CN216718758U - Optical module - Google Patents

Abstract

The application provides an optical module, including: the circuit board is provided with a through hole, the heat conducting plate is provided with a mounting surface and a heat conducting surface, the transmitter optical sub-module is mounted on the mounting surface, the transmitter optical sub-module and the heat conducting plate penetrate through the through hole and are mounted on a heat conducting platform of the upper cover together, and the upper surface of a laser of the transmitter optical sub-module and the upper surface of the circuit board are on the same horizontal plane. The application provides an optical module, through the trompil of circuit board and the installation face of heat-conducting plate, set up the laser instrument on the installation face, make laser instrument surface and circuit board surface on same horizontal plane, can guarantee the high frequency performance of laser instrument in the short within range with the gold wire bonding connection length control between laser instrument and the circuit board, and then can guarantee the high frequency performance of optical module.

Description

Optical module

Technical Field

The utility model relates to the technical field of optical communication, in particular to an optical module.

Background

The steady development of the global telecommunication industry and the steady growth of broadband users lay a solid foundation for the development of the optical communication industry. With the continuous improvement of global bandwidth demand and the expansion of data centers and application fields of security monitoring optical communication industries, optical fiber broadband access has become a mainstream communication mode. Under the promotion of popularization of terminals such as smart phones and the like and applications such as video and cloud computing and the like, telecom operators continuously invest in building and upgrading mobile broadband and optical fiber broadband networks, and the investment scale of optical communication equipment is further expanded.

The rapid development of the optical communication industry drives the updating of the optical module. Under the market competition environment where optical communication is increasingly intense at present, the demand of communication equipment for reducing the size of the equipment and increasing the interface density is also increasing. To meet this demand, optical modules are also being developed in a small package with high integration. For example, the QSFP (Small Form-factor Pluggable optical module), the QSFP +, the CFP/CFP2/CFP4, the QSFP28, the QSFP-DD and the like are all optical modules with Small-sized Pluggable high-density interfaces, at present, the QSFP28 optical module has four electric channels, the operating speed of each channel is 10Gbps or 25Gbps, 40G and 100G Ethernet application is supported, the number of the channels of a brand-new product FP-DD (Pluggable dual density) optical module is increased to 8, the operating speed of each channel is up to 25Gbps through MRZ modulation or is up to 50Gbps through PAM4 modulation, and therefore 200Gbps or 400Gbps is supported. The QSFP-DD optical module can meet or exceed the requirements of high-speed enterprise, telecommunication and data network equipment on the density of Ethernet, optical fiber channels and InfiniBand ports, thereby meeting the continuously improved requirements on 200Gbps and 400Gbps network solutions. The optical transmitter sub-module and the circuit board of the high-speed high-power optical module all need to be connected by gold wires, and the parameter characteristics of the bonding gold wires, such as the number, the length, the arch height, the span, the welding spot position and the like, can seriously affect the high-speed transmission characteristics. Especially at high speeds of 50Gbps and above, the parasitic inductance effect of the bonding gold wire is particularly obvious. The geometric parameters of the gold bonding wire influence the equivalent inductance, capacitance and resistance of the gold bonding wire, and accordingly, the interconnection characteristics are changed. And as the length of the bonding gold wire is shortened, the equivalent inductance of the bonding gold wire is reduced, and the insertion loss is also reduced. Therefore, there is a need for an optical module that can reduce the length of the bonding gold wire and control the bonding gold wire within a short range to solve the above-mentioned technical problems.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model aims to provide an optical module to solve the problem that the gold wire bonding length between a circuit board and a transmitter optical subassembly is controlled in a short range.

In order to achieve the above object, an embodiment of the present invention provides an optical module including: the circuit board, the heat conducting plate, the transmitter optical subassembly, the upper cover and the bottom shell;

the circuit board is provided with a through hole for penetrating and accommodating the heat conducting plate and the light emission secondary module;

the heat conducting plate is provided with a mounting surface and a heat conducting surface;

the transmitter optical subassembly is used for generating and outputting signal light, is arranged on the mounting surface, and is provided with a laser used for generating the signal light;

the upper cover is provided with a heat conduction table, the heat conduction surface is tightly attached to the heat conduction table, the heat conduction plate is installed on the heat conduction table, the heat conduction plate and the light emission secondary module are further installed on the heat conduction table through the through hole, the height of the heat conduction table is set to enable the surface of the installed laser and the surface of the circuit board to be on the same horizontal plane, the laser and the circuit board are connected in a gold wire bonding mode, and the arch height length of the gold wire bonding connection is enabled to be minimum;

the bottom shell and the upper cover are tightly connected by adopting screws to form an optical module cavity which is used for accommodating and fixing the circuit board, the heat-conducting plate, the optical module transmitting sub-module and the optical receiving sub-module, and is provided with a radiating surface which is tightly contacted with a radiator, so that the heat of the optical module cavity is transferred to the radiator and is radiated to the atmosphere.

In the optical module, after the tosa and the thermal conductive plate are mounted on the thermal conductive table through the through hole, the distance between the laser and the circuit board in the horizontal direction is the smallest, so that the span length of the gold wire bonding connection is the smallest.

In the optical module, the bottom case is provided with a lock surface, and after the optical module is inserted into the cage, the lock plate of the cage is blocked by the lock surface, so that the optical module is locked in the cage.

The optical module further comprises a zipper, wherein the zipper is provided with an unlocking block and a handle, and when the handle is pulled, the unlocking block jacks up the locking plate to be separated from the locking surface, so that the optical module is unlocked in the cage and pulled out of the cage.

The application provides an optical module, through the trompil of circuit board and the installation face of heat-conducting plate, set up the laser instrument on the installation face, make laser instrument surface and circuit board surface on same horizontal plane, can guarantee the high frequency performance of laser instrument in short within range with the gold wire bonding connection length control between laser instrument and the circuit board, and then can guarantee the high frequency performance of optical module.

Drawings

FIG. 1 is an exploded view of an embodiment of an optical module according to the present application;

FIG. 2 is a first schematic diagram illustrating an assembly of a circuit board, a heat conducting plate, a transmitter sub-module and a receiver sub-module according to an embodiment of an optical module of the present application;

FIG. 3 is a second schematic diagram illustrating an assembly of a circuit board, a heat conducting plate, a transmitter sub-module and a receiver sub-module according to an embodiment of an optical module of the present application;

FIG. 4 is an enlarged view of a portion of a laser chip and a circuit board of an TOSA according to an embodiment of the present invention;

FIG. 5 is an exploded view of an embodiment of a circuit board, a thermal conductive plate, a transmitter sub-module and a receiver sub-module of an optical module according to an embodiment of the present disclosure;

FIG. 6 is a third schematic diagram illustrating an assembly of the circuit board, the heat-conducting plate, the transmitter sub-assembly, and the receiver sub-assembly of an embodiment of an optical module of the present application;

FIG. 7 is an assembly diagram of an optical module according to an embodiment of the present application with an upper cover removed;

FIG. 8 is a schematic view of an optical module according to an embodiment of the present application, with a bottom shell and a zipper removed;

FIG. 9 is a schematic diagram of a circuit board of an optical module according to an embodiment of the present application;

FIG. 10 is a diagram of a first thermal plate of an embodiment of an optical module of the present application;

FIG. 11 is a second diagram of a thermal conductive plate according to an embodiment of an optical module of the present application;

FIG. 12 is a first assembly diagram of an optical module according to an embodiment of the present disclosure;

FIG. 13 is a second assembly diagram of an optical module according to an embodiment of the present application;

fig. 14 is a schematic diagram of an upper cover of an optical module embodiment according to the present application;

FIG. 15 is a bottom view of an optical module according to an embodiment of the present disclosure;

FIG. 16 is a schematic view of a cage, heat sink and latch of a mating assembly of an embodiment of a light module of the present application;

fig. 17 is a schematic diagram of a zipper of an optical module according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to 17, an embodiment of the present invention provides an optical module, including: the circuit board 110, the thermal conductive plate 120, the tosa 130, the upper cover 300 and the bottom case 200;

as shown in fig. 9, the circuit board 110 is provided with a through hole 111 for passing and accommodating the heat conductive plate 120 and the tosa 130;

as shown in fig. 10 and 11, the heat-conducting plate 120 has a mounting surface 1211 and a heat-conducting surface 1212;

as shown in fig. 2, 3 and 4, the tosa 130 is used for generating and outputting signal light, is mounted on the mounting surface 1211, and is provided with a laser 131 for generating signal light;

as shown in fig. 14, the upper cover 300 is provided with a heat conducting platform 310, the heat conducting surface 1212 is tightly adhered to the heat conducting platform 310, so that the heat conducting plate 120 is mounted on the heat conducting platform 310, and further, the heat conducting plate 120 and the tosa 130 are mounted on the heat conducting platform 310 through the through hole 111, the height of the heat conducting platform 310 is such that the surface of the mounted laser 131 and the surface of the circuit board 110 are on the same horizontal plane, the laser 131 and the circuit board 110 are bonded and connected by gold wires 132, and the arch height length of the gold wire 132 bonding and connection is minimized;

as shown in fig. 1, 12 and 13, the bottom case 200 and the top cover 200 are tightly connected by screws 910 to form an optical module cavity for accommodating the fixed circuit board 110, the thermal conductive plate 120, the optical module transmitter sub-module 130 and the optical receiver sub-module 140, and the heat dissipation surface 210 is disposed, and the heat dissipation surface 210 is tightly contacted with the heat sink 910 to transfer heat of the optical module cavity to the heat sink 910 and dissipate the heat into the atmosphere.

Continuing with fig. 3 and 4, after the tosa 130 and the thermal plate 120 are mounted on the thermal plate 310 through the through hole 111, the distance between the laser 131 and the circuit board 110 in the horizontal direction is minimized to minimize the span length of the gold wire 132 bonding connection.

As shown in fig. 13, the bottom housing 200 is provided with a locking surface 220, and after the optical module is inserted into the cage 900, the locking piece 930 of the cage 900 is locked to the locking surface 220, so that the optical module is locked in the cage 900.

As shown in fig. 17, the optical module further includes a fastener 400, the fastener 400 includes an unlocking block 410 and a handle 420, and when the handle 420 is pulled, the unlocking block 410 pushes up the locking piece 930 to separate from the locking surface 220, so that the optical module is unlocked in the cage 900 and pulled out of the cage 900.

As shown in fig. 5 and fig. 6, the optical module provided in this embodiment further includes a protective cover 135 and a protective cover 145, and after the tosa 130 and the rosa 140 are coupled on the circuit board 110, the protective cover 135 and the protective cover 145 are respectively adhered and fixed to the upper spaces of the tosa 130 and the rosa 140, so as to protect the gold wires 132 after being bonded from being damaged and also protect the tosa 130 and the rosa 140 from being damaged in the cavity of the optical module.

According to the optical module provided by the application, the laser 131 is arranged on the mounting surface 1211 through the through hole 111 of the circuit board 110 and the mounting surface 1211 of the heat conducting plate 120, so that the surface of the laser 131 and the surface of the circuit board 110 are on the same horizontal plane, the bonding connection length of the gold wire 132 between the laser 131 and the circuit board 110 can be controlled within a short range, the high-frequency performance of the laser 131 is ensured, and further the high-frequency performance of the optical module can be ensured.

The foregoing is considered as illustrative and exemplary only and is not intended to be limiting of the utility model, and it is to be understood that the terminology used is intended to be in the nature of words of description rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims (4)

1. A light module, comprising: a circuit board, a heat conducting plate, a transmitter sub-module, an upper cover and a bottom shell,

the circuit board is provided with a through hole for penetrating and accommodating the heat conducting plate and the light emission secondary module;

the heat conducting plate is provided with a mounting surface and a heat conducting surface;

the optical transmitter sub-module is used for generating and outputting signal light, is arranged on the mounting surface, and is provided with a laser for generating the signal light;

the upper cover is provided with a heat conduction table, the heat conduction surface is tightly attached to the heat conduction table, the heat conduction plate is installed on the heat conduction table, the heat conduction plate and the emission secondary module penetrate through the through hole and are installed on the heat conduction table, the height of the heat conduction table is set to enable the surface of the installed laser and the surface of the circuit board to be on the same horizontal plane, and the laser and the circuit board are connected in a gold wire bonding mode;

the bottom shell and the upper cover are tightly connected by screws to form an optical module cavity, the optical module cavity is used for accommodating and fixing the circuit board, the heat conducting plate, the optical module transmitting submodule and the optical receiving submodule, and the bottom shell and the upper cover are provided with radiating surfaces, and the radiating surfaces are tightly contacted with a radiator to transfer heat of the optical module cavity to the radiator and radiate the heat to the atmosphere.

2. An optical module as claimed in claim 1, wherein said laser is spaced a minimum distance horizontally from said circuit board after said tosa and said thermal plate are mounted on said thermal plate through said through hole to minimize the length of said gold wire bonding connection.

3. The optical module of claim 1, wherein the bottom housing is provided with a locking surface, and after the optical module is inserted into the cage, the locking plate of the cage is blocked by the locking surface, so that the optical module is locked in the cage.

4. A light module as claimed in claim 3, wherein the light module further comprises a zipper, the zipper is provided with an unlocking block and a handle, and when the handle is pulled, the unlocking block jacks up the locking plate to be separated from the locking surface, so that the light module is unlocked in the cage and pulled out of the cage.

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