CN216820088U - Circuit board assembly and electret microphone - Google Patents
Circuit board assembly and electret microphone Download PDFInfo
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- CN216820088U CN216820088U CN202123155277.6U CN202123155277U CN216820088U CN 216820088 U CN216820088 U CN 216820088U CN 202123155277 U CN202123155277 U CN 202123155277U CN 216820088 U CN216820088 U CN 216820088U
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- circuit layer
- circuit board
- diaphragm
- ring
- electret microphone
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Abstract
The utility model belongs to the technical field of electret microphones, and particularly relates to a circuit board assembly and an electret microphone. The circuit board assembly comprises a circuit board, the circuit board comprises a first circuit layer and a second circuit layer stacked with the first circuit layer, a first via hole is formed in the first circuit layer, a second via hole is formed in the position, corresponding to the first via hole, of the second circuit layer, the circuit board further comprises an intermediate circuit layer, the intermediate circuit layer is located between the first circuit layer and the second circuit layer, and the surfaces of the two sides of the intermediate circuit layer respectively cover the first via hole and the second via hole. The utility model avoids forming a leak hole after the first circuit layer and the second circuit layer are superposed, and further avoids Hum sound, namely Hum sound or noise, generated by the interference of unclean power noise from the outside on a microphone assembled by using the circuit board assembly.
Description
Technical Field
The utility model belongs to the technical field of microphones, and particularly relates to a circuit board assembly and an electret microphone.
Background
At present, a game earphone refers to an earphone which is suitable for waiting for playing games. For game players, the most troublesome thing in the game process is to bring surrounding noise into the game, and the game is influenced by poor sound pickup effect. Compared with the situation that the teammate cannot hear clearly your voice information, the worse thing is that the teammate hears wrong your voice information. The novel game earphone needs a microphone with a noise reduction function, so that various inconveniences brought to communication due to noise are reduced. More perfectly, the integration of active noise reduction technology is limited by price positioning and cannot expand the use.
The microphone is used as a front end for receiving sound, and a single-direction electret microphone is selected by many domestic game earphones at present. Referring to fig. 1 and 3, the directivity of the single-directional microphone determines that it can attenuate the noise source within a certain angle range on the back surface, but is limited by its structure, and mainly, the rear sound hole of the microphone itself and the circuit board 503 'formed by superimposing the front surface 501' (pad output surface) and the back surface 502 '(component mounting surface) of the PCB design generate a certain number of leak holes 504'.
When the wireless earphone is charged simultaneously in the use process, interference electric signals of some non-pure power supplies enter the inside of the microphone through the leak holes 504' in a radiation mode, so that the interference electric signals are absorbed and recorded by the microphone, buzzing background noise is finally displayed at the earphone end, and the use comfort of a user is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the application is to provide a circuit board assembly, aiming at solving the problem of how to eliminate the leakage hole of the circuit board.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: the utility model provides a circuit board assembly, a serial communication port, including the circuit board, the circuit board include first circuit layer and with the second circuit layer of the range upon range of setting of first circuit layer, first via hole has been seted up on first circuit layer, the second circuit layer corresponds the second via hole has been seted up to the position of first via hole, the circuit board still includes middle circuit layer, middle circuit layer is located first circuit layer with between the second circuit layer, just the both sides surface on middle circuit layer covers respectively first via hole with the second via hole.
In one embodiment, the first circuit layer, the second circuit layer, and the intermediate circuit layer are all circular and all the same diameter.
In one embodiment, the circuit board assembly further comprises a plurality of pads located on the outer surface of the first circuit layer, and the pads are arranged at intervals.
In one embodiment, the wiring board assembly further comprises an electrical component located on an outer surface of the second circuit layer.
In one embodiment, the first circuit layer is further opened with a rear sound hole, and the rear sound hole penetrates through the second circuit layer and the intermediate circuit layer.
Another aim of this application still lies in providing an electret microphone, and it includes as above circuit board subassembly, electret microphone is still including shell, diaphragm, back of the body plate and the damping subassembly that has the arrangement chamber, the diaphragm back of the body plate and the damping subassembly all accept in settle the chamber, it has the opening to settle the chamber, the circuit board set up in the opening part, just the second circuit layer is located settle the chamber, the diaphragm with the second circuit layer sets up relatively, the back of the body plate set up in the diaphragm, just the damping subassembly is located the back of the body plate with between the second circuit layer, the sound inlet hole of intercommunication exterior space is still seted up at the bottom of settling the chamber in chamber.
In one embodiment, the diaphragm comprises a diaphragm ring arranged at the bottom of the mounting cavity and a diaphragm connected with the diaphragm ring.
In one embodiment, the electret microphone further comprises an insulating ring, wherein the ring surface of the insulating ring is connected with the membrane ring and the insulating ring is arranged around the circumference of the vibrating membrane, the edge of the back plate abuts against the insulating ring, the back plate and the vibrating membrane are arranged in a stacked mode, and the back plate is provided with a plurality of sound transmission holes.
In one embodiment, the electret microphone further includes a conductive ring stacked on the back plate, the damping assembly includes a support ring and a damping cloth, a through hole is formed in the bottom of the support ring, the damping cloth is connected to the support ring and covers the through hole, one end of the support ring abuts against the circuit board, and the other end of the support ring abuts against the conductive ring.
In one embodiment, the electret microphone further comprises an insulating sleeve made of an insulating material and located in the placement cavity, the back plate and the conductive ring are both contained in the insulating sleeve, and one end of the support ring extends into the insulating sleeve and abuts against the conductive ring.
The beneficial effect of this application lies in: through set up middle circuit layer between first circuit layer and second circuit layer, and first circuit layer and second circuit layer are connected respectively to the both sides surface on middle circuit layer, thereby make middle circuit layer can shelter from first via hole and second via hole, thereby avoid forming the small opening after first circuit layer and second circuit layer stack, and then can avoid using the Hum sound that the microphone of this circuit board subassembly equipment received external unclean power noise to disturb and appear, buzz sound or noise promptly.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a schematic diagram of a front side structure of a circuit board in the prior art;
FIG. 2 is a schematic diagram of a reverse structure of a circuit board in the prior art;
FIG. 3 is a schematic diagram of a circuit board according to the prior art;
fig. 4 is a schematic structural diagram of a first circuit layer provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of a second circuit layer provided in an embodiment of the present application;
FIG. 6 is a schematic structural diagram of an intermediate circuit layer provided in an embodiment of the present application;
fig. 7 is a schematic structural diagram of a circuit board provided in an embodiment of the present application;
fig. 8 is a schematic cross-sectional view of an electret microphone provided in an embodiment of the present application.
Wherein, in the figures, the respective reference numerals:
1. a housing;
5. a circuit board assembly;
51. a pad;
52. an electrical component;
50. a circuit board;
6. an insulating ring;
7. an insulating sleeve;
8. conducting rings;
9. damping cloth;
4. a support ring;
3. a membrane;
31. vibrating diaphragm;
32. a membrane ring;
11. a sound inlet hole;
20. a back plate;
21. an acoustically transparent aperture;
500. a rear sound hole;
501. a first circuit layer;
502. a second circuit layer;
503. an intermediate circuit layer;
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the present application, and the specific meanings of the above terms may be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 4 and 6, a circuit board assembly 5 and an electret microphone having the same are provided in an embodiment of the present application. The circuit board assembly 5 includes a circuit board 50, and the circuit board 50 includes a first circuit layer 501 and a second circuit layer 502 stacked on the first circuit layer 501. Referring to fig. 7, optionally, the first circuit layer 501 is an output layer, and is provided with two output ends, through which the first circuit layer 501 can be electrically connected to other electrical components 52, so as to output an electrical signal outwards. Optionally, the first circuit layer 501 is a Printed circuit board (Printed circuit boards).
Referring to fig. 4 and fig. 6, optionally, the first circuit layer 501 has a first via hole, and the second circuit layer 502 has a second via hole at a position corresponding to the first via hole. Optionally, the first via hole and the second via hole are both through holes. The circuit board 50 further includes an intermediate circuit layer 503, the intermediate circuit layer 503 is located between the first circuit layer 501 and the second circuit layer 502, and two side surfaces of the intermediate circuit layer 503 respectively cover the first via hole and the second via hole.
Optionally, the second circuit layer 502 and the intermediate circuit layer 503 are also Printed circuit boards (Printed circuit boards).
By arranging the intermediate circuit layer 503 between the first circuit layer 501 and the second circuit layer 502 and respectively connecting the first circuit layer 501 and the second circuit layer 502 to the two side surfaces of the intermediate circuit layer 503, the intermediate circuit layer 503 can shield the first via hole and the second via hole, thereby avoiding the formation of a leak hole after the first circuit layer 501 and the second circuit layer 502 are superposed, and further avoiding Hum sound, namely Hum sound or noise, generated by the interference of unclean power supply noise on a microphone assembled by using the circuit board assembly.
Alternatively, the first circuit layer 501, the second circuit layer 502 and the intermediate circuit layer 503 may be connected by means of soldering or gluing.
In one embodiment, the first circuit layer 501, the second circuit layer 502, and the middle circuit layer 503 are all circular and have the same diameter.
Referring to fig. 4 and fig. 6, it can be understood that the first circuit layer 501, the second circuit layer 502 and the middle circuit layer 503, which are all circularly disposed, have no directivity during subsequent mounting with the electret microphone, so that the mounting direction of the electret microphone can be rapidly identified, thereby improving the mounting efficiency of the circuit board assembly 5 and the electret microphone.
Referring to fig. 8, in an embodiment, the circuit board assembly 5 further includes a pad 51, the pad 51 is located on an outer surface of the first circuit layer 501, and a plurality of pads 51 are disposed at intervals.
Alternatively, the two bonding pads 51 are two output terminals of the first circuit layer 501, and the first circuit layer 501 can be soldered to another electrical component 52 through the two bonding pads 51.
In one embodiment, the wiring board assembly 5 further includes an electrical component, and the electrical component 52 is located on an outer surface of the second circuit layer 502.
Referring to fig. 4 and 6, in the present embodiment, the electrical component 52 is a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET).
Referring to fig. 8, in an embodiment, the first circuit layer 501 further has a rear sound hole 500, and the rear sound hole 500 penetrates through the second circuit layer 502 and the middle circuit layer 503.
Alternatively, the rear sound holes 500 are provided in plurality at intervals.
The utility model further provides an electret microphone, which comprises a circuit board assembly 5, the specific structure of the circuit board assembly 5 refers to the above embodiments, and the electret microphone adopts all the technical schemes of all the above embodiments, so that all the beneficial effects brought by the technical schemes of the above embodiments are also achieved, and are not repeated herein.
In one embodiment, the electret microphone further comprises a shell 1 with a placement cavity, a diaphragm 3, a back plate 20 and a damping component, wherein the diaphragm 3, the back plate 20 and the damping component are contained in the placement cavity, the placement cavity is provided with an opening, the circuit board is arranged at the opening, the second circuit layer 502 is positioned in the placement cavity, the diaphragm 3 and the second circuit layer 502 are oppositely arranged, the back plate 20 is arranged on the diaphragm 3, the damping component is positioned between the back plate 20 and the second circuit layer 502, and a sound inlet hole 11 communicated with an external space is further formed in the bottom of the placement cavity.
Referring to fig. 8, optionally, the wireless game headset with the electret microphone may be used while being charged in a situation where the wireless game headset with the electret microphone is low in power. And the buzzing background noise with different degrees and irritability caused by different clean degrees of the charging power supply can not occur, so that the comfort of using the earphone is improved.
Optionally, the bottom of the housing 1 is provided with a plurality of sound inlet holes 11.
Referring to fig. 8, in one embodiment, the diaphragm 3 includes a diaphragm ring 32 disposed at the bottom of the installation cavity and a diaphragm 31 connected to the diaphragm ring 32. It will be appreciated that the diaphragm 3 may convert sound into an electrical signal by mechanical vibration.
Optionally, the membrane ring 32 is located at the bottom of the installation cavity, and the diaphragm 31 is located on the membrane ring 32, optionally, the diaphragm 31 is a PPS membrane as one end of the parallel plate capacitor; PPS films are used in thicknesses that are industry-predetermined standards, taking into account the difficulty of obtaining and purchasing the material.
Referring to fig. 8, in an embodiment, the electret microphone further includes an insulating ring 6, an annular surface of the insulating ring 6 is connected to the membrane ring 32, the insulating ring 6 is disposed around the circumference of the diaphragm 31, an edge of the back plate 20 abuts against the insulating ring 6, the back plate 20 and the diaphragm 31 are stacked, and the back plate 20 is provided with a plurality of sound holes 21.
Optionally, one side of the back plate 20 is plated with an electret film for storing charge; the surface of the back plate 20 coated with the electret film is arranged opposite to the PPS film. In this embodiment, the back plate 20 needs to remove the static charge on the surface with an ion fan before the electret charge, and then uses a certain low-voltage electret charge to ensure the stability of the charge.
Referring to fig. 8, in an embodiment, the electret microphone further includes a conductive ring 8 stacked on the back plate 20, the damping assembly includes a support ring 4 and a damping cloth 9, a through hole is formed at the bottom of the support ring 4, the damping cloth 9 is connected to the support ring 4 and covers the through hole, one end of the support ring 4 abuts against the circuit board assembly 5, and the other end of the support ring 4 abuts against the conductive ring 8.
Optionally, the conductive ring 8 is made of metallic copper.
Referring to fig. 8, optionally, the support ring 4 is U-shaped and made of copper, a through hole is formed at the bottom of the support ring 4, and the damping cloth 9 is attached to the outer side surface of the support ring 4 to be used as the damping of the directional electret microphone; the circuit board assembly 5 is provided with a plurality of rear sound holes 500 close to the outer ring, and the rear sound holes 500 are matched with the damping cloth 9 to realize the function of single direction.
Referring to fig. 8, the side surface of the support ring 4 is optionally spaced from the wall of the installation cavity.
In one embodiment, the electret microphone further comprises an insulating sleeve 7 made of an insulating material and located in the installation cavity, the back plate 20 and the conductive ring 8 are both accommodated in the insulating sleeve 7, and one end of the support ring 4 extends into the insulating sleeve 7 and abuts against the conductive ring 8.
Referring to fig. 8, optionally, the insulating sleeve 7 is made of a plastic material, and the insulating sleeve 7 is used to fix the back plate 20, the conductive ring 8 and the support ring 4, and ensure that the back plate 20, the conductive ring 8 and the support ring 4 are insulated from the housing 1; the back plate 20 is electrically contacted with the conductive ring 8; the conductive ring 8 is in electrical contact with the bottom outer side of the support ring 4.
The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.
Claims (10)
1. The utility model provides a circuit board subassembly, its characterized in that, includes the circuit board, the circuit board include first circuit layer and with the second circuit layer of the range upon range of setting of first circuit layer, first via hole has been seted up on first circuit layer, the second circuit layer corresponds the second via hole has been seted up to the position of first via hole, the circuit board still includes middle circuit layer, middle circuit layer is located first circuit layer with between the second circuit layer, just the both sides surface on middle circuit layer covers respectively first via hole with the second via hole.
2. The wiring board assembly of claim 1, wherein: the first circuit layer, the second circuit layer and the middle circuit layer are all circular and have the same diameter.
3. The wiring board assembly of claim 1, wherein: the circuit board assembly further comprises a plurality of welding pads located on the outer surface of the first circuit layer, and the welding pads are arranged at intervals.
4. The wiring board assembly of claim 1, wherein: the circuit board assembly further includes an electrical component located on an outer surface of the second circuit layer.
5. The circuit board assembly of any of claims 1-4, wherein: the first circuit layer is further provided with a rear sound hole, and the rear sound hole penetrates through the second circuit layer and the middle circuit layer.
6. An electret microphone, comprising the circuit board assembly of any one of claims 1-5, wherein the electret microphone further comprises a housing with a placement cavity, a diaphragm, a back plate and a damping assembly, the diaphragm, the back plate and the damping assembly are contained in the placement cavity, the placement cavity has an opening, the circuit board is disposed at the opening, the second circuit layer is disposed on the placement cavity, the diaphragm and the second circuit layer are disposed oppositely, the back plate is disposed on the diaphragm, the damping assembly is disposed between the back plate and the second circuit layer, and a sound inlet hole communicated with an external space is further disposed at the bottom of the placement cavity.
7. The electret microphone of claim 6, wherein: the diaphragm comprises a diaphragm ring arranged at the bottom of the installation cavity and a diaphragm connected with the diaphragm ring.
8. The electret microphone of claim 7, wherein: the electret microphone still includes the insulating collar, the anchor ring of insulating collar is connected the membrane ring just insulating encircleing the circumference of vibrating diaphragm is arranged, the flange edge butt of back plate the insulating collar, just the back plate with the range upon range of setting of vibrating diaphragm, a plurality of sound holes have been seted up on the back plate.
9. The electret microphone of any one of claims 7-8, wherein: the electret microphone still including range upon range of set up in conducting ring on the back of the body plate, damping subassembly includes support ring and damping cloth, the through-hole has been seted up to the bottom of support ring, the damping cloth is connected the support ring covers the through-hole, the one end butt of support ring the circuit board, the other end butt of support ring the conducting ring.
10. The electret microphone of claim 9, wherein: the electret microphone also comprises an insulating sleeve which is made of insulating materials and is positioned in the placement cavity, the back plate and the conducting ring are contained in the insulating sleeve, and one end of the support ring extends into the insulating sleeve and is abutted to the conducting ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123155277.6U CN216820088U (en) | 2021-12-14 | 2021-12-14 | Circuit board assembly and electret microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123155277.6U CN216820088U (en) | 2021-12-14 | 2021-12-14 | Circuit board assembly and electret microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216820088U true CN216820088U (en) | 2022-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123155277.6U Active CN216820088U (en) | 2021-12-14 | 2021-12-14 | Circuit board assembly and electret microphone |
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| CN (1) | CN216820088U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117354705A (en) * | 2023-12-04 | 2024-01-05 | 苏州敏芯微电子技术股份有限公司 | Acoustic-electric conversion structure, manufacturing method thereof, microphone and electronic equipment |
-
2021
- 2021-12-14 CN CN202123155277.6U patent/CN216820088U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117354705A (en) * | 2023-12-04 | 2024-01-05 | 苏州敏芯微电子技术股份有限公司 | Acoustic-electric conversion structure, manufacturing method thereof, microphone and electronic equipment |
| CN117354705B (en) * | 2023-12-04 | 2024-02-13 | 苏州敏芯微电子技术股份有限公司 | Acoustic-electric conversion structure, manufacturing method thereof, microphone and electronic equipment |
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