CN216513658U

CN216513658U - High-efficiency composite heat dissipation film

Info

Publication number: CN216513658U
Application number: CN202123419218.5U
Authority: CN
Inventors: 周二风; 刘建会; 江点
Original assignee: Yancheng Jiuzhi New Material Technology Co ltd
Current assignee: Yancheng Jiuzhi New Material Technology Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-05-13
Anticipated expiration: 2031-12-30

Abstract

The utility model discloses a high-efficiency composite heat dissipation film, which comprises: PET substrate layer and aluminium foil layer, the surface coating that PET substrate layer and graphite alkene layer carried on the back mutually has the mute black ink layer of a heat conduction, the aluminium foil layer has a plurality of interval distribution's through-hole, the upper surface and the lower surface on this aluminium foil layer have covered graphite alkene layer respectively, graphite alkene layer down, this goes up graphite alkene layer, graphite alkene layer corresponds regional direct laminating connection of through-hole department respectively down, go up and be connected through first heat conduction adhesive layer between graphite alkene layer and the PET substrate layer, graphite alkene layer and the surface coating that the aluminium foil layer carried on the back mutually have a second heat conduction adhesive layer down, one from the surface that the material layer pasted and apply in second heat conduction adhesive layer, surface from the material layer and second heat conduction adhesive layer contact has a plurality of bump. The efficient composite heat dissipation film disclosed by the utility model improves the soaking performance of the heat dissipation film in the horizontal direction to heat, avoids bubbles generated when the film is attached to the surface of a heat source, and improves the stability of the heat dissipation performance of the efficient composite heat dissipation film.

Description

High-efficiency composite heat dissipation film

Technical Field

The utility model relates to an efficient composite heat dissipation film, and belongs to the technical field of heat dissipation films.

Background

On the one hand, along with the acceleration of the present upgrading of electronic product, the popularization of high power, high thermal chip, on the other hand, the rapid development of science and technology, electronic device is miniaturized gradually, and the dominant frequency of chip is higher and higher, and power is bigger and bigger, leads to heat flux density to increase sharply, produces a large amount of heats. Failure to process the heat in a timely manner can affect the operation of the electronic device, reduce the lifetime of the device, and may present safety concerns. In the prior art, a heat dissipation film is adopted to improve the heat dissipation problem of an electronic device, but the prior heat dissipation film still has a lot of technological spaces which can be improved in the technology.

Disclosure of Invention

The utility model aims to provide a high-efficiency composite heat dissipation film, which not only improves the soaking performance of the heat dissipation film in the horizontal direction to heat, but also avoids bubbles generated when the heat dissipation film is attached to the surface of a heat source, and improves the stability of the heat dissipation performance of the high-efficiency composite heat dissipation film.

In order to achieve the purpose, the utility model adopts the technical scheme that: an efficient composite heat dissipation film, comprising: PET substrate layer and aluminium foil layer, the surface coating that PET substrate layer and graphite alkene layer carried on the back mutually has the mute black ink layer of a heat conduction, the aluminium foil layer has a plurality of interval distribution's through-hole, and the upper surface and the lower surface on this aluminium foil layer cover respectively have last graphite alkene layer, lower graphite alkene layer, and this goes up graphite alkene layer, lower graphite alkene layer and corresponds the regional direct laminating connection of through-hole department respectively, go up and be connected through first heat conduction gluing layer between graphite alkene layer and the PET substrate layer, graphite alkene layer and the surface coating that the aluminium foil layer carried on the back mutually have a second heat conduction gluing layer down, one from the surface that the material layer subsides in second heat conduction gluing layer, the surface that comes into contact with second heat conduction gluing layer from the material layer has a plurality of bump.

The further improved scheme in the technical scheme is as follows:

1. in the scheme, the surface of the release material layer with the salient points has the roughness of 3-5 mu m.

2. In the scheme, the thickness of the upper graphene layer is 60-150 microns.

3. In the scheme, the thickness of the lower graphene layer is 200-400 microns.

4. In the scheme, the diameter of the through hole is 1-3 mm.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

according to the efficient composite heat dissipation film, the aluminum foil layer is provided with the through holes which are distributed at intervals, the upper surface and the lower surface of the aluminum foil layer are respectively covered with the upper graphene layer and the lower graphene layer, the upper graphene layer and the lower graphene layer are respectively and directly attached and connected with each other in the areas corresponding to the through holes, the upper graphene layer is connected with the PET substrate layer through the first heat conduction adhesive layer, and the surface of the lower graphene layer opposite to the aluminum foil layer is coated with the second heat conduction adhesive layer, so that the soaking performance of the heat dissipation film in the horizontal direction to heat is improved, the heat conduction performance in the vertical direction is also improved, and the integral comprehensive heat dissipation efficiency is improved; in addition, it is from the surface that the material layer subsides applied in second heat conduction gluing layer, has a plurality of bump from the surface that the material layer contacted with second heat conduction gluing layer, has avoided producing the bubble with heat source surface laminating time to lead to the heat can not effectual radiating defect, further improved the stability of the heat dispersion of high-efficient compound heat dissipation pad pasting.

Drawings

FIG. 1 is a schematic structural view of the high-efficiency composite heat dissipation film of the present invention;

fig. 2 is a schematic view of a partial structure of the high-efficiency composite heat dissipation film of the utility model.

In the above drawings: 1. a PET substrate layer; 2. an aluminum foil layer; 3. a thermally conductive matte black ink layer; 4. a first thermally conductive adhesive layer; 5. an upper graphene layer; 6. a lower graphene layer; 7. a first release material layer; 8. a second thermally conductive adhesive layer; 9. a through hole; 10. and (4) bumps.

Detailed Description

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1: an efficient composite heat dissipation film, comprising: PET substrate layer 1 and aluminium foil layer 2, the surface coating that PET substrate layer 1 and aluminium foil layer 2 carried on the back mutually has a mute black ink layer 3 of heat conduction, aluminium foil layer 2 has a plurality of interval distribution's through-hole 9, and this aluminium foil layer 2's upper surface and lower surface have covered graphite alkene layer 5, graphite alkene layer 6 down respectively, and this goes up graphite alkene layer 5, graphite alkene layer 6 corresponds regional direct laminating connection of 9 departments of through-hole separately, go up and be connected through first heat conduction gluing layer 4 between graphite alkene layer 5 and the PET substrate layer 1, graphite alkene layer 6 has a second heat conduction gluing layer 8 with the surface coating that aluminium foil layer 2 carried on the back mutually down, one from type material layer 7 subsides in the surface of second heat conduction gluing layer 8, the surface from type material layer 7 and the contact of second heat conduction gluing layer 8 has a plurality of bump 10.

The thickness of the upper graphene layer 5 is 120 μm.

The thickness of the lower graphene layer 6 was 300 μm, and the diameter of the through-hole 9 was 1.2 mm.

The release material layer 7 has a surface roughness of the bump 10 of 4.2 μm.

Example 2: an efficient composite heat dissipation film, comprising: PET substrate layer 1 and aluminium foil layer 2, the surface coating that PET substrate layer 1 and aluminium foil layer 2 carried on the back mutually has a mute black ink layer 3 of heat conduction, aluminium foil layer 2 has a plurality of interval distribution's through-hole 9, and this aluminium foil layer 2's upper surface and lower surface have covered graphite alkene layer 5, graphite alkene layer 6 down respectively, and this goes up graphite alkene layer 5, graphite alkene layer 6 corresponds regional direct laminating connection of 9 departments of through-hole separately, go up and be connected through first heat conduction gluing layer 4 between graphite alkene layer 5 and the PET substrate layer 1, graphite alkene layer 6 has a second heat conduction gluing layer 8 with the surface coating that aluminium foil layer 2 carried on the back mutually down, one from type material layer 7 subsides in the surface of second heat conduction gluing layer 8, the surface from type material layer 7 and the contact of second heat conduction gluing layer 8 has a plurality of bump 10.

The release material layer 7 has a surface roughness of the bump 10 of 3.5 μm.

The thickness of the upper graphene layer 5 is 80 μm.

The thickness of the lower graphene layer 6 was 150 μm, and the diameter of the through-hole 9 was 2 mm.

When the efficient composite heat dissipation film is adopted, the aluminum foil layer is provided with a plurality of through holes distributed at intervals, the upper surface and the lower surface of the aluminum foil layer are respectively covered with the upper graphene layer and the lower graphene layer, the upper graphene layer and the lower graphene layer are respectively and directly attached and connected with each other corresponding to the through hole part region, the upper graphene layer is connected with the PET substrate layer through the first heat conduction adhesive layer, and the surface of the lower graphene layer opposite to the aluminum foil layer is coated with the second heat conduction adhesive layer, so that the heat dissipation performance of the heat dissipation film in the horizontal direction is improved, the heat conduction performance in the vertical direction is also improved, and the integral comprehensive heat dissipation efficiency is improved; in addition, it is from the surface that the material layer subsides applied in second heat conduction gluing layer, has a plurality of bump from the surface that the material layer contacted with second heat conduction gluing layer, has avoided producing the bubble with heat source surface laminating time to lead to the heat can not effectual radiating defect, further improved the stability of the heat dispersion of high-efficient compound heat dissipation pad pasting.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a high-efficient compound heat dissipation pad pasting which characterized in that: the method comprises the following steps: a PET substrate layer (1) and an aluminum foil layer (2), wherein the surface of the PET substrate layer (1) opposite to the surface of the aluminum foil layer (2) is coated with a heat-conducting matte black ink layer (3), the aluminum foil layer (2) is provided with a plurality of through holes (9) which are distributed at intervals, the upper surface and the lower surface of the aluminum foil layer (2) are respectively covered with an upper graphene layer (5) and a lower graphene layer (6), the upper graphene layer (5) and the lower graphene layer (6) are respectively and directly jointed and connected with the through holes (9) corresponding to the areas, the upper graphene layer (5) is connected with the PET substrate layer (1) through a first heat-conducting adhesive layer (4), the surface of the lower graphene layer (6) back to the aluminum foil layer (2) is coated with a second heat-conducting adhesive layer (8), a release material layer (7) is pasted on the surface of the second heat-conducting adhesive layer (8), the surface of the release material layer (7) in contact with the second heat-conducting adhesive layer (8) is provided with a plurality of salient points (10).

2. The efficient composite heat dissipation film as recited in claim 1, wherein: the thickness of the upper graphene layer (5) is 60-150 mu m.

3. The efficient composite heat dissipation film as recited in claim 1, wherein: the thickness of the lower graphene layer (6) is 200-400 microns.

4. The efficient composite heat dissipation film as recited in claim 1, wherein: the diameter of the through hole (9) is 1-3 mm.

5. The efficient composite heat dissipation film as recited in claim 1, wherein: the surface roughness of the release material layer (7) with the salient points (10) is 3-5 mu m.