CN216451595U - Can solve circuit board of harmomegathus problem band steel piece - Google Patents

Abstract

The utility model discloses a circuit board with a steel sheet, which can solve the problems of expansion and contraction, and comprises the steel sheet, an insulating layer, a copper sheet layer, a protective layer and an electronic device, wherein the insulating layer is arranged above the steel sheet, the copper sheet layer is arranged above the insulating layer, the electronic device is arranged on the copper sheet layer, the protective layer is arranged above the copper sheet layer, a through hole is arranged at the position of the protective layer corresponding to the electronic device, and the electronic device penetrates through the through hole. It is through fixing the insulating layer on the steel sheet, and the steel sheet supports the insulating layer, when welding for the insulating layer receives the steel sheet to support can not take place the shrink and the inflation condition, thereby improves welded efficiency and welding success rate, reduces manufacturing cost, increases product competitiveness.

Description

Can solve circuit board of harmomegathus problem band steel piece

Technical Field

The utility model relates to a circuit board, in particular to a circuit board with a steel sheet capable of solving the problem of expansion and shrinkage, which is applied to the field of design and manufacture of flexible printed circuit boards.

Background

Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible, insulating substrates. Flexible circuits provide excellent electrical performance, meet design requirements for smaller and higher density packaging, and also help reduce assembly processes and enhance reliability. The flexible circuit board is the only solution to meet the miniaturization and mobility requirements of electronic products. The flexible circuit board can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the lead, can be randomly arranged according to the space layout requirement, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized; the flexible circuit board can greatly reduce the volume and the weight of the electronic product, and is suitable for the development of the electronic product towards high density, miniaturization and high reliability. The Flexible Printed Circuit (FPC) is commonly known in the Flexible Circuit board industry as an FPC (Flexible Printed Circuit) abbreviation and has many advantages which are not possessed by a rigid Printed Circuit board. Therefore, the flexible circuit board is widely applied to high-density and miniaturized products and fields such as spaceflight, military affairs, mobile communication, notebook computers, computer peripheral equipment, digital cameras and the like.

The material that current FPC board constitutes is insulating film, conductor and insulating film, the conductor sets up at two insulating film, however current FPC board is when carrying out small-size, miniature electron device welding, for example when MINI LED lamp welds, the distance between its two pads is little, generally adopt wave-soldering to weld, in concrete implementation welding process, the insulating film that can make on the FPC board shrink and the inflation condition appear, take place welding off normal phenomenon after the product welding, appear welding insecure, weld the product bad problem such as askew, influence production efficiency.

Disclosure of Invention

Aiming at the problems that when wave soldering is adopted to weld small and miniature electronic devices in the prior art, the contraction and expansion of an FPC board occurs, the welding deviation phenomenon occurs, the welding is not firm, the welding is askew and other product defects are generated, the utility model provides the circuit board with the steel sheet, which can solve the expansion and contraction problem, wherein the insulation layer is fixed on the steel sheet, the steel sheet supports the insulation layer, and when the welding is carried out, the contraction and expansion of the insulation layer supported by the steel sheet can not occur, so that the welding efficiency and the welding success rate are improved.

The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model provides a can solve circuit board of harmomegathus problem band steel piece, the circuit board is including steel sheet, insulating layer, copper sheet layer, protective layer and electron device, the insulating layer sets up the steel sheet top, the copper sheet layer sets up the insulating layer top, electron device sets up on the copper sheet layer, the protective layer sets up copper sheet layer top, the protective layer corresponds electron device's position is equipped with the through-hole, electron device passes the through-hole.

Furthermore, the insulating layer is fixedly installed with the steel sheet by adopting an adhesive layer.

Further, the electronic device is a MINI LED lamp, and the MINI LED lamp is 0.6-0.65 mm long, 0.3-0.35 mm wide and 0.10-0.15 mm high in size.

Further, the protective layer is white ink; or the protective layer adopts a white film.

Further, the thickness of the steel sheet is 0.04 mm-0.20 mm.

Further, the thickness of the copper sheet layer is 0.018 mm-0.025 mm.

Furthermore, the insulating layer adopts a PI film, and the thickness of the PI film is 0.02 mm-0.036 mm.

Furthermore, the thickness of the adhesive layer is 0.003 mm-0.005 mm.

Further, the thickness of the protective layer is 0.01 mm-0.04 mm.

Further, the circuit board comprises a wiring terminal, and the wiring terminal is arranged on any one side of the copper sheet layer.

The utility model has the beneficial effects that: the utility model provides a circuit board with a steel sheet, which can solve the problem of expansion and contraction.

Drawings

FIG. 1 is a schematic view of a partial sectional structure of a circuit board according to the present invention;

fig. 2 is a schematic structural diagram of a circuit board of the present invention in a top view.

Reference numerals: 1-steel sheet, 2-adhesive layer, 3-insulating layer, 4-copper sheet layer, 5-protective layer, 6-through hole, 7-electronic device and 8-wiring terminal.

Detailed Description

In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

Referring to fig. 1-2, the present invention provides a circuit board with steel sheets capable of solving the problem of expansion and contraction, the circuit board comprises a steel sheet 1, an insulating layer 3, a copper sheet layer 4, a protective layer 5 and an electronic device 7, the insulating layer 3 is disposed above the steel sheet 1, the copper sheet layer 4 is disposed above the insulating layer 3, the electronic device 7 is disposed on the copper sheet layer 4, and the protective layer 5 is disposed above the copper sheet layer 4, which can be simply understood as fixing the FPC board on the steel sheet 1, the FPC board comprises the insulating layer 3, the copper sheet layer 4 and the protective layer 5, the insulating layer 3 is fixed on the steel sheet 1, the protective layer 5 is provided with through holes 6 corresponding to the electronic device 7, the electronic device 7 passes through the through hole 6, in other words, the electronic device 7 is mounted on the copper sheet layer 4 through the through hole 6, in the specific implementation, the number of the through holes 6 is set according to the specific use requirement, when performing the wave soldering, or during other welding modes, the insulating layer 3 is always supported by the steel sheet 1, and the shrinkage and expansion conditions can not occur in the welding process, so that the welding deviation phenomenon can not occur, the welding efficiency and the welding success rate can be improved, the production cost is reduced, and the product competitiveness is increased. Wherein the electronic device 7 comprises a MINI LED lamp, a MINI diode, a MINI sensor and the like.

In this embodiment, the insulating layer 3 is fixedly mounted with the steel sheet 1 by the adhesive layer 2. The adhesive layer 2 is preferably thermosetting adhesive, so that the processing is convenient, materials such as non-setting adhesive and the like can be selected during specific implementation, or the insulating layer 3 and the steel sheet 1 are fixedly installed together by selecting other fixing structures instead of the adhesive layer 2 during production and processing, or the insulating layer 3 is directly arranged on the steel sheet 1.

In this embodiment, the thickness of the steel sheet 1 is 0.04mm to 0.20 mm. Preferably 0.05mm or 0.20mm, which can meet the strength requirement and can not make the whole circuit board too thick.

In this embodiment, the thickness of the copper sheet layer 4 is 0.018 mm-0.025 mm. Can guarantee the normal electrically conductive use of electron device 7, also can be through control copper sheet layer 4 thickness, the effectual circuit board thickness that controls that carries on for the circuit board is more frivolous.

In this embodiment, the insulating layer 3 is a PI film, i.e., a polyimide film, and the insulating layer 3 may be a polyester film, preferably a PI film, having a thickness of 0.02mm to 0.036 mm. Preferably 0.025mm, and the requirement for the adhesion of the copper sheet layer 4 is satisfied, and the insulating layer 3 may be made of other insulating materials capable of adhering to the copper sheet layer 4.

In this embodiment, when the adhesive layer 2 is provided between the insulating layer 3 and the steel sheet 1, the thickness of the adhesive layer 2 is 0.003mm to 0.005mm, preferably 0.004mm, and the requirement for bonding the insulating layer 3 and the steel sheet 1 can be satisfied.

In this embodiment, the protective layer 5 may be a PI film, i.e., a polyimide film, or a polyester film, and the insulating layer 3 may also be made of other insulating materials suitable for attaching the copper sheet layer 4, or white ink is used as the protective layer. The thickness of the protective layer 5 is 0.01 mm-0.04 mm, the protective layer is used for attaching and fixing the copper sheet layer 4, and the protective layer is matched with the insulating layer 3 to seal the copper sheet layer 4 in specific implementation, so that oxidation of the copper sheet layer is effectively prevented.

In the specific implementation, when the circuit board is applied to a keyboard backlight module, in order to effectively ensure the brightness of the keycaps, the electronic device 7 is an MINI LED lamp, the size of the MINI LED lamp is 0.6-0.65 mm in length, 0.3-0.35 mm in width and 0.10-0.15 mm in height, so that the MINI LED lamp only needs to illuminate one keycap, 1 or 2 MINI LED lamps can be arranged on a common key, and 2-4 MINI LED lamps are correspondingly arranged on larger and longer keys such as 'enter', 'shift' and 'blank', so as to meet the illumination requirements of the common key, and more LEDs can be arranged corresponding to one keycap according to the actual requirements. The LED lamp may not be arranged under the keycap which does not need to be illuminated.

In this embodiment, in order to increase the luminance of key cap when producing, protective layer 5 is white printing ink, reflects MINI LED lamp through adopting white printing ink to this reaches increase key cap luminance effect, and in concrete implementation, white printing ink adopts the printing mode to set up on copper sheet layer 4, and it also can choose for use other modes to set up, if: spraying, silk-screen printing and the like; alternatively, the protective layer 5 may be a white film, which may also reflect the MINI LED lamp. Alternatively, the protective layer 5 is an insulating film, and white ink is printed on the insulating film, and in the above reflection system, in order to control the thickness of the entire wiring board, when the thickness of the entire wiring board is required to be 0.10mm, it is preferable that the protective layer 5 is white ink, when the thickness of the entire wiring board is required to be more than 0.11mm, it is preferable that the protective layer 5 is a white film.

In this embodiment, the circuit board includes the binding post 8, and the binding post 8 sets up in copper sheet layer 4's arbitrary one side. Its binding post 8 can be FPC binding post, or other kinds of binding post, and its binding post 8 is used for copper sheet layer 4 to connect external mainboard.

It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.

Claims (10)

1. The utility model provides a can solve circuit board of harmomegathus problem area steel sheet, a serial communication port, the circuit board is including steel sheet (1), insulating layer (3), copper sheet layer (4), protective layer (5) and electron device (7), insulating layer (3) set up steel sheet (1) top, copper sheet layer (4) set up insulating layer (3) top, electron device (7) set up on copper sheet layer (4), protective layer (5) set up copper sheet layer (4) top, protective layer (5) correspond the position of electron device (7) is equipped with through-hole (6), electron device (7) pass through-hole (6).

2. The wiring board with steel sheet capable of solving the problem of expansion and contraction as claimed in claim 1, wherein said insulating layer (3) is fixed with said steel sheet (1) by an adhesive layer (2).

3. The wiring board of claim 1, wherein the electronic device (7) is a MINI LED lamp having a length of 0.6-0.65 mm, a width of 0.3-0.35 mm and a height of 0.10-0.15 mm.

4. A wiring board with steel sheet capable of solving the problem of expansion and contraction according to claim 1, wherein said protective layer (5) is white ink; or a white film is adopted as the protective layer (5).

5. The wiring board with steel sheet capable of solving the problem of expansion and contraction according to claim 1, wherein the thickness of the steel sheet (1) is 0.04mm to 0.20 mm.

6. A wiring board with steel sheets capable of solving the problem of expansion and contraction according to claim 1, wherein the thickness of the copper sheet layer (4) is 0.018mm to 0.025 mm.

7. The wiring board of band steel sheet capable of solving the problem of expansion and contraction as claimed in claim 1, wherein said insulation layer (3) is PI film, and the thickness of said PI film is 0.02 mm-0.036 mm.

8. The wiring board with steel sheet capable of solving the problem of expansion and contraction as claimed in claim 2, wherein the thickness of said adhesive layer (2) is 0.003mm to 0.005 mm.

9. A wiring board with steel sheet capable of solving the problem of expansion and contraction according to claim 1, wherein the thickness of the protective layer (5) is 0.01mm to 0.04 mm.

10. A wiring board of steel strip capable of solving the problem of expansion and contraction according to claim 1, wherein said wiring board comprises terminals (8), said terminals (8) being disposed on either side of said copper strip layer (4).

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