CN216673212U - Loudspeaker control circuit and loudspeaker - Google Patents

Loudspeaker control circuit and loudspeaker Download PDF

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CN216673212U
CN216673212U CN202122912109.0U CN202122912109U CN216673212U CN 216673212 U CN216673212 U CN 216673212U CN 202122912109 U CN202122912109 U CN 202122912109U CN 216673212 U CN216673212 U CN 216673212U
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output end
band
module
filtering unit
resistor
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沈庆
毛昊桢
李清
樊光利
李孔娟
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iFlytek Co Ltd
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iFlytek Co Ltd
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Abstract

The utility model provides a loudspeaker control circuit and a loudspeaker, comprising: the baseband chip is used for generating a first audio signal; the audio power amplification module is connected with the baseband chip and used for processing the first audio signal and outputting a differential signal; the band elimination filtering module is connected with the audio power amplification module and used for processing the differential signal so as to filter vibration inductance in the differential signal and output a second audio signal; the quality factor of the band elimination filter module is larger than a preset value. The utility model utilizes the band-stop filtering module to replace a high-pass filtering module, and aims to compensate the frequency near the resonant frequency point of the motor in the existing scheme, thereby releasing partial low frequency and achieving the purpose of better low-frequency performance.

Description

Loudspeaker control circuit and loudspeaker
Technical Field
The utility model relates to the technical field of acoustic devices, in particular to a loudspeaker control circuit and a loudspeaker.
Background
Common consumer electronics generally have a plurality of acoustic devices such as a receiver, a loudspeaker, a motor and the like, and the single devices are stacked, so that the space and the cost are greatly poor; the three-in-one loudspeaker is equivalent to a combination body of a loudspeaker, a receiver and a motor, and is greatly improved in cost and space. When a voice and audio/video application scene is carried out, two paths of signals are output from the interior of the mobile phone baseband chip, wherein one path of signals is a voice signal and a music signal and is used for realizing voice communication and audio playing; and the other path is a motor vibration signal for realizing motor vibration. The voice signal, the motor vibration signal and the music signal are all output from the audio signals (SPKN and SPKP), and different signals cannot be processed respectively, so that the voice call and the music playing effect are poor, and the problem of vibration in the call or the music playing is obvious.
In the prior art, in the scenes such as audio playing and voice communication which do not need vibration, a high-pass filter is opened to filter low-frequency components, so that the aim of filtering the vibration sense of a motor is fulfilled. In a calling ringtone scene needing to play while vibrating, a high-pass filter and a band-pass filter are turned on at the same time, and music and motor vibration signals are output. At the moment, the incoming call ringtone of people has both horn sound and vibration. And under the scene of only needing vibration, the size of the motor signal is controlled through the band-pass filter, and only the motor vibration signal is output.
In the prior art, only vibration sensation filtering is concerned under a scene without vibration, the motor vibration sensation is filtered by a high-pass filter with high cut-off frequency, and the subjective perception loss of a user is large no matter the low-frequency effect of conversation or music playing is achieved.
SUMMERY OF THE UTILITY MODEL
The utility model provides a loudspeaker control circuit and a loudspeaker, wherein the circuit can improve the effects of communication and music playing.
In order to solve the above technical problems, a first technical solution provided by the present invention is: provided is a horn control circuit including: a baseband chip for generating a first audio signal; the audio power amplifier module is connected with the baseband chip and used for processing the first audio signal and outputting a differential signal; the band elimination filtering module is connected with the audio power amplification module and used for processing the differential signal so as to filter vibration inductance in the differential signal and output a second audio signal; the quality factor of the band elimination filter module is larger than a preset value.
Wherein, loudspeaker control circuit still includes: and the earphone access module is connected with the baseband chip and the output end of the band elimination filter module, receives the first audio signal, processes the first audio signal and outputs a third audio signal.
Wherein, audio power amplifier module includes: the power amplifier chip comprises a signal input end, an enabling control end, a power supply end, a first output end and a second output end; the signal input end of the power amplifier chip is connected with the baseband chip and receives a first audio signal; the enabling control end is connected with the baseband chip, receives an enabling signal and is in a first state based on the enabling signal; the power supply end is connected with a power supply and receives a voltage power supply signal; the first output end of the power amplifier chip and the second output end of the power amplifier chip are connected with the band elimination filtering module.
Wherein, the band elimination filtering module includes: the first band-stop filtering unit is connected with the first output end, receives the first differential signal, and processes the first differential signal to output a second audio signal; and the second band elimination filtering unit is connected with the second output end, receives the second differential signal and processes the second differential signal so as to output a second audio signal.
Wherein, still include: and the switch switching module is connected between the audio power amplifier module and the band elimination filtering module, and controls a path between the audio power amplifier module and the first band elimination filtering unit or controls a path between the audio power amplifier module and the second band elimination filtering unit.
Wherein, the switch switching module includes: the first switch switching unit is connected between the audio power amplifier module and the first band-resistance filtering unit, and responds to the conduction of a channel between the audio power amplifier module and the first band-resistance filtering unit, so that the first band-resistance filtering unit receives a first differential signal; and the second switch switching unit is connected between the audio power amplifier module and the second band elimination filtering unit, and responds to the conduction of a channel between the audio power amplifier module and the second band elimination filtering unit, so that the second band elimination filtering unit receives a second differential signal.
The first switch switching unit comprises a first switching chip, and the first switching chip comprises a first input end, a first output end and a second output end; the first band-resistance filtering unit comprises an input end and an output end; the first input end of the first switching chip is connected with the first output end of the audio power amplifier module, the first output end of the first switching chip is connected with the output end of the first band-resistance filtering unit, and the second output end of the first switching chip is connected with the input end of the first band-resistance filtering unit; the second switch switching unit comprises a second switching signal, and the second switching chip comprises a first input end, a first output end and a second output end; the second band-elimination filtering unit comprises an input end and an output end; the first input end of the second switching chip is connected with the second output end of the audio power amplifier module, the first output end of the second switching chip is connected with the input end of the second band-stop filtering unit, and the second output end of the second switching chip is connected with the output end of the second band-stop filtering unit.
Wherein, the first band-stop filtering unit comprises: the first low-pass filtering unit is connected with the second output end of the first switch switching unit and the first output end of the first switch switching unit; the first high-pass filtering unit is connected with the second output end of the first switch switching unit and the first output end of the first switch switching unit; the second band elimination filter unit includes: the second low-pass filtering unit is connected with the second output end of the second switch switching unit and the first output end of the second switch switching unit; and the second high-pass filtering unit is connected with the second output end of the second switch switching unit and the first output end of the second switch switching unit.
Wherein the first low-pass filtering unit includes: the first end of the first resistor is connected with the second output end of the first switch switching unit; the first end of the second resistor is connected with the second end of the first resistor, and the second end of the second resistor is connected with the first output end of the first switch switching unit; the first end of the first capacitor is connected with the second end of the first resistor, and the second end of the first capacitor is grounded; the first end of the second capacitor is connected with the first end of the first capacitor, and the second end of the second capacitor is grounded; the first high-pass filtering unit includes: a first end of the third capacitor is connected with the second output end of the first switch switching unit; a first end of the fourth capacitor is connected with a second end of the third capacitor, and a second end of the fourth capacitor is connected with the first output end of the first switch switching unit; a first end of the third resistor is connected with a second end of the third capacitor, and a second end of the third resistor is grounded; and the first end of the fourth resistor is connected with the first end of the third resistor, and the second end of the fourth resistor is grounded.
The second low-pass filtering unit is the same as the first low-pass filtering unit, and the second high-pass filtering unit is the same as the first high-pass filtering unit.
Wherein, the earphone pathway module includes: the first earphone module is connected with the baseband chip and the output end of the second band elimination filtering unit and used for receiving a first audio signal and outputting a third audio signal, and the first audio signal is a first type differential signal; the second earphone module is connected with the baseband chip and the output end of the first band-resistance filtering unit and used for receiving the first audio signal and outputting a third audio signal, and the first audio signal is a second type differential signal; and the bias voltage providing module is connected with the first earphone module and the second earphone module and connected with the baseband chip to receive the bias voltage.
Wherein, first earphone module includes: a second end of the fifth resistor is connected with the output end of the second band elimination filter unit; a first end of the fifth capacitor is connected with the baseband chip, and a second end of the fifth capacitor is connected with a first end of the fifth resistor; the second earpiece module includes: the second end of the seventh resistor is connected with the output end of the first band-resistance filtering unit; a first end of the sixth capacitor is connected with the baseband chip, and a second end of the sixth capacitor is connected with a first end of the seventh resistor; the bias voltage providing module includes: a first end of the sixth resistor is connected with a second end of the fifth resistor, and a second end of the sixth resistor is connected with the baseband chip and receives the bias voltage; and a first end of the eighth resistor is connected with a first end of the seventh resistor, and a second end of the eighth resistor is connected with the baseband chip and receives the bias voltage.
In order to solve the above technical problems, a first technical solution provided by the present invention is: there is provided a horn comprising the horn control circuit of any one of.
The utility model has the beneficial effects that the band-stop filtering module is used for replacing the high-pass filtering module, so that the frequency near the resonant frequency point of the motor in the existing scheme is compensated, partial low frequency is released, and better low-frequency performance is obtained.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural diagram of a first embodiment of a horn control circuit according to the present invention;
FIG. 2 is a schematic structural diagram of a second embodiment of a speaker control circuit according to the present invention;
FIG. 3 is a schematic structural diagram of a speaker control circuit according to a third embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an audio power amplifier module according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a fourth embodiment of a speaker control circuit according to the present invention;
FIG. 6 is a schematic structural diagram of a switch module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a first band-stop filtering module according to an embodiment of the utility model;
FIG. 8 is a schematic structural diagram of a second band-stop filtering module according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of an embodiment of an earpiece path module according to the present invention;
fig. 10 is a schematic structural diagram of a horn according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, a functional module diagram of a horn control circuit according to a first embodiment of the present invention specifically includes: the device comprises a baseband chip 1, an audio power amplifier module 2 and a band elimination filter module 3; the baseband chip 1 is used for generating a first audio signal, and the audio power amplifier module 2 is connected to the baseband chip 1 and used for processing the first audio signal and outputting a differential signal. The band elimination filter module 3 is connected with the audio power amplifier module 2 and used for processing the differential signal so as to filter vibration inductance in the differential signal and output a second audio signal. In this embodiment, the quality factor of the band-stop filtering module is greater than a preset value.
In the prior art, in scenes such as audio playing and voice communication which do not need to be vibrated, a high-pass filter is used for filtering a low-frequency part, so that the aim of filtering the vibration sense of a motor is fulfilled; in a scene of the incoming call ringtone needing to be played while vibrating, music and motor vibration signals are output by utilizing a high-pass filter and a band-pass filter, so that the incoming call ringtone has both horn sound and vibration sound. However, in the prior art, only vibration sensation filtering is focused, the motor vibration sensation is filtered by a high-pass filter with a high cut-off frequency, and the subjective perception loss of a user is large no matter the low-frequency effect of conversation or music playing is achieved. This application utilizes band elimination filter module to replace high pass filter module, and the purpose lies in compensating near motor resonance frequency point frequency among the current scheme to release partial low frequency, obtain the purpose of better low frequency performance.
Referring to fig. 2, a functional block diagram of a speaker control circuit according to a second embodiment of the present invention is shown, which is different from the first embodiment shown in fig. 1 in that the present embodiment further includes: the earphone access module 4 is connected with the baseband chip 1 and the output end of the band elimination filter module 3, receives the first audio signal, processes the first audio signal and outputs a third audio signal.
Specifically, in the prior art, the earphone call scenario is not considered separately, and the earphone call scenario still passes through the power amplifier, because the radio frequency power supply pin and the audio power amplifier power supply pin are both battery powered, and are affected by the TDMA (Time Division multiple access) of the radio frequency GSM (global system for mobile communications), more TDD (Time Division Distortion) Noise (Noise) can be brought. Therefore, the problems of interference sound and large bottom noise of the telephone receiver are caused, and the hearing is seriously influenced. The utility model provides a loudspeaker control circuit sets up earphone route module 4, and earphone route module 4 does not pass through audio power amplifier module 2, can reduce radio frequency interference, noise reduction.
Referring to fig. 3, in the present application, the band-stop filtering module 3 includes: a first band-stop filtering unit 31 and a second band-stop filtering unit 32; the first band-stop filtering unit 31 and the second band-stop filtering unit 32 are connected with the audio power amplifier module 2. Referring to fig. 4, which is a schematic structural diagram of an audio power amplifier module according to an embodiment of the present invention, the audio power amplifier module 2 includes a power amplifier chip U1, and the power amplifier chip U1 includes: the circuit comprises a signal input end INN, an enable control end SD, a power supply end VDD, a first output end VOUT1 and a second output end VOUT 2. A signal input end INN of the power amplifier chip U1 is connected with the baseband chip 1 and receives a first audio signal MP3_ OUTR; the enabling control end SD is connected with the baseband chip 1, receives an enabling signal AUDIO _ PA _ SDN and is in a first state based on the enabling signal AUDIO _ PA _ SDN; the power supply end VDD is connected with a power supply and receives a voltage power supply signal VBAT _ SPK; the first output end VOUT1 of the power amplifier chip U1 and the second output end VOUT2 of the power amplifier chip U1 are connected with the band elimination filter module 3. Specifically, a first output terminal VOUT1 of the power amplifier chip U1 is connected to the first band-elimination filtering unit 31, and a second output terminal VOUT2 of the power amplifier chip U1 is connected to the second band-elimination filtering unit 32. Specifically, the first band-stop filtering unit 31 receives the first differential signal from the first output terminal VOUT1, and processes the first differential signal to output the second audio signal. The second band-elimination filtering unit 32 receives the second differential signal from the second output terminal VOUT2, and processes the second differential signal to output a second audio signal.
In an embodiment, the audio power amplifier module 2 further includes a peripheral circuit, and specifically, as shown in fig. 4, the peripheral circuit includes a resistor R1, a resistor R2, a resistor R3, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, an inductor L1, and an inductor L2. A first end of the resistor R1 is connected with an enable control end SD, and a second end is grounded; a port BYPASS of the power amplifier chip U1 is connected with a first end of a capacitor C4, and a second end of a capacitor C4 is grounded; a port INP of the power amplifier chip U1 is connected with a first end of the capacitor C4; the port AGND of the power amplifier chip U1 is connected to the ground voltage terminal GND. The port AGND1 of the power amplifier chip U1 is connected to the first end of the capacitor C2, the first end of the capacitor C3, and the ground voltage GND, and the power supply terminal VD is connected to the second end of the capacitor C2, the second end of the capacitor C3, and the power supply. The signal input terminal INN is connected to the second terminal of the resistor R3, the first terminal of the resistor R3 is connected to the second terminal of the capacitor C1, and the first terminal of the capacitor C1 is connected to the baseband chip 1. The first output terminal VOUT1 is connected to the first terminal of the inductor L1, the second terminal of the inductor L1 is connected to the P1, the P1 is connected to the first bandstop filter module 31, the second output terminal VOUT2 is connected to the first terminal of the inductor L2, the second terminal of the inductor L2 is connected to the P2, and the P2 is connected to the second bandstop filter module 32.
Further, as shown in fig. 5, the wireless communication device further includes a switch switching module 5, where the switch switching module 5 is connected between the audio power amplifier module 2 and the band-stop filtering module 3, and controls a path between the audio power amplifier module 2 and the first band-stop filtering unit 32, or controls a path between the audio power amplifier module 2 and the second band-stop filtering unit 32. Specifically, the switch switching module 5 includes: the first switch switching unit 51 is connected between the audio power amplifier module 2 and the first band-stop filtering unit 31, and in response to the conduction of the path between the audio power amplifier module 2 and the first band-stop filtering unit 31, the first band-stop filtering unit 31 receives the first differential signal. The second switch switching unit 52 is connected between the audio power amplifier module 2 and the second band elimination filter unit 32, and in response to the conduction of the path between the audio power amplifier module 2 and the second band elimination filter unit 32, the second band elimination filter unit 32 receives the second differential signal.
Referring to fig. 6, 7 and 8, fig. 6 is a schematic structural diagram of a switch switching unit according to an embodiment of the present invention, fig. 7 is a schematic structural diagram of a first band-stop filter unit according to an embodiment of the present invention, and fig. 8 is a schematic structural diagram of a second band-stop filter unit according to an embodiment of the present invention. Specifically, the first switch switching unit 51 includes a first switching chip U2, and the first switching chip U2 includes a first input terminal VIN, a first output terminal OUT1, and a second output terminal OUT 2. The first bandstop filtering unit 31 comprises an input PIN1 and an output POUT. A first input end VIN of the first switching chip U2 is connected to a first output end VOUT1 of the audio power amplifier module 2, and specifically, the first input end VIN of the first switching chip U2 is connected to the P1 end; the first output terminal OUT1 of the first switching chip U2 is connected to the output terminal POUT of the first band-stop filtering unit 31, and the second output terminal OUT2 of the first switching chip U2 is connected to the input terminal PIN2 of the first band-stop filtering unit 31.
The second switching unit 52 includes a second switching chip U3, the second switching chip U3 includes a first input terminal VIN, a first output terminal OUT1, and a second output terminal OUT 2; the second band-reject filter unit 32 comprises an input NIN1 and an output NOUT. A first input end VIN of the second switching chip U3 is connected to a second output end VOUT2 of the audio power amplifier module 2, and specifically, the first input end VIN of the second switching chip U3 is connected to the P2 end; the first output end OUT1 of the second switch chip U3 is connected to the input end NININI of the second band-stop filtering unit 32, and the second output end OUT2 of the second switch chip U3 is connected to the output end NOUT of the second band-stop filtering unit 32.
The first switching chip U2 and the second switching chip U3 each include a control terminal ON, and the control terminal ON receives an enable signal EN, which controls the ON and off of the first switching chip U2 and the second switching chip U3.
In one embodiment, the first band-stop filtering unit includes: the first low-pass filtering unit is connected to the second output end OUT2 of the first switch switching unit 51 and the first output end OUT1 of the first switch switching unit 51, and the first high-pass filtering unit is connected to the second output end OUT2 of the first switch switching unit 51 and the first output end OUT1 of the first switch switching unit 51.
The second band elimination filter unit includes: a second low-pass filter unit connected to the second output terminal OUT2 of the second switch switching unit 52 and the first output terminal OUT1 of the second switch switching unit 52, and a second high-pass filter unit connected to the second output terminal OUT2 of the second switch switching unit 52 and the first output terminal OUT1 of the second switch switching unit 52.
Referring to fig. 7, the first low pass filter unit includes a first resistor R4, a second resistor R5, a first capacitor C6 and a second capacitor C5. A first end of the first resistor R4 is connected to the second output end OUT2 of the first switch switching unit 51, a first end of the second resistor R5 is connected to a second end of the first resistor R4, and a second end of the second resistor R5 is connected to the first output end POUT of the first switch switching unit 51. A first end of the first capacitor C6 is connected to a second end of the first resistor R4, and a second end of the first capacitor C6 is grounded to GND; the first terminal of the second capacitor C5 is connected to the first terminal of the first capacitor C6, and the second terminal of the second capacitor C5 is grounded to GND.
The first high-pass filtering unit includes: a third resistor R6, a fourth resistor R7, a third capacitor C7 and a fourth capacitor C8. A first terminal of the third capacitor C7 is connected to the second output terminal OUT2 of the first switch switching unit 51. A first terminal of the fourth capacitor C8 is connected to the second terminal of the third capacitor C7, and a second terminal of the fourth capacitor C8 is connected to the first output terminal OUT1 of the first switch switching unit 51. A first end of the third resistor R6 is connected with a second end of the third capacitor C7, and a second end of the third resistor R6 is grounded GND; the first end of the fourth resistor R7 is connected to the first end of the third resistor R6, and the second end of the fourth resistor R7 is grounded GND.
In one embodiment, the second low-pass filtering unit is the same as the first low-pass filtering unit, and the second high-pass filtering unit is the same as the first high-pass filtering unit. As shown in fig. 8 in particular, in the second band-stop filtering unit 32, a first end of the first resistor R4 is connected to the first output end OUT1 of the second switch switching unit 52, and a first end of the third capacitor C7 is connected to the first output end OUT1 of the second switch switching unit 52; a second terminal of the second resistor R5 is connected to the second output terminal OUT2 of the second switch switching unit 52, and a second terminal of the fourth capacitor C8 is connected to the second output terminal OUT2 of the second switch switching unit 52.
In specific application, under loudspeaker external playing scenes such as hands-free conversation, music playing and the like, the mobile phone baseband chip 1 outputs a single-ended audio signal (MP3_ OUTR), and the signal is input to the signal input end INN of the audio power amplifier module 2 through a resistance-capacitance filter network (a capacitor C1 and a resistor R3) in a single-ended input mode; meanwhile, the baseband chip 1 controls the AUDIO power amplifier module 2 to be opened and closed through an enable signal (AUDIO _ PA _ SDN), and supplies power to the AUDIO power amplifier module 2 through a battery power supply signal (VBAT _ SPK); two differential P1 and P2 output pins of the audio power amplifier module 2 are respectively connected with input pins VIN of two loadswitch chips (U2 and U3), wherein U2 is a P pole control chip of a differential signal, and U3 is an N pole control chip; each loadswitch chip is provided with two output ports which are respectively connected with two loudspeaker end audio signal input circuits. One path of the chip output PINs NIN1 and PIN1 is a passive band-stop filtering scheme (a block 1 and a block 2), and NIN2 and PNIN2 are direct-connection schemes. Finally, the audio signal is output to the triad horn via the NOUT and POUT signals.
Specifically, in multimedia and voice play call scenes, requirements on tone quality, detail expression, low-frequency expression and the like are high, and through a band elimination filter module with a high Q (quality factor) value, audio signals of frequencies near a motor resonance point are filtered out, and more low-frequency signals are reserved to obtain better low-frequency expression. The main control signal controls the loadswitch chip to realize the output of the PIN2 of the U2 chip and the NIN2 channel of the U3 chip, at the moment, the PIN1 of the U2 chip and the NIN1 output PIN of the U3 chip are closed, and no signal is output. And in a receiver call scene, an AUDIO power amplifier enabling pin AUDIO _ PA _ SDN is pulled down, and the AUDIO power amplifier stops working at the moment. The receiver signal is directly output to the loudspeaker through the receiver passage.
The design of the band-elimination filter module 3 is, for example, the band-elimination filter module in which the audio power amplifier module outputs N-pole signals as shown in fig. 8, and the band-elimination filter module in which the audio power amplifier module outputs P-pole signals as shown in fig. 7. The center frequency of the band elimination filter module is fc, and fc is designed to be close to the motor resonant voltage through resistance-capacitance combination. And Q (quality factor) value can be adjusted, the stop band of the band elimination filter module is superposed with the frequency of the pass band of motor vibration, the motor vibration is accurately and effectively filtered, and other low-frequency components are reserved, so that the low-frequency feeling is improved. The band-stop filtering module in fig. 8 and 7 is formed by connecting a second-order low-pass filter composed of R4, R5, C5 and C6 and a second-order high-pass filter composed of R6, R7, C7 and C8 in parallel. The stopband ω cl < ω ch, so it attenuates the signal from ω cl to ω ch.
Figure BDA0003367571060000101
Figure BDA0003367571060000102
(ω cl and ω ch are the upper and lower cut-off frequencies, respectively). If R4 ═ R6 ═ R, R5 ═ R7 ═ 10 ═ R, C6 ═ C7 ═ C, C5 ═ C8 ═ 1/10 ═ C, ω 0 ═ 1/RC, and fc ═ ω 0/2 Π. The stop band width B is:
Figure BDA0003367571060000111
Figure BDA0003367571060000112
a quality factor Q of
Figure BDA0003367571060000113
Omega cl and omega ch can be dynamically adjusted (different Q values are obtained) according to the resonance bandwidth of the three-in-one loudspeaker, so that the optimal filtering effect is obtained. The calculation can obtain: r4 ═ R6 ═ R100 ohm, R5 ═ R7 ═ R1 kohm, C6 ═ C7 ═ C ═ 10uF, C5 ═ C8 ═ 1/10 ═ C ═ 1 uF. ω cl is 64.7Hz, ω ch is 433.64Hz, fc is 171Hz, and Q is 0.46.
Referring to fig. 9, fig. 9 is a schematic structural diagram of an embodiment of an earpiece path module 4 according to the present application, where the earpiece path module 4 includes: the first earphone module is connected with the baseband chip 1 and the output end NOUT of the second band elimination filter unit 32, and is used for receiving a first audio signal and outputting a third audio signal, and the first audio signal is a first type differential signal. The second earpiece module is connected to the baseband chip 1 and the output terminal POUT of the first band-stop filtering unit 31, and is configured to receive the first audio signal and output a third audio signal, where the first audio signal is a second type differential signal.
The first earphone module comprises a fifth resistor R13 and a fifth capacitor C13. Wherein, the second end of the fifth resistor R13 is connected to the output end NOUT of the second band-stop filtering unit 32. The first end of the fifth capacitor C13 is connected to the baseband chip 1, and the second end of the fifth capacitor C13 is connected to the first end of the fifth resistor R13.
The second earpiece module includes a seventh resistor R12, a sixth capacitor C14. A second end of the seventh resistor R12 is connected to the output terminal POUT of the first band-impedance filtering unit 31. A first terminal of the sixth capacitor C14 is connected to the baseband chip 1, and a second terminal of the sixth capacitor C14 is connected to a first terminal of the seventh resistor R12.
The bias voltage providing module includes a sixth resistor R14 and an eighth resistor R15. The first end of the sixth resistor R14 is connected to the second end of the fifth resistor R13, and the second end of the sixth resistor R14 is connected to the baseband chip 1, and receives the bias voltage AVDD1V 25. The first end of the eighth resistor R15 is connected to the first end of the seventh resistor R12, and the second end of the eighth resistor R15 is connected to the baseband chip 1, and receives the bias voltage AVDD1V 25.
In the receiver call scenario, the baseband chip 1 outputs a first audio signal, where the first audio signal includes a first type differential signal RECP0 and a second type differential signal RECN 0. At this time, the enable signal (AUDIO _ PA _ SDN) of the AUDIO power amplifier module 2 is pulled low, and the AUDIO power amplifier module 2 stops working. RECN0 and RECP0 are input to the triple-play horn via a headphone circuit. The 2 12 Ω resistors R12 and R13 of the handset path module 4 are connected in series with the horn to construct an equivalent 32 Ω load to simulate the handset internal resistance, RREC=R12+R13+RSPK. If the R12 and R13 resistances are increased, the handset output power is reduced(ii) a If the R12 and R13 resistances are reduced, the power is boosted. In order to avoid the leakage current output to NOUT and POUT from affecting the performance of the handset circuit, 2 capacitors C13 and C14 of 47uF are added for DC blocking, and then a high-pass filter is formed with the 12 Ω resistors R12 and R13. The high-pass cut-off frequency fL 1/(2 Π C13R 13) 282 Hz. If the capacitance value of C13 and the resistance value of R13 are increased, the value of fL is reduced; decreasing the capacitance of C13 and the resistance of R13 increases the value of fL. To avoid leakage current, a DC voltage is established by biasing resistors R14 and R15 and a bias voltage of 1.25V, eliminating voltage differences.
According to the loudspeaker control circuit, a high-pass filter at a software end under the scenes of music playing and voice communication is removed, a passive band elimination filter with an adjustable Q value is added to a loudspeaker channel at a hardware end, and an impedance matching and high-pass filter circuit is added to a receiver channel. The method is suitable for software and hardware implementation modes of a three-in-one loudspeaker scheme of a mobile phone baseband chip, and in two working scenes of loudspeaker amplification and motor vibration, hardware band elimination filtering, direct connection and other two audio input modes are switched and called. In a handset call scenario, the handset hardware circuit is designed separately. The design of the band elimination filter of the three-in-one loudspeaker scheme suitable for the mobile phone baseband chip specifically comprises the impedance matching of a loudspeaker access band elimination filter and a headphone access, a hardware schematic diagram of a high-pass filter, the parameter setting of the resistance-capacitance value of a resistance-capacitance piece in the scheme and the like.
Referring to fig. 10, which is a schematic structural diagram of a horn 60 according to an embodiment of the present invention, the horn 60 includes a horn control circuit 61, and the horn control circuit 61 is the horn control circuit according to any one of the embodiments of fig. 1 to 9, which is not described herein again.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (13)

1. A horn control circuit, comprising:
a baseband chip for generating a first audio signal;
the audio power amplifier module is connected with the baseband chip and used for processing the first audio signal and outputting a differential signal;
the band elimination filtering module is connected with the audio power amplification module and used for processing the differential signal so as to filter vibration inductance in the differential signal and output a second audio signal; and the quality factor of the band elimination filtering module is greater than a preset value.
2. The circuit of claim 1, further comprising:
and the receiver access module is connected with the baseband chip and the output end of the band elimination filtering module, receives the first audio signal, processes the first audio signal and outputs a third audio signal.
3. The circuit of claim 2,
the audio power amplifier module comprises: the power amplifier chip comprises a signal input end, an enabling control end, a power supply end, a first output end and a second output end;
the signal input end of the power amplifier chip is connected with the baseband chip and receives the first audio signal; the enabling control end is connected with the baseband chip, receives an enabling signal and is in a first state based on the enabling signal; the power supply end is connected with a power supply and receives a voltage power supply signal; the first output end of the power amplifier chip and the second output end of the power amplifier chip are connected with the band elimination filtering module.
4. The circuit of claim 3, wherein the band-stop filtering module comprises:
the first band-stop filtering unit is connected with the first output end, receives a first differential signal, processes the first differential signal and outputs a second audio signal;
and the second band elimination filtering unit is connected with the second output end, receives a second differential signal, and processes the second differential signal to output the second audio signal.
5. The circuit of claim 4, further comprising:
and the switch switching module is connected between the audio power amplifier module and the band elimination filtering module, and controls a path between the audio power amplifier module and the first band elimination filtering unit or controls a path between the audio power amplifier module and the second band elimination filtering unit.
6. The circuit of claim 5, wherein the switching module comprises:
the first switch switching unit is connected between the audio power amplifier module and the first band-resistance filtering unit, and responds to the conduction of a channel between the audio power amplifier module and the first band-resistance filtering unit, so that the first band-resistance filtering unit receives a first differential signal;
and the second switch switching unit is connected between the audio power amplifier module and the second band-stop filtering unit, and responds to the conduction of a channel between the audio power amplifier module and the second band-stop filtering unit, so that the second band-stop filtering unit receives a second differential signal.
7. The circuit of claim 6,
the first switch switching unit comprises a first switching chip, and the first switching chip comprises a first input end, a first output end and a second output end; the first band-resistance filtering unit comprises an input end and an output end;
a first input end of the first switching chip is connected with a first output end of the audio power amplifier module, a first output end of the first switching chip is connected with an output end of the first band-resistance filtering unit, and a second output end of the first switching chip is connected with an input end of the first band-resistance filtering unit;
the second switch switching unit comprises a second switching chip, and the second switching chip comprises a first input end, a first output end and a second output end; the second band elimination filter unit comprises an input end and an output end;
the first input end of the second switching chip is connected with the second output end of the audio power amplifier module, the first output end of the second switching chip is connected with the input end of the second band-stop filtering unit, and the second output end of the second switching chip is connected with the output end of the second band-stop filtering unit.
8. The circuit of claim 7, wherein the first band-stop filtering unit comprises:
the first low-pass filtering unit is connected with the second output end of the first switch switching unit and the first output end of the first switch switching unit;
the first high-pass filtering unit is connected with the second output end of the first switch switching unit and the first output end of the first switch switching unit;
the second band-stop filtering unit includes:
the second low-pass filtering unit is connected with the second output end of the second switch switching unit and the first output end of the second switch switching unit;
and the second high-pass filtering unit is connected with the second output end of the second switch switching unit and the first output end of the second switch switching unit.
9. The circuit of claim 8, wherein the first low-pass filtering unit comprises:
a first end of the first resistor is connected with the second output end of the first switch switching unit;
a first end of the second resistor is connected with a second end of the first resistor, and a second end of the second resistor is connected with a first output end of the first switch switching unit;
a first end of the first capacitor is connected with a second end of the first resistor, and a second end of the first capacitor is grounded;
a first end of the second capacitor is connected with a first end of the first capacitor, and a second end of the second capacitor is grounded;
the first high-pass filtering unit includes:
a first end of the third capacitor is connected with the second output end of the first switch switching unit;
a first end of the fourth capacitor is connected with a second end of the third capacitor, and a second end of the fourth capacitor is connected with the first output end of the first switch switching unit;
a first end of the third resistor is connected with a second end of the third capacitor, and a second end of the third resistor is grounded;
and a first end of the fourth resistor is connected with a first end of the third resistor, and a second end of the fourth resistor is grounded.
10. The circuit of claim 9, wherein the second low-pass filtering unit is the same as the first low-pass filtering unit, and wherein the second high-pass filtering unit is the same as the first high-pass filtering unit.
11. The circuit of claim 7, wherein the earpiece path module comprises:
the first earphone module is connected with the baseband chip and the output end of the second band elimination filter unit and used for receiving the first audio signal and outputting the third audio signal, and the first audio signal is a first type differential signal
The second earphone module is connected with the baseband chip and the output end of the first band-resistance filtering unit and is used for receiving the first audio signal and outputting a third audio signal, wherein the first audio signal is a second type differential signal;
and the bias voltage providing module is connected with the first earphone module and the second earphone module and connected with the baseband chip to receive bias voltage.
12. The circuit of claim 11, wherein the first earpiece module comprises:
a second end of the fifth resistor is connected with the output end of the second band-stop filtering unit;
a first end of the fifth capacitor is connected with the baseband chip, and a second end of the fifth capacitor is connected with a first end of the fifth resistor;
the second earpiece module includes:
a second end of the seventh resistor is connected with the output end of the first band-resistance filtering unit;
a first end of the sixth capacitor is connected with the baseband chip, and a second end of the sixth capacitor is connected with a first end of the seventh resistor;
the bias voltage providing module includes:
a first end of the sixth resistor is connected with a second end of the fifth resistor, and a second end of the sixth resistor is connected with the baseband chip and receives the bias voltage;
and a first end of the eighth resistor is connected with a first end of the seventh resistor, and a second end of the eighth resistor is connected with the baseband chip and receives the bias voltage.
13. A loudspeaker comprising a loudspeaker control circuit as claimed in any one of claims 1 to 12.
CN202122912109.0U 2021-11-22 2021-11-22 Loudspeaker control circuit and loudspeaker Active CN216673212U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122912109.0U CN216673212U (en) 2021-11-22 2021-11-22 Loudspeaker control circuit and loudspeaker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122912109.0U CN216673212U (en) 2021-11-22 2021-11-22 Loudspeaker control circuit and loudspeaker

Publications (1)

Publication Number Publication Date
CN216673212U true CN216673212U (en) 2022-06-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
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CN (1) CN216673212U (en)

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