CN216701665U - Non-contact heater and aerosol generating device - Google Patents

Abstract

The application relates to a non-contact heater and aerosol produce device, temperature equalizer include the lateral wall, and the gas pocket distributes on temperature equalizer, and is surrounded by the lateral wall, and the heat-generating body includes surface resistance, with the contact of outside wall. The temperature equalizer is added to balance the heat inside the heating body, so that the heat of each air hole is balanced, and the passing air flow can be uniformly heated. And the temperature equalizer can absorb, store and release heat to compensate the temperature of the air flow because of larger heat capacity, so that the temperature reduction of each sucked air flow, such as 50ml of air, is smaller and only reduced by 20-30 ℃ after passing through the non-contact heater, and the temperature equalizer can equalize the temperature and reduce the temperature reduction speed, so that the air flow for heating the aerosol substrate is only heated to 300-400 ℃, the heating power of the non-contact heater can be reduced, the energy is saved, and the use cost is reduced.

Description

Non-contact heater and aerosol generating device

Technical Field

The embodiment of the utility model relates to the technical field of aerosol generation, in particular to a non-contact heater and an aerosol generating device.

Background

Aerosol-generating devices typically comprise a heater and a power supply component for powering the heater, the heater being for heating the aerosol substrate to generate the aerosol.

The existing heater is usually a contact heater, and an aerosol substrate (such as a cigarette) is heated by central heating or circumferential heating and the like, the heating mode mainly heats the aerosol substrate by direct heat conduction, however, the contact heating mode has the defect of uneven heating, namely, the temperature of the part directly contacted with a heating element is higher, and the temperature of the part far away from the heating element is rapidly decreased, so that only the aerosol substrate close to the heating element can be baked, and the aerosol substrate cannot be completely baked, thereby causing great waste of the aerosol substrate and insufficient amount of aerosol. If the baking efficiency is improved by raising the temperature of the heating element, the aerosol substrate of the burnt fiddle near the heating element is easily caused, thereby not only affecting the taste, but also causing a large increase of harmful components.

The existing non-contact heater is usually a hollow heating wire or a hollow heating ring, when the scheme that the heating wire is used for heating air is adopted, the higher temperature of the heating wire is needed by only depending on the heating wire for heating the air, the flowing air can be heated to be more than 300 ℃ only when the temperature of the heating wire reaches more than 600 ℃, and the heating wire can be rapidly cooled once the air flow passes through, so that the temperature of the heating wire can be reduced by 200-300 ℃ through single-port suction action. Therefore, power compensation needs to be carried out on the heating wire during suction, otherwise, the effect of heating air needed by smoking cigarettes is difficult to achieve, however, when the power of the heating wire is compensated based on the size of the air flow detected by the air flow sensor, because the contact area of the heating wire and the air is small, the power compensation scheme not only needs higher power to achieve the needed heating effect, but also has the problems that the temperature of the heated gas is not accurate, the compensation response is not timely, and the temperature is not uniform all the way.

SUMMERY OF THE UTILITY MODEL

The purpose of the embodiment of the application includes providing a non-contact heater and an aerosol generating device, which can quickly heat up the air flow to a preset temperature range and can balance the heat at each part of the air flow.

The embodiment of the application provides a non-contact heater, which is used for heating air flow and comprises a heating body and a temperature equalizer connected with the heating body, wherein the heating body is configured into a surface heat source so as to form heat conduction with at least part of the surface of the temperature equalizer, a plurality of air holes penetrating through the temperature equalizer are defined in the temperature equalizer or a plurality of air holes are defined between the temperature equalizer and the heating body, the air holes are used for allowing the air flow to pass through, and the temperature equalizer is configured to absorb the heat of the heating body and release the heat to each air hole so as to heat the air flowing through each air hole.

Embodiments of the present application provide an aerosol generating device comprising an aerosol substrate volume for holding an aerosol substrate and the non-contact heater located upstream of the aerosol substrate volume for heating an air stream supplied into the aerosol substrate volume.

The non-contact heater and the aerosol generating device are additionally provided with the temperature equalizer to balance the heat inside the heating element, so that the heat of each air hole is balanced, the passing air flow can be uniformly heated, the heat exchange area of the air flow can be increased by increasing the number of the air holes, and the efficiency of heating the air flow to a preset temperature range (such as 300-400 ℃) can be improved. And the temperature equalizer can absorb, store and release heat to compensate the temperature of the air flow because of larger heat capacity, so that the temperature reduction of each sucked air flow, such as 50ml of air, is smaller and only reduced by 20-30 ℃ after passing through the non-contact heater, and the temperature equalizer can equalize the temperature and reduce the temperature reduction speed, so that the air flow for heating the aerosol substrate is only heated to 300-400 ℃, the heating power of the non-contact heater can be reduced, the energy is saved, and the use cost is reduced.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

FIG. 1 is a cross-sectional view of a non-contact heater according to an embodiment of the present application;

FIG. 2 is a top view of a non-contact heater provided by an embodiment of the present application;

FIG. 3 is a top view of a non-contact heater according to yet another embodiment of the present application;

FIG. 4 is another top view of a non-contact heater provided in accordance with another embodiment of the present application;

FIG. 5 is a cross-sectional view of a non-contact heater according to another embodiment of the present application;

FIG. 6 is a schematic diagram of an area resistor according to an embodiment of the present application;

FIG. 7 is a schematic diagram of an area resistor in another embodiment of the present application;

FIG. 8 is a schematic diagram of a temperature equalizer in an embodiment of the present application;

FIG. 9 is a schematic diagram of a temperature equalizer in another embodiment of the present application;

FIG. 10 is a schematic diagram of a temperature equalizer in a further embodiment of the present application;

FIG. 11 is a schematic view of a non-contact heater according to yet another embodiment of the present application;

FIG. 12 is a schematic view of a non-contact heater according to yet another embodiment of the present application;

in the figure:

1. a heating element; 11. an inductor; 111. a barrel; 112. a common wall; 12. a thin film heating element; 13. an electrode; 131. a pin;

2. a temperature equalizer;

3. and (4) air holes.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.

An embodiment of the present application provides a non-contact heater, which generates a high temperature airflow capable of heating and volatilizing an aerosol substrate by heating the airflow, and then heats the aerosol substrate by flowing the airflow into the aerosol substrate, so as to heat the aerosol substrate uniformly, increase the amount of aerosol formed by volatilizing the aerosol substrate under the baking of the high temperature airflow, reduce the waste of the aerosol substrate, and reduce harmful substances in the aerosol substrate.

Referring to fig. 1 and 5, the non-contact heater includes a heating element 1, a temperature equalizer 2, and a plurality of air holes 3.

The heating body is used for generating heat, and the heat can change the airflow into high-temperature airflow in a preset temperature range. The temperature equalizer can absorb heat, store heat and release heat, thereby being capable of enabling each air hole to be in an environment with approximately the same temperature through heat transfer, enabling the heat of each air flow leaving from each air hole to be even, and meanwhile, when the heating body stops heating or the flow or flow rate of the air flow is increased suddenly, the temperature equalizer can compensate the heat, and the inner temperature and the outer temperature of the temperature equalizer are prevented from being reduced too fast. The temperature equalizer is contacted with the heating body, so that the heat absorbed, stored and released by the temperature equalizer comes from the heat emitted by the heating body.

In some embodiments, the temperature equalizer may be ceramic, further, the ceramic may be honeycomb ceramic, and referring to fig. 8 to 10, the honeycomb ceramic has a porous structure, i.e., a large number of air holes 3 are distributed, so as to provide a larger heat exchange surface area, so that the non-contact heater has a high efficiency of heating air, and at the same time, the honeycomb ceramic of the porous structure is closer to a solid structure, has a higher heat storage capacity than a ceramic pipe with the same volume, and in addition, the alumina material has a thermal conductivity greater than 30W/MK, so as to enable the heat to be conducted more rapidly and uniformly, and has a high thermal conductivity, so that the honeycomb ceramic of the porous structure can meet the requirement of rapidly heating air to a preset temperature.

In some embodiments, the temperature equalizer may be made of alumina ceramic, aluminum nitride ceramic, silicon carbide ceramic, beryllium oxide ceramic, or zirconia ceramic, among others. The air holes in the honeycomb ceramic may be circular holes, elliptical holes and polygonal holes, and referring to fig. 8 to 10, the polygonal holes include triangular holes, square holes, hexagonal holes, and the like.

In some embodiments, the heating element 1 is configured as a surface heat source, and is in surface contact with at least part of the surface of the temperature equalizer 2 to increase the heat exchange area between the heating element 1 and the temperature equalizer 2, reduce the thermal resistance between the heating element 1 and the temperature equalizer 2, and further improve the heat transfer efficiency between the heating element 1 and the temperature equalizer 2, so as to ensure that the temperature equalizer 2 can rapidly heat up, store heat and release heat.

In some embodiments, reference may be made to fig. 1-4, the heat generating body includes an inductor 11 that can generate heat in an alternating magnetic field.

The inductor may be a magnetic body, and when an alternating magnetic field is applied to the magnetic body, energy loss due to eddy current loss (eddy current loss) and hysteresis loss (hysteresis loss) occurs in the magnetic body, and the lost energy is released from the magnetic body as heat energy. The larger the amplitude or frequency of the alternating magnetic field applied to the magnetic body, the more thermal energy can be released from the magnetic body.

In some embodiments, the susceptors may comprise metals or carbon. The inductor may include at least one of ferrite (ferrite), ferromagnetic alloy (ferromagnetic alloy), stainless steel (stainless steel), and aluminum (Al). In addition, the inductor may further include at least one of a ceramic such as graphite (graphite), molybdenum (molybdenum), silicon carbide (silicon carbide), niobium (niobium), nickel alloy (nickel alloy), metal film (metal film), zirconium dioxide (zirconia), a transition metal such as nickel (Ni) or cobalt (Co), and a metalloid such as boron (B) or phosphorus (P).

Referring to fig. 1-4, temperature equalizer 2 is coupled to sensing body 11 such that temperature equalizer 2 can exchange heat with sensing body 11.

In some embodiments, the sensing body 11 forms a cylinder 111 surrounding the temperature equalizer 2, and referring to fig. 1 and 2, the sensing body 11 may have a cylindrical structure or a ring structure having one cylinder 111, and the cylinder 111 is hollow and has open upper and lower ends. Under the alternating magnetic field, eddy current is generated on at least part of the wall of the cylinder 111, thereby generating heat. If the temperature equalizer 2 is not present in the cylinder 111, a temperature gradient will be formed from the cylinder wall to the cylinder center of the cylinder 111, which may result in uneven heat distribution in the inductor 11 and uneven heating of the air flow heated by the inductor 11.

In order to overcome the above problems, reference may be made to fig. 1 and 2, a temperature equalizer 2 is disposed in the inductor 11, the temperature equalizer 2 is located inside the inductor 11 and can contact with an inner wall of the inductor 11 to perform heat exchange with the inductor 11 with higher efficiency, the temperature equalizer 2 has a thermal conductivity greater than air, can rapidly absorb heat of the inductor 11, and the heat can be rapidly equalized on the temperature equalizer 2, so as to reduce a temperature gradient from a cylinder wall of the cylinder 111 to a cylinder core, so that heat in the inductor 11 is uniformly distributed, and temperature in the air holes 2 is equalized.

In some embodiments, referring to fig. 3 and 4, the inductor 11 is a cylindrical structure or a ring structure including at least two cylinders 111, and the two adjacent cylinders 111 have a common wall 112 in common, and since the heat capacity of the material of which the inductor is made is smaller than that of the material of which the temperature equalizer is made, the inductor has a faster temperature rise rate and a higher heat generation rate than the temperature equalizer, and the common wall 112 can also generate heat under the alternating magnetic field, or the common wall 112 can be heated up rapidly by heat transfer by being connected with the heatable wall located at the periphery of the cylinders 11. The common wall 112 divides the inner space of the inductor 11 into at least two parts, so that at least two cylinders 111 can be formed in the inductor 11, and the common wall 112 enables the inner part of the inductor 11 to be heated rapidly, so that the temperature gradient from the outer side wall of the inductor 11 to the center can be reduced, and as the inductor 11 is divided into a plurality of cylinders 111 with smaller volume by the common walls 112, the distance from the cylinder wall of each cylinder 111 to the center of the cylinder can be reduced, so that the temperature gradient from the cylinder wall of each cylinder 111 to the center of the cylinder 111 can be reduced.

The cylinder 111 may extend along the direction of the gas flow, and the cylinder 111 may have a straight structure, a bent structure, or an inclined structure.

In some embodiments, referring to fig. 1 to 4, each cylinder 111 of the inductor 11 may be provided with a temperature equalizer 2 therein, and may be in surface contact with each other, so as to increase the total heat exchange area between the temperature equalizer 2 and the inductor 11, thereby increasing the heat exchange efficiency and the heat soaking efficiency. At this time, at least a part of the air hole 3 may be located on the temperature equalizer 2, such as setting the temperature equalizer 2 as honeycomb ceramics; at least a part of the air hole 3 may also be located in a gap between the sensor body 11 and the temperature equalizer 2, such as the temperature equalizer 2 is in contact with the corresponding cylinder 111, and the outer side wall of the temperature equalizer 2 or the inner side wall of the cylinder 11 may be configured as a wave surface, a thread surface, or a staggered point front surface.

In some embodiments, referring to fig. 4, the inductor 11 is provided as a honeycomb structure having a plurality of cylinders 111. The temperature equalizer 2 may be disposed in the partial cylinder 11, and the temperature equalizer 2 may not be disposed in the partial cylinder 11, so that the cylinder 11 in which the temperature equalizer 2 is not disposed may belong to the air vent 3, allowing the air flow to pass through. Optionally, each temperature equalizer 2 has at least one air hole 3, the aperture of the air hole 3 on the temperature equalizer 2 may be the same as the diameter of the cylinder 11 as the air hole 3, and the temperature equalizers 2 are uniformly distributed in the inductor 11 to balance the temperature at various positions inside the inductor 11 as much as possible.

In some embodiments, referring to fig. 1, the temperature equalizer 2 is in surface contact with the corresponding cylinder 11, and an outer side wall of the temperature equalizer 2 is attached to an inner wall of the corresponding cylinder 11 to increase a heat exchange area.

In some embodiments, the thermal capacity of temperature equalizer 2 is greater than the thermal capacity of inductor 11, so that after each aspiration flow, e.g., 50ml of air, passes over the non-contact heater, the non-contact heater temperature decreases less, only 20-30 ℃, or even less, with the thermal capacity of temperature equalizer 2.

In some embodiments, as shown in FIG. 11, the heat-generating body 1 has a plurality, each heat-generating body 1 constitutes a sheet-like or plate-like surface heat source, and each temperature equalizer 2 is positioned between two heat-generating bodies 1 constituting a sandwich structure. The extending direction of the plurality of heat-generating bodies 1 and the temperature equalizer 2 may be coincident with the traveling direction of the air, that is, the plurality of heat-generating bodies 1 and the temperature equalizer 2 are stacked in the lateral direction to form one or more sandwich structures, and the air hole 3 may be provided in the heat-generating body 1 or in the temperature equalizer 2 or defined between the heat-generating body 1 and the temperature equalizer 2. In other embodiments, as shown in fig. 12, the extending direction of the plurality of heat-generating bodies 1 and the temperature equalizer 2 may be perpendicular to the traveling direction of the air, that is, a plurality of heating elements 1 and temperature equalizers 2 are stacked in the longitudinal direction to form one or more sandwich structures, and the heating elements 1 and the temperature equalizers 2 are provided with ducts, and the pore canals on the heating element 1 and the temperature equalizer 2 are just communicated or are communicated in a staggered way to form an air hole 3 for air to pass through, the pore canals on the heating element 1 and the temperature equalizer 2 can have the same aperture and also can have different apertures, can have the same hole shape or different hole shapes, can have the same pore channel distribution density or different pore channel distribution densities, and when air passes through, the heating body 1 and the temperature equalizer 2 are required to be penetrated one by one, so that the heating body is heated and the temperature is increased to form hot air which meets the preset requirement.

In some embodiments, referring to fig. 5 to 7, the heating element 1 includes a thin film heating element 12, and correspondingly, the temperature equalizer 2 may be made of honeycomb ceramics, and the thin film heating element 12 covers the outer sidewall of the temperature equalizer 2 and is attached to the outer sidewall of the temperature equalizer 2, so as to realize surface contact, thereby increasing the heat exchange area and reducing the thermal resistance in the heat transfer process.

Optionally, referring to fig. 5 to 7, the thin film heating element 12 is a resistive film, the resistive film may be at least disposed on the outer sidewall of the temperature equalizer 2 through a thick film printing process, a physical vapor deposition process, a chemical vapor deposition process, a spraying process, or the like, and in another embodiment, the resistive film may also be disposed on the upper surface, the lower surface, or the like of the temperature equalizer.

Further, referring to fig. 5 to 7, the heating element 1 further includes an electrode 13, the electrode 13 is electrically connected to the surface resistor 12, the electrode 13 may be disposed on the outer side wall of the temperature equalizer 2 through a thick film printing process, a physical vapor deposition process, a chemical vapor deposition process, a spraying process, or the like, and then may be formed into a resistive film through the thick film printing process, the physical vapor deposition process, the chemical vapor deposition process, the spraying process, or the like, the resistive film is disposed at least on the outer side wall of the temperature equalizer 2, a part of the electrode 13 overlaps the resistive film, and a part of the electrode 13 is exposed outside the resistive film to form a pin 131 of the electrode 13 for electrically connecting to other conductors. The two electrodes 13 are a positive electrode and a negative electrode, and the pins 131 of the positive electrode and the negative electrode may be located on the same side of the thin film heating element 12 as shown in fig. 6 or on opposite sides of the resistive film as shown in fig. 7.

In some embodiments, the heat-generating body 1 is a resistance heat-generating body capable of ventilation so that an air flow can pass through the heat-generating body 1, for example, the heat-generating body 1 comprises a ventilation heat-generating film having a large number of ventilation micropores; if the heating body 1 is a net-shaped resistor, the meshes of the heating body are permeable; for another example, the heating element 1 includes a planar spiral resistor, and a gap through which an air flow passes is provided between two adjacent spirals. The temperature equalizer 2 is provided with a plurality of air holes 3 allowing air flow to pass through, and the heating body 1 and the temperature equalizer 2 can be stacked in a staggered way along the air flow advancing direction, so that the air flow needs to pass through the heating body 1 and the temperature equalizer 2 layer by layer before heating the aerosol substrate. The heating body 1 and the temperature equalizer 2 may be stacked alternately in the traveling direction of the air flow, so that the heating body 1 heats the temperature equalizer 2 from above or below the temperature equalizer 2 or from both of them at the same time, and then equalizes the temperature of the air hole in the temperature equalizer 2 by absorbing, storing, releasing heat, etc. the temperature of the temperature equalizer 2.

An embodiment of the present application provides an aerosol generating device comprising an aerosol substrate volume for holding an aerosol substrate and said non-contact heater, the aerosol substrate volume being located downstream of the non-contact heater such that air heated by the non-contact heater enters the aerosol substrate volume and flows uniformly into the aerosol substrate volume to toast and heat the aerosol substrate (e.g. a cigarette). In some embodiments, the aerosol substrate volume is spaced from the non-contact heater so that there is a compartment between the aerosol substrate volume and the non-contact heater where, on the one hand, the air flow can be suitably cooled to avoid excessive temperatures burning the bottom of the aerosol substrate and, on the other hand, the compartment is used to mix the air flows from the vents so that the air flow is re-equilibrated before entering the aerosol substrate to avoid uneven baking of the aerosol substrate due to uneven air flow temperature distribution.

Optionally, the aerosol generating device may further comprise a coil for generating an alternating magnetic field, and the coil may be disposed at the periphery of the susceptor.

The non-contact heater and the aerosol generating device increase the temperature equalizer to equalize the heat inside the heating element, so that the heat of each air hole is balanced, the passing air flow can be uniformly heated, the heat exchange area of the air flow can be increased by increasing the number of the air holes, and the efficiency of heating the air flow to a preset temperature range (such as 300-400 ℃) can be improved.

According to the non-contact heater and the aerosol generating device, the temperature equalizer has larger heat capacity, and can absorb, store and release heat to compensate the temperature of the air flow, so that after the air flow sucked by each port, for example 50ml of air, passes through the non-contact heater, the temperature is reduced by less and only 20-30 ℃, and the temperature reduction speed can be reduced because the temperature equalizer can equalize the temperature, so that the air flow for heating the aerosol substrate is only required to be heated to 400 ℃ of 300-.

It should be noted that the preferred embodiments of the present application are shown in the specification and the drawings, but the present application is not limited to the embodiments described in the specification, and further, it will be apparent to those skilled in the art that modifications and variations can be made in the above description, and all such modifications and variations should be within the scope of the appended claims of the present application.

Claims (13)

1. A non-contact heater for heating an air flow, comprising a heat-generating body configured as a surface heat source so as to be thermally conductive with at least a part of a surface of a temperature equalizer, and a temperature equalizer connected to the heat-generating body, the temperature equalizer having a plurality of air holes defined therethrough or defined therebetween for the air flow therethrough, the temperature equalizer being configured to absorb heat of the heat-generating body and release the heat into each of the air holes to heat the air flowing through each of the air holes.

2. The non-contact heater according to claim 1, wherein the heat generating body is configured to surround at least a part of a surface of the temperature equalizer.

3. The non-contact heater of claim 1 wherein said heat generating body comprises an inductor capable of inducing heat generation in a changing magnetic field.

4. A non-contact heater according to claim 3 wherein said susceptor forms a cylinder surrounding said temperature equalizer.

5. The non-contact heater according to claim 1, wherein an extending direction of the air hole is substantially coincident with an extending direction of the heat generating body.

6. The non-contact heater of claim 3 wherein the thermal capacity of the temperature equalizer material is greater than the thermal capacity of the inductor material.

7. The non-contact heater according to claim 1, wherein the temperature equalizer comprises a honeycomb ceramic, the plurality of gas holes defined by the honeycomb ceramic.

8. The non-contact heater according to claim 1, wherein said heat-generating bodies constitute a sheet-like or plate-like surface heat source, and said temperature equalizer is positioned between two of said heat-generating bodies.

9. The non-contact heater according to claim 1, wherein said heat generating body comprises a thin film heat generating body in contact with at least a part of a surface of said temperature equalizer.

10. The non-contact heater according to claim 9, wherein said thin film heat-generating body is formed on at least a part of a surface of said temperature equalizer by a thick film printing process, a physical vapor deposition process, a chemical vapor deposition process, or a spray process.

11. The non-contact heater according to claim 1, wherein the heat-generating body and the temperature equalizer are arranged in a stack in an air flow traveling direction.

12. The non-contact heater according to claim 11, wherein said heating element comprises a planar spiral resistor or a mesh resistor.

13. An aerosol generating device comprising an aerosol substrate volume for receiving an aerosol substrate and a non-contact heater as claimed in any of claims 1 to 12 located upstream of the aerosol substrate volume for heating an air stream supplied into the aerosol substrate volume.

Images