CN216749891U - Power module - Google Patents

Abstract

The utility model discloses a power module. The power module comprises an electrical interconnection assembly and at least one electronic element group. The electrical interconnection assembly comprises a conductive structure and a circuit board. The conductive structure comprises a first conductive piece and a second conductive piece which are arranged side by side and insulated from each other. The circuit board is arranged on the conductive structure. The circuit board defines an opening, and the opening partially corresponds to the first conductive member and partially corresponds to the second conductive member. At least one electronic component group comprises a power element, and the power element is provided with a first connecting pad, a second connecting pad and a third connecting pad. The first connecting pad and the second connecting pad are respectively electrically connected to the first conductive piece and the second conductive piece through the opening, and the third connecting pad is arranged on the circuit board.

Description

Power module

Technical Field

The present invention relates to a power module, and more particularly, to a power module having a high withstand voltage.

Background

The power module can be applied to a household frequency conversion system, an electric vehicle and an industrial control system (industrial control system) to convert electric energy or control a circuit. In conventional circuit systems, a power device, a gate driving device and a control device are usually integrated. In the prior art, a specific circuit layout is formed on a circuit board in advance according to a circuit design, and then a plurality of discrete power components, control components, gate driving components and other related components are assembled on a main control circuit board to integrate into a power module.

However, in some circuits, such as: the voltage conversion circuit and the power module can be required to operate under high-power conditions such as high voltage or large current. Therefore, the power module is required to have high withstand voltage and characteristics of withstanding a large current operation.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a power module, which has a high withstand voltage and can operate under a large current.

In order to solve the above technical problem, one technical solution adopted by the present invention is to provide a power module. The power module comprises an electrical interconnection assembly and at least one electronic component group. The electrical interconnection assembly comprises a conductive structure and a first circuit board. The conductive structure comprises a first conductive piece, a second conductive piece and a third conductive piece which are arranged side by side and insulated from each other. The second conductive member and the third conductive member are respectively located on two opposite sides of the first conductive member. The first wiring board partially covers the conductive structure. The first electronic component group comprises a first power component and a second power component. The first power element is bridged between the first conductive piece and the second conductive piece and is electrically connected to the first circuit board, and the second power element is bridged between the first conductive piece and the third conductive piece and is electrically connected to the first circuit board. The second power element is connected in series with the first power element through the first conductive member.

According to one embodiment of the present invention, the first conductive member, the second conductive member, and the third conductive member define a component mounting surface, and the first circuit board partially covers the component mounting surface.

According to one embodiment of the present invention, the electrical interconnect assembly further includes a circuit laminate juxtaposed to the conductive structure, and a plurality of leads disposed on the first circuit board and extending from the first circuit board to a surface of the circuit laminate.

According to one embodiment of the present invention, the wiring laminate has a plurality of via holes.

According to one embodiment of the present invention, the circuit laminated plate includes two layers of wiring boards and a conductive plate located between the two layers of wiring boards, and the electronic component group further includes: and the control element is arranged on one of the circuit boards and is electrically connected with the first power element and the second power element through a plurality of leads.

According to one embodiment of the present invention, the electrical interconnection assembly further includes a circuit laminated plate and a plurality of leads, the circuit laminated plate is arranged side by side on the conductive structure, the plurality of leads are disposed on the first circuit board, a surface of the circuit laminated plate has at least one contact pad, and the at least one contact pad and the corresponding lead are connected through a connection carrier.

According to one embodiment of the present invention, the first circuit board partially covers the first conductive member and partially covers the second conductive member, the first power device has a source pad, a drain pad and a gate pad, the source pad is electrically connected to the first conductive member, the drain pad is electrically connected to the second conductive member, and the gate pad is disposed on the first circuit board.

According to one embodiment of the present invention, the first circuit board partially covers the third conductive member, the second power device has a source pad, a drain pad and a gate pad, the source pad is electrically connected to the third conductive member, the drain pad is electrically connected to the first conductive member, and the gate pad is disposed on the first circuit board.

According to one embodiment of the present invention, the first electronic component group further includes: a diode element, wherein the diode element is disposed on the conductive structure and connected in parallel to the first power element or the second power element.

According to one embodiment of the present invention, the electrical interconnect assembly further comprises: the second circuit board partially covers the conductive structure, and the first circuit board and the second circuit board are respectively positioned on the upper side and the lower side of the conductive structure.

According to one embodiment of the present invention, the power module further comprises: a second electronic component set disposed on the electrical interconnection component, wherein the second electronic component set and the second circuit board are located on the same side of the conductive structure, and have a third power component and a fourth power component, the first power component is connected in parallel to the third power component through the first conductive member and the second conductive member, and the second power component is connected in parallel to the fourth power component through the first conductive member and the third conductive member.

According to one embodiment of the present invention, the first power element and the third power element are disposed to be offset from each other, and the second power element and the fourth power element are disposed to be offset from each other.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a power module. The power module comprises an electrical interconnection assembly and at least one electronic component group. The electrical interconnection assembly comprises a conductive structure and a circuit board. The conductive structure comprises a first conductive piece and a second conductive piece which are arranged side by side and insulated from each other. The circuit board is arranged on the conductive structure. The circuit board defines an opening, and the opening partially corresponds to the first conductive member and partially corresponds to the second conductive member. At least one electronic component group comprises a power element, and the power element is provided with a first connecting pad, a second connecting pad and a third connecting pad. The first connecting pad and the second connecting pad are respectively electrically connected to the first conductive piece and the second conductive piece through the opening, and the third connecting pad is arranged on the circuit board.

According to one embodiment of the present invention, the opening defines a first pad installation region in the first conductive member, a height between a surface of the circuit board and a top end surface of the first pad installation region is the same, and the first pad is connected to the first pad installation region.

According to one embodiment of the present invention, the opening defines a first pad installation region in the first conductive member and a second pad installation region in the second conductive member, and a height difference is formed between a top end surface of the first pad installation region and a top end surface of the second pad installation region.

According to one embodiment of the present invention, the first conductive member and the second conductive member are spaced apart from each other to define a slot, and the electrical interconnection assembly further comprises: and the insulating joint material is positioned in the open groove and is connected between the first conductive piece and the second conductive piece.

According to one embodiment of the present invention, the electronic component group further includes: and the diode element is arranged on the conductive structure, wherein two electrodes of the diode element are respectively and electrically connected to the first conductive piece and the second conductive piece through the openings and are connected to the power element in parallel.

According to one embodiment of the present invention, the power module further comprises: and the heat dissipation part is arranged on the power element.

According to one embodiment of the present invention, the electronic component group further includes: and the control element is arranged on the circuit board and is electrically connected with the power element through the circuit board.

One of the benefits of the present invention is that the power module provided by the present invention can operate under high voltage and high current through the technical schemes that the conductive structure includes a first conductive piece and a second conductive piece which are arranged side by side and insulated from each other, the circuit board partially covers the conductive structure, and the first pad and the second pad of the power device are respectively electrically connected to the first conductive piece and the second conductive piece, and the third pad is arranged on the circuit board.

For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description of the utility model and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the utility model.

Drawings

Fig. 1 is a perspective view of a power module according to a first embodiment of the utility model.

Fig. 2 is a schematic exploded view of a power module without an encapsulation layer according to a first embodiment of the utility model.

Fig. 3 is an exploded perspective view of the power module of the first embodiment of the utility model at another angle with the encapsulation layer omitted.

Fig. 4 is a partially exploded perspective view of the power module without the heat sink and the package layer according to the first embodiment of the utility model.

Fig. 5 is a schematic cross-sectional view along line V-V in fig. 1.

Fig. 6 is a partially enlarged schematic view of the region VI in fig. 5.

Fig. 7 is a partially enlarged cross-sectional view of a power module according to another embodiment of the utility model.

Fig. 8 is a schematic sectional view taken along line VIII-VIII in fig. 1.

Fig. 9 is a schematic cross-sectional view of a power module according to a second embodiment of the utility model.

Fig. 10 is a schematic cross-sectional view of a power module according to a third embodiment of the utility model.

Fig. 11 is an exploded perspective view of a power module according to a fourth embodiment of the utility model, with an encapsulation layer omitted.

Fig. 12 is an exploded perspective view of a power module of a fifth embodiment of the utility model, with heat dissipation elements and a package layer omitted.

Fig. 13 is a partially enlarged schematic view of a region XIII in fig. 12.

Fig. 14 is an exploded perspective view of a power module of a sixth embodiment of the utility model, with heat dissipation elements and a package layer omitted.

Fig. 15 is a partially enlarged schematic view of the region XV in fig. 14.

Detailed Description

The following is a description of the embodiments of the "power module" disclosed in the present invention with reference to specific embodiments, and those skilled in the art will understand the advantages and effects of the present invention from the disclosure of the present specification. The utility model is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the utility model. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

[ first embodiment ]

Referring to fig. 1 to 3, fig. 1 is a schematic perspective view of a power module according to a first embodiment of the utility model, and fig. 2 and 3 are schematic perspective exploded views of the power module at different angles, respectively. The power module M1 of the present embodiment can be applied to circuit design of electronic products and is suitable for operating under high voltage and high current. In the present embodiment, the power module M1 includes an electrical interconnection assembly 1, at least one electronic component group 2A,2B (two are shown in fig. 2 as an example), heat dissipation members 3A,3B, a plurality of input/output pins 4, and a package layer 5.

In addition to supporting the electronic component groups 2A,2B, the electrical interconnection component 1 can also establish electrical connection between a plurality of electronic components in the electronic component groups 2A, 2B. The detailed structure of the electrical interconnection assembly 1 and the electrical connection relationship between the electrical interconnection assembly 1 and the electronic component sets 2A and 2B according to the embodiment of the present invention are further described below. In this embodiment, a part of circuits forming a voltage conversion system circuit is described as an example.

Referring to fig. 2, the electrical interconnection element 1 includes a conductive structure 10, a first circuit board 11 and a second circuit board 12. The conductive structure 10 of the present embodiment includes a first conductive member 101, a second conductive member 102, and a third conductive member 103. The first conductive member 101, the second conductive member 102, and the third conductive member 103 are arranged side by side in the first direction D1 and are insulated from each other. The second conductive element 102 and the third conductive element 103 are respectively located on two opposite sides of the first conductive element 101.

Further, the first to third conductive members 101 and 103 may be used to construct current transmission paths of the electronic components in the electronic component groups 2A and 2B. In the embodiment, each of the first to third conductive members 101 and 103 has a plate shape, and the thickness range may be from 0.5mm to 4 mm. In addition, the materials constituting the first to third conductive members 101 and 103 may be selected from materials having high conductivity, such as: copper or alloys thereof to reduce parasitic resistance. Thus, the first to third conductive members 101 and 103 can allow a larger current to pass through, so that the power module M1 can operate under a large voltage and a large current.

In the embodiment, the first conductive member 101 and the second conductive member 102 are separated from each other to define a slot h 1. In addition, the first conductive member 101 and the third conductive member 103 are also separated from each other to define another slot h 2. In the present embodiment, the electrical interconnection component 1 further includes an insulating bonding material 104, and the insulating bonding material 104 is located in the open slot h1 between the first conductive member 101 and the second conductive member 102 to connect the first conductive member 101 and the second conductive member 102. In addition, another insulating bonding material 104 is further disposed in the open slot h2 between the first conductive member 101 and the third conductive member 103 to connect the first conductive member 101 and the third conductive member 103.

As shown in fig. 1 and 2, the first conductive member 101 has a first end 101e, the second conductive member 102 has a second end 102e, and the third conductive member 103 has a third end 103 e. The second end 102e is disposed in the same direction as the third end 103e, and the first end 101e is disposed in the opposite direction to the second end 102e (or the third end 103 e). In addition, the power module M1 may be connected to another system circuit through the first to third terminals 101e to 103 e. For example, the first end portion 101e may be electrically connected to a voltage switching terminal, one of the second end portion 102e and the third end portion 103e is electrically connected to a power voltage terminal, and the other is electrically connected to a ground terminal. In addition, the first to third conductive members 101-103 have higher rigidity and strength, so that the power module M1 of the present invention can be connected to another system circuit by means of a plug-in.

In addition, in the embodiment of fig. 2, upward surfaces of the first conductive member 101, the second conductive member 102, and the third conductive member 103 define an element mounting surface SA, and downward surfaces of the first conductive member 101, the second conductive member 102, and the third conductive member 103 define another element mounting surface SB.

Please refer to fig. 1 and fig. 2. In the present embodiment, the first wiring board 11 and the second wiring board 12 are respectively located on two opposite sides of the conductive structure 10. In other words, the first wiring board 11 and the second wiring board 12 are separated from each other by the conductive structure 10. It should be noted that, by disposing the first circuit board 11 and the second circuit board 12 on two opposite sides of the conductive structure 10, the warpage of the electrical interconnection element 1 due to high temperature of the process (e.g., during reflow) can also be avoided.

At least one of the first wiring board 11 and the second wiring board 12 may be a single-layer wiring board or a multilayer wiring board, and the other may be an insulating board of a wireless circuit, a single-layer wiring board, or a multilayer wiring board. That is, one of the first circuit board 11 and the second circuit board 12 has a plurality of traces (not shown) and pads (not shown) on its surface and inside according to actual requirements. Accordingly, a plurality of electronic components in the electronic component groups 2A,2B can be arranged on the first wiring board 11 or the second wiring board 12 according to the actual circuit design.

It should be noted that in the present embodiment, the thickness of the first wiring board 11 and the thickness of the second wiring board 12 are both smaller than the thickness of the conductive structure 10. Further, the thickness of the first wiring board 11 (or the second wiring board 12) is about 150 μm to 400 μm. In addition, the sum of the thicknesses of the first wiring board 11 and the second wiring board 12 is also smaller than the thickness of the conductive structure 10.

Referring to fig. 2 and 4 in combination, fig. 4 is a partially exploded perspective view of a power module without a heat sink and a package layer according to a first embodiment of the utility model. Further, the first wiring board 11 of the present embodiment has two openings 11ha,11 hb. One of the openings 11ha is located corresponding to the open slot h1 between the first conductive member 101 and the second conductive member 102, and partially exposes the first conductive member 101 and the second conductive member 102. Accordingly, in the first direction D1, the width of the opening 11ha is greater than the width of the slot h 1. The opening 11ha may define a first pad setting region 101a and a second pad setting region 102a on the first conductive member 101 and the second conductive member 102, respectively.

Similarly, the other opening 11hb is located corresponding to the open slot h2 between the first conductive member 101 and the third conductive member 103, and partially exposes the first conductive member 101 and the third conductive member 103. Accordingly, the opening 11hb defines another first pad installation region 101a on the first conductive member 101, and defines a third pad installation region 103a on the third conductive member 103. That is, the first circuit board 11 partially covers the first conductive member 101, the second conductive member 102, and the third conductive member 103.

Referring to fig. 3, similar to the first circuit board 11, the second circuit board 12 also has two openings 12ha,12 hb. One of the openings 12ha is located corresponding to the open slot h1 between the first conductive member 101 and the second conductive member 102, and partially exposes the first conductive member 101 and the second conductive member 102. The other opening 12hb is located corresponding to the open slot h2 between the first conductive member 101 and the third conductive member 103, and partially exposes the first conductive member 101 and the third conductive member 103. By partially exposing the first conductive member 101, the second conductive member 102, and the third conductive member 103, transmission of a load requiring a large current can be handled separately from control signals using the first circuit board 11 and the second circuit board 12.

Accordingly, the second circuit board 12 may also define two first pad setting regions 101b on the bottom side of the first conductive member 101, and define another second pad setting region 102b and another third pad setting region 103b on the bottom sides of the second conductive member 102 and the third conductive member 103, respectively. However, the present invention is not limited thereto, and in another embodiment, the second circuit board 12 may have only one of the openings 12ha,12 hb. That is, the first wiring board 11 partially covers the component mounting area SA, and the second wiring board 12 partially covers the other component mounting surface SB.

It should be noted that in the present embodiment, the first circuit board 11 and the second circuit board 12 are embedded on two sides of the conductive structure 10. Referring to fig. 2 and 4, the first conductive member 101 has a first concave region (not numbered) recessed relative to the two first pad installation regions 101a on a side facing the first circuit board 11. In other words, the first pad disposing regions 101a of the first conductive members 101 are all bosses. In addition, the first circuit board 11 has a first circuit arrangement portion 111 located on the first conductive member 101, and an edge profile of the first circuit arrangement portion 111 matches an edge profile of the first pad installation region 101a (or the first recess region) and is installed in the first recess region.

Similarly, referring to fig. 3, on a side facing the first circuit board 11, the second conductive element 102 also has a second recess region (not numbered) recessed relative to the second pad setting region 102a, and the third conductive element 103 has a third recess region (not numbered) recessed relative to the third pad setting region 103 a. In addition, the first circuit board 11 has a second circuit arrangement portion 112 disposed in the second recessed area, and a third circuit arrangement portion 113 disposed in the third recessed area. In this embodiment, the edge profile of the second circuit arrangement portion 112 matches the edge profile of the second pad setting region 102a, and the edge profile of the third circuit arrangement portion 113 matches the edge profile of the third pad setting region 103 a.

In other words, the edge profiles of the two sides of the opening 11ha of the first circuit board 11 are respectively matched with the edge profile of the first pad mounting region 101a and the edge profile of the second pad mounting region 102a, and the edge profiles of the two sides of the opening 11hb are respectively matched with the edge profile of the other first pad mounting region 101a and the edge profile of the third pad mounting region 103 a.

Referring to fig. 3, the first to third conductive members 101 and 103 may also form a first recessed area, a second recessed area and a third recessed area on a side facing the second circuit board 12. The edge contour of the second circuit board 12 in the opening 12ha matches the edge contours of the first pad setting region 101b and the second pad setting region 102b, and the edge contour of the opening 12hb matches the edge contour of the other first pad setting region 101b and the edge contour of the third pad setting region 103 b. However, the utility model is not limited thereto. In another embodiment, the surfaces of the first to third conductive members 101 and 103 facing the second circuit board 12 may also be flat surfaces.

Referring to fig. 2 to 4, two electronic component sets 2A and 2B are disposed on the electrical interconnection component 1 and respectively located on two opposite sides of the electrical interconnection component 1, but the utility model is not limited thereto. Each electronic component group 2A,2B may include one or more electronic components (a plurality is shown in fig. 1 and 2 for example). The electronic component may be a power component, a control component, a diode component, a passive component, a protection component, or the like, and the present invention is not limited thereto. In addition, the electronic component groups 2A,2B may also include one or more of power components, control components, diode components, passive components, or protection components.

The power element is, for example, an Insulated Gate Bipolar Transistor (IGBT), a Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET), or any combination thereof. The material of the power element is, for example, silicon carbide, silicon or gallium nitride. In addition, the diode element is, for example, a fast forward diode (FRD) or a power diode. When the power module M1 is applied to a voltage conversion circuit, the electronic component group 2A,2B may include a plurality of power elements 21,22 arranged in an array.

Referring to fig. 4 and fig. 5, each of the power devices 21 and 22 may include a first pad 21s and 22s, a second pad 21d and 22d, and a third pad 21g and 22 g. The first pads 21s,22s may be source pads, the second pads 21d,22d may be drain pads, and the third pads 21g,22g may be gate pads. In addition, in detail, each power element 21,22 may include a power chip 210,220 and a conductive connection member 211,221 connected to the power chip 210, 220. The first pads 21s,22s and the third pads 21g,22g are located on the active surfaces of the power chips 210, 220. The conductive connection 211,221 is disposed on the rear surface of the power chip 210,220 and has a lead portion 211t,221 t. The second pads 21d and 22d are disposed at the ends of the lead portions 211t and 221 t.

For convenience of illustration, the electronic component group 2A is defined as a first electronic component group, and the electronic component group 2B is defined as a second electronic component group. In addition, in the first electronic component group 2A, the power component 21 connected to the first conductive component 101 and the second conductive component 102 is defined as a first power component, and the power component 22 connected to the first conductive component 101 and the third conductive component 103 is defined as a second power component. The plurality of first power elements 21 arranged in the same row in the second direction D2 may be connected in parallel with each other through the conductive structure 10. Similarly, a plurality of second power elements 22 arranged in another row in the second direction D2 may also be connected in parallel with each other through the conductive structure 10.

Referring to fig. 4 and 5, fig. 5 is a schematic cross-sectional view taken along line V-V in fig. 1. In detail, the first pad 21s (source pad) and the second pad 21d (drain pad) of each first power device 21 can be electrically connected to the first conductive member 101 and the second conductive member 102 through the openings 11ha,12ha of the first circuit board 11 or the second circuit board 12, respectively. In addition, the third pad 21g (gate pad) of each first power device 21 is disposed on the first circuit arrangement portions 111 and 121 of the first circuit board 11 or the second circuit board 12 and electrically connected to the circuit (not shown) in the first circuit board 11.

In detail, the first contact pad 22s (source contact pad) and the second contact pad 22d (drain contact pad) of each second power device 22 can be electrically connected to the first conductive member 101 and the third conductive member 103 through the other opening 11hb,12hb of the first circuit board 11 or the second circuit board 12, respectively. In addition, the third pad 22g (gate pad) of each second power device 22 is disposed on the third circuit arrangement portions 113 and 123 of the first circuit board 11 or the second circuit board 12, and is electrically connected to the circuit (not shown) in the first circuit board 11.

Based on the above, as shown in fig. 5, the first pad 21s (source pad) of the first power device 21 and the second pad 22D (drain pad) of the second power device 22 in the same row in the first direction D1 are connected to the first conductive member 101 together, so that the first power device 21 and the second power device 22 are connected in series. It should be noted that the number of the power components 21,22 and the electrical connection relationship thereof can be adjusted according to actual requirements, and the utility model is not limited thereto.

Referring to fig. 4 again, in the present embodiment, a plurality of input/output pins 4 are disposed on one side of the electrical interconnection element 1, so that the power module M1 can be electrically connected to another external circuit. Further, a plurality of input/output pins 4 may be defined for receiving or outputting a plurality of different signals. In one embodiment, the input/output pins 4 may be used for transmitting a gate driving signal to control the operation of the power devices 21 and 22. Accordingly, each input/output pin 4 may be disposed on the first wiring board 11 or the second wiring board 12, and electrically connected to the third pads 21g,22g (gate pads) of the corresponding power components 21,22 through the wiring in the first wiring board 11 or the second wiring board 12.

Referring to fig. 5 and fig. 6 in combination, fig. 6 is a partially enlarged schematic view of a region VI in fig. 5. It should be noted that, in the present embodiment, there is almost no height difference between the top end surface of any one of the first pad installation regions 101a of the first conductive member 101 (or the bottom end surface of the first pad installation region 101b) and the surface of the first circuit arrangement portion 111 of the first circuit board 11 (or the first circuit arrangement portion 121 of the second circuit board 12).

As shown in fig. 6, in the preferred embodiment, the top end surface (or the bottom end surface) of any one of the first pad disposing regions 101a (101b) is coplanar with the surface height of the first line arrangement portions 111 (121). Similarly, the top end surface of the third pad placement region 103a (or the bottom end surface of the third pad placement region 103 b) does not have a height difference from the surface of the third circuit arrangement portion 111 of the first wiring board 11 (or the third circuit arrangement portion 123 of the second wiring board 12).

In addition, as shown in fig. 5, in the present embodiment, the top end surfaces of any two of the first pad disposition region 101a, the second pad disposition region 102a and the third pad disposition region 103a on one side of the conductive structure 10 are coplanar, so that the power devices 21 and 22 are disposed on the electrical interconnection element 1 by Surface Mount Technology (SMT). Similarly, the bottom end surfaces of any two of the first pad disposing region 101b, the second pad disposing region 102b and the third pad disposing region 103b on the other side of the conductive structure 10 are coplanar.

However, the present invention is not limited to the embodiment shown in FIG. 6. Fig. 7 is a partially enlarged cross-sectional view of a power module according to another embodiment of the utility model. In this embodiment, a height difference H1 may also be present between the top end surface of the first pad disposing region 101a and the top end surface of the second pad disposing region 102a, and the height difference H1 may be greater than 10 μm and between 10 μm and 200 μm. Accordingly, the length of the lead portion 211t of the conductive connection member 211 of the first power device 21 can be adjusted corresponding to the height difference H1, so that the second pad 21d located at the lead portion 211t is connected to the second pad disposing region 102 a.

In the embodiment of fig. 7, the top surface of the second pad installation region 102a protrudes from the top surface of the first pad installation region 101 a. Accordingly, the thickness of the second conductive member 102 is greater than that of the first conductive member 101. That is, the thicknesses of the first to third conductive members 101 and 103 are not necessarily all the same. In addition, in the embodiment, the bottom end surface of the second pad installation region 102b also protrudes from the bottom end surface of the first pad installation region 101b, but the utility model is not limited thereto. In another embodiment, the top surface of the second pad disposing region 102a may be convex or concave relative to the top surface of the first pad disposing region 101a, but the bottom surface of the second pad disposing region 102b is still coplanar with the bottom surface of the first pad disposing region 101b, and vice versa.

Referring to fig. 4 again, in the present embodiment, the first and second electronic component groups 2A and 2B may further include a diode element 23 (fig. 4 shows a plurality of examples), and the diode element 23 may be connected in parallel with the first power element 21 or the second power element 22. Taking the diode element 23 connected in parallel with the first power element 21 as an example, the diode element 23 and the first power element 21 are arranged in the same row in the second direction D2, and the two electrodes 23a,23b of the diode element 23 are connected to the first conductive member 101 and the second conductive member 102 through the opening 11ha, respectively.

However, in other embodiments, diode element 23 may also be omitted. In another embodiment, the first and second electronic component groups 2A,2B may further include control components, passive components, or protection components, etc. according to actual requirements. The electronic components may be disposed on the electrical interconnection element 1 together with the power components 21 and 22, and electrically connected to the plurality of power components 21 and 22 through the electrical interconnection element 1 to form a part of a normalization circuit.

It should be noted that when the electronic components of the first and second electronic component groups 2A,2B are operated, the heat generated by the electronic components can be dissipated through the conductive structure 10. That is, the conductive structure 10 not only can establish electrical connection between electronic components, but also can assist in heat dissipation.

As shown in fig. 4 and 5, a second electronic component group 2B can also be disposed on the electrical interconnection component 1 in a similar manner. Specifically, the second electronic component group 2B is located on the same side of the conductive structure 10 as the second wiring board 12, and includes one or more power components 21, 22. For convenience of illustration, in the second electronic component group 2B, the power component 21 connected to the first conductive component 101 and the second conductive component 102 is defined as a third power component, and the power component 22 connected to the first conductive component 101 and the third conductive component 103 is defined as a fourth power component.

Accordingly, the first power component 21 in the first electronic component group 2A can be connected in parallel to the third power component 21 in the second electronic component group 2B through the first conductive member 101 and the second conductive member 102. And the second power component 22 in the first electronic component group 2A can be connected in parallel to the fourth power component 22 in the second electronic component group 2B through the first conductive member 101 and the third conductive member 103. Thus, the power density of the power module M1 can be increased without increasing the area of the electrical interconnection element 1. It should be noted that the number of electronic components in the first and second electronic component groups 2A,2B is not necessarily the same.

Fig. 8 is a schematic cross-sectional view taken along line VIII-VIII in fig. 1. In the embodiment, in the first and second electronic component groups 2A,2B, the electronic components (e.g., the first and third power components 21) located on two opposite sides of the conductive structure 10 are aligned with each other, but the utility model is not limited thereto.

Referring to fig. 2, fig. 3 and fig. 5 again, the power module M1 of the first embodiment includes two heat dissipation elements 3A and 3B, and the two heat dissipation elements 3A and 3B are respectively located on two opposite sides of the conductive structure 10. Each heat sink 3A,3B is disposed on the plurality of power components 21,22 for dissipating heat generated by the plurality of power components 21,22 during operation. That is, the plurality of power elements 21,22 are disposed between the heat sink 3A,3B and the electrical interconnection component 1. In one embodiment, the heat dissipation elements 3A and 3B are, for example, Copper-clad ceramic substrates (DBC) or Direct Plated Copper ceramic substrates (DPC), but the utility model is not limited thereto.

As shown in fig. 5, the heat sink 3A,3B may include a first conductive pattern layer 31, a second conductive pattern layer 32, and an insulating heat conductor 33 between the first conductive pattern layer 31 and the second conductive pattern layer 32. The first conductive pattern layer 31 has two conductive portions (not numbered) separated from each other, one of which is directly disposed on the plurality of first power elements 21 and the other of which is directly disposed on the plurality of second power elements 22. The insulating heat conductor 33 is, for example, a ceramic plate or an insulating adhesive material having a high thermal conductivity, and the present invention is not limited thereto. The second conductive pattern layer 32 is disposed on the insulating heat conductor 33 and has a larger area than the first conductive pattern layer 31.

In addition, the encapsulation layer 5 covers the electrical interconnection element 1 and the at least one electronic component group 2A, 2B. However, the electrical interconnection element 1, the heat sinks 3A,3B and the plurality of input/output pins 4 are partially exposed outside the package layer 5. As shown in fig. 5, the second conductive pattern layer 32 of the heat dissipation members 3A,3B is exposed outside the package layer 5, so that the heat generated by the power module M1 during operation can be dissipated to the outside more effectively.

In addition, when the power module M1 is applied to another system circuit (not shown), the power elements 21 and 22 and other electronic elements in the power module M1 can be electrically connected to the system circuit by connecting the input/output pins 4 of the power module M1 and the exposed three ends 101e to 103e of the electrical interconnection element 1 to specific voltage terminals.

[ second embodiment ]

Fig. 9 is a schematic cross-sectional view of a power module according to a second embodiment of the utility model. The same elements in this embodiment as those in the embodiment of fig. 8 have the same or similar reference numerals and are not described again. In the power module M2 of the present embodiment, the electronic components (e.g., the first and third power components 21) in the first and second electronic component groups 2A,2B on two opposite sides of the conductive structure 10 are not aligned but are staggered with each other. That is, the vertical projection of any one electronic component in the first electronic component group 2A only partially overlaps the electronic components in the second electronic component group 2B. Therefore, the heat energy generated by the electronic element during operation can be prevented from being concentrated in a specific area, and the heat energy can be more easily and quickly dissipated.

[ third embodiment ]

Referring to fig. 10, fig. 10 is a cross-sectional view of a power module according to a third embodiment of the utility model. The same elements of this embodiment as those of the embodiment of fig. 9 have the same or similar reference numerals and are not described again. In the power module M3 of the present embodiment, there is only one electronic component group 2A. In the present embodiment, the surface of the conductive structure 10 on which the second wiring board 12 is disposed may be a flat surface without any recessed region.

In addition, in the present embodiment, the electronic component group 2A further includes a control component 24. The control device 24 may be disposed on the first circuit board 11 and electrically connected to the third pads 21g,22g (gate pads) of the power devices 21,22 through the first circuit board 11 to control the power devices 21, 22. In this embodiment, the plurality of input/output pins 4 may be omitted.

[ fourth embodiment ]

Fig. 11 is an exploded perspective view of a power module with an omitted package layer according to a fourth embodiment of the disclosure. The components of the power module M4 of the present embodiment that are the same as the components of the power module M1 of the first embodiment have the same or similar reference numerals, and are not repeated. In the electrical interconnection element 1' of the present embodiment, the conductive structure 10 has only the first conductive member 101 and the second conductive member 102 that are insulated from each other and disposed side by side. The first conductive member 101 and the second conductive member 102 are separated from each other to define a slot h 1.

The first wiring board 11 is disposed on one side of the conductive structure 10 with the opening 11h corresponding to the slot h1, and the second wiring board 12 is disposed on the other side of the conductive structure 10 with the opening 12h corresponding to the slot h 1. When the two electronic component groups 2A,2B are respectively disposed on two opposite sides of the electrical interconnection component 1', the plurality of power components 21 in the two electronic component groups 2A,2B can be connected in parallel to each other through the first conductive member 101 and the second conductive member 102.

[ fifth embodiment ]

Referring to fig. 12 and 13, a perspective view and a partially enlarged view of a power module according to a fifth embodiment of the utility model are respectively shown. The same or similar components of the power module M3 in this embodiment have the same reference numerals, and the description of the same parts is omitted.

In the present embodiment, the first end portion 101e of the first conductive member 101, the second end portion 102e of the second conductive member 102, and the third end portion 103e of the third conductive member 103 face the same direction. In addition, the electrical interconnection assembly 1 of the present embodiment further includes a circuit laminated plate 13 and an insulating connection portion 14. The circuit laminates 13 and the conductive structures 10 are juxtaposed to each other, and the circuit laminates 13 and the conductive structures 10 may be separated by insulating connections 14.

Referring to fig. 13, the circuit laminated board 13 of the present embodiment includes two layers of circuit boards 131 and 132 and a conductive board 130, and the conductive board 130 is located between the two layers of circuit boards 131 and 132. It should be noted that the conductive plate 130 and the conductive structure 10 of the circuit laminated plate 13 of the present embodiment can be completed in the same process, and the circuit boards 131 and 132 can be completed in the same process as the first circuit board 11 and the second circuit board 12. In one embodiment, the circuit board 131 is a part of the first circuit board 11, and the circuit board 132 is a part of the second circuit board 12. It should be noted that at least one of the circuit boards 131,132 may be a single-layer circuit board or a multi-layer circuit board, and the other may be an insulating board of a wireless circuit, a single-layer circuit board or a multi-layer circuit board. In the present embodiment, the circuit board 131 is a single-layer circuit board or a multi-layer circuit board, and has a plurality of traces (not shown) and pads (not shown) on the surface and inside thereof.

Referring to fig. 12 again, the circuit laminated board 13 includes a plurality of via holes 13h, and each via hole 13h passes through the conductive plate 130 from the circuit board 131 to the other circuit board 132. Thus, by providing pin headers (not shown) in the via holes 13h, the circuit of the wiring board 131 (or the wiring board 132) can be connected to an external circuit, or the circuits in the two-layered wiring boards 131 and 132 can be connected.

In addition, in the present embodiment, the electronic component group 2A further includes a control component 24 and at least one passive component 25 (two are shown in fig. 12 for example). The control component 24 is disposed on the circuit laminate 13, and the passive component 25 is disposed on the first wiring board 11. In detail, the control element 24 of the present embodiment is disposed on the circuit board 131, but the present invention is not limited thereto. In another embodiment, the control element 24 may be disposed on another circuit board 132. The passive element 25 is, for example, a resistor, but the utility model is not limited thereto.

It should be noted that a plurality of leads 6 are disposed on the first circuit board 11, and each lead 6 is electrically connected to the corresponding first power device 21 or the second power device 22. In addition, a part of the leads 6 is connected to the passive component 25, and another part is used to connect the first circuit board 11 and the circuit in the circuit board 131. A plurality of leads 6 may extend from the first wiring board 11 to the surface of the wiring laminate 13.

In detail, in the present embodiment, each lead 6 has an extension 6a instead of the input/output pin 4 shown in the third embodiment. In addition, the extension section 6a extends from the first wiring board 11 to the surface of the wiring laminate 13. Further, the extension 6a of each lead 6 of the present embodiment is connected to the outermost circuit board 131 through the insulating connection portion 14 to electrically connect to the control element 24.

[ sixth embodiment ]

Referring to fig. 14 and fig. 15, a perspective view and a partially enlarged view of a power module according to a sixth embodiment of the utility model are respectively shown. Elements of this embodiment that are the same as or similar to those of the embodiment of fig. 12 have the same reference numerals, and the description of the same parts is omitted. The present embodiment is different from the previous embodiment in that the laminated circuit board 13 of the present embodiment includes four layers of circuit boards 131-134.

The surface of the circuit laminated board 13 of the present embodiment has at least one contact pad 28 (fig. 14 shows a plurality of examples). The plurality of contact pads 28 may be electrically connected to the circuit within the circuit board 131. At least one contact pad 28 can be connected to the corresponding lead 6 by means of a connection carrier 29.

However, the present invention is not limited to the connection manner as long as each lead 6 can be connected to the wiring laminate 13. In another embodiment, the contact pads 28 may be replaced by conductive contact holes, and one end of the connection carrier 29 is connected to the corresponding lead 6, and the other end is inserted into the corresponding conductive contact hole, so that the lead 6 is connected to the wiring laminate 13.

[ advantageous effects of the embodiments ]

One of the advantages of the power module provided by the present invention is that the power module M1-M4 can be operated under a large voltage and a large current by the technical solutions of "a first conductive member 101 and a second conductive member 102 are arranged side by side and insulated from each other", "the circuit boards 11,12 are arranged on the conductive structure 10", and "the first pads 21s,22s and the second pads 21d,22d of the power devices 21,22 are electrically connected to the first conductive member 101 and the second conductive member 102, respectively, and the third pad 21g is arranged on the circuit boards 11, 12".

Furthermore, in the electrical interconnection assembly 1 of the embodiment of the present invention, the circuit boards 11 and 12 are combined with the conductive structure 10 to serve as a current transmission path for the plurality of electronic components in the electronic component groups 2A and 2B. The conductive structure 10 can increase the path through which current flows, allow a large current to flow, and have good heat dissipation capability. On the other hand, control elements, passive elements or protection elements may be disposed on the circuit boards 11 and 12 according to actual requirements, so that the power modules M1-M4 of the embodiment of the present invention have greater expansion (expansion) of elements and are suitable for forming various standardized circuits.

In one embodiment, by disposing the first circuit board 11 and the second circuit board 12 on two opposite sides of the conductive structure 10, the number of electronic components can be increased without increasing the area of the electrical interconnection element 1, and thus the power density (power density) of the power modules M1, M2, M4 can be increased.

In addition, a part of the encapsulation layer 5 is filled in the open slot h1 between the first conductive member 101 and the second conductive member 102 and the open slot h2 between the second conductive member 102 and the third conductive member 103, so that the components of the power modules M1 to M4 are prevented from being damaged due to arc discharge (arcing) when the power modules M1 to M4 operate at high voltage, and the voltage endurance capability of the power modules M1 to M4 is further improved.

The disclosure is only a preferred embodiment of the utility model and should not be taken as limiting the scope of the utility model, which is defined by the appended claims.

Claims (19)

1. A power module, characterized in that the power module comprises:

an electrical interconnect assembly, comprising:

the conductive structure comprises a first conductive piece, a second conductive piece and a third conductive piece which are arranged side by side and insulated from each other; and

a first circuit board partially covering the conductive structure; and

the first electronic component group comprises a first power component and a second power component, wherein the first power component is bridged between the first conductive piece and the second conductive piece and is electrically connected to the first circuit board, the second power component is bridged between the first conductive piece and the third conductive piece and is electrically connected to the first circuit board, and the second power component is connected in series with the first power component through the first conductive piece.

2. The power module of claim 1, wherein the first conductive member, the second conductive member, and the third conductive member define a component arrangement surface, and the first circuit board partially covers the component arrangement surface.

3. The power module of claim 1 wherein the electrical interconnect assembly further comprises a circuit laminate juxtaposed to the conductive structure and a plurality of leads disposed on the first circuit board and extending from the first circuit board to a surface of the circuit laminate.

4. The power module of claim 3 wherein the wiring laminate has a plurality of vias.

5. The power module of claim 3 wherein said wiring laminate includes two layers of wiring boards and a conductive plate between said two layers of wiring boards, said electronic component group further comprising: and the control element is arranged on one of the circuit boards and is electrically connected with the first power element and the second power element through a plurality of leads.

6. The power module of claim 1 wherein the electrical interconnect assembly further comprises a circuit laminate juxtaposed to the conductive structure and a plurality of leads disposed on the first circuit board, the circuit laminate having at least one contact pad on a surface thereof and being connected to the at least one contact pad and the corresponding lead by a connecting carrier.

7. The power module of claim 1, wherein the first circuit board partially covers the first conductive member and partially covers the second conductive member, the first power device has a source pad, a drain pad, and a gate pad, the source pad is electrically connected to the first conductive member, the drain pad is electrically connected to the second conductive member, and the gate pad is disposed on the first circuit board.

8. The power module of claim 1 wherein the first circuit board partially covers the third conductive member, the second power device has a source pad electrically connected to the third conductive member, a drain pad electrically connected to the first conductive member, and a gate pad disposed on the first circuit board.

9. The power module of claim 1, wherein the first group of electronic components further comprises: a diode element, wherein the diode element is disposed on the conductive structure and connected in parallel to the first power element or the second power element.

10. The power module of claim 1, wherein the electrical interconnect assembly further comprises: the second circuit board partially covers the conductive structure, and the first circuit board and the second circuit board are respectively positioned on the upper side and the lower side of the conductive structure.

11. The power module of claim 10, wherein the power module further comprises: a second electronic component group disposed on the electrical interconnection component, wherein the second electronic component group and the second circuit board are located on the same side of the conductive structure, and have a third power element and a fourth power element, the first power element is connected in parallel to the third power element through the first conductive member and the second conductive member, and the second power element is connected in parallel to the fourth power element through the first conductive member and the third conductive member.

12. The power module of claim 11 wherein the first power element and the third power element are offset from each other and the second power element and the fourth power element are offset from each other.

13. A power module, characterized in that the power module comprises:

an electrical interconnect assembly, comprising:

the conductive structure comprises a first conductive piece and a second conductive piece which are arranged side by side and insulated from each other; and

a circuit board disposed on the conductive structure, wherein the circuit board has an opening, and the opening partially corresponds to the first conductive member and partially corresponds to the second conductive member; and

and the electronic component group comprises a power element, wherein the power element is provided with a first connecting pad, a second connecting pad and a third connecting pad, the first connecting pad and the second connecting pad are respectively and electrically connected with the first conductive piece and the second conductive piece through the opening, and the third connecting pad is arranged on the circuit board.

14. The power module as claimed in claim 13, wherein the opening defines a first pad installation region in the first conductive member, a height between a surface of the circuit board and a top end surface of the first pad installation region is the same, and the first pad is connected to the first pad installation region.

15. The power module as claimed in claim 13, wherein the opening defines a first pad installation region in the first conductive member and a second pad installation region in the second conductive member, and a height difference is formed between a top end surface of the first pad installation region and a top end surface of the second pad installation region.

16. The power module of claim 13, wherein the first conductive member and the second conductive member are spaced apart from each other to define a slot, the electrical interconnection assembly further comprising: and the insulating joint material is positioned in the open groove and is connected between the first conductive piece and the second conductive piece.

17. The power module of claim 13, wherein the set of electronic components further comprises: and the diode element is arranged on the conductive structure, wherein two electrodes of the diode element are respectively and electrically connected to the first conductive piece and the second conductive piece through the openings and are connected to the power element in parallel.

18. The power module of claim 13, wherein the power module further comprises: and the heat dissipation piece is arranged on the power element.

19. The power module of claim 13, wherein the set of electronic components further comprises: and the control element is arranged on the circuit board and is electrically connected with the power element through the circuit board.

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