CN216760808U

CN216760808U - Surface blue film pasting equipment for wafer processing

Info

Publication number: CN216760808U
Application number: CN202122741950.8U
Authority: CN
Inventors: 张健
Original assignee: Shanghai Rongjing Semiconductor Technology Co ltd
Current assignee: Shanghai Rongjing Semiconductor Technology Co ltd
Priority date: 2021-11-10
Filing date: 2021-11-10
Publication date: 2022-06-17
Anticipated expiration: 2031-11-10

Abstract

The utility model discloses surface blue film pasting equipment for wafer processing, and relates to the technical field of wafer processing. It can be through setting up cutting blade and elevating system, can be fixed in the periphery of wafer with cutting blade, and do not directly utilize the cutting blade to directly cut the blue membrane on wafer surface, avoid the potential safety hazard that cutting blade brought the wafer, simultaneously through setting up pressing mechanism, can extrude the unnecessary blue membrane of wafer outlying on cutting blade, carry out the excision of unnecessary blue membrane, through setting up first rotating electrical machines, first threaded rod and screwed pipe, can carry out the oscilaltion to the wafer on the silo, the realization is got and is put the swift of wafer, and avoid staff's limbs to be close and receive the injury apart from cutting blade.

Description

Surface blue film pasting equipment for wafer processing

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a device for pasting a blue film on a surface for wafer processing.

Background

The wafer is one of the main raw materials of the LED, is the light-emitting component of the LED, the quality of the wafer is the most core part of the LED, and the performance of the LED is directly determined by the quality of the wafer.

In the existing wafer film sticking device, refer to patent document CN203218232U, in the solution proposed in this patent document, after the wafer film sticking, a cutting knife is used to directly cut the periphery of the wafer, which is likely to cause damage to the wafer surface, and is cut by the cutting knife, causing damage to the wafer, and is not beneficial to improving the production efficiency; therefore, the surface blue film pasting equipment for wafer processing is provided to solve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides a surface blue film pasting device for wafer processing.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a surface mount blue membrane equipment for wafer processing, includes the base, the last fixed surface of base is connected with the diaphragm, the last fixed surface of diaphragm is connected with the frame, the last fixed surface of diaphragm is connected with cutting blade, the upper portion of base is provided with elevating system, the upper portion of diaphragm is provided with pressing means.

Furthermore, elevating system includes a rotating electrical machines and two montants, a rotating electrical machines fixed connection in the upper surface of base, two montants all fixed connection in the upper surface of base.

Further, the output shaft end fixedly connected with first threaded rod of first rotating electrical machines, the surface threaded connection of first threaded rod has the screwed pipe, the surface fixed connection of screwed pipe has two first gag lever posts, two the equal fixedly connected with spacing groove of one end that first gag lever post kept away from each other, two the surface of two montants is located to the spacing groove cover respectively.

Further, the upper fixed surface of screwed pipe is connected with the telescopic link, the surface cover of telescopic link is equipped with first expanding spring, the upper fixed surface of telescopic link is connected with the silo, the upper end and the lower extreme of first expanding spring respectively in the bottom surface of silo with the upper fixed surface of screwed pipe connects.

Furthermore, pressing means includes a second rotating electrical machines, a movable groove, two chutes and a roller, second rotating electrical machines fixed connection in the left inner wall of frame, two chutes respectively fixed connection in the preceding inner wall of frame and back inner wall.

Furthermore, the output shaft end of the second rotating motor is fixedly connected with a second threaded rod, the inner wall of the movable groove is in threaded connection with the outer surface of the second threaded rod, and the front side and the back side of the movable groove are fixedly connected with second limiting rods.

Furthermore, two one end that the second gag lever post kept away from each other respectively with two spout sliding connection, the bottom surface fixedly connected with draw-in groove of activity groove, the bottom surface sliding connection of draw-in groove has two backup pads.

Furthermore, both ends are connected with two respectively around the roller bearing a side that the backup pad is close to each other rotates, the inner wall fixedly connected with two sets of second expanding spring of draw-in groove, two sets of the bottom of second expanding spring respectively with two the upper surface fixed connection of backup pad.

Compared with the prior art, the surface blue film pasting equipment for wafer processing has the following beneficial effects:

1. according to the utility model, the cutting blade and the lifting mechanism are arranged, so that the cutting blade can be fixed on the periphery of the wafer, the blue film on the surface of the wafer is not directly cut by the cutting blade, the potential safety hazard brought to the wafer by the cutting blade is avoided, and meanwhile, the pressing mechanism is arranged, so that the redundant blue film on the periphery of the wafer can be extruded on the cutting blade, and the redundant blue film is cut.

2. According to the utility model, through arranging the first rotating motor, the first threaded rod and the threaded pipe, the wafer above the material groove can be lifted up and down, the wafer can be quickly taken and placed, the phenomenon that the limbs of a worker are damaged due to the fact that the limbs of the worker are close to a cutting blade is avoided, through arranging the first limiting rod and the second limiting rod, the threaded pipe and the movable groove can be limited, and the phenomenon that the threaded pipe or the movable groove does not displace due to synchronous movement of the threaded pipe and the corresponding driving equipment is avoided.

Drawings

FIG. 1 is a schematic front view of a three-dimensional structure according to the present invention;

FIG. 2 is a schematic bottom view of the three-dimensional structure of the present invention;

FIG. 3 is a schematic perspective view of the lifting mechanism of the present invention;

fig. 4 is a schematic perspective view of the pressing mechanism of the present invention.

In the figure: 1. a base; 2. a transverse plate; 3. a frame; 4. a cutting blade; 5. a lifting mechanism; 501. a first rotating electrical machine; 502. a vertical rod; 503. a first threaded rod; 504. a threaded pipe; 505. a first limit rod; 506. a limiting groove; 507. a telescopic rod; 508. a first extension spring; 509. a trough; 6. a pressing mechanism; 601. a second rotating electrical machine; 602. a movable groove; 603. A chute; 604. a roller; 605. a second threaded rod; 606. a second limiting rod; 607. a card slot; 608. a support plate; 609. a second extension spring.

Detailed Description

The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the utility model.

This embodiment provides a blue membrane equipment of surface subsides for wafer processing, and the device can avoid the cutting knife to cause the damage to the surface of wafer when the blue membrane of wafer laminating, has increased the security of equipment, simultaneously effectual improvement make the work efficiency of equipment.

Referring to fig. 1 to 4, a surface mount blue film device for wafer processing includes a base 1, and is characterized in that: the upper surface of base 1 is fixed with diaphragm 2, and the upper surface of diaphragm 2 is fixed with frame 3, and the upper surface of diaphragm 2 is fixed with cutting blade 4.

Here base 1, diaphragm 2 and frame 3 are the supporting component of equipment, and the edges and corners department of base 1, diaphragm 2 and frame 3 all passes through passivation treatment, avoids its edges and corners to cause the accidental injury to the staff, and the bottom surface of base 1 should fixedly connected with slipmat, avoids 1 bottom surface of base and the unstable equipment that leads to of ground laminating to take place the displacement.

The upper portion of the base 1 is provided with a lifting mechanism 5, wherein the lifting mechanism 5 comprises a first rotating electrical machine 501 and two vertical rods 502, the first rotating electrical machine 501 is fixedly connected to the upper surface of the base 1, and the two vertical rods 502 are both fixedly connected to the upper surface of the base 1.

Meanwhile, an output shaft end of the first rotating electric machine 501 is fixedly connected with a first threaded rod 503, an outer surface of the first threaded rod 503 is in threaded connection with a threaded pipe 504, the outer surface of the threaded pipe 504 is fixedly connected with two first limiting rods 505, one ends of the two first limiting rods 505, which are far away from each other, are fixedly connected with limiting grooves 506, and the outer surfaces of the two vertical rods 502 are respectively sleeved with the two limiting grooves 506.

Still include, threaded pipe 504's last fixed surface is connected with telescopic link 507, and telescopic link 507's surface cover is equipped with first expanding spring 508, and telescopic link 507's last fixed surface is connected with silo 509, and the upper end and the lower extreme of first expanding spring 508 are respectively in silo 509's bottom surface and threaded pipe 504's last fixed surface connection.

Can rotate through first rotating electrical machines 501 promptly to reach and drive screwed pipe 504 and rise or descend, realize the oscilaltion to silo 509, it is inconvenient to avoid the manual work to get the wafer, keeps away from cutting blade 4 simultaneously when operating wafer, the effectual security that has improved equipment.

The pressing mechanism 6 is disposed on the upper portion of the horizontal plate 2, in this embodiment, the pressing mechanism 6 includes a second rotating electrical machine 601, a movable slot 602, two sliding slots 603 and a roller 604, the second rotating electrical machine 601 is fixedly connected to the left inner wall of the frame 3, and the two sliding slots 603 are respectively and fixedly connected to the front inner wall and the rear inner wall of the frame 3.

Preferably, the output shaft end of the second rotating electrical machine 601 is fixedly connected with a second threaded rod 605, the inner wall of the movable groove 602 is in threaded connection with the outer surface of the second threaded rod 605, and the front and the back of the movable groove 602 are fixedly connected with a second limit rod 606.

Furthermore, the ends of the two second limiting rods 606 away from each other are respectively connected with the two sliding grooves 603 in a sliding manner, the bottom surface of the movable groove 602 is fixedly connected with a clamping groove 607, and the bottom surface of the clamping groove 607 is connected with two supporting plates 608 in a sliding manner.

Furthermore, the front end and the rear end of the roller 604 are respectively rotatably connected with one side surface of the two support plates 608 close to each other, the inner wall of the slot 607 is fixedly connected with two groups of second expansion springs 609, and the bottom ends of the two groups of second expansion springs 609 are respectively fixedly connected with the upper surfaces of the two support plates 608.

That is, the second rotating motor 601 drives the movable groove 602 to move left and right, so as to realize the movement of the roller 604, so that the roller 604 drives the second expansion spring 609 to extrude the cutting blade 4 after the film sticking of the wafer is completed, and the redundant blue film of the wafer is cut off without damaging the wafer.

The working principle is as follows: firstly, a wafer is placed on a trough 509, a blue film is placed on the upper surface of the wafer, then a first rotating motor 501 is started, the first rotating motor 501 drives a first threaded rod 503 to rotate, the threaded pipe 504 drives the trough 509 to descend because the threaded pipe 504 is limited by a first limiting rod 505 and a limiting groove 506 to move relative to the threaded pipe 504, when the trough 509 descends to be horizontal to a cutting blade 4, the first rotating motor 501 is turned off, a second rotating motor 601 is started, the second rotating motor 601 passes through a second threaded rod 605, due to the arrangement of the second limiting rod 606, the movable trough 602 and the second threaded rod 605 generate relative movement, the left-right movement of the movable trough 602 is realized, the roller 604 is driven to move on a transverse plate 2, when a second telescopic spring 609 passes over the cutting blade 4, the pressure between the movable trough 602 and the second threaded rod 605 realizes the cutting of the wafer, the blue film on the surface of the wafer is shaped, then, due to the arrangement of the first expansion spring 508 and the second expansion spring 609, the roller 604 does not affect the crystal on the trough 509, after the film pasting and cutting are finished, the first rotating motor 501 is reversed, the trough 509 is lifted, and then the finished wafer product is taken out.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a surface pad pasting blue membrane equipment for wafer processing, includes base (1), its characterized in that: the upper surface fixed connection of base (1) has diaphragm (2), the upper surface fixed connection of diaphragm (2) has frame (3), the upper surface fixed connection of diaphragm (2) has cutting blade (4), the upper portion of base (1) is provided with elevating system (5), the upper portion of diaphragm (2) is provided with pressing mechanism (6).

2. The apparatus of claim 1, wherein: elevating system (5) include one first rotating electrical machines (501) and two montants (502), first rotating electrical machines (501) fixed connection in the upper surface of base (1), two montants (502) all fixed connection in the upper surface of base (1).

3. The apparatus of claim 2, wherein: the output shaft end fixedly connected with first threaded rod (503) of first rotating electrical machines (501), the surface threaded connection of first threaded rod (503) has screwed pipe (504), two first gag lever posts (505) of the fixed surface of screwed pipe (504), two the equal fixedly connected with spacing groove (506) of one end that first gag lever post (505) kept away from each other, two the surface of two montants (502) is located to spacing groove (506) cover respectively.

4. The apparatus of claim 3, wherein: the utility model discloses a novel telescopic pipe, including screwed pipe (504), the last fixed surface of screwed pipe (504) is connected with telescopic link (507), the surface cover of telescopic link (507) is equipped with first expanding spring (508), the last fixed surface of telescopic link (507) is connected with silo (509), the upper end and the lower extreme of first expanding spring (508) respectively in the bottom surface of silo (509) with the last fixed surface of screwed pipe (504) connects.

5. The apparatus of claim 1, wherein: the pressing mechanism (6) comprises a second rotating motor (601), a movable groove (602), two sliding grooves (603) and a rolling shaft (604), the second rotating motor (601) is fixedly connected to the left inner wall of the frame (3), and the two sliding grooves (603) are respectively and fixedly connected to the front inner wall and the rear inner wall of the frame (3).

6. The apparatus of claim 5, wherein: the output shaft end of the second rotating motor (601) is fixedly connected with a second threaded rod (605), the inner wall of the movable groove (602) is in threaded connection with the outer surface of the second threaded rod (605), and the front side and the back side of the movable groove (602) are fixedly connected with a second limiting rod (606).

7. The apparatus of claim 6, wherein: two the one end that second gag lever post (606) kept away from each other respectively with two spout (603) sliding connection, the bottom surface fixedly connected with draw-in groove (607) of activity groove (602), the bottom surface sliding connection of draw-in groove (607) has two backup pads (608).

8. The apparatus of claim 7, wherein: the front end and the rear end of the roller (604) are respectively connected with two side faces, close to each other, of the support plates (608) in a rotating mode, the inner wall of the clamping groove (607) is fixedly connected with two groups of second expansion springs (609), and the bottom ends of the two groups of second expansion springs (609) are respectively fixedly connected with the upper surfaces of the two support plates (608).