mounting plate 31. Alternatively, the grabbing structure may be provided with two, three or four, which is not limited herein.
Alternatively, when two grasping structures are provided, the grasping structures are circumferentially symmetrically provided on both sides of the mounting plate 31. Here, the mounting plate 31 is a long strip plate-shaped structure, and the support column 20 is vertically arranged in the middle of the mounting plate 31 and has a "T" shaped structure with the mounting plate 31; through grooves are formed in the circumferential direction of the mounting plate 31, and the cross section of the mounting plate 31 is of an I-shaped structure; the two ends of the telescopic rod 10 are provided with four grabbing structures, so that the external member can be grabbed stably, and the situation that the external member falls off due to poor grabbing can be reduced.
Referring to fig. 5-7, in some embodiments, the grasping configuration includes a suction cup body 50, the suction cup body 50 being connected with the bottom end connector 30. Specifically, the suction cup body 50 includes a suction cup portion 51, a pressing cover 52, a pull rod 53, a pressing rod 54, and a connecting boss 55. Wherein, the suction surface of the suction cup part 51 is positioned at one side of the external member, and the suction surface of the suction cup part 51 is the grabbing surface; the pressing cover 52 is arranged on the upper part of the sucking disc part 51, namely, the pressing cover 52 is arranged on one side of the sucking disc part 51 facing the bottom end connecting piece 30; a pressure lever 54 is arranged on the gland 52, one end of a pull rod 53 is connected with the pressure lever 54, and the other end of the pull rod 53 penetrates through the gland 52 and is connected with the sucker part 51; the adjusting bolt 40 of the bottom end coupling member 30 is coupled to the coupling boss 55. The pull rod 53 is pulled by the pressure rod 54, so as to drive the sucking disc part 51 to switch between a first state and a second state, as shown in fig. 6, the first state is that the middle area of the sucking surface of the sucking disc part 51 is contacted with the surface of the external member, and the sucking disc part 51 is in a non-sucking state, namely a separated state; as shown in fig. 7, in the second mode, the suction surface of the suction pad 51 is in a suction state in which a negative pressure is generated in the middle area of the suction surface and the suction pad 51 is not in contact with the surface of the sleeve.
In the above embodiment, the plunger 54 is further provided with a projection, and when the middle region of the suction cup portion 51 is separated from the surface of the bundle, the projection abuts against the top surface of the cover 52. When the pressing rod 54 is pressed, the convex part can cushion the pressing rod 54, so that the pressing rod 54 is separated from the gland 52, and the pull rod 53 is pulled to move towards the gland 52 side, so that the sucker part 51 is in a second form; the pressing rod 54 can also be arranged on the connecting boss 55, part of the pulling rod 53 can extend into the inner side of the connecting boss 55, and the screw of the adjusting bolt 40 is connected with part of the threaded hole on the upper part of the connecting boss 55. At this time, the pressing rod 54 is provided outside the connection boss 55 and connected to the pull rod 53, and when the middle region of the suction cup portion 51 is separated from the surface of the sleeve and does not contact, the convex portion abuts against the top surface of the gland 52.
In order to simplify the structure of the tool, the connection boss 55 and the press cover 52 are integrated, the connection boss 55 is formed with a groove for the movement of the pull rod 53 inside the press cover 52, the press rod 54 is provided on the connection boss 55 and connected with the pull rod 53, and a screw hole for the connection of the adjusting bolt 40 is formed at the upper part of the connection boss 55.
The grabbing structure can comprise the form of the sucker body, and can also comprise a mechanical arm or an electromagnetic adsorption mechanism and the like.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims (10)

1. A mounting and demounting tool for a semiconductor film forming apparatus, comprising:
the supporting column is vertically arranged on the upper surface of the bottom end connecting piece;
the end part of the telescopic rod is rotatably connected to the upper end of the support, and the angle between the telescopic rod and the support can be adjusted;
and the grabbing structure is connected to the end part of the bottom end connecting piece and used for grabbing the external member of the semiconductor film forming equipment.
2. The disassembly and assembly tool of claim 1, wherein the bottom end connector comprises:
the mounting plate is fixed on the upper surface of the mounting plate;
the rotating plate is connected to the end part of the mounting plate and can rotate relative to the mounting plate in the plate surface direction of the mounting plate so as to drive the grabbing structure to rotate; wherein the grabbing structure is connected to the end of the rotating plate.
3. The disassembly and assembly tool of claim 2, wherein the bottom end connector further comprises an adjusting bolt, the thread of the adjusting bolt is matched with a threaded hole reserved in the rotating plate, and the grabbing structure is fixed at the bottom end of the adjusting bolt.
4. The disassembly and assembly tool of claim 2, wherein the number of the support posts and the mounting plate is two, and the two support posts are respectively connected to two ends of the telescopic rod;
the two ends of each mounting panel that back on the back of the body are connected one respectively the rotor plate, every the both ends that back on the back of the body of rotor plate are connected one grab the structure.
5. The disassembly and assembly tool of claim 2, wherein the bottom end connector further comprises:
the location axle, the vertical connection of location axle is in on the mounting panel, the rotor plate with location axle shaft hole connects so that the rotor plate can rotate.
6. The assembly and disassembly tool of claim 5, wherein the mounting plate is circumferentially provided with a through groove, the rotating plate is inserted into the through groove, and the positioning shaft passes through the through groove and is matched with a shaft hole reserved in the rotating plate.
7. The disassembly and assembly tool of any one of claims 1 to 6, wherein a hinge seat is connected to an end of the telescopic rod, and the hinge seat is rotatably connected to the support.
8. The disassembly and assembly tool of claim 7, wherein the telescopic rod comprises an outer tube and two inner tubes, the inner tubes are inserted into the outer tube and can move axially along the outer tube, and the end of the inner tubes, which is far away from the outer tube, is connected with the hinge seat;
or the telescopic rod comprises an outer tube and an inner tube, the inner tube is inserted into the outer tube and can move axially along the outer tube, and the end parts of the inner tube and the outer tube, which are far away from each other, are connected with the hinge seats.
9. The disassembly and assembly tool of any one of claims 1 to 6, wherein the gripping structure comprises:
the sucking disc body, its upper portion is provided with the connection boss, connect the boss with the bottom connecting piece is connected.
10. The assembly and disassembly tool of claim 9, wherein the suction cup body comprises:
the connecting boss is arranged at the upper part of the gland;
a chuck section provided below the pressure cover, the chuck section having an adsorption surface for adsorbing the kit;
the pull rod is arranged at the upper part of the sucker part, and the end part of the pull rod penetrates through the gland and is connected with the sucker part;
the pressure rod is arranged at the upper part of the gland and is connected with the end part of the pull rod; the pull rod is pulled by the pressure rod, so that the sucker part can be switched between a first state and a second state, wherein the first state is a state that the adsorption surface does not adsorb the external member, and the second state is a state that the adsorption surface adsorbs the external member.
CN202123426694.XU 2021-12-31 2021-12-31 Disassembling tool for semiconductor film forming equipment Active CN216859570U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123426694.XU CN216859570U (en) 2021-12-31 2021-12-31 Disassembling tool for semiconductor film forming equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123426694.XU CN216859570U (en) 2021-12-31 2021-12-31 Disassembling tool for semiconductor film forming equipment

Publications (1)

Publication Number Publication Date
CN216859570U true CN216859570U (en) 2022-07-01

Family

ID=82149975

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123426694.XU Active CN216859570U (en) 2021-12-31 2021-12-31 Disassembling tool for semiconductor film forming equipment

Country Status (1)

Country Link
CN (1) CN216859570U (en)

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