CN216412088U - High heat dissipation computer heat dissipation module - Google Patents
High heat dissipation computer heat dissipation module Download PDFInfo
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- CN216412088U CN216412088U CN202122671635.2U CN202122671635U CN216412088U CN 216412088 U CN216412088 U CN 216412088U CN 202122671635 U CN202122671635 U CN 202122671635U CN 216412088 U CN216412088 U CN 216412088U
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- heat dissipation
- fan
- heat
- cover plate
- circular opening
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Abstract
The utility model discloses a high-heat-dissipation computer heat dissipation module, which comprises a bottom plate and a cover plate, wherein a circular opening is formed in the cover plate, a circle of first heat dissipation fins are arranged on the periphery of the circular opening, the first heat dissipation fins are connected in series through a circular main central rib, a fan mounting frame is arranged in the circular opening, a fan is mounted on the fan mounting frame, the fan is positioned in the first heat dissipation fins, a plurality of second heat dissipation fins are further arranged on one side of the cover plate, and a plurality of first mounting holes are formed in the periphery of the cover plate; the utility model has simple structure and novel design, can carry out quick heat dissipation and improve the heat dissipation efficiency by matching the first heat dissipation fins and the fan, and then carries out further heat dissipation by the arranged second heat dissipation fins, thereby effectively improving the heat dissipation performance and further realizing the high-efficiency heat dissipation of the CPU.
Description
Technical Field
The utility model relates to the technical field of heat dissipation modules, in particular to a high-heat-dissipation computer heat dissipation module.
Background
The heat dissipation module is an indispensable part on a computer and is used for cooling the CPU, the working principle is that the heat of the CPU is led out through a heat transfer pipe and then is dissipated by fins in the heat dissipation module, and a fan is further arranged in the heat dissipation module and exchanges heat between external cold air and the heat dissipation fins, so that the cooling of the CPU is realized; the existing heat dissipation module has poor heat dissipation performance and influences the normal use of a computer.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a rudder piece spraying process device to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a high heat dissipation computer heat dissipation module, includes bottom plate and apron, be equipped with circular opening on the apron, circular open-ended periphery is equipped with the first heat radiation fins of round, through circular main rib cluster between the first heat radiation fins, be equipped with the fan mounting bracket in the circular opening, install the fan on the fan mounting bracket, the fan is located first heat radiation fins, one side of apron still is equipped with a plurality of second heat radiation fins, the periphery of apron is equipped with a plurality of first mounting holes.
Preferably, the border of bottom plate is equipped with the mounting panel, be equipped with a plurality of second mounting holes on the mounting panel, be equipped with the fluting on the mounting panel, one side of mounting panel is equipped with the ventilation otter board, the inside of bottom plate still is equipped with a set of stopper, the position of stopper is adjacent with the position of fluting.
Preferably, the cover plate covers the bottom plate, the first mounting holes and the second mounting holes are opposite to each other one by one, the first heat dissipation fins correspond to the limiting blocks, and the second heat dissipation fins are adjacent to the ventilation screen plate.
Compared with the prior art, the utility model has the beneficial effects that: the utility model has simple structure and novel design, can carry out quick heat dissipation and improve the heat dissipation efficiency by matching the first heat dissipation fins and the fan, and then carries out further heat dissipation by the arranged second heat dissipation fins, thereby effectively improving the heat dissipation performance and further realizing the high-efficiency heat dissipation of the CPU.
Drawings
FIG. 1 is a schematic view of a cover plate according to the present invention;
FIG. 2 is a schematic diagram of a low plate structure according to the present invention;
fig. 3 is a schematic cross-sectional view of the overall structure of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a high heat dissipation computer heat dissipation module comprises a bottom plate 1 and a cover plate 2, wherein a circular opening 21 is formed in the cover plate 2, a circle of first heat dissipation fins 22 are arranged on the periphery of the circular opening 21, the first heat dissipation fins 22 are connected in series through a circular main central rib 221 and used for supporting the first heat dissipation fins to play a role in reinforcing and supporting, a fan mounting frame 211 is arranged in the circular opening 21, a fan 212 is mounted on the fan mounting frame 211 and used for accelerating heat dissipation, the fan 212 is located in the first heat dissipation fins 22, when the fan rotates, heat is quickly dissipated from the first heat dissipation fins, then waste heat can enter, heat is dissipated again in a plurality of second heat dissipation fins 23 on one side of the cover plate 2, and a plurality of first mounting holes 24 are formed in the periphery of the cover plate 2;
the border of bottom plate 1 is equipped with mounting panel 11, be equipped with a plurality of second mounting holes 111 on the mounting panel 11, be equipped with fluting 112 on the mounting panel 1, it is convenient for the installation heat-transfer pipe to set up the fluting, the inside of bottom plate 1 still is equipped with a set of stopper 12, and this group's stopper is used for carrying out spacing fixed to the heat-transfer pipe, the position of stopper 12 is adjacent with fluting 112's position, and the heat-transfer pipe passes the fluting and is fixed in between the stopper, one side of mounting panel 11 is equipped with ventilation otter board 113 for ventilation and heat dissipation.
The heat radiation module mounting mode is that the cover plate 2 is covered on the bottom plate 1, at the moment, the first heat radiation fins 22 and the limiting blocks 12 in the cover plate are opposite, the fan is just aligned to the heat transfer pipe, in addition, the second heat radiation fins 23 are adjacent to the ventilation screen plate 113, heat can be discharged from the ventilation screen plate, each first mounting hole 24 is opposite to each second mounting hole 111 one by one, then fixing screws penetrate into the first mounting holes and the second mounting holes, and then the cover plate and the bottom plate can be fixed mutually by screwing.
In conclusion, when the heat transfer pipe guides the heat of the CPU to the heat dissipation module, the heat can be quickly dissipated by the cooperation of the first heat dissipation fins and the fan, the heat dissipation efficiency is improved, and then the heat can be further dissipated by the second heat dissipation fins, so that the heat dissipation performance can be effectively improved, and the efficient heat dissipation of the CPU is realized.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. The utility model provides a high heat dissipation computer heat dissipation module, includes bottom plate (1) and apron (2), its characterized in that: be equipped with circular opening (21) on apron (2), the periphery of circular opening (21) is equipped with the first heat radiation fin (22) of round, through circular main rib (221) concatenation between first heat radiation fin (22), be equipped with fan mounting bracket (211) in circular opening (21), install fan (212) on fan mounting bracket (211), fan (212) are located first heat radiation fin (22), one side of apron (2) still is equipped with a plurality of second heat radiation fin (23), the periphery of apron (2) is equipped with a plurality of first mounting holes (24).
2. The high heat dissipation computer heat dissipation module of claim 1, wherein: the border of bottom plate (1) is equipped with mounting panel (11), be equipped with a plurality of second mounting holes (111) on mounting panel (11), be equipped with fluting (112) on mounting panel (1), one side of mounting panel (11) is equipped with ventilation otter board (113), the inside of bottom plate (1) still is equipped with a set of stopper (12), the position of stopper (12) is adjacent with the position of fluting (112).
3. The high heat dissipation computer heat dissipation module of claim 1, wherein: the cover plate (2) covers the bottom plate (1), the first mounting holes (24) and the second mounting holes (111) are opposite to each other one by one, the first radiating fins (22) correspond to the limiting blocks (12), and the second radiating fins (23) are adjacent to the ventilation screen plate (113).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122671635.2U CN216412088U (en) | 2021-11-03 | 2021-11-03 | High heat dissipation computer heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122671635.2U CN216412088U (en) | 2021-11-03 | 2021-11-03 | High heat dissipation computer heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216412088U true CN216412088U (en) | 2022-04-29 |
Family
ID=81299252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122671635.2U Active CN216412088U (en) | 2021-11-03 | 2021-11-03 | High heat dissipation computer heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216412088U (en) |
-
2021
- 2021-11-03 CN CN202122671635.2U patent/CN216412088U/en active Active
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