CN216421352U - Full-automatic circuit board bonding wire equipment - Google Patents
Full-automatic circuit board bonding wire equipment Download PDFInfo
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- CN216421352U CN216421352U CN202122918821.1U CN202122918821U CN216421352U CN 216421352 U CN216421352 U CN 216421352U CN 202122918821 U CN202122918821 U CN 202122918821U CN 216421352 U CN216421352 U CN 216421352U
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Abstract
The utility model relates to the technical field of the structure of a welding wire mechanical device, in particular to a full-automatic circuit board welding wire device; the automatic machining device comprises a rack and a workbench connected with the rack, wherein a machining control system and a pneumatic control system are arranged on the rack; the workbench is provided with a material conveying system, an image recognition system and an automatic packaging system; the material conveying system comprises a plurality of conveyor belts; the workbench is also provided with a straightening device, a peeling device, a plurality of cutting devices, a soldering device and a main chain guide rail; on the workbench, the other end of the soldering device is also provided with a positioning device and a half-welding device; the utility model discloses a full-automatic circuit board bonding wire equipment, its degree of automation is high, efficient, and whether can automatic identification processing qualified moreover, still be equipped with automatic get a device, intelligent degree is high, the practicality is strong.
Description
Technical Field
The utility model relates to a bonding wire mechanical equipment's technical field of structure especially relates to a full-automatic circuit board bonding wire equipment.
Background
The circuit board welding line is a frequently-occurring process in industrial production, and the existing circuit board welding line process is mostly finished by manual work in multiple processes; at present, the labor cost is very high, and the fault rate is very high due to the complex procedures, the efficiency is slow, the delivery cycle is long, the product quality cannot be guaranteed, and the defects exist.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a full-automatic formula, use manpower sparingly, and efficient circuit board bonding wire equipment.
In order to solve the technical problem, the utility model discloses the technical scheme who takes is: a full-automatic circuit board wire welding device comprises a rack and a workbench connected with the rack, wherein a processing control system and a pneumatic control system are mounted on the rack; the workbench is provided with a material conveying system, an image recognition system and an automatic packaging system;
the material conveying system comprises a plurality of conveyor belts; the workbench is also provided with a straightening device, a peeling device, a plurality of cutting devices, a soldering device and a main chain guide rail; on the workbench, a positioning device and a half-soldering device are further arranged at the other end of the soldering device;
after external materials are conveyed to a main chain guide rail from a material conveying system, the external materials are distributed and fed to a straightening device and a peeling device from the main chain guide rail for processing, and then are cut off by a cutting device; then cutting off the workpiece by a cutting device after the workpiece is processed by a soldering tin device; and then, after passing through a positioning device, welding is carried out by eight-half welding.
Further, the image recognition system is located on the workbench; after the materials are welded by the eight-half welding, the image recognition system is used for recognizing whether the materials are qualified in welding; and if the materials are qualified, pushing the materials to the automatic packaging system for packaging.
Further, still be equipped with the image display screen on the frame, the image display screen with image recognition system electric connection.
Further, the automatic packaging system comprises a dispensing device and an ultraviolet lamp.
Furthermore, an automatic workpiece taking device is further arranged on the workbench.
Further, the positioning device adopts a photoelectric sensor for positioning.
Further, an automatic tray placing system is further arranged on the workbench and used for placing the processed materials in a tray placing mode and then taking the processed materials away by the automatic piece taking device.
The utility model discloses a full-automatic circuit board welding line equipment, a processing control system and a pneumatic control system are arranged on a frame; the workbench is provided with a material conveying system, an image recognition system and an automatic packaging system; after external materials are conveyed to the main chain guide rail from the material conveying system, the external materials are distributed and fed to the straightening device and the peeling device from the main chain guide rail for processing, and then are cut off by the cutting device; then cutting off the workpiece by a cutting device after the workpiece is processed by a soldering tin device; and then, after passing through a positioning device, welding is carried out by eight-half welding. Moreover, the utility model is also provided with an image recognition system for recognizing whether the welding of the materials is qualified; and if the materials are qualified, pushing the materials to the automatic packaging system for packaging. Therefore, the utility model discloses a full-automatic circuit board bonding wire equipment, its degree of automation is high, efficient, and whether can automatic identification processing qualified moreover still is equipped with automatic pick-off unit, and intelligent degree is high, the practicality is strong.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments;
fig. 1 is a schematic structural diagram of a full-automatic circuit board wire bonding apparatus of the present invention;
fig. 2 is a schematic structural diagram of another view angle of the full-automatic circuit board wire bonding apparatus of the present invention;
fig. 3 is a schematic diagram of a partial explosion structure of the full-automatic circuit board wire bonding equipment of the present invention;
fig. 4 is a schematic structural diagram of an automatic packaging system of the full-automatic circuit board wire bonding apparatus of the present invention;
fig. 5 is a schematic structural diagram of a material conveying system of the full-automatic circuit board wire bonding equipment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from the specific details set forth herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As shown in fig. 1, it is a schematic structural diagram of a full-automatic circuit board wire bonding apparatus of the present invention; as shown in fig. 2, it is a schematic structural diagram of another view angle of the full-automatic circuit board wire bonding apparatus of the present invention; as shown in fig. 3, it is a schematic diagram of a partial explosion structure of the full-automatic circuit board wire bonding apparatus of the present invention; as shown in fig. 4, it is a schematic structural diagram of an automatic packaging system of a full-automatic circuit board wire bonding apparatus according to the present invention; as shown in fig. 5, it is a schematic structural diagram of a material conveying system of a full-automatic circuit board wire bonding apparatus according to the present invention; the utility model discloses a full-automatic circuit board bonding wire equipment, which comprises a frame 11 and a workbench 12 connected with the frame 11, wherein a processing control system 1 and a pneumatic control system 2 are arranged on the frame 11; the workbench 12 is provided with a material conveying system 3, an image recognition system 41 and an automatic packaging system 5;
the material conveying system 3 comprises a plurality of conveyor belts 31; the workbench 12 is also provided with a straightening device 7, a peeling device 8, a plurality of cutting devices 9, a soldering device 10 and a main chain guide rail 15; on the workbench 12, the other end of the soldering device 10 is also provided with a positioning device 12 and a hastelloy welding 13;
after external materials are conveyed to a main chain guide rail 15 from a material conveying system 3, the external materials are distributed and fed to a straightening device 7 and a peeling device 8 from the main chain guide rail 15 for processing, and then are cut off by a cutting device 9; then the cutting is carried out by a cutting device 9 after being processed by a soldering tin device 10; and then passes through a positioning device 12, and then is welded by a half-welding 13. The utility model discloses in, conveyer belt 31 can have a plurality ofly, and the segmentation is the transported substance material respectively, and efficiency is higher.
In the present invention, the image recognition system 41 is located on the working table 12; after the material is welded by the haba welding 13, the image recognition system 41 is used for recognizing whether the material is qualified in welding; if the materials are qualified, the materials are pushed to the automatic packaging system 5 for packaging, as a preferred scheme, an image display screen 19 is further arranged on the rack 11, and the image display screen 19 is electrically connected with the image recognition system 41. Therefore, when the image recognition system 41 recognizes the material, the observed material can be displayed on the image display screen 19.
In the present invention, the automatic packaging system 5 includes a dispensing device 23 and an ultraviolet lamp 24; therefore, the quality of image recognition system discernment pad, qualified back conveying is through adhesive deposite device 23 to and the encapsulation of ultraviolet lamp 24, the utility model discloses in, positioner 12 adopts photoelectric sensor location.
In the utility model, an automatic workpiece taking device 6 is also arranged on the workbench 12, and when the materials are processed, the automatic workpiece taking device 6 takes workpieces automatically; preferably, an automatic balance system 17 is further arranged on the workbench 12, and the automatic balance system 17 is used for balance placement of the processed materials; therefore, the automatic tray placing system 17 places trays according to a certain design and then is taken away by the automatic workpiece taking device 6.
The utility model discloses a full-automatic circuit board welding line equipment, a processing control system and a pneumatic control system are arranged on a frame; the workbench is provided with a material conveying system, an image recognition system and an automatic packaging system; after external materials are conveyed to the main chain guide rail from the material conveying system, the external materials are distributed and fed to the straightening device and the peeling device from the main chain guide rail for processing, and then are cut off by the cutting device; then cutting off the workpiece by a cutting device after the workpiece is processed by a soldering tin device; and then, after passing through a positioning device, welding is carried out by eight-half welding. Moreover, the utility model is also provided with an image recognition system for recognizing whether the welding of the materials is qualified; and if the materials are qualified, pushing the materials to the automatic packaging system for packaging. Therefore, the utility model discloses a full-automatic circuit board bonding wire equipment, its degree of automation is high, efficient, and whether can automatic identification processing qualified moreover still is equipped with automatic pick-off unit, and intelligent degree is high, the practicality is strong.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. A full-automatic circuit board wire welding device comprises a rack and a workbench connected with the rack, and is characterized in that a processing control system and a pneumatic control system are mounted on the rack; the workbench is provided with a material conveying system, an image recognition system and an automatic packaging system;
the material conveying system comprises a plurality of conveyor belts; the workbench is also provided with a straightening device, a peeling device, a plurality of cutting devices, a soldering device and a main chain guide rail; on the workbench, the other end of the soldering device is also provided with a positioning device and a half-welding device;
after external materials are conveyed to a main chain guide rail from a material conveying system, the external materials are distributed and fed to a straightening device and a peeling device from the main chain guide rail for processing, and then are cut off by a cutting device; then cutting off the workpiece by a cutting device after the workpiece is processed by a soldering tin device; and then after passing through a positioning device, welding processing is carried out through half welding.
2. The fully automated wirebonding apparatus according to claim 1, wherein the image recognition system is located on the work table; after the materials are welded by the eight-half welding, the image recognition system is used for recognizing whether the materials are qualified in welding; if the materials are qualified, the materials are pushed to the automatic packaging system for packaging.
3. The apparatus according to claim 2, wherein an image display screen is further disposed on the frame, and the image display screen is electrically connected to the image recognition system.
4. The apparatus of claim 1 wherein the automated packaging system comprises a dispensing device and an ultraviolet lamp.
5. The apparatus according to claim 1, wherein the table further comprises an automatic pick-off device.
6. The apparatus of claim 1 wherein the positioning device is positioned using a photosensor.
7. The full-automatic circuit board bonding equipment according to claim 5, wherein an automatic tray placing system is further arranged on the workbench, and the automatic tray placing system places the processed materials in a tray placing mode and then takes the processed materials away by the automatic piece taking device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122918821.1U CN216421352U (en) | 2021-11-25 | 2021-11-25 | Full-automatic circuit board bonding wire equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122918821.1U CN216421352U (en) | 2021-11-25 | 2021-11-25 | Full-automatic circuit board bonding wire equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216421352U true CN216421352U (en) | 2022-05-03 |
Family
ID=81338679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122918821.1U Active CN216421352U (en) | 2021-11-25 | 2021-11-25 | Full-automatic circuit board bonding wire equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216421352U (en) |
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2021
- 2021-11-25 CN CN202122918821.1U patent/CN216421352U/en active Active
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