CN216752239U

CN216752239U - Transition slide glass of composite electrode structure

Info

Publication number: CN216752239U
Application number: CN202122534631.XU
Authority: CN
Inventors: 张燕; 曾皓
Original assignee: Chengdu Hongming Electronics Co Ltd
Current assignee: Chengdu Hongming Electronics Co Ltd
Priority date: 2021-10-21
Filing date: 2021-10-21
Publication date: 2022-06-14
Anticipated expiration: 2031-10-21

Abstract

The utility model discloses a transition slide glass with a composite electrode structure, which comprises a high-alumina ceramic substrate, a first metal electrode, a second metal electrode and a third metal electrode, wherein the first metal electrode, the second metal electrode and the third metal electrode are all arranged on the surface of the same side of the high-alumina ceramic substrate and are mutually independent. The three mutually independent metal electrodes are arranged on the high-alumina ceramic substrate to form the transition slide glass which can be used for mounting other electronic elements, and the transition slide glass is mounted on the printed circuit board during application.

Description

Transition slide glass of composite electrode structure

Technical Field

The utility model relates to a slide for mounting electronic elements, in particular to a transition slide with a composite electrode structure.

Background

In electronic equipment, a carrier plate is a substrate used for carrying various electronic components such as resistors, capacitors, inductors and the like in electronic circuits such as systems, assemblies, modules and the like, and is connected with electronic components in a tin-lead welding mode, a thermoacoustic welding mode and the like.

The traditional Printed Circuit Board (PCB) is a supplier for connecting electronic components, the design of the PCB is mainly a layout design, and the PCB has the advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. However, because the integrated electronic components of the printed circuit board are more and the circuits are more complex, when the components in a certain loop are broken down and damaged, the performance of other components in an adjacent loop may be affected, and the integrated circuit board is damaged, so that the situation has no particularly great adverse effect on common components and modules, but has great influence on the design and manufacturing fields of spacecrafts and the like, and the main reason is that: the spacecraft is complex in component system and high in manufacturing cost, and the integrated carrier plate is not allowed to be repeatedly disassembled, assembled and replaced from the viewpoint of saving component cost and labor cost, so that a transition slide glass is required to be added between an electronic component and a traditional carrier plate to solve the problems.

SUMMERY OF THE UTILITY MODEL

The present invention aims to solve the above problems by providing a transition chip for a composite electrode structure on a printed circuit board, mainly for a spacecraft.

The utility model realizes the purpose through the following technical scheme:

a transition slide with a composite electrode structure comprises a high-alumina ceramic substrate, a first metal electrode, a second metal electrode and a third metal electrode, wherein the first metal electrode, the second metal electrode and the third metal electrode are arranged on the same side surface of the high-alumina ceramic substrate and are mutually independent.

Preferably, in order to realize high-stability connection between the metal electrode and the high-alumina ceramic substrate and facilitate welding with other electronic elements, the first metal electrode, the second metal electrode and the third metal electrode are all made of multiple layers of metals and sequentially comprise a tungsten layer, a nickel layer and a tin-lead layer, the tungsten layer is connected with the high-alumina ceramic substrate in a sintering permeation mode, the nickel layer is electroplated on the tungsten layer, and the tin-lead layer is electroplated on the nickel layer.

The utility model has the beneficial effects that:

the three mutually independent metal electrodes are arranged on the high-alumina ceramic substrate to form a transition slide capable of mounting other electronic elements, and the transition slide is mounted on the printed circuit board during application; through setting up the metal electrode of the three layer construction including tungsten layer, nickel layer, tin-lead layer, tungsten layer and high alumina porcelain base plate realize good adhesion effect through high temperature sintering infiltration, show improvement electrode strength, and intensity is superior to traditional silver layer, and tin-lead layer is as the superficial layer, and its welding quality is excellent for with electronic component welding, the nickel layer is located between tungsten layer and the tin-lead layer as the barrier layer, improves the electrode cohesion.

Drawings

FIG. 1 is a schematic front view of a transition slide of the composite electrode structure of the present invention;

fig. 2 is a sectional view a-a of fig. 1.

Detailed Description

The utility model will be further described with reference to the accompanying drawings in which:

as shown in fig. 1 and fig. 2, the transition slide of the composite electrode structure of the present invention includes a high alumina ceramic substrate 2, a first metal electrode 1, a second metal electrode 3, and a third metal electrode 4, where the first metal electrode 1, the second metal electrode 3, and the third metal electrode 4 are all disposed on the same side surface of the high alumina ceramic substrate 2 and are independent of each other. Preferably, the first metal electrode 1, the second metal electrode 3 and the third metal electrode 4 are all multilayer metals and sequentially comprise a tungsten layer 7, a nickel layer 6 and a tin-lead layer 5, the tungsten layer 7 is connected with the high-alumina ceramic substrate 2 in a sintering infiltration mode, the nickel layer 6 is electroplated on the tungsten layer 7, and the tin-lead layer 5 is electroplated on the nickel layer 6.

The overall shape of the transition slide shown in the figure is horseshoe-shaped, and the first metal electrode 1, the second metal electrode 3 and the third metal electrode 4 are respectively positioned on the upper part, the lower left side part and the lower right side part of an arc to meet the application requirement.

The following practical application case illustrates the application mode of the transition slide of the composite electrode structure.

Connecting the electrodeless side of a high-alumina porcelain substrate 2 with a printed circuit board (not shown) by using adhesive glue, welding a first metal electrode 1 with one electrode end of a thermistor main chip (not shown), welding a lead wire at the other electrode end of the thermistor main chip to be used as a leading-out end A (not shown) of the thermistor main chip, meanwhile, welding the first metal electrode 1 with a third metal electrode 4 to form connection by welding a lead wire, welding a second metal electrode 3 with one electrode end of a thermistor auxiliary chip (not shown), welding a lead wire at the other electrode end of the thermistor auxiliary chip to be used as a leading-out end B (not shown) of the thermistor auxiliary chip, simultaneously, welding the second metal electrode 3 with the third metal electrode 4 to form connection by welding a lead wire, welding the third metal electrode 4 with a lead wire to be used as a common leading-out end C, therefore, A and C are used as two leading-out ends of the main chip of the thermistor, B and C are used as two leading-out ends of the auxiliary chip of the thermistor, so that double-channel conduction of the main chip of the thermistor and the auxiliary chip of the thermistor is realized, and the use requirements are met. If the main chip of the thermistor or/and the auxiliary chip of the thermistor are damaged, the high-alumina ceramic substrate 2 and the printed circuit board are separated and replaced, and the printed circuit board does not need to be replaced.

The above embodiments are only preferred embodiments of the present invention, and are not intended to limit the technical solutions of the present invention, so long as the technical solutions can be realized on the basis of the above embodiments without creative efforts, which should be considered to fall within the protection scope of the patent of the present invention.

Claims

1. A transition slide glass of a composite electrode structure is characterized in that: the high-alumina ceramic substrate comprises a high-alumina ceramic substrate, a first metal electrode, a second metal electrode and a third metal electrode, wherein the first metal electrode, the second metal electrode and the third metal electrode are arranged on the same side surface of the high-alumina ceramic substrate and are mutually independent.

2. The composite electrode structure transition slide of claim 1, wherein: the first metal electrode the second metal electrode with the third metal electrode is multilayer metal and is tungsten layer, nickel layer, tin plumbous layer in proper order, the tungsten layer with the high alumina porcelain substrate is connected with the mode of sintering, the nickel layer electroplate in on the tungsten layer, tin plumbous layer electroplate in on the nickel layer.