CN216607177U - Wire box forming die - Google Patents
Wire box forming die Download PDFInfo
- Publication number
- CN216607177U CN216607177U CN202122627457.3U CN202122627457U CN216607177U CN 216607177 U CN216607177 U CN 216607177U CN 202122627457 U CN202122627457 U CN 202122627457U CN 216607177 U CN216607177 U CN 216607177U
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- plate
- wire box
- template
- fixed
- lower template
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- 230000000694 effects Effects 0.000 claims abstract description 28
- 238000001816 cooling Methods 0.000 claims abstract description 21
- 238000003825 pressing Methods 0.000 claims description 12
- 239000000498 cooling water Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 abstract description 10
- 230000007246 mechanism Effects 0.000 abstract description 3
- 230000009471 action Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000670 limiting effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000004512 die casting Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model discloses a forming die for a wire box, which comprises a bottom plate, wherein the upper end of the bottom plate is connected with a lower template, a movable plate is arranged on the inner side of the bottom plate, sliding grooves are symmetrically formed in the bottom plate and the lower template, and a die groove is formed in the lower template; the cope match-plate pattern sets up the lower bolster top, and the cope match-plate pattern lower extreme is fixed with the pressure diaphragm plate to the pressure diaphragm plate mutually supports with the model groove, all is pour the hole on cope match-plate pattern and the pressure diaphragm plate simultaneously and runs through, still includes: the fixing holes are formed in the lower side of the lower template at equal intervals, the fixing holes penetrate through the lower end face of the lower template, and cooling pipes are arranged on the side edges of the fixing holes. This electric wire box forming die cushions when adopting buffer gear to cope match-plate pattern and lower bolster compound die to can effectively avoid cope match-plate pattern and lower bolster collision to lead to damaging when carrying out the compound die, the ejection mechanism of cooperation linkage realizes the automatic ejecting effect to finished product electric wire box, thereby avoids finished product electric wire box and mould to bond each other and leads to taking out inconvenient problem.
Description
Technical Field
The utility model relates to the technical field of molds, in particular to a forming mold for a wire box.
Background
In the production process of the wire box, a die-casting mode is generally adopted for casting production, the mode has the advantages of fast forming, accurate specification and the like, when the die-casting production is carried out, production needs to be carried out through related dies, and the existing wire box forming die has certain defects when used, such as the defects exist;
according to the forming die of the junction box disclosed in the publication No. CN209454080U, the design that the slide seat core pulling system and the point gate are arranged on two sides of the cavity is adopted, so that the problem of top damage of the inner wall of a product is solved, automatic gate shearing production is realized, the number of the cavities is increased to one and eight, and the production efficiency and the product quality are greatly improved;
in carrying out the die-casting production process, need to go up mould and lower mould and use each other supporting, current forming die lacks buffer gear and leads to going up the lower mould and easily producing the collision when cooperating to lead to the fragile problem of mould, and pouring the back, easily bond together between fashioned electric wire box and the mould, thereby lead to fashioned electric wire box to take out inconvenient scheduling problem, so need improve in order to satisfy actual demand to above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a wire box forming die, which aims to solve the problems that the upper die and the lower die are easy to collide when being matched due to the lack of a buffer mechanism, the die is easy to damage, and the formed wire box is inconvenient to take out.
In order to achieve the purpose, the utility model provides the following technical scheme: a wire box forming die comprises a bottom plate, wherein the upper end of the bottom plate is connected with a lower template, a movable plate is arranged on the inner side of the bottom plate, sliding grooves are symmetrically formed in the bottom plate and the lower template, and a die groove is formed in the lower template;
the upper template is arranged above the lower template, a film pressing plate is fixed at the lower end of the upper template, the film pressing plate is matched with the model groove, and the upper template and the film pressing plate are both penetrated by pouring holes;
further comprising:
the fixing holes are formed in the lower side of the lower template at equal intervals, the fixing holes penetrate through the lower end face of the lower template, the cooling pipes are arranged on the side edges of the fixing holes and are formed in the lower end of the lower template, and the cooling pipes are connected with external cooling water pipes to achieve a cooling effect;
and the buffer plates are symmetrically arranged below the upper template.
Preferably, the lower bolster upper end still symmetry is provided with the spacing groove, and the spacing groove mutually supports with the buffer board to the spacing inslot side is provided with high temperature resistant blotter, and high temperature resistant blotter fixes on the lower bolster simultaneously, and when cope match-plate pattern and lower bolster cooperate, through the effect of buffer board and high temperature resistant blotter, can realize cushioning effect, and then avoids cope match-plate pattern and lower bolster collision to lead to damaging when carrying out the compound die.
Preferably, the movable plate is further provided with a sliding block and a first spring;
the sliding blocks are symmetrically fixed on two sides of the movable plate, the tail ends of the sliding blocks are of arc structures, and the sliding blocks are in sliding connection with the bottom plate;
the first spring is fixed at equal intervals on the lower end face of the movable plate, the other end of the first spring is fixed on the bottom plate, the movable plate can move up and down under the action of the first spring, so that basic acting force is provided for the movement of the ejector rod, the automatic ejection effect on the wire box is further achieved, and the stability of the movable plate in movement is guaranteed under the sliding limiting effect of the sliding block.
Preferably, ejector rods are further fixed on the movable plate at equal intervals, the ejector rods and the movable plate are vertically distributed, the ejector rods and the fixing holes are matched with each other to achieve a sealing effect, and the ejector rods and the fixing holes are matched with each other to achieve a sealing effect, so that normal production of the wire box is guaranteed.
Preferably, still the symmetry is fixed with the guide arm on the cope match-plate pattern, and is vertical distribution between guide arm and the cope match-plate pattern to be sliding connection between guide arm and the spout, when cope match-plate pattern and lower bolster cooperate, realize the direction spacing through the sliding action of guide arm and spout, guarantee the accurate compound die of cope match-plate pattern and lower bolster, and through the effect of guide arm, can provide the effort for the removal of slider, and then provide the effort for the removal of fly leaf.
Preferably, the buffer board is also vertically and symmetrically fixed with vertical rods, the vertical rods are in sliding connection with the upper die plate, and when the buffer board is stressed to move, the buffer board is guaranteed to move stably through the sliding effect between the vertical rods and the upper die plate.
Preferably, the buffer board up end still symmetry is fixed with the second spring, and the second spring other end is fixed at cope match-plate pattern lower extreme face, constitutes buffer gear through the elastic action of second spring, both provides basic guarantee for the removal of buffer board, and collision damage when can avoiding cope match-plate pattern and lower bolster compound die again.
Compared with the prior art, the utility model has the beneficial effects that: this electric wire box forming die cushions when adopting buffer gear to cope match-plate pattern and lower bolster compound die to can effectively avoid cope match-plate pattern and lower bolster collision to lead to damaging when carrying out the compound die, the ejection mechanism of cooperation linkage realizes the automatic ejecting effect to finished product electric wire box, thereby avoids finished product electric wire box and mould to bond each other and leads to taking out inconvenient problem.
1. When carrying out the compound die, through the slip guide effect of guide arm and spout, guarantee the accuracy of lower bolster and cope match-plate pattern compound die, the cushioning effect can be realized to the effect of cooperation spacing groove, high temperature resistant blotter, buffer board, montant and second spring, stability when guaranteeing lower bolster and cope match-plate pattern compound die, avoids the lower bolster to collide the problem that leads to the mould to damage with the cope match-plate pattern.
2. After the shaping, the lower bolster makes things convenient for the finished product to take out with the cope match-plate pattern separation, makes slider and fly leaf rebound under the effect of first spring this moment, and then drives and slide between ejector pin and the fixed orifices, realizes the automatic ejecting effect to the finished product through the effect of ejector pin, avoids finished product and mould bonding to lead to taking out inconvenient problem.
Drawings
FIG. 1 is a schematic view of a front cross-sectional structure of a base plate according to the present invention;
FIG. 2 is a schematic side view of a cross-sectional structure of a base plate according to the present invention;
FIG. 3 is a schematic top view of the cross-sectional structure of the present invention;
FIG. 4 is a schematic view of the overall structure of the mold assembly of the present invention;
fig. 5 is a schematic perspective view of the movable plate of the present invention.
In the figure: 1. a base plate; 2. a lower template; 201. a limiting groove; 202. a high temperature resistant cushion pad; 3. a movable plate; 301. a slider; 302. a first spring; 4. a chute; 5. a top rod; 6. a mould groove; 7. a fixing hole; 8. a cooling tube; 9. mounting a template; 901. a guide bar; 10. a film pressing plate; 11. pouring holes; 12. a buffer plate; 1201. a vertical rod; 13. a second spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a wire box forming die comprises a bottom plate 1, wherein the upper end of the bottom plate 1 is connected with a lower template 2, a movable plate 3 is arranged on the inner side of the bottom plate 1, sliding grooves 4 are symmetrically formed in the bottom plate 1 and the lower template 2, and a die groove 6 is formed in the lower template 2;
the upper template 9 is arranged above the lower template 2, a film pressing plate 10 is fixed at the lower end of the upper template 9, the film pressing plate 10 is matched with the model groove 6, and the upper template 9 and the film pressing plate 10 are penetrated through by a pouring hole 11;
further comprising:
the fixing holes 7 are formed in the lower side of the lower template 2 at equal intervals, the fixing holes 7 penetrate through the lower end face of the lower template 2, the cooling pipes 8 are arranged on the side edges of the fixing holes 7, the cooling pipes 8 are formed in the lower end of the lower template 2, and the cooling pipes 8 are connected with external cooling water pipes to achieve a cooling effect;
and the buffer plates 12 are symmetrically arranged below the upper template 9.
The upper end of the lower template 2 is also symmetrically provided with limiting grooves 201, the limiting grooves 201 are matched with the buffer plate 12, the inner sides of the limiting grooves 201 are provided with high-temperature-resistant buffer pads 202, and the high-temperature-resistant buffer pads 202 are fixed on the lower template 2; the movable plate 3 is further provided with a slide block 301 and a first spring 302; the sliding blocks 301 are symmetrically fixed on two sides of the movable plate 3, the tail ends of the sliding blocks 301 are of arc-shaped structures, and the sliding blocks 301 are in sliding connection with the bottom plate 1; the first springs 302 are fixed on the lower end surface of the movable plate 3 at equal intervals, and the other ends of the first springs 302 are fixed on the bottom plate 1; the movable plate 3 is also fixed with ejector rods 5 at equal intervals, the ejector rods 5 and the movable plate 3 are vertically distributed, and the ejector rods 5 and the fixing holes 7 are matched with each other to realize a sealing effect.
After the die assembly is finished, pouring is carried out through the pouring hole 11, the shaping of the wire box is realized under the action of the film pressing plate 10 and the model groove 6, and in the pouring process, cooling water is injected into the cooling pipe 8 through an external water pipe to realize the circulating cooling effect, the electric wire box can be ensured to be cooled quickly, after the cooling is finished, when the electric wire box needs to be taken out, the upper template 9 and the lower template 2 are separated according to the principle, at the moment, the stress action of the sliding block 301 is relieved, under the action of the first spring 302, the slide block 301 and the movable plate 3 are moved upwards, thereby driving the mandril 5 to move upwards, ensuring the stability of the movement of the mandril 5 through the sliding action between the mandril 5 and the fixed hole 7, through the effect of ejector pin 5, realize the ejecting effect to finished product electric wire box, avoid electric wire box and mould to bond each other and lead to the problem of drawing of patterns difficulty to improve process rate.
The upper die plate 9 is also symmetrically fixed with guide rods 901, the guide rods 901 are vertically distributed with the upper die plate 9, and the guide rods 901 are in sliding connection with the sliding chutes 4; the vertical rods 1201 are also vertically and symmetrically fixed on the buffer plate 12, and the vertical rods 1201 are in sliding connection with the upper template 9; the upper end surface of the buffer plate 12 is also symmetrically fixed with a second spring 13, and the other end of the second spring 13 is fixed on the lower end surface of the upper template 9.
When the wire box forming die is used, the bottom plate 1 and the upper die plate 9 are fixed, then the upper die plate 9 and the lower die plate 2 are assembled, the cooling pipe 8 is connected with an external cooling water pipe, the mold assembly is realized through the sliding action between the guide rod 901 and the chute 4, when the guide rod 901 is contacted with the slide block 301, the slide block 301 is forced to move downwards, thereby driving the movable plate 3 and the mandril 5 to move downwards, leading the mandril 5 to be matched with the fixed hole 7 to realize sealing, when the die is closed, the buffer plate 12 is matched with the limit groove 201, the buffer is realized through the actions of the high-temperature-resistant buffer pad 202 and the second spring 13, the damage of the die caused by the collision of the upper die plate 9 and the lower die plate 2 in the die closing process is avoided, and when the buffer plate 12 moves under stress, through the sliding guide effect between the vertical rod 1201 and the upper die plate 9, the stable linear motion of the buffer plate 12 is ensured.
The working principle is as follows: as shown in fig. 1-5, when the wire box forming mold is used, firstly, the bottom plate 1 and the upper template 9 are fixed, then the upper template 9 and the lower template 2 are assembled, and the cooling pipe 8 is connected with an external cooling water pipe, as shown in fig. 4, when mold closing is performed, the accuracy of mold closing is ensured through the sliding action of the guide rod 901 and the sliding groove 4, the buffer plate 12 is matched with the limiting groove 201, and the buffer is realized through the action of the high temperature resistant buffer pad 202 and the second spring 13, so that the damage of the mold caused by the mutual collision of the upper template 9 and the lower template 2 during mold closing is avoided, when mold closing is performed, acting force is provided for the slide block 301 through the guide rod 901, the slide block 301, the movable plate 3 and the ejector rod 5 are moved downwards, the seal is realized through the mutual matching of the ejector rod 5 and the fixing hole 7, when casting is performed, the casting hole 11 is performed, and the sizing of the wire box is realized through the action of the film pressing plate 10 and the mold groove 6, and realize the cooling effect of electric wire box through the recirculated cooling water in the cooling tube 8, after the cooling is accomplished, make cope match-plate pattern 9 and lower bolster 2 separation according to above-mentioned principle, at this moment under the effect of first spring 302, make slider 301, fly leaf 3 and ejector pin 5 upwards move, realize the ejecting effect of finished product electric wire box through the effect of ejector pin 5, avoid electric wire box and mould to bond each other and lead to the problem of drawing of patterns difficulty, thereby improve process rate, this is the theory of operation of this electric wire box forming die.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A wire box forming die comprises a bottom plate (1), wherein the upper end of the bottom plate (1) is connected with a lower template (2), a movable plate (3) is arranged on the inner side of the bottom plate (1), sliding grooves (4) are symmetrically formed in the bottom plate (1) and the lower template (2), and a die groove (6) is formed in the lower template (2);
the upper template (9) is arranged above the lower template (2), a film pressing plate (10) is fixed at the lower end of the upper template (9), the film pressing plate (10) is matched with the model groove (6), and meanwhile, the upper template (9) and the film pressing plate (10) are both penetrated through by pouring holes (11);
it is characterized by also comprising:
the fixing holes (7) are formed in the lower side of the lower template (2) at equal intervals, the fixing holes (7) penetrate through the lower end face of the lower template (2), the cooling pipes (8) are arranged on the side edges of the fixing holes (7), the cooling pipes (8) are formed in the lower end of the lower template (2), and the cooling pipes (8) are connected with external cooling water pipes to achieve a cooling effect;
and the buffer plates (12) are symmetrically arranged below the upper template (9).
2. A wire box molding die according to claim 1, wherein: the upper end of the lower template (2) is symmetrically provided with limit grooves (201), the limit grooves (201) are matched with the buffer plate (12), high-temperature-resistant buffer pads (202) are arranged on the inner sides of the limit grooves (201), and the high-temperature-resistant buffer pads (202) are fixed on the lower template (2).
3. A wire box molding die according to claim 1, wherein: the movable plate (3) is also provided with a sliding block (301) and a first spring (302);
the sliding blocks (301) are symmetrically fixed on two sides of the movable plate (3), the tail ends of the sliding blocks (301) are of arc-shaped structures, and the sliding blocks (301) are in sliding connection with the base plate (1);
the first springs (302) are fixed on the lower end face of the movable plate (3) at equal intervals, and the other ends of the first springs (302) are fixed on the bottom plate (1).
4. A wire box molding die according to claim 1, wherein: the movable plate (3) is further fixed with ejector rods (5) at equal intervals, the ejector rods (5) and the movable plate (3) are vertically distributed, and the ejector rods (5) are matched with the fixing holes (7) to achieve a sealing effect.
5. A wire box molding die according to claim 1, wherein: the upper template (9) is also symmetrically fixed with guide rods (901), the guide rods (901) and the upper template (9) are vertically distributed, and the guide rods (901) are in sliding connection with the sliding grooves (4).
6. A wire box molding die according to claim 1, wherein: vertical rods (1201) are vertically and symmetrically fixed on the buffer plate (12), and the vertical rods (1201) are in sliding connection with the upper template (9).
7. A wire box molding die according to claim 1, wherein: and the upper end surface of the buffer plate (12) is also symmetrically fixed with a second spring (13), and the other end of the second spring (13) is fixed on the lower end surface of the upper template (9).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122627457.3U CN216607177U (en) | 2021-10-29 | 2021-10-29 | Wire box forming die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122627457.3U CN216607177U (en) | 2021-10-29 | 2021-10-29 | Wire box forming die |
Publications (1)
Publication Number | Publication Date |
---|---|
CN216607177U true CN216607177U (en) | 2022-05-27 |
Family
ID=81694226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202122627457.3U Expired - Fee Related CN216607177U (en) | 2021-10-29 | 2021-10-29 | Wire box forming die |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN216607177U (en) |
-
2021
- 2021-10-29 CN CN202122627457.3U patent/CN216607177U/en not_active Expired - Fee Related
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220527 |