CN216542674U - Grinding tool for dissecting and analyzing plastic packaged semiconductor discrete device - Google Patents
Grinding tool for dissecting and analyzing plastic packaged semiconductor discrete device Download PDFInfo
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- CN216542674U CN216542674U CN202123261619.2U CN202123261619U CN216542674U CN 216542674 U CN216542674 U CN 216542674U CN 202123261619 U CN202123261619 U CN 202123261619U CN 216542674 U CN216542674 U CN 216542674U
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Abstract
The utility model discloses a grinding tool for dissection analysis of a plastic-packaged semiconductor discrete device, which comprises a hollow base, wherein the top of the hollow base is provided with a slotted hole communicated with the hollow base, the top of the hollow base is provided with a collecting box positioned on one side of the slotted hole, a second threaded rod is rotatably connected between the inner walls of two sides of the hollow base, a threaded block is sleeved on the second threaded rod in a threaded manner, the threaded block is positioned in the slotted hole, a servo motor is fixedly arranged on one outer side wall of the hollow base, and one end of the second threaded rod penetrates through the outer side wall of the hollow base and is fixedly connected with an output shaft of the servo motor. The plastic package device grinding device not only can be used for compressing and fixing plastic package devices with different sizes, but also can be used for adjusting the grinding thickness of the compressed and fixed plastic package devices, so that the grinding requirements of the plastic package devices with different sizes can be met, waste materials generated in grinding can be collected, subsequent cleaning is facilitated, the processing environment is protected, and the plastic package device grinding device is convenient to use.
Description
Technical Field
The utility model relates to the technical field of grinding tools, in particular to a grinding tool for plastic package discrete semiconductor device dissection analysis.
Background
At present, when a failure product of a plastic packaged discrete semiconductor device is analyzed in the semiconductor industry, the side surface of the plastic packaged device needs to be ground so as to observe the cross section of an internal chip.
When the existing grinding tool for dissecting and analyzing the plastic packaged semiconductor discrete device is used, the plastic packaged devices with different sizes are difficult to fix, the plastic packaged devices are easy to loosen after being fixed, meanwhile, the grinding thickness of the plastic packaged devices is difficult to adjust, waste materials generated during grinding can fall onto a grinding table board, and the grinding tool is inconvenient to clean manually.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides a grinding tool for dissecting and analyzing a plastic packaged semiconductor discrete device.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the grinding tool for plastic package discrete semiconductor device anatomical analysis comprises a hollow base, wherein a slotted hole communicated with the hollow base is formed in the top of the hollow base, a collecting box located on one side of the slotted hole is arranged at the top of the hollow base, a second threaded rod is rotatably connected between inner walls of two sides of the hollow base, a threaded block is sleeved on the second threaded rod and located in the slotted hole, a servo motor is fixedly mounted on the outer side wall of the hollow base, one end of the second threaded rod penetrates through the outer side wall of the hollow base and is fixedly connected with an output shaft of the servo motor, a pressing mechanism located above the hollow base is arranged at the top of the threaded block, and an auxiliary polishing mechanism located on one side, away from the slotted hole, of the collecting box is arranged at the top of the hollow base.
Preferably, the pressing mechanism comprises a fixed block fixedly installed at the top of the threaded block, the fixed block is located above the collecting box, a side block is fixedly installed on one side wall, close to the collecting box, of the fixed block, the top of the side block is provided with a first threaded rod in threaded connection with the top of the side block in a penetrating mode, a rotating wheel is fixedly installed at one end, located above the side block, of the first threaded rod, and one end, located below the side block, of the first threaded rod is connected with a pressing block in a rotating mode.
Preferably, the auxiliary polishing mechanism comprises two vertical plates fixedly mounted at the top of the hollow base, two symmetrically arranged slide rods are fixedly connected between the two vertical plates, the outer side walls of the two slide rods are slidably sleeved with the same slide block, an air cylinder is arranged on the outer side wall of one vertical plate, the telescopic end of the air cylinder penetrates through the outer side wall of one vertical plate and is fixedly connected to one side wall of the slide block, a grinding block is arranged on one side, close to the threaded block, of the slide block, and the grinding block is located above the collecting box.
Preferably, the fixing block and the side block are integrally formed.
Preferably, the vertical plate and the hollow base are integrally formed.
Preferably, the compact is circular.
The utility model has the beneficial effects that:
through setting up runner, first threaded rod, briquetting, second threaded rod, abrasive brick, servo motor, riser, slider, slide bar, abrasive brick and collecting box, can compress tightly fixedly to the plastic envelope device of unidimensional not, can adjust compressing tightly fixed grinding thickness simultaneously to can satisfy the grinding requirement of unidimensional plastic envelope device, can also collect the waste material that produces when grinding, be convenient for carry on follow-up clearance, protected the processing environment, convenient to use.
The device not only can compress and fix the plastic package devices with different sizes, but also can adjust the grinding thickness of the compression and fixation, thereby meeting the grinding requirements of the plastic package devices with different sizes, collecting waste materials generated during grinding, facilitating subsequent cleaning, protecting the processing environment and being convenient to use.
Drawings
Fig. 1 is a schematic structural diagram of a mold for anatomical analysis of a plastic packaged discrete semiconductor device according to the present invention;
FIG. 2 is an enlarged schematic view of FIG. 1 at A according to the present invention;
FIG. 3 is a schematic plan view of the interior of the hollow base of the present invention.
In the figure: the grinding machine comprises a hollow base 1, a collecting box 2, an air cylinder 3, a servo motor 4, a sliding block 5, a sliding rod 6, a vertical plate 7, a slotted hole 8, a rotating wheel 9, a first threaded rod 10, a pressing block 11, a threaded block 12, a fixed block 13, a side block 14, a second threaded rod 15 and a grinding block 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, the grinding tool for plastic package discrete semiconductor device dissection analysis comprises a hollow base 1, a slotted hole 8 communicated with the hollow base 1 is formed in the top of the hollow base 1, a collecting box 2 located on one side of the slotted hole 8 is arranged on the top of the hollow base 1, a second threaded rod 15 is rotatably connected between the inner walls of two sides of the hollow base 1, a threaded block 12 is sleeved on the second threaded rod 15 in a threaded manner, the threaded block 12 is located in the slotted hole 8, a servo motor 4 is fixedly installed on one outer side wall of the hollow base 1, one end of the second threaded rod 15 penetrates through the outer side wall of the hollow base 1 and is fixedly connected with an output shaft of the servo motor 4, and a pressing mechanism located above the hollow base 1 is arranged at the top of the threaded block 12;
the pressing mechanism comprises a fixed block 13 fixedly mounted at the top of a threaded block 12, the fixed block 13 is positioned above the collecting box 2, a side block 14 is fixedly mounted on one side wall, close to the collecting box 2, of the fixed block 13, the fixed block 13 and the side block 14 are integrally formed, the integrally formed structure is firm, the service life is long, a first threaded rod 10 in threaded connection with the side block 14 penetrates through the top of the side block 14, a rotating wheel 9 is fixedly mounted at one end, located above the side block 14, of the first threaded rod 10, a pressing block 11 is rotatably connected at one end, located below the side block 14, of the first threaded rod 10, and the pressing block 11 is circular;
the top of cavity base 1 is provided with the supplementary grinding machanism who is located collecting box 2 and keeps away from slotted hole 8 one side, supplementary grinding machanism includes two risers 7 of fixed mounting at cavity base 1 top, riser 7 and cavity base 1 integrated into one piece, the integrated into one piece sound construction, long service life, two slide bars 6 that fixedly connected with symmetry set up between two risers 7, sliding sleeve is equipped with same slider 5 on two slide bar 6's the lateral wall, be provided with cylinder 3 on the lateral wall of its riser 7, the flexible end of cylinder 3 runs through the lateral wall and the fixed connection of its riser 7 on a lateral wall of slider 5, one side that slider 5 is close to threaded block 12 is provided with abrasive brick 16, abrasive brick 16 is located the top of collecting box 2.
When the plastic packaging device is used, a plastic packaging device is positioned below a pressing block 11, a rotating wheel 9 is manually rotated to enable a first threaded rod 10 to rotate, the first threaded rod 10 rotates to enable the pressing block 11 to move downwards, so that the pressing block 11 is tightly abutted against the plastic packaging device, the plastic packaging device is tightly pressed and fixed, a servo motor 4 is started to enable a second threaded rod 15 to rotate, the second threaded rod 15 rotates to enable a threaded block 12 to move towards a direction close to an abrasive block 16, so that the plastic packaging device moves towards the direction close to the abrasive block 16, a cylinder 3 is started after the plastic packaging device moves to be abutted against the abrasive block 16, the cylinder 3 enables a sliding block 5 to move back and forth along the axial direction of a sliding rod 6, so that the abrasive block 16 moves back and forth to grind the side surface of the plastic packaging device, and waste materials generated by grinding can fall into a collecting box 2, and subsequent cleaning is facilitated.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (6)
1. The grinding tool for plastic package discrete semiconductor device dissection analysis comprises a hollow base (1) and is characterized in that a slotted hole (8) communicated with the hollow base (1) is formed in the top of the hollow base (1), a collecting box (2) located on one side of the slotted hole (8) is arranged on the top of the hollow base (1), a second threaded rod (15) is rotatably connected between the inner walls of two sides of the hollow base (1), a threaded block (12) is sleeved on the second threaded rod (15) in a threaded manner, the threaded block (12) is located in the slotted hole (8), a servo motor (4) is fixedly installed on one outer side wall of the hollow base (1), one end of the second threaded rod (15) penetrates through the outer side wall of the hollow base (1) and is fixedly connected with an output shaft of the servo motor (4), and a pressing mechanism located above the hollow base (1) is arranged on the top of the threaded block (12), the top of the hollow base (1) is provided with an auxiliary polishing mechanism which is positioned on one side of the collecting box (2) far away from the slotted hole (8).
2. The grinder for anatomical analysis of plastic packaged semiconductor discrete devices according to claim 1, wherein the compressing mechanism comprises a fixed block (13) fixedly mounted on the top of a threaded block (12), the fixed block (13) is located above the collecting box (2), a side block (14) is fixedly mounted on one side wall of the fixed block (13) close to the collecting box (2), a first threaded rod (10) in threaded connection with the top of the side block (14) penetrates through the top of the side block (14), a rotating wheel (9) is fixedly mounted at one end of the first threaded rod (10) located above the side block (14), and a pressing block (11) is rotatably connected to one end of the first threaded rod (10) located below the side block (14).
3. The grinding tool for the anatomical analysis of the discrete plastic packaged semiconductor device according to claim 1, wherein the auxiliary grinding mechanism comprises two vertical plates (7) fixedly mounted on the top of the hollow base (1), two symmetrically arranged slide rods (6) are fixedly connected between the two vertical plates (7), the same slide block (5) is slidably sleeved on the outer side walls of the two slide rods (6), an air cylinder (3) is disposed on the outer side wall of one vertical plate (7), the telescopic end of the air cylinder (3) penetrates through the outer side wall of one vertical plate (7) and is fixedly connected to one side wall of the slide block (5), a grinding block (16) is disposed on one side of the slide block (5) close to the threaded block (12), and the grinding block (16) is located above the collection box (2).
4. A grinder for anatomical analysis of discrete plastic packaged semiconductor devices according to claim 2, characterised in that the fixed block (13) and the side blocks (14) are integrally formed.
5. A grinder for anatomical analysis of discrete semiconductor devices in plastic package according to claim 3, characterised in that the vertical plate (7) and the hollow base (1) are integrally formed.
6. A grinder for anatomical analysis of plastic packaged discrete semiconductor devices according to claim 2, characterised in that the pressing block (11) is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123261619.2U CN216542674U (en) | 2021-12-23 | 2021-12-23 | Grinding tool for dissecting and analyzing plastic packaged semiconductor discrete device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123261619.2U CN216542674U (en) | 2021-12-23 | 2021-12-23 | Grinding tool for dissecting and analyzing plastic packaged semiconductor discrete device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216542674U true CN216542674U (en) | 2022-05-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123261619.2U Active CN216542674U (en) | 2021-12-23 | 2021-12-23 | Grinding tool for dissecting and analyzing plastic packaged semiconductor discrete device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216542674U (en) |
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2021
- 2021-12-23 CN CN202123261619.2U patent/CN216542674U/en active Active
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