CN216411489U - Highly integrated semiconductor chip detection equipment - Google Patents
Highly integrated semiconductor chip detection equipment Download PDFInfo
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- CN216411489U CN216411489U CN202122830858.9U CN202122830858U CN216411489U CN 216411489 U CN216411489 U CN 216411489U CN 202122830858 U CN202122830858 U CN 202122830858U CN 216411489 U CN216411489 U CN 216411489U
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Abstract
The application relates to a highly integrated semiconductor chip check out test set belongs to semiconductor chip check out test set technical field, includes: the testing machine comprises a testing machine outer frame, wherein a cavity for accommodating a testing circuit board is arranged in the testing machine outer frame; the test circuit board comprises a plurality of plug-in test circuit boards which are inserted into the test machine outer frame and are circumferentially arranged and used for mounting the semiconductor chips. The utility model provides a semiconductor chip check out test set will be located polylith grafting test circuit board of test machine frame and is the mode that the circumference was arranged and install and arrange, and this kind of installation can utilize bigger space with the semiconductor chip check out test set who arranges, realizes depositing more grafting test circuit boards, realizes among the semiconductor chip check out test set, increases more test content.
Description
Technical Field
The application relates to the technical field of semiconductor chip testing equipment, in particular to highly integrated semiconductor chip testing equipment.
Background
In the chip production process, the detection of the chip is an important step, when the batch chip test is carried out, enterprises generally use an automatic chip tester to carry out the batch test on the chip, the existing chip test is carried out by using a chip tester with a vertical cabinet structure, test circuit boards in the chip tester with the vertical cabinet structure are arranged in a matrix, and the number of the test circuit boards contained in the test circuit boards is limited. Therefore, such a chip tester generally has a large volume, needs to occupy a large space, and has a high requirement on indoor space, and an enterprise often needs to place such a chip tester according to a large workshop.
Disclosure of Invention
The embodiment of the application provides a highly integrated semiconductor chip detection device to solve the problems that a chip testing machine in the related art is large in size and small in number of accommodated test circuit boards.
The embodiment of the application provides a highly integrated semiconductor chip check out test set, includes:
the testing machine comprises a testing machine outer frame, wherein a cavity for accommodating a testing circuit board is arranged in the testing machine outer frame;
the test circuit board comprises a plurality of plug-in test circuit boards which are inserted into the test machine outer frame and are circumferentially arranged and used for mounting semiconductor chips.
In some embodiments: the plurality of the plug-in test circuit boards are all rectangular plate-shaped structures, and extension lines of the plug-in test circuit boards in the width direction are intersected at one point.
In some embodiments: the test circuit board also comprises a fan-shaped motherboard which is fixed on the outer frame of the test machine and is in plug-in connection with one end of the plug-in test circuit board through a connector, and a circular circuit board which is detachably connected on the outer frame of the test machine and is in plug-in connection with the other end of the plug-in test circuit board through a connector.
In some embodiments: a circular circuit board fixing plate is fixedly arranged at one end, close to the circular circuit board, of the outer frame of the testing machine, and a circular hole for assembling, disassembling and splicing the test circuit board is formed in the circular circuit board fixing plate;
the circular circuit board fixing plate is detachably provided with a circular circuit board frame body for fixing the circular circuit board, and the circular circuit board is located in a circular hole of the circular circuit board fixing plate.
In some embodiments: the circular circuit board fixing plate and the circular circuit board frame body are both rectangular structures, L-shaped positioning supports are fixedly arranged at four corners of the circular circuit board fixing plate, and the four corners of the circular circuit board frame body are respectively positioned in the L-shaped positioning supports;
the four corners of the circular circuit board fixing plate are respectively provided with a circular circuit board positioning pin, and the four corners of the circular circuit board frame body are respectively provided with a circular circuit board positioning sleeve matched with the circular circuit board positioning pin.
In some embodiments: the testing machine outer frame is internally provided with a pressure taking and releasing claw and a cylinder, the pressure taking and releasing claw and the cylinder drive the circular circuit board frame to be close to and far away from the circular circuit board fixing plate, one end of the pressure taking and releasing claw is provided with a hook which is combined with and separated from the circular circuit board frame, and the cylinder drives the pressure taking and releasing claw to reciprocate.
In some embodiments: the outer frame of the testing machine is also fixedly provided with a fan fixing plate which is arranged around the peripheries of the plug-in test circuit boards, and the fan fixing plate is provided with an inner cooling fan used for cooling the plug-in test circuit boards.
In some embodiments: a plurality of positioning guide rails positioned at the outer sides of the plurality of plug-in test circuit boards are also fixedly arranged in the test machine outer frame, and slots for inserting the plug-in test circuit boards are arranged on the positioning guide rails;
the testing machine is characterized in that a circular positioning support which is located on the inner sides of the plurality of plug-in test circuit boards is fixedly arranged in the testing machine outer frame, and a plurality of positioning grooves which are distributed circumferentially are formed in the periphery of the circular positioning support.
In some embodiments: the circular positioning supports are arranged in a plurality of numbers, the circular positioning supports are arranged at intervals, the axes of the circular positioning supports are collinear, and two adjacent circular positioning supports are fixedly connected through the supporting rod.
In some embodiments: the testing machine comprises a testing machine outer frame, and is characterized in that outer frame heat dissipation panels for covering the testing machine outer frame are arranged on the periphery of the testing machine outer frame, heat dissipation holes are formed in the outer frame heat dissipation panels, and a plurality of outer heat dissipation fans are arranged on at least one outer frame heat dissipation panel.
The beneficial effect that technical scheme that this application provided brought includes:
the embodiment of the application provides a highly integrated semiconductor chip detection device, and the semiconductor chip detection device is provided with a test machine outer frame, and a cavity for accommodating a test circuit board is arranged in the test machine outer frame; the test circuit board comprises a plurality of plug-in test circuit boards which are inserted into the outer frame of the test machine and are circumferentially arranged and used for mounting the semiconductor chips.
Therefore, the semiconductor chip detection equipment installs and arranges the plurality of plug-in test circuit boards in the outer frame of the testing machine in a circumferential arrangement mode, and the semiconductor chip detection equipment can utilize a larger space to store more plug-in test circuit boards, so that more test contents are added in the semiconductor chip detection equipment.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a perspective view of the structure of an embodiment of the present application;
fig. 2 is a perspective view of a circular circuit board frame and a circular circuit board that are not included in the embodiment of the present application;
FIG. 3 is a front view of the structure of an embodiment of the present application;
fig. 4 is a sectional view taken along a-a in fig. 3.
Reference numerals:
1. testing machine outer frame; 2. inserting a test circuit board; 3. a fan-shaped mother board; 4. a circular circuit board; 5. a connector; 6. a circular circuit board fixing plate; 7. a circular circuit board frame; 8. an L-shaped positioning bracket; 9. a circular circuit board positioning pin; 10. a circular circuit board positioning sleeve; 11. a fan fixing plate; 12. an inner heat dissipation fan; 13. positioning the guide rail; 14. a circular positioning bracket; 15. an outer frame heat dissipation panel; 16. an outer heat-radiating fan; 17. heat dissipation holes; 18. an indicator light; 19. taking and unloading the pressing claw; 20. a cylinder; 21. a support rod.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides highly-integrated semiconductor chip detection equipment which can solve the problems that a chip tester in the related art is large in size and small in number of accommodated test circuit boards.
Referring to fig. 2 and 4, an embodiment of the present application provides a highly integrated semiconductor chip inspection apparatus, including:
the testing machine comprises a testing machine outer frame 1, wherein the testing machine outer frame 1 is of a rectangular frame structure formed by assembling aluminum alloy sections, and a rectangular cavity for accommodating a testing circuit board is arranged in the testing machine outer frame 1.
The test circuit board comprises a plurality of plug-in test circuit boards 2 which are inserted into the test machine frame 1 and are arranged in a circumferential mode and used for mounting semiconductor chips, and the plug-in test circuit boards 2 are used as carrier plates and used for mounting the semiconductor chips to be detected.
The plurality of plugging test circuit boards 2 are preferably rectangular plate-shaped structures, the test contents of the plurality of plugging test circuit boards 2 are the same or different, the extension lines of the plurality of plugging test circuit boards 2 in the width direction are intersected at one point (namely the same circle center), the shapes and the sizes of the plugging test circuit boards 2 are the same, and the distances from the plugging test circuit boards 2 to the circle center are the same.
The semiconductor chip detection equipment of the embodiment of the application installs and arranges the plurality of inserted test circuit boards 2 in the outer frame 1 of the testing machine in a circumferential arrangement mode, and the semiconductor chip detection equipment for installation and arrangement can utilize a larger space to store more inserted test circuit boards 2, so that more test contents are added in the semiconductor chip detection equipment.
In some alternative embodiments: referring to fig. 2 and 4, the embodiment of the present application provides a highly integrated semiconductor chip detection apparatus, the test circuit board of the semiconductor chip detection apparatus further includes a fan-shaped motherboard 3 fixed on the test machine outer frame 1 and connected to one end of the plug-in test circuit board 2 through a connector 5, and a circular circuit board 4 detachably connected to the test machine outer frame 1 and connected to the other end of the plug-in test circuit board 2 through a connector 5.
The fan-shaped mother boards 3 are provided with a plurality of blocks, the plurality of fan-shaped mother boards 3 are spliced end to form a circular ring-shaped structure, and the fan-shaped mother boards 3 are connected with the plug-in test circuit board 2 in a plug-in mode through the connectors 5 to input detection electric signals for the plug-in test circuit board 2. The circular circuit board 4 is connected with the plug-in test circuit board 2 through the connector 5 in a plug-in manner to output a detection electric signal for the plug-in test circuit board 2.
The fan-shaped mother board 3 is fixed on the outer frame 1 of the testing machine, one end of the test circuit board 2 convenient to plug in is connected with the fan-shaped mother board 3 through the connector 5 in a plugging mode, after the plurality of plug-in test circuit boards 2 are all plugged and butted in place with the fan-shaped mother board 3, the circular circuit board 4 is plugged and butted in place with the other ends of the plurality of plug-in test circuit boards 2 through the connector 5, and then power-on detection can be conducted.
In some alternative embodiments: referring to fig. 1 to 4, in the semiconductor chip inspection apparatus according to the embodiment of the present disclosure, a circular circuit board fixing plate 6 is fixedly disposed at an end of a testing machine outer frame 1 of the semiconductor chip inspection apparatus, the end being close to a circular circuit board 4, and a circular hole for detachably plugging a testing circuit board 2 is formed in the circular circuit board fixing plate 6. The circular circuit board fixing plate 6 is detachably provided with a circular circuit board frame body 7 for fixing the circular circuit board 4, and the circular circuit board 4 is positioned in a circular hole of the circular circuit board fixing plate 6.
The circular circuit board fixing plate 6 and the circular circuit board frame body 7 are both rectangular structures, L-shaped positioning supports 8 are fixedly arranged at four corners of the circular circuit board fixing plate 6, and the four corners of the circular circuit board frame body 7 are respectively positioned in the L-shaped positioning supports 8. The L-shaped positioning supports 8 are fixedly arranged at the four corners of the circular circuit board fixing plate 6 to position the circular circuit board frame body 7, so that the circular circuit board 4 arranged on the circular circuit board frame body 7 and the assembly and disassembly plugging test circuit board 2 are ensured to be accurately plugged and aligned.
The four corners of the circular circuit board fixing plate 6 are respectively provided with a circular circuit board positioning pin 9, and the four corners of the circular circuit board frame 7 are respectively provided with a circular circuit board positioning sleeve 10 matched with the circular circuit board positioning pin 9. When the circular circuit board 4 installed on the circular circuit board fixing plate 6 is inserted with the detachable insertion test circuit board 2, the circular circuit board positioning sleeves 10 at the four corners of the circular circuit board frame body 7 are matched with the circular circuit board positioning pins 9 at the four corners of the circular circuit board fixing plate 6 to jointly provide guiding positioning for the insertion of the circular circuit board 4 and the detachable insertion test circuit board 2.
In some alternative embodiments: referring to fig. 1, 3 and 4, in the semiconductor chip inspection apparatus according to the embodiment of the present invention, a pressure taking and releasing claw 19 and an air cylinder 20 are provided in a tester outer frame 1 of the semiconductor chip inspection apparatus, the pressure taking and releasing claw 19 and the air cylinder 20 are provided for driving a circular circuit board frame 7 to approach to and separate from a circular circuit board fixing plate 6, one end of the pressure taking and releasing claw 19 is provided with a hook for engaging with and disengaging from the circular circuit board frame 7, and the air cylinder 20 drives the pressure taking and releasing claw 19 to reciprocate.
The cylinder 20 drives the pressure-removing claw 19 to reciprocate for moving the circular circuit board frame body 7 in a direction approaching and moving away from the circular circuit board fixing plate 6. When the cylinder 20 contracts, the cylinder 20 drives the pressure-removing claw 19 to drive the circular circuit board frame body 7 to move in a direction close to the circular circuit board fixing plate 6, so that the circular circuit board 4 on the circular circuit board frame body 7 is connected with the plurality of plugging test circuit boards 2 in a plugging mode to realize electric connection.
When the cylinder 20 extends out, the cylinder 20 drives the pressure-removing claw 19 to drive the circular circuit board frame body 7 to move in a direction away from the circular circuit board fixing plate 6, so that the circular circuit boards 4 on the circular circuit board frame body 7 are completely separated from the plurality of plugging test circuit boards 2, and the work difficulty of manually disassembling and assembling the circular circuit boards 4 is reduced.
In some alternative embodiments: referring to fig. 2 and 4, in the semiconductor chip inspection apparatus according to the embodiment of the present disclosure, a fan fixing plate 11 is further fixedly disposed in the testing machine outer frame 1 of the semiconductor chip inspection apparatus, and the fan fixing plate 11 is provided with an inner cooling fan 12 for cooling the plug-in test circuit boards 2. The inner heat dissipation fans 12 are provided in a plurality, and at least one inner heat dissipation fan 12 is arranged between every two adjacent plug-in test circuit boards 2.
A plurality of positioning guide rails 13 positioned outside the plurality of plug-in test circuit boards 2 are also fixedly arranged in the test machine outer frame 1, and slots for inserting the plug-in test circuit boards 2 are arranged on the positioning guide rails 13; still be fixed in test machine frame 1 and be equipped with the circular positioning support 14 that is located the inboard of polylith grafting test circuit board 2, the periphery of circular positioning support 14 is equipped with a plurality of constant head tanks that are the circumference and distribute and are used for installing grafting test circuit board 2.
The circular positioning supports 14 are provided with a plurality of circular positioning supports 14, the circular positioning supports 14 are identical in shape and size, the circular positioning supports 14 are arranged at intervals along the length direction of the plugging test circuit board 2, the axes of the circular positioning supports are collinear, and the two adjacent circular positioning supports 14 are fixedly connected through the supporting rod 21. The inner side of the plug-in test circuit board 2 is the side far away from the testing machine outer frame 1, and the outer side of the plug-in test circuit board 2 is the side close to the testing machine outer frame 1. The inner side and the outer side of the plugging test circuit board 2 are respectively positioned and fixed through a circular positioning bracket 14 and a positioning guide rail 13.
In some alternative embodiments: referring to fig. 1 and 2, in the semiconductor chip inspection apparatus according to the embodiment of the present disclosure, an outer frame heat dissipation panel 15 covering a tester outer frame 1 is disposed around the tester outer frame 1 of the semiconductor chip inspection apparatus, heat dissipation holes 17 are disposed on the outer frame heat dissipation panel 15, a plurality of outer heat dissipation fans 16 are disposed on at least one outer frame heat dissipation panel 15, and the plurality of outer heat dissipation fans 16 are used for cooling a fan-shaped motherboard 3.
An indicator light 18 is further arranged on the outer frame heat dissipation panel 15, the indicator light 18 is connected with a temperature sensor for measuring the temperature in the test machine outer frame 1, and the indicator light 18 can flicker to prompt and alarm when the temperature in the test machine outer frame 1 exceeds a certain set value.
Principle of operation
The embodiment of the application provides a highly integrated semiconductor chip detection device, because the semiconductor chip detection device of the application is provided with a testing machine outer frame 1, a cavity for accommodating a testing circuit board is arranged in the testing machine outer frame 1; the testing circuit board comprises a plurality of plug-in testing circuit boards 2 which are inserted into the testing machine frame 1 and are circumferentially arranged and used for mounting semiconductor chips.
Therefore, the semiconductor chip detection equipment of the application installs and arranges the plurality of plug-in test circuit boards 2 in the test machine outer frame 1 in a circumferential arrangement mode, and the semiconductor chip detection equipment for installation and arrangement can utilize a larger space, realize storing more plug-in test circuit boards 2, and increase more test contents in the semiconductor chip detection equipment.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A highly integrated semiconductor chip inspection apparatus, comprising:
the testing machine comprises a testing machine outer frame (1), wherein a cavity for accommodating a testing circuit board is arranged in the testing machine outer frame (1);
the testing circuit board comprises a plurality of plug-in testing circuit boards (2) which are inserted into the testing machine outer frame (1) and are circumferentially arranged and used for mounting semiconductor chips.
2. A highly integrated semiconductor chip inspection apparatus as claimed in claim 1, wherein:
the plug-in test circuit board (2) is of a rectangular plate-shaped structure, and extension lines of the plug-in test circuit board (2) in the width direction intersect at one point.
3. A highly integrated semiconductor chip inspection apparatus as claimed in claim 1 or 2, wherein:
the test circuit board also comprises a fan-shaped motherboard (3) which is fixed on the outer frame (1) of the test machine and is in plug-in connection with one end of the plug-in test circuit board (2) through a connector (5), and a circular circuit board (4) which is detachably connected on the outer frame (1) of the test machine and is in plug-in connection with the other end of the plug-in test circuit board (2) through the connector (5).
4. A highly integrated semiconductor chip inspection apparatus as claimed in claim 3, wherein:
a circular circuit board fixing plate (6) is fixedly arranged at one end, close to the circular circuit board (4), of the testing machine outer frame (1), and a circular hole for detachably inserting the testing circuit board (2) is formed in the circular circuit board fixing plate (6);
the round circuit board fixing plate (6) is detachably provided with a round circuit board frame body (7) for fixing the round circuit board (4), and the round circuit board (4) is located in a round hole of the round circuit board fixing plate (6).
5. A highly integrated semiconductor chip inspection apparatus as claimed in claim 4, wherein:
the round circuit board fixing plate (6) and the round circuit board frame body (7) are both rectangular structures, L-shaped positioning supports (8) are fixedly arranged at four corners of the round circuit board fixing plate (6), and the four corners of the round circuit board frame body (7) are respectively positioned in the L-shaped positioning supports (8);
the four corners of the circular circuit board fixing plate (6) are respectively provided with a circular circuit board positioning pin (9), and the four corners of the circular circuit board frame body (7) are respectively provided with a circular circuit board positioning sleeve (10) matched with the circular circuit board positioning pin (9).
6. A highly integrated semiconductor chip inspection apparatus as claimed in claim 4, wherein:
the testing machine outer frame (1) is internally provided with a pressure taking and releasing claw (19) and an air cylinder (20) which drive the circular circuit board frame body (7) to be close to and far away from the circular circuit board fixing plate (6), one end of the pressure taking and releasing claw (19) is provided with a hook which is combined with and separated from the circular circuit board frame body (7), and the air cylinder (20) drives the pressure taking and releasing claw (19) to reciprocate.
7. A highly integrated semiconductor chip inspection apparatus as claimed in claim 1, wherein:
the testing machine is characterized in that a fan fixing plate (11) surrounding the peripheries of the plug-in test circuit boards (2) is fixedly arranged in the testing machine outer frame (1), and an inner cooling fan (12) used for cooling the plug-in test circuit boards (2) is arranged on the fan fixing plate (11).
8. A highly integrated semiconductor chip inspection apparatus as claimed in claim 1, wherein:
a plurality of positioning guide rails (13) positioned at the outer sides of the plurality of plug-in test circuit boards (2) are also fixedly arranged in the test machine outer frame (1), and slots for inserting the plug-in test circuit boards (2) are formed in the positioning guide rails (13);
the testing machine is characterized in that a circular positioning support (14) which is located on the inner sides of the plurality of plug-in test circuit boards (2) is further fixedly arranged in the testing machine outer frame (1), and a plurality of positioning grooves which are distributed circumferentially are formed in the periphery of the circular positioning support (14).
9. A highly integrated semiconductor chip inspection apparatus as claimed in claim 8, wherein:
the circular positioning supports (14) are arranged in a plurality of numbers, the circular positioning supports (14) are arranged at intervals, the axes of the circular positioning supports are collinear, and two adjacent circular positioning supports (14) are fixedly connected through a supporting rod (21).
10. A highly integrated semiconductor chip inspection apparatus as claimed in claim 1, wherein:
the testing machine is characterized in that outer frame heat dissipation panels (15) covering the testing machine outer frame (1) are arranged on the periphery of the testing machine outer frame (1), heat dissipation holes (17) are formed in the outer frame heat dissipation panels (15), and at least one outer heat dissipation fan (16) is arranged on each outer frame heat dissipation panel (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122830858.9U CN216411489U (en) | 2021-11-10 | 2021-11-10 | Highly integrated semiconductor chip detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122830858.9U CN216411489U (en) | 2021-11-10 | 2021-11-10 | Highly integrated semiconductor chip detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216411489U true CN216411489U (en) | 2022-04-29 |
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ID=81300694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122830858.9U Active CN216411489U (en) | 2021-11-10 | 2021-11-10 | Highly integrated semiconductor chip detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216411489U (en) |
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2021
- 2021-11-10 CN CN202122830858.9U patent/CN216411489U/en active Active
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