CN216531475U

CN216531475U - Camera module, camera module mounting fixture and electronic equipment

Info

Publication number: CN216531475U
Application number: CN202122946222.0U
Authority: CN
Inventors: 王军
Original assignee: Truly Opto Electronics Ltd
Current assignee: Truly Opto Electronics Ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-05-13
Anticipated expiration: 2031-11-26

Abstract

The embodiment of the utility model discloses a camera module, which comprises: the camera lens, the camera lens base and the PCB; the lens is arranged at one end of the lens base; the PCB is arranged at the other end of the lens base; the PCB comprises an element surface and a sensor surface, wherein the element surface is provided with a contact point for testing, and the contact point for testing is arranged in the edge area of the PCB. The embodiment of the utility model discloses a camera module mounting fixture, which ensures that a PCB is not deformed and improves the yield of products by arranging test contact points on a PCB element surface of a camera module in the edge area of the PCB and matching the camera module with a probe of the camera module fixture in the assembling process.

Description

Camera module, camera module mounting fixture and electronic equipment

Technical Field

The utility model relates to the technical field of cameras, in particular to a camera module, a camera module mounting clamp and electronic equipment.

Background

In the AA (Active alignment, which is a technology for determining the relevant position of a device in an assembly process based on the output function of the assembled device), a lens base and a circuit board with an optical sensor are assembled together (as shown in fig. 1a), and the key link is to bond and fix the lens base and the circuit board with the optical sensor through AA glue after adjusting the relative position between the lens base and the circuit board with the optical sensor to the clearest position.

Along with the requirement of the market on the shooting image quality is higher and higher, the size of an optical sensor selected by the camera module is larger and larger, but the size of a circuit board is also larger, the large-size PCB is easier to deform in the assembling process, and then the positions of the lens and the optical sensor are changed after the assembly, the change can cause that the definition of a picture shot by the camera module cannot be fixed at the clearest position, and the yield of products is reduced.

Since the contact points for testing on the PCB of the camera module are disposed in the middle of the component surface (as shown in fig. 3), when the camera module is mounted, the probes corresponding to the fixture inevitably apply a certain pushing force to the middle of the PCB.

The deformation of PCB is caused by the following reasons:

as shown in fig. 1 (fig. 1a is a structural schematic diagram of a PCB without deformation, and fig. 1b is a structural schematic diagram of a PCB with deformation), a conductive probe on an AA link test fixture jacks up the PCB, the PCB is focused and cured under a deformation condition, so that after the module is processed, the PCB gradually returns to an original flat state due to external force no longer acting on the PCB, and in a recovery process, the position of a lens and an optical sensor deviates, so that the definition of a picture is reduced.

Secondly, as shown in fig. 2, the AA link is caused by the conductive probe contacting with the test point on the PCB by pressing.

And thirdly, as shown in fig. 2 (fig. 2a is a schematic diagram of the camera module before assembly, and fig. 2b is a structural schematic diagram of upward thrust applied by the probe to the PCB in the assembly process of the camera module), when the AA mechanical arm presses the PCB on the test fixture, the test point on the PCB contacts with the probe. But the upward pushing force of the probe causes the PCB to deform since there is no downward force in the central area of the PCB.

Disclosure of Invention

In order to at least solve the above technical problem, an embodiment of the present invention provides a camera module, which can ensure that a PCB is not deformed after being mounted on a lens base.

To achieve the above object, an embodiment of the present invention provides a camera module, including:

the camera lens, the camera lens base and the PCB;

the lens is arranged at one end of the lens base;

the PCB is arranged at the other end of the lens base;

the PCB comprises an element surface and a sensor surface, wherein the element surface is provided with a contact point for testing, and the contact point for testing is arranged in the edge area of the PCB.

In some exemplary embodiments, the sensor face is provided with an optical sensor, which is mounted facing the lens mount.

In some exemplary embodiments, the PCB and the lens mount are fixed by AA glue.

In order to achieve the above object, an embodiment of the present invention further provides a camera module mounting fixture, including:

a base and a mechanical arm;

the base is provided with a probe, and the probe is arranged in the edge area of the base.

In some exemplary embodiments, the probe comprises an elastic probe.

In some exemplary embodiments, the elastic probe is disposed over the boss.

In some exemplary embodiments, the edge of the base is provided with a boss.

In some exemplary embodiments, the height of the bosses is lower than the height of the elastomeric probes before deformation.

In some exemplary embodiments, the height of the boss is not less than the elastic probe deformation distance.

In order to achieve the above object, an embodiment of the present invention further provides an electronic device, which includes the above camera module.

The camera module of the embodiment of the utility model comprises: the camera lens, the camera lens base and the PCB; the lens is arranged at one end of the lens base; the PCB is arranged at the other end of the lens base; the PCB comprises an element surface and a sensor surface, wherein the element surface is provided with a contact point for testing, and the contact point for testing is arranged in the edge area of the PCB. Because the edge area is located to the contact point for test on the PCB, consequently avoided current test to use when the contact point is located the central zone installation of PCB, the deformation of PCB that the contact of probe and the contact of contact point for test of anchor clamps brought has greatly reduced the defective rate of product because the deformation of PCB leads to, and then has improved the performance of camera, has improved user's use impression again to the competitiveness of product has been improved.

Drawings

In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, reference will now be made briefly to the attached drawings, which are needed in the description of one or more embodiments or prior art, and it should be apparent that the drawings in the description below are only some of the embodiments described in the specification, and that other drawings may be obtained by those skilled in the art without inventive exercise.

FIG. 1 is a schematic diagram showing the comparison of the shapes of a PCB before and after deformation of a camera module in the prior art;

FIG. 2 is a schematic diagram of a probe and a contact point for testing during the installation of a PCB of a camera module in the prior art;

FIG. 3 is a schematic diagram of a PCB layout of a camera module according to the prior art;

FIG. 4 is a schematic view of a camera module according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a surface structure of a PCB component in the camera module according to the embodiment of the utility model;

FIG. 6 is a schematic diagram of a PCB sensor surface structure in the camera module according to the embodiment of the utility model;

FIG. 7 is a schematic diagram of the camera module and the camera module mounting fixture in the embodiment of the present invention;

fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Description of reference numerals:

101-lens; 102/404-lens mount; 103/201/405-PCB; 202-element face; 203-test contact points; 301-a sensor face; 302-an optical sensor; 401-a robotic arm; 402-a base; 403-Probe.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

The embodiment of the utility model provides a camera module, which comprises:

the camera lens, the camera lens base and the PCB;

the lens is arranged at one end of the lens base;

the PCB is arranged at the other end of the lens base;

Example 1

FIG. 4 is a schematic view of a camera module according to an embodiment of the present invention; FIG. 5 is a schematic diagram of a surface structure of a PCB component in the camera module according to the embodiment of the utility model; FIG. 6 is a schematic diagram of a PCB sensor surface structure in the camera module according to the embodiment of the utility model; the camera module according to the embodiment of the present invention will be described in detail with reference to fig. 4 to 6.

The camera module of the embodiment of the utility model comprises: a lens 101, a lens mount 102/404, and a PCB 103/201/405.

In some exemplary embodiments, the lens 101 is mounted at one end of a lens mount 102/404.

In some exemplary embodiments, the PCB103/201/405 is disposed at the other end of the lens mount 102/404.

In some exemplary embodiments, the PCB103/201/405 includes a component face 202 and a sensor face 301.

In some exemplary embodiments, the component face 202 is provided with test contact points 203.

In some exemplary embodiments, test contacts 203 are provided on the edge area of the PCB 103/201/405.

In some exemplary embodiments, the sensor surface 301 is provided with an optical sensor 302.

In some exemplary embodiments, the optical sensor 302 is mounted facing the lens mount 102/404; i.e., the sensor face 301 of the PCB103/201/405, is mounted facing the lens mount 102/404.

In some exemplary embodiments, the PCB103/201/405 and the lens mount 102/404 are secured by AA glue.

The embodiment of the present invention further provides a camera module mounting fixture, including:

the probe is distributed on the base;

the probe is arranged on the edge area of the base.

Example 2

FIG. 7 is a schematic diagram of the camera module and the camera module mounting fixture in the embodiment of the present invention; the camera module mounting jig according to the embodiment of the present invention will be described in detail below with reference to fig. 7.

In the embodiment of the present invention, fig. 7(a) is a schematic diagram of the PCB103/201/405 of the camera module ready to be placed in the camera module mounting jig, but before assembly; fig. 7(b) is a schematic diagram of the complete assembly of the PCB103/201/405 of the camera module and the lens mount 102/404 under the cooperation of the camera module mounting jig.

The embodiment of the present invention further provides a camera module mounting fixture, including: a base 402.

In some exemplary embodiments, a robotic arm 401 may optionally be provided that cooperates with the base 402.

In some exemplary embodiments, the base 402 is provided with probes 403, and the probes 403 are disposed on the edge region of the base 402.

In some exemplary embodiments, the probes 403 comprise resilient probes, the resiliency may give some cushioning when in contact with the test contact pads 203.

In some exemplary embodiments, as can be seen from fig. 7(a) to 7(b), the spring probes compress when the lens mount 102/404 of the camera module is assembled with the PCB 103/201/405.

In some exemplary embodiments, the position of the robotic arm 401 corresponds to the probe 403, i.e., the point of application of the robotic arm 401 is on the same directional axis as the probe 403 when the camera module is mounted on the PCB 103/201/405.

In some exemplary embodiments, the edge of the base 402 is provided with a boss.

In some exemplary embodiments, the elastic probe is arranged on the boss

In some exemplary embodiments, the elastic probes may protrude the height of the bosses on the base 402 before being deformed; when the elastic probe is deformed and the mechanical arm 401, the probe 403 and the boss are tightly attached, the deformation of the elastic probe can be completed or the deformation stroke of the elastic probe has a margin.

In some exemplary embodiments, the robotic arm 401 is sized to fit within the carrying point of the base 402.

In some exemplary embodiments, because the test contacts 203 are disposed on the edge region of the PCB103/201/405, and the probes 403 on the base 402 of the fixture are also electrically connected to the test contacts 203 when the test contacts are mounted, the probes 403 on the base 402 of the fixture need to be disposed in the edge region in synchronization to ensure a better fit when the camera module is mounted on the fixture.

Example 3

In the structure of the electronic device according to the embodiment of the present invention, in a hardware level, the electronic device includes a processor, and optionally further includes a bus, a network interface, and a memory. The Memory may include a Memory, such as a Random-Access Memory (RAM), and may further include a non-volatile Memory, such as at least 1 disk Memory. Of course, the electronic device may also include hardware required for other services.

The processor, the network interface, and the memory may be connected to each other via a bus, which may be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc.

And the memory is used for storing programs. In particular, the program may include program code including computer operating instructions.

In some exemplary embodiments, the electronic device includes the camera module.

Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. The utility model provides a camera module which characterized in that includes: the camera lens, the camera lens base and the PCB;

the lens is arranged at one end of the lens base;

the PCB is arranged at the other end of the lens base;

2. The camera module of claim 1, wherein said sensor face is provided with an optical sensor mounted facing said lens mount.

3. The camera module of claim 1, wherein the PCB and the lens mount are secured by AA glue.

4. The utility model provides a camera module sectional fixture which characterized in that includes:

the probe is distributed on the base;

the probes are arranged on the edge area of the base.

5. The fixture of claim 4, wherein the probe comprises a resilient probe.

6. A clamp as claimed in claim 5, wherein the base is provided with a boss at its edge.

7. The fixture of claim 6, wherein said resilient probes are disposed over said bosses.

8. The fixture of claim 7, wherein the height of the bosses is less than the height of the elastomeric probes prior to being undeformed.

9. The fixture of claim 7, wherein the height of the boss is not less than the spring probe deformation distance.

10. An electronic device, comprising the camera module according to any one of claims 1 to 3.