CN216719049U - Server cooling system - Google Patents
Server cooling system Download PDFInfo
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- CN216719049U CN216719049U CN202220044690.0U CN202220044690U CN216719049U CN 216719049 U CN216719049 U CN 216719049U CN 202220044690 U CN202220044690 U CN 202220044690U CN 216719049 U CN216719049 U CN 216719049U
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- pump
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- 238000001816 cooling Methods 0.000 title claims abstract description 99
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims description 63
- 239000012530 fluid Substances 0.000 claims 3
- 238000004134 energy conservation Methods 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 239000003507 refrigerant Substances 0.000 description 21
- 230000006835 compression Effects 0.000 description 12
- 238000007906 compression Methods 0.000 description 12
- 239000000110 cooling liquid Substances 0.000 description 8
- 238000005057 refrigeration Methods 0.000 description 7
- 239000002826 coolant Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000006467 substitution reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002528 anti-freeze Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model belongs to the technical field of server heat dissipation, and particularly provides a server heat dissipation system which comprises a first cooling loop, a second cooling loop and a third cooling loop, wherein the third cooling loop flows through a cold plate, a first heat exchanger and a second heat exchanger; the second cooling circuit is in an operating state at a first temperature, and the second cooling circuit in the operating state flows through the first heat exchanger and the second heat exchanger to exchange heat with the third cooling circuit; the first cooling circuit is in an operating state at a second temperature, and the first cooling circuit in the operating state flows through the first heat exchanger and the second heat exchanger to exchange heat with the third cooling circuit; the first cooling circuit includes a compressor. The utility model can meet the heat dissipation requirement of the server and reduce the power consumption of the fan, thereby realizing energy conservation and consumption reduction.
Description
Technical Field
The utility model belongs to the technical field of server heat dissipation, and particularly relates to a server heat dissipation system.
Background
With the increasing power of chips, the conventional air-cooling heat dissipation method is difficult to solve the heat dissipation problem of high-power and high-heat-flux chips, and the liquid-cooling heat dissipation method can solve the heat dissipation problem of high-power and high-heat-flux chips, and is more and more widely applied to cooling of high-power electronic equipment. The liquid cooling is mainly divided into single-phase liquid cooling and double-phase liquid cooling, the maturity of the single-phase liquid cooling is high, and the method is suitable for large-scale deployment; the maturity of the two-phase liquid cooling is low, and the large-scale deployment difficulty is high. The vapor compression refrigeration mode can ensure that certain cold quantity is provided under the high-temperature environment, and the temperature of the liquid cooling inlet is reduced.
The liquid cooling mode is to adopt cooling tower or radiator to cool down the coolant liquid that flows through the cold drawing under normal atmospheric temperature usually, then adopt the vapor compression refrigeration mode to cool down the coolant liquid under the high temperature environment, but this kind of cooling mode is usually because the refrigerated compressor power consumption of vapor compression is great, and the energy-conserving effect of during operation is not good under the high temperature environment.
SUMMERY OF THE UTILITY MODEL
Aiming at the technical problem of high power consumption of the conventional vapor compression refrigeration, the utility model provides a server heat dissipation system, which only uses single-phase liquid cooling at normal temperature by designing a liquid cooling system combining vapor compression, pump driving and single phase, starts a pump driving two-phase system after the ambient temperature rises, starts a vapor compression refrigeration system after the ambient temperature continues to rise, and closes the pump driving two-phase system, so that the liquid cooling system can work in a high-temperature environment, and meanwhile, the heat dissipation temperature of a radiator is increased and the power consumption of a fan is reduced when the liquid cooling system works in the high-temperature environment, thereby realizing energy conservation and consumption reduction.
The utility model provides a server cooling system, comprising:
a first cooling loop, a second cooling loop, and a third cooling loop flowing through the cold plate, the first heat exchanger, and the second heat exchanger; the second cooling circuit is in an operating state at a first temperature, and the second cooling circuit in the operating state flows through the first heat exchanger and the second heat exchanger to exchange heat with the third cooling circuit; the first cooling circuit is in an operating state at a second temperature, and the first cooling circuit in the operating state flows through the first heat exchanger and the second heat exchanger to exchange heat with the third cooling circuit; the first cooling circuit includes a compressor.
Furthermore, the first cooling loop comprises a first liquid storage tank, an expansion valve and a compressor, the first liquid storage tank is communicated with the expansion valve through a first outlet of the first three-way valve and communicated with the second heat exchanger through the expansion valve, an outlet of the second heat exchanger is communicated with the compressor through a first outlet of the second three-way valve, and the compressor is communicated with the first liquid storage tank through the first heat exchanger.
Furthermore, the second cooling loop comprises a first liquid storage tank, a second pump and a heat regenerator, the first liquid storage tank is communicated with the second pump through a second outlet of the first three-way valve, the second pump is communicated with a liquid pipeline of the heat regenerator, the liquid pipeline of the heat regenerator is communicated with the second heat exchanger, the second heat exchanger is communicated with a gas pipeline of the heat regenerator through a second outlet of the second three-way valve, and the gas pipeline of the heat regenerator is communicated with the first liquid storage tank through the first heat exchanger.
Furthermore, the third cooling loop comprises a second liquid storage tank, a first pump and a cold plate, the first liquid storage tank, the first pump and the cold plate are sequentially connected in series, and the outlet end of the cold plate of the series pipeline is communicated with the second liquid storage tank through the first heat exchanger and the second heat exchanger.
Furthermore, a first fan is arranged at the first heat exchanger, and a second fan is arranged at the second heat exchanger.
Furthermore, the first pump, the second pump, the first three-way valve, the second three-way valve, the expansion valve and the compressor are all electrically connected with a controller, the input end of the controller is connected with a temperature sensor arranged in the server case, and the controller is also electrically connected with the first fan and the second fan.
The server cooling system has the advantages that the server cooling system provided by the utility model only uses single-phase liquid cooling at normal temperature by designing a liquid cooling system combining vapor compression, pump driving and single-phase, when the ambient temperature rises, the pump driving two-phase system is started, when the ambient temperature continues to rise, the vapor compression refrigeration system is started, and the pump driving two-phase system is closed, so that the liquid cooling system can work in a high-temperature environment, and meanwhile, the cooling temperature of a radiator is increased and the power consumption of a fan is reduced when the liquid cooling system works in the high-temperature environment, thereby realizing energy conservation and consumption reduction.
In addition, the utility model has reliable design principle, simple structure and very wide application prospect.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a server heat dissipation system according to an embodiment of the present application.
Wherein, 1, a first liquid storage tank; 2. a first three-way valve; 3. an expansion valve; 4. a second three-way valve; 5. a compressor; 6. a second pump; 7. a heat regenerator; 8. a second liquid storage tank; 9. a first pump; 10. a cold plate; 11. a first heat exchanger; 12. a second heat exchanger; 13. a first fan; 14. a second fan.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1, in the present embodiment, a server heat dissipation system includes:
a first cooling loop, a second cooling loop, and a third cooling loop, the third cooling loop flowing through the cold plate 10, the first heat exchanger 11, and the second heat exchanger 12; the second cooling circuit is in operation at a first temperature, the second cooling circuit in operation flowing through the first heat exchanger 11 and the second heat exchanger 12 to exchange heat with the third cooling circuit; the first cooling circuit is in operation at a second temperature, the first cooling circuit in operation flowing through the first heat exchanger 11 and the second heat exchanger 12 to exchange heat with the third cooling circuit; the first cooling circuit comprises a compressor 5. Through designing vapor compression, pump drive the liquid cooling system of double-phase and single-phase combination, only use single-phase liquid cooling under the normal atmospheric temperature, after ambient temperature risees, open the pump and drive two-phase system, after ambient temperature continues to rise, open vapor compression refrigerating system to close the pump and drive two-phase system, make the liquid cooling system can work under high temperature environment, improve the radiating temperature of radiator simultaneously under the high temperature environment during operation, reduce the fan consumption, thereby realize energy saving and consumption reduction.
The first cooling loop comprises a first liquid storage tank 1, an expansion valve 3 and a compressor 5, the first liquid storage tank 1 is communicated with the expansion valve 3 through a first outlet of a first three-way valve 2 and is communicated with a second heat exchanger 12 through the expansion valve 3, an outlet of the second heat exchanger 12 is communicated with the compressor 5 through a first outlet of a second three-way valve 4, and the compressor 5 is communicated with the first liquid storage tank 1 through a first heat exchanger 11. The second cooling loop comprises a first liquid storage tank 1, a second pump 6 and a heat regenerator 7, the first liquid storage tank 1 is communicated with the second pump 6 through a second outlet of the first three-way valve 2, the second pump 6 is communicated with a liquid pipeline of the heat regenerator 7, the liquid pipeline of the heat regenerator 7 is communicated with a second heat exchanger 12, the second heat exchanger 12 is communicated with a gas pipeline of the heat regenerator 7 through a second outlet of the second three-way valve 4, and the gas pipeline of the heat regenerator 7 is communicated with the first liquid storage tank 1 through the first heat exchanger 11. It can be seen that the alternative operating state of the first cooling circuit and the second cooling circuit can be controlled by controlling the first three-way valve 2 and the second three-way valve 4.
The third cooling loop comprises a second liquid storage tank 8, a first pump 9 and a cold plate 10, the first liquid storage tank 1, the first pump 9 and the cold plate 10 are sequentially connected in series, and the outlet end of the cold plate 10 of the series pipeline is communicated with the second liquid storage tank 8 after passing through a first heat exchanger 11 and a second heat exchanger 12. The cold plate 10 is disposed near the high temperature server components, for example, in close proximity to the CPU.
The first heat exchanger 11 is provided with a first fan 13, and the second heat exchanger 12 is provided with a second fan 14. The heat exchanger is cooled by a fan.
In practical application, when ambient temperature is less than T1, only operate single-phase liquid cooling system, third cooling circuit promptly, coolant liquid flows in cold plate 10 from second liquid storage pot 8 under the drive of first pump 9, take away electronic equipment's heat and flow out cold plate 10 through cold plate 10, flow in first heat exchanger 11, utilize first fan to dispel the heat simultaneously, flow in second heat exchanger 12 behind the first heat exchanger 11 of outflow, utilize the second fan to dispel the heat simultaneously, flow in the liquid storage pot behind the second heat exchanger 12 of outflow, accomplish single-phase liquid cooling circulation.
When the ambient temperature is between T1 and T2, the single-phase liquid cooling system and the two-way liquid cooling system are operated simultaneously, namely the second cooling loop and the third cooling loop are operated. At the moment, the first three-way valve 2 and the second three-way valve 4 are adjusted, a branch which flows through the expansion valve 3 and the compressor 5 is closed, a branch which flows through the second pump 6 and the heat regenerator 7 is opened, the refrigerant flows through the first three-way valve 2 from the first liquid storage tank 1 and enters the heat regenerator 7 under the drive of the second pump 6, the refrigerant which enters the heat regenerator 7 is in a liquid state, the heat regenerator 7 has the function of increasing the temperature of the refrigerant which enters the second heat exchanger 12 through heat exchange to enable the temperature of the refrigerant to be closer to a boiling point, the refrigerant enters the second heat exchanger 12 to exchange heat with the cooling liquid of the third cooling loop, meanwhile, the refrigerant undergoes phase change and is changed from the liquid state to a gas-liquid coexisting state, the heat of the cooling liquid is taken away through the high vaporization latent heat of the refrigerant, the refrigerant flows out of the second heat exchanger 12 and then enters the first heat exchanger 11 through the heat regenerator 7, the refrigerant condenses and releases heat in the first heat exchanger 11, and simultaneously, the temperature of the third cooling loop, thereby improving the heat transfer coefficient of the first heat exchanger 11 to the external convection, and being beneficial to reducing the power consumption of the first fan.
When the ambient temperature exceeds T2, the single phase liquid cooling system (third cooling loop) and the vapor compression refrigeration system (first cooling loop) are operated simultaneously. At this time, the first three-way valve 2 and the second three-way valve 4 are adjusted, the branch passing through the second pump 6 and the heat regenerator 7 is closed, the branch passing through the expansion valve 3 and the compressor 5 is opened, the refrigerant circularly flows among the first heat exchanger 11, the liquid storage tank, the expansion valve 3, the second heat exchanger 12 and the compressor 5, the refrigerant evaporates and absorbs heat in the second heat exchanger 12, the temperature of the cooling liquid of the third cooling loop is reduced, the refrigerant after being compressed by the compressor 5 is condensed and releases heat in the first heat exchanger 11, and the temperature of the cooling liquid of the third cooling loop is improved, therefore, the heat transfer coefficient of the first heat exchanger 11 to the outside convection is improved, the reduction of the power consumption of the first fan is facilitated, the refrigerant flows out of the first heat exchanger 11 and then enters the first liquid storage tank 1, then enters the expansion valve 3 from the first liquid storage tank 1 for throttling, and the throttled refrigerant enters the second heat exchanger 12 to complete the circulation of the refrigerant.
The coolant used by the single-phase liquid cooling system is deionized water or antifreeze, and the refrigerant used by the two-way liquid cooling system and the vapor compression refrigeration system is the same refrigerant, and R134a can be adopted. The first heat exchanger 11 and the second heat exchanger 12 are used to ensure that the cooling liquid and the refrigerant can exchange heat, and also can radiate heat outwards, for example, fins on two sides of the heat exchanger are used to increase heat exchange area, and the two middle channels are used to be the cooling liquid and the refrigerant, and in order to ensure the heat exchange effect of the refrigerant and the cooling liquid, the refrigerant and the cooling liquid flow in opposite directions. The ambient temperature T1 should be less than T2, T1 may be set at 40 deg.C, and T2 may be set at 50 deg.C. The cold plate 10 used may be expanded to a plurality of cold plates 10 in series and parallel for large scale deployment.
The system can manually control the working state of each loop, further adopts automatic control for providing the automation degree of the heat dissipation system, and automatically controls the circuit relationship to comprise: the first pump 9, the second pump 6, the first three-way valve 2, the second three-way valve 4, the expansion valve 3 and the compressor 5 are all electrically connected with a controller, the input end of the controller is connected with a temperature sensor arranged in the server case, and the controller is also electrically connected with a first fan 13 and a second fan 14.
The controller controls the states of the first pump 9, the second pump 6, the first three-way valve 2, the second three-way valve 4, the expansion valve 3 and the compressor 5 which are electrically connected with the controller according to the temperature collected by the temperature sensor, and the control principle is the same as that of the method. Meanwhile, the rotating speeds of the first fan 13 and the second fan 14 can be controlled according to the actual temperature, so that the heat dissipation power consumption can be further reduced.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. A server heat dissipation system, comprising:
a first cooling loop, a second cooling loop, and a third cooling loop, the third cooling loop flowing through the cold plate, the first heat exchanger, and the second heat exchanger; the second cooling circuit is in an operating state at a first temperature, and the second cooling circuit in the operating state flows through the first heat exchanger and the second heat exchanger to exchange heat with the third cooling circuit; the first cooling circuit is in an operating state at a second temperature, and the first cooling circuit in the operating state flows through the first heat exchanger and the second heat exchanger to exchange heat with the third cooling circuit; the first cooling circuit includes a compressor.
2. The system of claim 1, wherein the first cooling circuit includes a first reservoir, an expansion valve, and a compressor, the first reservoir being in communication with the expansion valve via a first outlet of the first three-way valve and in communication with the second heat exchanger via the expansion valve, an outlet of the second heat exchanger being in communication with the compressor via a first outlet of the second three-way valve, and the compressor being in communication with the first reservoir via the first heat exchanger.
3. The system of claim 2, wherein the second cooling circuit comprises a first reservoir, a second pump, and a regenerator, the first reservoir being in communication with the second pump through a second outlet of the first three-way valve, the second pump being in communication with a liquid line of the regenerator, the liquid line of the regenerator being in communication with the second heat exchanger, the second heat exchanger being in communication with a gaseous line of the regenerator through a second outlet of the second three-way valve, the gaseous line of the regenerator being in communication with the first reservoir through the first heat exchanger.
4. The system of claim 3, wherein the third cooling loop comprises a second fluid reservoir, a first pump, and a cold plate, wherein the first fluid reservoir, the first pump, and the cold plate are connected in series, and wherein the cold plate outlet end of the series line is communicated with the second fluid reservoir after passing through the first heat exchanger and the second heat exchanger.
5. The system of claim 4, wherein a first fan is disposed at the first heat exchanger and a second fan is disposed at the second heat exchanger.
6. The system of claim 5, wherein the first pump, the second pump, the first three-way valve, the second three-way valve, the expansion valve, and the compressor are electrically connected to a controller, an input of the controller is connected to a temperature sensor disposed within the server chassis, and the controller is further electrically connected to the first fan and the second fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220044690.0U CN216719049U (en) | 2022-01-07 | 2022-01-07 | Server cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220044690.0U CN216719049U (en) | 2022-01-07 | 2022-01-07 | Server cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216719049U true CN216719049U (en) | 2022-06-10 |
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ID=81892056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220044690.0U Active CN216719049U (en) | 2022-01-07 | 2022-01-07 | Server cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216719049U (en) |
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2022
- 2022-01-07 CN CN202220044690.0U patent/CN216719049U/en active Active
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