CN216437553U - PCB board - Google Patents

Abstract

The utility model discloses a PCB board, including electronic component, fin and base plate, electronic component's bottom is pasted the dress in one side of base plate, and electronic component's top is provided with the fin, and fin surface coating has the heat dissipation to glue, and the heat dissipation is glued and the laminating of shell inner wall. The utility model discloses an arrange the fin in the electronic component top, can integrate more components in limited base plate area, reduced the base plate area to can simplify the heat dissipation route, realize better radiating effect.

Description

PCB board

Technical Field

The utility model relates to an integrated circuit design field, in particular to PCB board.

Background

As the function and integration of the asic have been improved, higher requirements are required for the utilization of the substrate area of the Printed Circuit Board ("PCB"), and it is desired to integrate more electronic components on the limited substrate to manufacture a small and precise ic.

At present, the most widely applied design concept for electronic components with heat dissipation fins is to arrange the heat dissipation fins at the bottom of the electronic component, mount the bottom of the electronic component on a substrate provided with through holes, and enable heat dissipation conduction paths generated by the electronic component during working to sequentially pass through the heat dissipation fins, the through holes of the substrate, heat dissipation glue and a shell.

This design theory makes the other side that the via hole region corresponds the base plate can not paste other components, needs bigger base plate to hold all components, leads to the base plate area too big, and the heat dissipation route of PCB board is complicated moreover, and the radiating effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the base plate area of PCB board among the integrated circuit too big, the heat dissipation route of PCB board is complicated, the poor technical problem of radiating effect. The utility model provides a PCB board can be at more components of limited base plate area internal integration, has reduced the base plate area to can simplify the heat dissipation route of PCB board, realize better radiating effect.

In order to solve the technical problem, the utility model discloses an embodiment discloses a PCB board, including electronic component, fin and base plate, electronic component's bottom is pasted the dress in one side of base plate, and electronic component's top is provided with the fin, and fin surface coating has the heat dissipation to glue, and the heat dissipation is glued and the laminating of shell inner wall.

By adopting the technical scheme, other elements can be pasted on the other side of the substrate, more elements are integrated in the limited substrate area, the substrate area is reduced, the heat dissipation path can be simplified, the better heat dissipation effect is realized, the heat conduction path generated by the work of the electronic element sequentially passes through the heat dissipation sheet, the heat dissipation glue and the shell, the heat is dissipated from the top of the electronic element body, and the influence of the extra heat on the elements around the substrate is avoided.

According to another embodiment of the present invention, the electronic component body is attached to the substrate without a via hole.

By adopting the technical scheme, the area of the substrate can be reduced, and the cost of the substrate is reduced.

According to another embodiment of the present invention, the electronic component is a chip.

According to another embodiment of the present invention, the other side of the substrate is used for mounting other components.

By adopting the technical scheme, more elements can be integrated in the limited substrate area, and the substrate area is saved.

According to another embodiment of the present invention, the heat-dissipating glue covers the surface of the heat-dissipating fin.

Adopt above-mentioned technical scheme, can effectively conduct the heat dissipation by the fin and glue, promote the radiating effect.

According to another embodiment of the present invention, the heat sink is connected to the electronic component by adhesion.

By adopting the technical scheme, the radiating fins can be fixed on the electronic element in a sticking mode, and heat is conducted to the radiating fins from the electronic element to the maximum extent, so that the radiating efficiency is improved.

Drawings

Fig. 1 is a schematic side view of a PCB according to an embodiment of the present invention.

In the figures, the various reference numbers:

1. the electronic device comprises a shell, 2, heat dissipation glue, 3, a heat dissipation sheet, 4, an electronic component, 5, a substrate, 6 and other components.

Detailed Description

The following description is provided for illustrative embodiments of the present invention, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. While the invention will be described in conjunction with the preferred embodiments, it is not intended that features of the invention be limited to only those embodiments. On the contrary, the intention of implementing the novel features described in connection with the embodiments is to cover other alternatives or modifications which may be extended based on the claims of the present invention. It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or the element to which the present invention is directed must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present embodiment, it should be further noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" are to be interpreted broadly, e.g., as a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present embodiment can be understood in specific cases by those of ordinary skill in the art.

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

As shown in fig. 1, the embodiment of the utility model provides a PCB board, including electronic component 4 and base plate 5, the dress is pasted in one side of base plate 5 in the bottom of electronic component 4, and the top of electronic component 4 is provided with fin 3, and 3 surface coatings of fin have heat dissipation to glue 2, and heat dissipation glues 2 and the laminating of 1 inner wall of shell. Specifically, in the present embodiment, the electronic component 4 is disposed on the substrate 5 in an SMD mounting manner, and the SMD mounting has the advantages of high reliability, strong vibration resistance, and low solder joint defect rate. In other embodiments, the mounting mode of the electronic component can be other forms, the utility model discloses do not limit this, can carry out reasonable selection according to the actual production needs.

In practical applications, the electronic component 4 generates a large amount of heat during operation, and if no heat dissipation measures are taken, the internal temperature of the electronic component 4 may reach or exceed the allowable junction temperature, which seriously affects the performance and the operating efficiency of the electronic component 4. The heat sink 3 can conduct heat generated by the electronic component 4 more effectively, dissipate heat in time, and prevent the electronic component 4 from being damaged. Simultaneously, in this embodiment, fin 3 glues 2 and the laminating of 1 inner wall of shell through the heat dissipation, and the heat that electronic component 4 produced can directly conduct shell 1 through fin 3 and heat dissipation glue 2 on, and the air goes around in diffusing through shell 1 again, has simplified the heat dissipation route, can realize better radiating effect.

The heat conduction path that electronic component 4 produced during operation passes through fin 3, heat dissipation glue 2, shell 1 in proper order, gives off to the ambient air in, and the heat that electronic component 4 produced during operation is scattered from electronic component 4's top, avoids on extra heat conduction substrate 5, and substrate 5 and its surrounding component can normally work. The PCB board of the application can be applied to the production field of all electronic parts.

In the present embodiment, the portion of the case 1 in contact with the heat dissipation paste 2 and the portion of the heat dissipation fin 3 in contact with the heat dissipation paste 2 are the same in shape. That is to say, the contact part of the upper side of the heat dissipation glue 2 and the shell 1 and the contact part of the lower side of the heat dissipation glue 2 and the heat dissipation fins 3 have the same shape, so that the heat dissipation efficiency can be improved on the basis that the heat transfer area corresponding to the shell 1 and the heat dissipation fins 3 is not changed, the uniformity of heat dissipation can be ensured, and the phenomenon of poor local heat dissipation is avoided.

Further, in the present application, no via hole is provided in the portion of the substrate 5 where the main body of the electronic component 4 is mounted. That is, the radiating fins 3 are arranged at the top of the electronic element 4, and the radiating fins 3 and the electronic element 4 are attached to the inner wall of the shell 1 through the radiating glue 2, so that the radiating path of the electronic element 4 is changed, a via hole does not need to be formed in the substrate 5, the cost of the substrate 5 can be reduced, and the area of the substrate 5 can be reduced. It should be noted that the electronic component 4 includes a body and a pin, and the body refers to a portion of the electronic component 4 that does not include the pin. Specifically, in the present embodiment, the electronic component 4 is a chip.

Further, in the present application, the other side of the substrate 5 is used for mounting other components 6. On the premise of ensuring the heat dissipation effect of the chip, more elements can be integrated in the limited area of the substrate 5, the signal wiring of the substrate 5 is not affected, the area of the substrate 5 is further reduced, and the design of the substrate 5 is more flexible. In other embodiments, under the condition of ensuring the area of the substrate, the substrate may also be provided with a via hole for heat dissipation, so that the heat dissipation effect can be further improved, the electronic component can be kept at a reasonable temperature for a long time to work, and the operating efficiency of the electronic component and the whole substrate is ensured.

Further, in this application, the heat dissipation glue 2 covers the surface of the heat dissipation plate 3, so that the heat dissipation effect can be better improved. The gap can be filled to the heat dissipation glue 2, accomplishes the heat transfer between the position of generating heat and radiating part, plays effects such as insulating, damping, sealed simultaneously, and the maximize carries out thermal transmission, promotes the radiating effect. Specifically, in this embodiment, the heat dissipation glue 2 is a heat conductive silicone. In other embodiments, other kinds of heat dissipation adhesives can be used for coating, the utility model discloses do not do the restriction to this, can carry out reasonable selection according to actual production needs.

Further, in the present application, the heat sink 3 and the electronic component 4 are connected by adhesion. Specifically, in the present embodiment, the heat sink 3 is attached to the electronic component 4 by a heat conductive adhesive. In other embodiments, can use other to paste the fin and paste on electronic component, also can use modes such as clamping piece to fix the fin on electronic component, the utility model discloses do not do the restriction to this, can carry out reasonable selection according to actual production needs.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing is a more detailed description of the invention, and the specific embodiments thereof are not to be considered as limiting. Various changes in form and detail, including simple deductions or substitutions, may be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims (6)

1. The utility model provides a PCB board, includes electronic component (4), fin (3) and base plate (5), the dress is pasted to the bottom of electronic component (4) one side of base plate (5), its characterized in that, the top of electronic component (4) is provided with fin (3), fin (3) surface coating has heat dissipation to glue (2), heat dissipation glue (2) and the laminating of shell (1) inner wall.

2. The PCB board according to claim 1, wherein no through hole is arranged on the substrate (5) where the electronic component (4) body is mounted.

3. A PCB board according to claim 1, wherein the electronic component (4) is a chip.

4. A PCB board according to claim 2, wherein the other side of the substrate (5) is used for mounting other components (6).

5. A PCB board according to claim 1, wherein the heat sink glue (2) covers the surface of the heat sink (3).

6. A PCB board according to claim 1, wherein the heat sink (3) and the electronic component (4) are connected by gluing.

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