CN216565357U

CN216565357U - Camera shooting assembly and electronic equipment

Info

Publication number: CN216565357U
Application number: CN202123454486.0U
Authority: CN
Inventors: 秦勇
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-05-17
Anticipated expiration: 2031-12-31

Abstract

The embodiment of the application provides a camera shooting assembly and electronic equipment, wherein the camera shooting assembly comprises a machine shell, a camera shooting module and a supporting structure, the machine shell comprises a bottom plate and a support, and the support is arranged around the bottom plate to form an accommodating space; at least one part of the camera module is arranged in the accommodating space, the camera module comprises a flexible circuit module and an image sensor, and the flexible circuit module is arranged around the image sensor and is electrically connected with the image sensor; and the supporting structure is arranged in the accommodating space and is connected with the flexible circuit module to support the flexible circuit module, so that the flexible circuit module and the bracket are arranged at intervals. The utility model provides a bearing structure among the subassembly of making a video recording is used for supporting the flexible circuit module, avoids the flexible circuit module can conflict the support in the support and produce the effort easily with the support and use image sensor, and then influences the compensation of optics anti-shake mechanism. The stability of the image sensor can be improved.

Description

Camera shooting assembly and electronic equipment

Technical Field

The application relates to the technical field of images, in particular to a camera shooting assembly and an electronic device.

Background

Imaging technologies such as photography are widely used in life and industry, and products such as mobile electronic devices constituted by imaging technologies are widely used. With the development of science and technology and social requirements, the requirements of users for shooting by using electronic equipment and the quality requirements are higher and higher.

In practical application, when a user shoots through the electronic device, the electronic device shakes or a shot object shakes, so that a shot picture is easily blurred. In the related art, an Optical Image Stabilization mechanism (OIS) is designed in the imaging apparatus, and the Optical Image Stabilization mechanism can move a Lens (Lens) and/or an Image Sensor (Image Sensor) according to a shake situation to compensate, so that a picture taken by the imaging apparatus designed with the Optical Image Stabilization mechanism is clearer than a picture taken by the imaging apparatus not designed with the Optical Image Stabilization mechanism.

In the related art, the lens, the image sensor, and the optical anti-shake mechanism are generally designed in a holder of the image pickup apparatus. The image sensor is connected with the mainboard of the electronic equipment through a Flexible Printed Circuit (FPC) so that the image sensor is electrically connected with the mainboard of the electronic equipment. The flexible circuit board can be abutted to the support in the support and easily generates acting force with the support to act on the image sensor, and further the compensation effect of the optical anti-shake mechanism is influenced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a camera shooting assembly and electronic equipment, which can improve the stability of an image sensor of the camera shooting assembly.

The embodiment of the application provides an subassembly of making a video recording, it includes:

the shell comprises a bottom plate and a bracket, wherein the bracket is arranged around the bottom plate to form an accommodating space;

the camera module is at least partially arranged in the accommodating space and comprises a flexible circuit module and an image sensor, and the flexible circuit module is arranged around the image sensor and is electrically connected with the image sensor; and

and the supporting structure is arranged in the accommodating space and is connected with the flexible circuit module to support the flexible circuit module, so that the flexible circuit module and the bracket are arranged at intervals.

The embodiment of the application further provides electronic equipment, the electronic equipment comprises a shell and a camera shooting assembly arranged on the shell, and the camera shooting assembly is the camera shooting assembly.

The bearing structure in the subassembly of making a video recording that this application embodiment provided links to each other with the flexible circuit module in order to support the flexible circuit module, makes the flexible circuit module set up with the support interval all the time. The flexible circuit module is prevented from abutting against the support in the support and easily generating acting force with the support to act on the image sensor, and further the compensation effect of the optical anti-shake mechanism is prevented from being influenced. The stability of the image sensor can be improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, wherein like reference numerals represent like parts in the following description.

Fig. 1 is a first schematic structural diagram of a camera module according to an embodiment of the present application.

Fig. 2 is a schematic view of a partial structure of a camera module according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of an ideal state of the camera module.

Fig. 4 is a schematic structural diagram of the camera module in a non-ideal state.

Fig. 5 is a schematic structural diagram of the camera module when the camera module realizes optical anti-shake in a non-ideal state.

Fig. 6 is a second structural schematic diagram of the camera module according to the embodiment of the present application.

Fig. 7 is a third schematic structural diagram of a camera module according to an embodiment of the present application.

Fig. 8 is a fourth schematic structural diagram of a camera module according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.

Referring to fig. 1 and fig. 2, fig. 1 is a first structural schematic diagram of a camera module according to an embodiment of the present disclosure. Fig. 2 is a schematic partial structural diagram of a camera module according to an embodiment of the present disclosure, and a camera module, such as the camera module 200, may include a housing, such as the housing 240, a camera module, such as the camera module 250, and a support structure, such as the support structure 210. The camera module 250 includes a flexible circuit module 259 and an image sensor 252, the flexible circuit module 259 encloses the image sensor 252 and is electrically connected to the image sensor 252, and the supporting structure 210 is connected to the flexible circuit module 259 to support the flexible circuit module 259, so as to prevent the flexible circuit module 259 from abutting against the housing 240 in the housing 240 and easily generating an acting force with the housing 240 to act on the image sensor 252, thereby affecting a compensation effect of the optical anti-shake mechanism. The stability of the image sensor 252 can be improved. Thereby increasing the clarity of the image captured by the camera module 200.

The following describes the case 240 and the camera module 250 separately, and then describes how the supporting structure supports the flexible circuit module 259.

The chassis 240 may include a bottom plate 244 and a bracket 242, wherein the bracket 242 is disposed around the bottom plate 244, such as the bracket 242 is disposed around an edge of the bottom plate 244. The bracket 242 and the base plate 244 are fixedly connected together to form a receiving space 246, and the receiving space 246 can receive the camera module 250 and the supporting structure 210. The bracket 242 and the base plate 244 may be directly fixedly connected, such as welded, integrally formed. The bracket 242 and the base plate 244 may be fixedly connected together in other manners, such as by connecting structural members. The fastening structure may have an adhesive to fasten the bracket 242 and the base plate 244 together.

It is understood that the housing 240 may be understood as a carrier for receiving and protecting the camera module 250 and the support structure. The structure of the chassis 240 shown in fig. 1 is merely an example of one structure of the embodiment of the present application, and the chassis 240 is not limited.

The camera module 250 may further include a lens such as a lens 251, an image sensor such as an image sensor 252, and a main circuit board such as a main circuit board 253, the main circuit board 253 is located on a side of the camera module 250 away from the side for receiving light, for example, a bottom of the camera module 250, the image sensor 252 is disposed on the main circuit board 253, the flexible circuit module 259 includes a first flexible circuit board 254 and a second flexible circuit board 255, the first flexible circuit board 254 is electrically connected to the main circuit board 253, the second flexible circuit board 255 is electrically connected to the main circuit board 253, and a connection position of the first flexible circuit 254 and the main circuit board 253 and a connection position of the second flexible circuit board 255 and the main circuit board 253 are located on two opposite sides of the main circuit board 253. The flexible circuit modules are respectively connected to two opposite sides of the main circuit board 253 and arranged around the main circuit board 253, the first flexible circuit board 254 and the second flexible circuit board 255 are electrically connected to the other side of the main circuit board 253, the connecting parts 258 of the flexible circuit modules can be fixedly connected with the support 242 through positioning columns and/or bonding pieces, and the first flexible circuit board 254 can be conducted with the second flexible circuit board 255 through a stamp hole welding mode.

The camera module 250 further includes a first anti-shake mechanism 257 of the image sensor 252, the first anti-shake mechanism 257 can limit the image sensor 252 of the camera module to move within a first preset range, for example, the first anti-shake mechanism 257 can drive the image sensor 252 to move along the X-axis direction, so as to achieve optical anti-shake of the image sensor 252 along the X-axis direction; the first anti-shake mechanism 257 may drive the image sensor 252 to move along the Y-axis direction to achieve optical anti-shake of the image sensor 252 along the Y-axis direction; the first anti-shake mechanism 257 can also drive the image sensor 252 to rotate around the Z-axis as a rotation axis, so as to realize optical anti-shake of the image sensor 252 in the Z-axis direction. The Z-axis direction may be the optical axis direction of the camera module 250 or the axis direction parallel to the optical axis, and the X-axis direction and the Y-axis direction may be the axis direction perpendicular to the optical axis direction. The X-axis direction and the Y-axis direction are perpendicular to each other. When the first anti-shake mechanism 257 drives the image sensor 252 to move, due to the connection manner of the first flexible circuit board 254 and the second flexible circuit board 255, the reaction force of the flexible circuit module on the main circuit board 253 can be reduced under an ideal state, and the reaction force of the flexible circuit module on the main circuit board 253 can be controlled within 5mN (100 um).

However, in the process that the first anti-shake mechanism 257 drives the image sensor 252 to move to achieve optical anti-shake of the image sensor 252, the main circuit board 253 moves together with the image sensor 252, and the first flexible circuit board 254 and the second flexible circuit board 255 connected with the main circuit board 253 collide with the bracket 242 in the bracket 142 and easily generate a force with the bracket 242 to act on the image sensor 252, thereby affecting the compensation effect of the first anti-shake mechanism. Please refer to fig. 3 to 5, fig. 3 is a schematic structural diagram of an ideal state of the camera module. Fig. 4 is a schematic structural diagram of the camera module in a non-ideal state. Fig. 5 is a schematic structural diagram of the camera module when the camera module realizes optical anti-shake in a non-ideal state.

Ideally, there is a space (as shown in fig. 2) between the first flexible circuit board 254 and the second flexible circuit board 255 connected to the two opposite sides of the main circuit board 253 and the bracket 242, that is, the flexible circuit module does not tilt and fall toward the bracket 242 and contact with the bracket 242 along with the movement of the main circuit board 253, so as to prevent the flexible circuit module from colliding with the bracket 242 in the bracket 242 and easily generating a force with the bracket 242 and acting on the main circuit board 253 connected to the image sensor 252, and further prevent the main circuit board 235 and the image sensor 252 from tilting. In an irrational state, due to the structural feature that the flexible circuit module is made of a soft material, the flexible circuit module is easy to fall toward the bracket 242 (as shown in fig. 3), the first flexible circuit board 254 and the second flexible circuit board 255 connected to the two opposite sides of the main circuit board 253 are in contact with the bracket 242, that is, the flexible circuit module inclines toward the bracket 242 along with the movement of the main circuit board 253, when the image sensor 252 is driven by the first anti-shake mechanism 257 of the camera module 250 to realize optical anti-shake, the flexible circuit module abuts against the bracket 242 in the bracket 242, and a force is generated by the bracket 242 and acts on the main circuit board 253 connected with the image sensor 252, so that the main circuit board 235 and the image sensor 252 incline (as shown in fig. 4). The problem that the image sensor is unstable due to the inclination of the main circuit board 235 and the image sensor 252 in the process of realizing the optical anti-shake of the image sensor, and the compensation effect of the optical anti-shake mechanism is further affected is solved. The supporting structure 259 of the camera module of the embodiment of the application can support the flexible circuit module, so that the flexible circuit module is always arranged at an interval with the bracket. The situation that the flexible circuit module in the bracket can be abutted against the bracket and easily generates acting force with the bracket to cause the main circuit board 253 to incline at a large angle is avoided. And then acts on the image sensor to influence the compensation action of the optical anti-shake mechanism. The stability of the image sensor can be improved.

Referring to fig. 1 and fig. 2, the flexible circuit module 259 includes a connection portion arranged along a first direction and an enclosure portion arranged along a second direction, the second direction is different from the first direction, wherein the first direction may be an X-axis direction, the second direction may be a Z-axis direction, the first direction is perpendicular to the second direction, the first flexible circuit board 254 includes a first connection portion 2541 arranged along the first direction and a first enclosure portion 2542 arranged along the second direction, the second flexible circuit board 255 includes a second connection portion 2551 arranged along the first direction and a second enclosure portion 2552 arranged along the second direction, the first connection portion 2541 and the second connection portion 2551 form the connection portion of the flexible circuit module 259, and the first enclosure portion 2542 and the second enclosure portion 2552 form the enclosure portion of the flexible circuit module 259. The first connection portion 2541 may be electrically connected to the image sensor 252 through the main circuit board 253, the second connection portion 2551 may be electrically connected to the image sensor 252 through the main circuit board 253 to electrically connect the connection portion to the image sensor 252, and the support structure 210 may include a first support 211 supporting the first flexible circuit board 254 and a second support 212 supporting the second flexible circuit board 255.

In order to prevent the enclosing part of the flexible circuit module from falling to the bracket 242, the supporting structure is connected to at least a portion of the connecting part and at least a portion of the enclosing part, so that the enclosing part and the bracket are spaced apart from each other. For example, the first supporting member 211 includes a first supporting portion 2111 connected to at least a portion of the first connecting portion 2541, a second supporting portion 2112 connected to at least a portion of the first enclosing portion 2542, and a third supporting portion 2113 connected to the first supporting portion 2111 and the second supporting portion 2112, and the third supporting portion 2113 forms a round angle to connect the first supporting portion 2111 and the second supporting portion 2112, respectively. The second support 212 includes a fourth support 2121 connected to at least a portion of the second connection portion 2551, a fifth support 2122 connected to at least a portion of the second surrounding portion 2552, and a sixth support connected to the fourth support 2121 and the fifth support 2122, and the sixth support 2123 forms a rounded corner to connect the fourth support 2121 and the fifth support 2122. Since the first and second supporting

members

211 and 212 have rigidity higher than that of the flexible circuit module, the flexible circuit module can be supported, the first and second supporting

members

211 and 212 may include a rigid carrier, which may be a rigid carrier such as a steel plate, a copper plate, or an iron plate, and one end of the rigid carrier may be connected to the main circuit board 253. It is understood that a rigid carrier may be disposed between the flexible circuit module 259 and the bracket 242, and the rigid carrier may hold the flexible circuit module 259 to support the flexible circuit module 259. In some embodiments, the flexible circuit module 259 may be disposed between the rigid carrier and the bracket 242, and the flexible circuit module 259 needs to be bonded to the rigid carrier by an adhesive. The first flexible circuit board 254 and the second flexible circuit board 255 can be supported by the rigid carrier, so that the flexible circuit module 259 is always spaced from the bracket. The situation that the flexible circuit module 259 in the bracket 242 collides with the bracket 242 and easily generates a force with the bracket 242 to cause the main circuit board 253 to tilt at a large angle is avoided. And further to the image sensor 252, affecting the compensation function of the optical anti-shake mechanism. The stability of the image sensor can be improved. The structure of the rigid carrier shown in the embodiment of the present application is merely an example of one structure of the embodiment of the present application, and the structure of the rigid carrier is not limited.

In some embodiments, the supporting structure 210 may include a plastic carrier, please refer to fig. 2 and 6, fig. 6 is a schematic diagram of a second structure of the camera module according to an embodiment of the present disclosure, and the flexible circuit module 259 is disposed between the supporting structure 210 and the bracket 242. The support structure 210 includes a first support member 211 and a second support member 212, the first support member 211 includes a first plastic carrier having a first connection surface 2114 connected to the first enclosing portion 2542, a second connection surface 2115 connected to the first connection portion 2541, and a third connection surface 2116 connecting the first connection surface 2114 and the second connection surface 2115, the third connection surface 2116 being obliquely disposed. The second support 212 comprises a second plastic carrier having a fourth attachment face 2124 connected to the second surrounding portion 2552, a fifth attachment face 2125 connected to the second connecting portion 2551, and a sixth attachment face 2126 connecting the fourth attachment face 2124 and the fifth attachment face 2125, the sixth attachment face 2126 being obliquely arranged. By obliquely disposing the third connection surface 2116 and the sixth connection surface 2126, it is possible to prevent the first plastic carrier and the second plastic carrier from colliding with the main circuit board 253 or the first anti-shake mechanism 257 when the first anti-shake mechanism 257 drives the image sensor 252 to move, which may affect the optical anti-shake of the first anti-shake mechanism 257. The plastic carrier may be curable glue, and a first plastic carrier is disposed on the first flexible circuit board 254 by dispensing, and a second plastic carrier is disposed on the second flexible circuit board 255. The first flexible circuit board 254 and the second flexible circuit board 255 can be supported by the plastic carrier, so that the flexible circuit module is always arranged at an interval from the bracket. The situation that the flexible circuit module in the bracket 242 will collide with the bracket 242 and easily generate a force with the bracket 242 to cause the main circuit board 253 to tilt at a large angle is avoided. And further to the image sensor 252, affecting the compensation function of the optical anti-shake mechanism. The stability of the image sensor can be improved. It is to be understood that the structure of the plastic carrier shown in the embodiments of the present application is only an example of one structure of the embodiments of the present application, and the structure of the plastic carrier is not limited.

In some embodiments, to further improve the supporting effect of the supporting structure, the supporting structure may include a rigid carrier and a plastic carrier, the rigid carrier may be the rigid carrier described above and disposed between the flexible circuit module and the bracket, and the plastic carrier may be the plastic carrier described above and the flexible circuit module is disposed between the plastic carrier and the rigid carrier. It is to be understood that the support structure shown in the embodiments of the present application is only an example of one structure of the embodiments of the present application, and the structure of the support structure is not limited.

In some embodiments, in order to further improve the stability of the image sensor, the image capturing assembly further includes a supporting assembly, please continue to refer to fig. 7, and fig. 7 is a third structural schematic diagram of the image capturing assembly according to the embodiment of the present disclosure.

The camera module 200 further includes a support module 220, the support module 220 is disposed between the main circuit board 253 and the bottom plate 244, and the support module 220 is used for supporting the main circuit board 253. When first anti-shake mechanism 257 drive image sensor 252 at the module 250 of making a video recording realizes optics anti-shake, because the module 250 of making a video recording has certain quality, when first anti-shake mechanism 257 drive image sensor 252 moved, unstable problem still can appear moving, consequently, set up supporting component 220 between main circuit board 253 and bottom plate 244, when not restricting the removal of first anti-shake mechanism 257 drive main circuit board 253, can also play the supporting role to main circuit board 253, further improve the stability of image sensor 252 motion.

The supporting member 220 may include at least one ball structure 221 and at least one elastic member 222, one end of the elastic member 222 is fixedly connected to the bottom plate 244, the other end of the elastic member is connected to the ball structure 221, and the ball structure 221 abuts against the main circuit board 253. The contact between the ball structure 221 and the main circuit board 253 can be point contact, the contact area between the main circuit board 253 and the ball structure 221 is small, the friction force is small, and when the first driving mechanism 257 drives the main circuit board 253 to move, the support assembly 220 does not limit the movement of the main circuit board 253.

One ball structure 221 and one elastic member 222 may form one support component group 201, a plurality of support component groups 201 may be disposed between the main circuit board 253 and the bottom plate 244, and five support component groups arranged at equal intervals along the X-axis direction are disposed between the main circuit board 253 and the bottom plate 244, and the equal interval arrangement of the five support component groups may be understood as that distances between two adjacent support component groups in the five support component groups are the same. One of the five sets of support assemblies is disposed near the junction of the first flexible circuit board 254 and the main circuit board 253, and one of the five sets of support assemblies is disposed near the junction of the second flexible circuit board 255 and the main circuit board 253, so that the support capability of the support assemblies for the bottom of the camera assembly can be improved. In some embodiments, multiple sets of support assemblies arranged along the Y-axis direction and multiple sets of support assemblies arranged along the X-axis direction may be disposed between the main circuit board 253 and the bottom plate 244 according to actual requirements.

The elastic member 222 may be a spring, a spring plate, a torsion spring, or a bellows, and the ball structure may be a metal ball structure with certain rigidity.

In some embodiments, in order to further improve the stability of the image sensor, the image capturing assembly further includes a supporting assembly, please continue to refer to fig. 8, and fig. 8 is a third structural schematic diagram of the image capturing assembly according to the embodiment of the present disclosure.

The support assembly 220 comprises at least one rolling member 223, the base plate is provided with at least one groove 224, at least a part of one rolling member 223 is arranged in the groove 224, one end of the rolling member 223 abuts against the groove bottom of the groove 224, the other end abuts against the main circuit board 253, and the rolling member 223 can roll in the groove 224.

The rolling member 223 may be a ball structure, the contact between the ball structure and the main circuit board 253 may be a point contact, the contact area between the main circuit board 253 and the ball structure is small, the friction force is small, and when the first driving mechanism 257 drives the main circuit board 253 to move, the support member 220 does not limit the movement of the main circuit board 253.

Among them, one rolling member 223 and one groove 224 may constitute one support component group 202, a plurality of support component groups 202 may be disposed between the main circuit board 253 and the bottom plate 244, and five support component groups arranged at equal intervals in the X-axis direction are disposed between the main circuit board 253 and the bottom plate 244, and the arrangement of the five support component groups at equal intervals may be understood as that the distances between two adjacent support component groups in the five support component groups are all the same. One of the five sets of support assemblies is disposed near the junction of the first flexible circuit board 254 and the main circuit board 253, and one of the five sets of support assemblies is disposed near the junction of the second flexible circuit board 255 and the main circuit board 253, so that the support capability of the support assemblies for the bottom of the camera assembly can be improved. In some embodiments, multiple sets of support assemblies arranged along the Y-axis direction and multiple sets of support assemblies arranged along the X-axis direction may be disposed between the main circuit board 253 and the bottom plate 244 according to actual requirements. In order to realize the dual-optical anti-shake function of the camera module 200, the camera module 200 may further include a second anti-shake mechanism 256, and the second anti-shake mechanism 256 is configured to limit the lens 251 of the camera module to move within a second predetermined range. The second anti-shake mechanism 256 may drive the lens 251 to move along the X-axis direction to achieve optical anti-shake of the X-axis, the second anti-shake mechanism 256 may drive the lens 251 to move along the Y-axis direction to achieve optical anti-shake of the Y-axis, and the second anti-shake mechanism 256 may also drive the lens 251 to move along the Z-axis direction to achieve optical anti-shake of the Z-axis or achieve a zoom function of the lens 251. The Z-axis direction may be the optical axis direction of the camera module 250 or the axis direction parallel to the optical axis, and the X-axis direction and the Y-axis direction may be the axis direction perpendicular to the optical axis direction. The X-axis direction and the Y-axis direction are perpendicular to each other. In the related art, only a single anti-shake function such as lens anti-shake or image sensor anti-shake can be realized, but an anti-shake angle that can be realized by a single anti-shake structure such as lens anti-shake or image sensor anti-shake is limited by a structural space of the electronic device, and only an optical anti-shake function of a small angle (such as within 1 ° or within 1.5 °) can be realized. The camera device of this application embodiment can realize camera lens anti-shake and image sensor anti-shake simultaneously, and integrated camera lens anti-shake function and image sensor anti-shake function can realize the optics anti-shake of bigger angle for correlation technique, effectively promotes the optics anti-shake effect of subassembly of making a video recording.

It is to be understood that the first anti-shake mechanism 257 for realizing the anti-shake of the image sensor 252 provided in the embodiments of the present application may adopt any one of an electromagnetic motor, a piezoelectric motor, a memory alloy type driver, and a micro electro mechanical system to realize an anti-shake function, and the electromagnetic motor may include a leaf spring type motor and a ball roller type motor. For example, the first anti-shake mechanism 257 may be a memory alloy type actuator, and the memory metal type actuator may include a deformation element, and the deformation element may deform to drive the image sensor 252 to move in a direction perpendicular to the optical axis of the lens 251 (including an X direction or a Y direction), or drive the image sensor 252 to rotate with the optical axis of the lens 251 or an axis direction parallel to the optical axis (Z axis) as a rotation axis, so as to implement an optical anti-shake function of the image sensor 252. The shape-changing element may be made of Shape Memory Alloy (SMA), and the shape memory alloy may heat and deform the shape memory alloy in a power-on state, and may change the length of the shape-changing element during deformation, so as to drive the image sensor 252 to move and realize the anti-shake function of the image sensor 252.

The second anti-shake mechanism 256 for realizing the anti-shake of the lens 251 according to the embodiment of the present application may adopt any one of an electromagnetic motor, a piezoelectric motor, a memory alloy type driver, and a micro electro mechanical system to realize the anti-shake function of the lens 251.

An embodiment of the present application further provides an electronic device, where the electronic device may specifically be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device, and the following description takes the mobile phone as an example, please refer to fig. 1 and 9, and fig. 9 is a schematic structural diagram of the electronic device provided in the embodiment of the present application.

The electronic device 100 may include a housing 110, a camera assembly 200, and a display screen 120. The display screen 120 is disposed on the housing 110, and can be used for displaying pictures, and the camera module 200 can be disposed on the housing 110 and can receive light emitted from an external environment to capture pictures. The camera assembly 200 may be a camera assembly 200 as described above.

The camera assembly 200 may include a first anti-shake mechanism 257, a second anti-shake mechanism 256, a lens 251, and an image sensor 252. The first anti-shake mechanism 257 drives the image sensor 252 to move so as to realize the optical anti-shake function of the image sensor 252, and the second anti-shake mechanism 256 drives the lens 251 to move so as to realize the lens anti-shake function of the lens 251. The image sensor 252 is disposed opposite to the lens 251, and in the embodiment of the present disclosure, the camera module 200 may be used to implement functions of photographing, recording, unlocking by face recognition, code scanning payment, and the like of the electronic device 100. It should be noted that the camera module 200 may be a front-mounted camera as shown in fig. 7, or may be a rear-mounted camera, which is not limited in this embodiment.

Specifically, the lens 251 may be made of glass or plastic. The lens 251 is mainly used to change the propagation path of light and focus the light. The lens 251 may include a plurality of lens sets, which may rectify and filter light rays from each other; so that the lens layers filter stray light (e.g., infrared light) when the light passes through the lens 251, so as to increase the imaging effect of the camera module 200. The image sensor 252 may be a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The image sensor 252 may be disposed opposite to the lens 251 in an optical axis direction of the camera module 200 (i.e., the optical axis direction of the lens 251), and is mainly configured to receive light collected by the lens 251 and convert an optical signal into an electrical signal, so as to meet an imaging requirement of the camera module 200. The first anti-shake mechanism 257 and the second anti-shake mechanism 256 are mainly used to improve the imaging effect of the camera module 200 caused by shaking of the user during the use process, so that the imaging effect of the image sensor 252 can meet the use requirement of the user.

Based on the optical anti-shake technology, a sensor such as a gyroscope or an accelerometer disposed in the electronic device 100 (or the image capturing assembly 200) may detect shake of the lens 251 and/or the image sensor 252 to generate a shake signal, and transmit the shake signal to a processing chip of the electronic device 100 and/or the image capturing assembly 200, and the processing chip of the electronic device 100 and/or the image capturing assembly 200 may calculate a displacement amount that the first anti-shake mechanism 257 and/or the second anti-shake mechanism 256 needs to compensate, so that the first anti-shake mechanism 257 and/or the second anti-shake mechanism 256 may compensate the lens 251 and/or the image sensor 252 according to a shake direction and the shake displacement amount, thereby improving an imaging effect of the image capturing assembly 200 due to shake of a user during use.

The supporting structure in the subassembly of making a video recording among the electronic equipment that this application embodiment provided links to each other with the flexible circuit module in order to support the flexible circuit module, makes the flexible circuit module set up with the support interval all the time. The flexible circuit module is prevented from abutting against the support in the support and easily generating acting force with the support to act on the image sensor, and further the compensation effect of the optical anti-shake mechanism is prevented from being influenced. The stability of the image sensor can be improved.

The foregoing describes in detail a camera module and an electronic device provided in an embodiment of the present application, and a specific example is applied to explain the principle and the embodiment of the present application, and the description of the foregoing embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A camera assembly, comprising:

2. The camera assembly of claim 1, wherein the flexible circuit module includes a connecting portion arranged along a first direction and an enclosing portion arranged along a second direction, the second direction is different from the first direction, the connecting portion is electrically connected to the image sensor, and the supporting structure is connected to at least a portion of the connecting portion and at least a portion of the enclosing portion, respectively, such that the enclosing portion and the bracket are spaced apart from each other.

3. The camera assembly of claim 2, wherein the first and second directions are perpendicular to each other.

4. The camera assembly of any of claims 1-3, wherein the support structure includes at least one of a rigid carrier and a plastic carrier.

5. The camera assembly of claim 4, wherein the support structure includes a rigid carrier disposed between the flexible circuit module and the bracket.

6. The camera assembly of claim 4, wherein the support structure includes a plastic carrier, the flexible circuit module being disposed between the plastic carrier and the bracket.

7. The camera module according to claim 6, wherein the plastic carrier has a first connecting surface connected to the surrounding portion, a second connecting surface connected to the connecting portion, and a third connecting surface connecting the first connecting surface and the second connecting surface, the third connecting surface being disposed obliquely.

8. The camera assembly of claim 4, wherein the support structure includes a rigid carrier and a plastic carrier, the rigid carrier being disposed between the flexible circuit module and the bracket, the flexible circuit module being disposed between the plastic carrier and the rigid carrier.

9. The camera assembly of claim 1, wherein the flexible circuit module includes a first flexible circuit board and a second flexible circuit board, the camera module includes a main circuit board, the image sensor is disposed on a side of the main circuit board away from the base plate, the first flexible circuit board and the second flexible circuit board are electrically connected to the image sensor through the main circuit board, and the first flexible circuit board and the second flexible circuit board are connected to opposite sides of the main circuit board;

the support structure includes a first support member supporting the first flexible circuit board and a second support member supporting the second flexible circuit board.

10. The camera assembly of claim 9, further comprising a support assembly disposed between the main circuit board and the base plate, the support assembly configured to support the main circuit board.

11. The camera assembly of claim 10, the support assembly comprising at least one ball structure and at least one resilient member, one end of one of the resilient members being fixedly connected to the base plate and the other end being connected to one of the ball structures, the ball structure abutting the main circuit board.

12. The camera assembly of claim 10, the support assembly including at least one roller, the base plate having at least one recess, at least a portion of one of the rollers being disposed in the recess, one end of the roller abutting the bottom of the recess and the other end abutting the main circuit board, the roller being rollable within the recess.

13. The camera assembly of claim 1, wherein the camera module further comprises a first anti-shake mechanism configured to drive the image sensor to move for optical anti-shake, and the support structure is configured to support the flexible circuit module when the first anti-shake mechanism drives the image sensor to move.

14. An electronic device, characterized in that the electronic device comprises a housing and a camera assembly arranged on the housing, wherein the camera assembly is the camera assembly according to any one of claims 1 to 13.