CN216558398U

CN216558398U - Laminated heat exchanger

Info

Publication number: CN216558398U
Application number: CN202123296495.1U
Authority: CN
Inventors: 徐伟伟
Original assignee: Aihede Heat Exchange System Wuxi Co ltd
Current assignee: Aihede Heat Exchange System Wuxi Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-05-17
Anticipated expiration: 2031-12-24

Abstract

The utility model relates to a laminated heat exchanger, which comprises a plurality of chip components and a plurality of fins, wherein each chip component comprises an upper chip body and a lower chip body, the upper chip body is assembled and connected with the lower chip body, medium inlet and outlet cavities at two ends and a middle flow passage are reserved between the upper chip body and the lower chip body, medium inlet and outlet through holes are formed in the medium inlet and outlet cavities at the upper and lower parts, the plurality of chip components are assembled and connected together through the medium inlet and outlet cavities at two ends, all the medium inlet and outlet cavities are connected in series to form a medium inlet and outlet channel, the lower chip body at the lowest side of each chip component is not provided with a medium inlet and outlet through hole, the lower end of the lower chip body at the lowest side is connected with a lower cover plate, the upper chip body at the highest side of each chip component is connected with an upper cover plate through hole, the cover plate through hole is provided with a medium inlet and outlet joint, the fins are arranged between the chip components, the laminated heat exchanger is simple in assembly operation, few in process steps and high in production efficiency.

Description

Laminated heat exchanger

Technical Field

The utility model relates to heat exchange equipment, in particular to a laminated heat exchanger.

Background

With the continuous development of heat exchangers, various types of heat exchangers are continuously increased, the application of the conventional plate-fin heat exchanger is wide, the plate-fin heat exchanger comprises a core body and oil receiving chambers connected with the two sides of the core body, the core body comprises a partition plate, fins, long sealing strips and short sealing strips, the assembly of the core body is troublesome, the oil receiving chambers need to be additionally welded, the assembly production process has multiple steps, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned drawbacks of the prior art, it is an object of the present invention to provide a stacked heat exchanger to solve one or more problems of the prior art.

In order to achieve the purpose, the technical scheme of the utility model is as follows:

a laminated heat exchanger comprises a plurality of chip components and a plurality of fins, wherein each chip component comprises an upper chip body and a lower chip body, the upper chip body and the lower chip bodies are in assembly connection, a medium inlet and outlet cavity and a middle flow channel are reserved between the upper chip body and the lower chip bodies at two ends, medium inlet and outlet through holes are formed in the medium inlet and outlet cavity and are opened up and down, the chip components are in assembly connection together through the medium inlet and outlet cavities at two ends, all the medium inlet and outlet cavities are connected in series to form a medium inlet and outlet channel, the lower chip body at the lowest side of the chip components is not provided with medium inlet and outlet through holes, the lower end of the lower chip body at the lowest side is connected with a lower cover plate, the upper chip body at the uppermost side of the chip components is connected with an upper cover plate, the upper cover plate is positioned at the upper side of the medium inlet and outlet through holes of the upper chip body and is provided with cover plate through holes, and medium inlet and outlet connectors are connected on the cover plate through holes, the fins are mounted between the chip assemblies.

As a further improvement of the above technical solution:

go up the chip body with chip body joint forms the chip subassembly down.

And two adjacent chip assemblies are connected through the medium inlet and outlet cavity in a clamping manner.

And two ends of the upper chip body and two ends of the lower chip body are processed into circular arcs.

The upper chip body and the lower chip body are formed by stamping through a stamping die.

The upper cover plate and the lower cover plate are integrally connected with two connecting plates, and connecting holes are formed in the connecting plates.

And two corners of the connecting plate close to the outer side are processed into round corners.

The connecting hole is a long round hole.

The laminated heat exchanger is integrally brazed.

Compared with the prior art, the utility model has the following beneficial technical effects:

1) the laminated heat exchanger comprises chip components and fins, wherein the chip components are formed by assembling an upper chip body and a lower chip body, the chip components form a flow channel and a medium inlet and outlet cavity, the chip components are connected through the medium inlet and outlet cavity, the medium inlet and outlet cavity is connected into a medium inlet and outlet channel, an oil receiving chamber is not required to be additionally installed, the fins are assembled among the chip components and are integrally brazed, the assembling operation is simple, the process steps are few, and the production efficiency is high;

2) the upper cover plate and the lower cover plate are integrally connected with the two connecting plates, so that the fan cover can be conveniently connected;

3) the upper chip body and the lower chip body are formed by stamping, so that the processing is convenient and the forming is fast;

4) compared with a plate-fin heat exchanger, the stacked-type heat exchanger is light in weight and low in material cost.

Drawings

Fig. 1 shows a schematic view of the structure of a stacked heat exchanger of the present invention.

Fig. 2 shows an exploded view of the structure of the stacked heat exchanger of the present invention.

In the drawings, the reference numbers:

1. a chip assembly; 11. an upper chip body; 12. a lower chip body; 13. entering and exiting the media chamber; 131. a medium inlet and outlet through hole; 14. a flow channel; 2. a fin; 3. a lower cover plate; 4. an upper cover plate; 41. a cover plate through hole; 5. a media inlet and outlet joint; 6. a connecting plate; 61. and connecting the holes.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the following detailed description of the present invention is provided with reference to the accompanying drawings and the detailed description. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise scale for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.

As shown in fig. 1 and fig. 2, the stacked heat exchanger of the present embodiment includes a plurality of chip assemblies 1 and a plurality of fins 2, the chip assemblies 1 include an upper chip body 11 and a lower chip body 12, the upper chip body 11 and the lower chip body 12 are assembled and connected in a snap-fit manner, a medium inlet and outlet cavity 13 and a middle flow channel 14 are left between the upper chip body 11 and the lower chip body 12, medium inlet and outlet through holes 131 are formed in the medium inlet and outlet cavity 13 and in the lower opening, the plurality of chip assemblies 1 are assembled and connected together in a snap-fit manner through the medium inlet and outlet cavities 13 at both ends, and all the medium inlet and outlet cavities 13 are connected in series to form a medium inlet and outlet channel, the lower chip body 12 at the lowest side of the chip assembly 1 is not provided with the medium inlet and outlet through hole 131, the lower end of the lower chip body 12 at the lowest side is connected with a lower cover plate 3, the upper cover plate 4 is connected to the upper chip body 11 at the highest side of the chip assembly 1, the upper cover plate 4 is provided with a cover plate through hole 41 at a position above the medium inlet and outlet through hole 131 of the upper chip body 11, the cover plate through hole 41 is connected with the in-out medium joint 5, and the fin 2 is installed between the chip assemblies 1.

The upper cover plate 4 and the lower cover plate 3 are integrally connected with two connecting plates 6, connecting holes 61 are formed in the connecting plates 6, two corners of the outer side of each connecting plate 6 are machined into round corners, the connecting holes 61 are long round holes and are connected with the fan cover through the connecting plates 6, and cold air and fluid media are cooled through a fan on the fan cover.

The two ends of the upper chip body 11 and the lower chip body 12 are processed into circular arcs, so that the appearance of the laminated heat exchanger is round and smooth, excessive edges and corners do not exist, and the laminated heat exchanger is not easy to collide and hurt.

The upper chip body 11 and the lower chip body 12 are formed by stamping through a stamping die, and are convenient to process and fast in forming.

The laminated heat exchanger is integrally brazed, the brazing process is omitted, the assembly operation is simple, the process steps are few, and the production efficiency is high.

When the laminated heat exchanger is assembled, the upper chip body 11 and the lower chip body 12 are assembled in a clamping way to form a plurality of chip assemblies 1, the lower cover plate 3 is placed at the bottommost part, the bottommost chip assembly 1 is placed, a fin 2 is arranged on the chip component 1 at the lowest side, the chip component 1 is clamped and assembled on the chip component 1 at the lowest side through the medium inlet and outlet cavity 13, the fins 2 are clamped by the two assembled chip components 1, then the chip components 1 and the fins 2 are assembled in sequence, finally an upper cover plate 4 and two medium inlet and outlet connectors 5 are arranged on the chip component 1 at the uppermost side in sequence, namely, the assembly is completed, after the assembly is completed, the laminated heat exchanger is soaked in the solution formed by the brazing powder, the surface of the laminated heat exchanger is covered with the brazing material, then the laminated heat exchanger enters a continuous furnace and slides to move forward, the brazing solder on the surface of the laminated heat exchanger can be solidified, so that the sealing performance of the heat exchanger is realized, and the integral laminated heat exchanger is formed in one step.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several polygons and modifications can be made without departing from the inventive concept, and these shall all fall within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A stacked heat exchanger, characterized in that: comprises a plurality of chip components and a plurality of fins, wherein the chip components comprise an upper chip body and a lower chip body, the upper chip body and the lower chip body are assembled and connected, a medium inlet and outlet cavity at two ends and a flow passage in the middle are reserved between the upper chip body and the lower chip body, medium inlet and outlet through holes are formed in the upper and lower parts of the medium inlet and outlet cavity, a plurality of chip components are assembled and connected together through the medium inlet and outlet cavities at the two ends, all the medium inlet and outlet cavities are connected in series to form medium inlet and outlet channels, the lower chip body at the lowest side of the chip assembly is not provided with medium inlet and outlet through holes, the lower end of the lower chip body at the lowest side is connected with a lower cover plate, the upper chip body at the uppermost side of the chip assembly is connected with an upper cover plate, the upper cover plate is provided with a cover plate through hole at the upper side of the medium inlet and outlet through hole of the upper chip body, the cover plate through hole is connected with a medium inlet and outlet connector, and the fins are arranged between the chip components.

2. The stacked heat exchanger of claim 1, wherein: go up the chip body with chip body joint forms the chip subassembly down.

3. The stacked heat exchanger of claim 1, wherein: and two adjacent chip assemblies are connected through the medium inlet and outlet cavity in a clamping manner.

4. The stacked heat exchanger of claim 1, wherein: and two ends of the upper chip body and two ends of the lower chip body are processed into circular arcs.

5. The stacked heat exchanger of claim 1, wherein: the upper chip body and the lower chip body are formed by stamping through a stamping die.

6. The stacked heat exchanger of claim 1, wherein: the upper cover plate and the lower cover plate are integrally connected with two connecting plates, and connecting holes are formed in the connecting plates.

7. The stacked heat exchanger of claim 6, wherein: and two corners of the connecting plate close to the outer side are processed into round corners.

8. The stacked heat exchanger of claim 6, wherein: the connecting hole is a long round hole.

9. The stacked heat exchanger of claim 1, wherein: the laminated heat exchanger is integrally brazed.